CN218850850U - Heat dissipation STB and electronic equipment - Google Patents
Heat dissipation STB and electronic equipment Download PDFInfo
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- CN218850850U CN218850850U CN202223240692.6U CN202223240692U CN218850850U CN 218850850 U CN218850850 U CN 218850850U CN 202223240692 U CN202223240692 U CN 202223240692U CN 218850850 U CN218850850 U CN 218850850U
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- circuit board
- decryption card
- top box
- set top
- decryption
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation set top box and electronic equipment, the electronic equipment comprises the heat dissipation set top box, the heat dissipation set top box comprises a shell, a circuit board and a decryption card assembly, one side of the shell is provided with an insertion hole, the circuit board is arranged in the shell, and a chip is arranged on the first side of the circuit board; the decryption card assembly comprises a decryption card and a decryption card seat, the decryption card seat is located on the second side of the circuit board, an exposed area is formed on the second side of the circuit board in a position corresponding to the decryption card, and a metal layer is exposed on the exposed area on the second side of the circuit board, so that heat conducted by the circuit board to the decryption card is reduced, and the temperature rise of the decryption card is controlled.
Description
Technical Field
The utility model relates to an electron field especially relates to a heat dissipation STB and electronic equipment.
Background
The intelligent decryption card of the digital television belongs to key components in the field of digital televisions, has strict requirements on temperature rise of the decryption card by industrial standards, has low temperature rise relative to the environment and overhigh temperature, and influences the service life and normal functions of the decryption card. However, as the functions of the set-top box are increased, the integration level is higher, and the size is smaller, the heat dissipation of the decryption card becomes a very critical problem and is difficult to control.
In the existing technical scheme, a lot of heat dissipation measures are taken that a decryption card and a high-power chip are arranged in a staggered mode, or a heat dissipation fin is enlarged to take heat away from a circuit board. However, as the set-top box is smaller, the layout space which can be improved by the circuit board is limited, the layout of components is crowded, the staggered layout effect of some high-power chips is limited due to hard requirements, and the temperature rise of the decryption card cannot be greatly reduced; increasing the number of the heat dissipation fins increases the heat dissipation cost, increases the cost, reduces the competitive advantage of the product, and has no obvious effect.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a heat dissipation STB aims at solving the problem that current heat dissipation STB uncontrollable decryption card temperature risees.
In order to achieve the above object, the utility model provides a heat dissipation set top box, wherein the heat dissipation set top box includes:
the plug comprises a shell, wherein one side of the shell is provided with an insertion hole;
the circuit board is arranged in the shell and provided with a first side and a second side which are opposite, a chip is installed on the first side of the circuit board, and the insertion hole is located on the second side of the circuit board; and the number of the first and second groups,
the decryption card assembly is arranged in the shell and comprises a decryption card seat and a decryption card, the decryption card seat is positioned on the second side of the circuit board and arranged corresponding to the insertion port, and the decryption card is arranged on the decryption card seat;
and the second side of the circuit board is provided with an exposed area at the position corresponding to the decryption card, and the metal layer is exposed at the exposed area on the second side of the circuit board.
Optionally, the housing is provided with a through hole at a position of the second side of the circuit board.
Optionally, the projection area of the decryption card on the second side of the circuit board is S1, the area of the exposed area is S2, and S2 is greater than or equal to 0.3s1.
Optionally, the second side of the circuit board is covered with a protective film in an area outside the exposed area.
Optionally, the protective film is made of a liquid photo solder resist.
Optionally, the projection position of the chip on the circuit board is staggered from the projection position of the decryption card on the circuit board.
Optionally, the chip is provided with a heat sink on a side facing away from the circuit board.
Optionally, a heat conducting material is filled between the chip and the heat sink.
Optionally, a slot is formed in a position, corresponding to the decryption card, of the second side of the circuit board.
In addition, the utility model also provides an electronic equipment, the electronic equipment includes the heat dissipation set top box, the heat dissipation set top box includes casing, circuit board and deciphering card component, one side of the casing is provided with an insertion hole; the circuit board is arranged in the shell and provided with a first side and a second side which are opposite, a chip is installed on the first side of the circuit board, and the insertion hole is located on the second side of the circuit board; the decryption card assembly is arranged in the shell and comprises a decryption card seat and a decryption card, the decryption card seat is positioned on the second side of the circuit board and is arranged corresponding to the insertion hole, and the decryption card is arranged on the decryption card seat; and the second side of the circuit board is provided with an exposed area at the position corresponding to the decryption card, and the metal layer is exposed at the exposed area on the second side of the circuit board.
The utility model provides an among the technical scheme, one side of casing is provided with the inserted hole for insert the deciphering card, the circuit board set up in the casing just the chip is installed to the first side of circuit board, and the second side-mounting has the deciphering cassette, the deciphering card install in on the deciphering cassette, the second side of circuit board is corresponding the position of deciphering card is formed with exposed district, the second side of circuit board is in exposed district department exposes the metal level, because the emissivity on metal level surface is low, exposed metal level can effectively reduce the circuit board with heat transfer between the deciphering card helps control the temperature rise of deciphering card.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic perspective view of each component of an embodiment of a heat dissipation set top box provided by the present invention;
fig. 2 is a side view of the heat dissipating set top box of fig. 1;
FIG. 3 is a schematic perspective view of the housing of FIG. 1;
fig. 4 is a top view of the circuit board of fig. 1.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Heat dissipation set |
22 | Chip and method for manufacturing the same |
| 200 | |
23 | |
| 1 | Shell body | 24 | Thermally |
| 11 | Insertion opening | 25 | |
| 12 | Through- |
3 | |
| 2 | |
31 | |
| 21 | |
32 | Decryption card |
| 21a | Liquid photo solder resist |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear \8230;) are involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship between the components in a specific posture (as shown in the attached drawings), the motion situation, etc., and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
At present, the commonly used heat dissipation set top box has the problem that the temperature rise of a decryption card is difficult to control.
In order to solve the above problem, the present invention provides a heat dissipation set top box 100, fig. 1 to 4 are the present invention provides a specific embodiment of the heat dissipation set top box.
Referring to fig. 1 to 4, the heat dissipation set top box 100 includes a housing 1, a circuit board 2, and a decryption card assembly 3, where one side of the housing 1 is provided with an insertion port 11, the circuit board 2 is disposed in the housing 1, the circuit board 2 has a first side and a second side opposite to each other, the first side of the circuit board 2 is mounted with a chip 22, the insertion port 11 is located at the second side of the circuit board 2, the decryption card assembly 3 is disposed in the housing 1, the decryption card assembly 3 includes a decryption card socket 31 and a decryption card 32, the decryption card socket 31 is located at the second side of the circuit board 2 and is disposed corresponding to the insertion port 11, the decryption card 32 is mounted on the decryption card socket 31, where a exposed region is formed at a position corresponding to the decryption card 32 at the second side of the circuit board 2, and a metal layer is exposed at the exposed region at the second side of the circuit board 2.
The utility model provides an among the technical scheme, one side of casing 1 is provided with inserted hole 11 for insert decryption card 32, circuit board 2 set up in the casing 1 just chip 22 is installed to the first side of circuit board 2, and decryption cassette 31 is installed to the second side, decryption card 32 install in on the decryption cassette 31, the second side of circuit board 2 is corresponding decryption card 32's position is formed with exposed district, circuit board 2's second side is in exposed district department exposes the metal level, because the heat radiation rate on metal level surface is low, exposed metal level can effectively reduce circuit board 2 with heat transfer between the decryption card 32 helps control decryption card 32's temperature rise.
Further, the form of the housing 1 is not limited as long as it is ensured that the housing 1 can mount the circuit board 2, for example, in this embodiment, as shown in fig. 1, the housing 1 is provided with a through hole 12 at a position of the second side of the circuit board 2, and the through hole 12 is used for dissipating heat, so that not only the above function can be realized, but also the heat dissipation of the decryption card 32 can be assisted, so as to control the temperature rise of the decryption card 32.
Further, the area of the exposed area of the circuit board 2 is not limited as long as it is ensured that the heat transfer between the circuit board 2 and the decryption card 32 can be effectively reduced, for example, in this embodiment, the projection area of the decryption card 32 on the second side of the circuit board 2 is S1, the area of the exposed area is S2, S2 is greater than or equal to 0.3S1, and the area of the exposed area is greater than 30% of the projection area of the decryption card 32 on the second side of the circuit board 2, so that the heat radiation of the circuit board 2 to the decryption card 32 can be greatly reduced.
Further, the composition structure of the circuit board 2 is not limited, as long as it is ensured that the circuit board 2 can be installed in the housing 1, for example, in this embodiment, the second side of the circuit board 2 is located the region outside the exposed region is covered with the protective film 21, the protective film 21 can protect the components on the circuit board 2, and the temperature rise control of the decryption card 32 will not be affected.
Further, the material of the protection film 21 is not limited as long as the protection film 21 can protect the components on the circuit board 2, for example, in the embodiment, the material of the protection film 21 is a liquid photo solder resist 21a, which not only can achieve the above function, but also can prevent short circuit due to bridging because of its high insulation.
Further, the mounting position of the chip 22 is not limited as long as the chip 22 is mounted on the first surface of the circuit board 2, for example, in this embodiment, the projection position of the chip 22 on the circuit board 2 is staggered from the projection position of the decryption card 32 on the circuit board 2, so that not only the above functions can be realized, but also the heat transfer from the chip 22 to the decryption card 32 can be reduced due to the staggered positions of the two, which helps to control the temperature rise of the decryption card 32.
Further, the components on the circuit board 2 are not limited as long as the housing 1 can accommodate the circuit board 2, for example, in this embodiment, as shown in fig. 2, the chip 22 is provided with a heat sink 23 on a side opposite to the circuit board 2, and the heat sink 23 is used for dissipating heat, so that the heat of the chip 22 can be dissipated toward the housing 1, and the influence on the temperature of the decryption card 32 is reduced.
Further, there is no limitation on whether there is a filler between the chip 22 and the heat sink 23, as long as it is ensured that heat can flow from the chip 22 to the heat sink 23, for example, in this embodiment, a heat conducting material 24 is filled between the chip 22 and the heat sink 23, and the heat conducting material 24 is used for conducting heat, so that heat can be quickly conducted from the chip 22 to the heat sink 23.
Further, the form of the circuit board 2 is not limited as long as the circuit board 2 is connected to the decryption card holder 31, for example, in the embodiment, as shown in fig. 4, a slot 25 is formed in a position, corresponding to the decryption card 32, on the second side of the circuit board 2, and the slot 25 is used for heat insulation, so that heat transfer from the circuit board 2 to the decryption card 32 can be further reduced.
Furthermore, the utility model provides an electronic equipment 200 still, electronic equipment 200 includes above-mentioned heat dissipation set-top box 100, heat dissipation set-top box 100 includes casing 1, circuit board 2 and decryption card subassembly 3, one side of casing 1 is provided with inserted hole 11, and circuit board 2 sets up in the casing 1, circuit board 2 has relative first side and second side, chip 22 is installed to circuit board 2's first side, inserted hole 11 is located circuit board 2's second side, decryption card subassembly 3 sets up in the casing 1, decryption card subassembly 3 includes decryption cassette 31 and decryption card 32, decryption cassette 31 is located circuit board 2's second side just corresponds inserted hole 11 sets up, decryption card 32 install in on the decryption cassette 31, wherein, circuit board 2's second side is in corresponding decryption card 32's position is formed with the exposed area, circuit board 2's second side is in exposed area department exposes the metal level.
The above only is the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all under the conception of the present invention, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.
Claims (10)
1. A heat dissipating set top box, comprising:
the plug comprises a shell, wherein one side of the shell is provided with an insertion hole;
the circuit board is arranged in the shell and provided with a first side and a second side which are opposite, a chip is installed on the first side of the circuit board, and the insertion hole is located on the second side of the circuit board; and the number of the first and second groups,
the decryption card assembly is arranged in the shell and comprises a decryption card seat and a decryption card, the decryption card seat is positioned on the second side of the circuit board and arranged corresponding to the insertion port, and the decryption card is arranged on the decryption card seat;
and the second side of the circuit board is provided with an exposed area at the position corresponding to the decryption card, and the metal layer is exposed at the exposed area on the second side of the circuit board.
2. The heat dissipating set top box of claim 1, wherein the housing defines a through hole at a location on the second side of the circuit board.
3. The heat-dissipating set top box of claim 1, wherein the area of the projection of the decryption card on the second side of the circuit board is S1, the area of the exposed area is S2, and S2 is greater than or equal to 0.3s1.
4. The heat dissipating set top box of claim 1 wherein the second side of the circuit board is covered with a protective film in an area outside the bare area.
5. The heat dissipating set top box of claim 4, wherein the protective film is made of a liquid photo solder resist.
6. The heat dissipating set top box of claim 1, wherein the projected position of the chip on the circuit board is offset from the projected position of the decryption card on the circuit board.
7. The heat dissipating set top box of claim 1, wherein the chip is provided with a heat sink on a side facing away from the circuit board.
8. The heat dissipating set top box of claim 7, wherein a thermally conductive material is filled between the chip and the heat sink.
9. The heat dissipating set top box of claim 1, wherein the second side of the circuit board is slotted at a location corresponding to the decryption card.
10. An electronic device, characterized in that it comprises a heat dissipating set-top box according to any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223240692.6U CN218850850U (en) | 2022-12-01 | 2022-12-01 | Heat dissipation STB and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223240692.6U CN218850850U (en) | 2022-12-01 | 2022-12-01 | Heat dissipation STB and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218850850U true CN218850850U (en) | 2023-04-11 |
Family
ID=87284941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223240692.6U Active CN218850850U (en) | 2022-12-01 | 2022-12-01 | Heat dissipation STB and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218850850U (en) |
-
2022
- 2022-12-01 CN CN202223240692.6U patent/CN218850850U/en active Active
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |