CN218842033U

CN218842033U - Silica gel heat conduction pad of high-efficient heat conduction

Info

Publication number: CN218842033U
Application number: CN202320075813.1U
Authority: CN
Inventors: 徐勇
Original assignee: Shenzhen Dongli Feiyang Technology Co ltd
Current assignee: Shenzhen Dongli Feiyang Technology Co ltd
Priority date: 2023-01-09
Filing date: 2023-01-09
Publication date: 2023-04-11
Anticipated expiration: 2033-01-09

Abstract

The utility model discloses a silica gel heat conduction pad of high-efficient heat conduction, its technical scheme is: including heat conduction pad body, the inside heat conduction mechanism that is equipped with of heat conduction pad body, heat conduction mechanism include the heat-conducting layer, and heat-conducting layer bottom fixed connection has the foundation layer, and the foundation layer bottom is inside to be inlayed and is equipped with a plurality of enhancement layers, foundation layer bottom fixedly connected with even layer, and even layer bottom fixedly connected with pastes the layer, pastes the layer bottom and is equipped with the isolation layer, the beneficial effects of the utility model are that: through the heat-conducting layer, the setting of basic unit and homogeneous layer, and every layer all uses different materials to make, thereby make the structure of leading the gasket no longer single, the heat transfer efficiency has been increased simultaneously, the setting of homogeneous layer and articulamentum can be so that the heat that gives off can be by even transmission simultaneously, avoid the problem of heat concentration, the setting of enhancement layer can strengthen the heat-conducting pad performance, give its excellent mechanical strength, the setting of isolation layer can prevent to paste the layer and can stick other objects before using simultaneously.

Description

Silica gel heat conduction pad of high-efficient heat conduction

Technical Field

The utility model relates to a silica gel pad heat conduction technical field, concretely relates to silica gel heat conduction pad of high-efficient heat conduction.

Background

The heat-conducting bonding sealing silicone rubber is a single-component, heat-conducting and room-temperature curing organic silicon bonding sealant. The heat conducting pad has excellent cold and hot alternation resistance, ageing resistance and electric insulation performance, has good heat conducting capacity and high-grade voltage resistance, is a substitute product for heat conducting silicone grease, has certain flexibility, and is well attached between a power device and a heat radiating aluminum sheet or a machine shell so as to achieve the best heat conducting and radiating purposes.

The existing heat conducting pad is made of heat conducting silica gel, the heat radiating speed is low, the heat conducting pad is single in structure, the heat transfer efficiency is poor, and the heat conducting pad is easy to deform during use and even torn due to the fact that the heat conducting pad is soft in texture during use, so that the use is influenced.

Disclosure of Invention

Therefore, the utility model provides a silica gel heat conduction pad of high-efficient heat conduction through the cooperation of each structure to solve above-mentioned current problem of proposing.

In order to achieve the above object, the present invention provides the following technical solutions: a silica gel heat conducting pad with high heat conduction efficiency comprises a heat conducting pad body, wherein a heat conducting mechanism is arranged inside the heat conducting pad body;

the heat conduction mechanism comprises a heat conduction layer, the bottom of the heat conduction layer is fixedly connected with a base layer, a plurality of reinforcing layers are embedded in the bottom of the base layer, the bottom of the base layer is fixedly connected with an even layer, the bottom of the even layer is fixedly connected with a pasting layer, an isolation layer is arranged at the bottom of the pasting layer, and a thin sheet is fixedly connected to one side of the isolation layer.

Preferably, the heat conducting layer is made of graphene material.

Preferably, a heat dissipation main groove is formed in the heat conduction layer, a plurality of heat dissipation auxiliary grooves are formed in the bottom of the heat dissipation main groove, and the plurality of heat dissipation auxiliary grooves are uniformly distributed in a linear shape.

Preferably, the base layer is made of a thermally conductive silicone material.

Preferably, the reinforcing layer is made of a glass fiber material.

Preferably, the uniform layer is made of copper foil.

Preferably, the adhesive layer is made of an acrylic adhesive material.

Preferably, the barrier layer is made of a PET material.

Preferably, a plurality of connecting layers are embedded in the pasting layer.

Preferably, the connecting layer is made of an aluminum foil material.

The utility model has the advantages that:

the utility model discloses a heat-conducting layer, the setting of basal layer and articulamentum, and every layer all uses different materials to make, thereby make the structure of leading the gasket no longer single, the heat transfer efficiency has been increased simultaneously, the setting of while articulamentum and articulamentum can be so that the heat that gives off can be evenly transmitted, avoid the problem of heat concentration, the setting of enhancement layer can strengthen the heat conduction pad performance, give its excellent mechanical strength, the setting of isolation layer can prevent to paste the layer and can stick other objects before using simultaneously.

Drawings

Fig. 1 is a schematic view of the overall structure provided by the present invention;

fig. 2 is a front sectional view provided by the present invention;

fig. 3 is an enlarged view of a portion a in fig. 2 according to the present invention.

In the figure: 1 heat conducting pad body, 2 heat conducting layers, 3 basic layers, 4 reinforcing layers, 5 uniform layers, 6 adhesive layers, 7 isolating layers, 8 sheets, 9 heat dissipation main grooves, 10 heat dissipation auxiliary grooves and 11 connecting layers.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Referring to the attached drawings 1-3, the utility model provides a silica gel heat conducting pad with high heat conduction efficiency, which comprises a heat conducting pad body 1, wherein a heat conducting mechanism is arranged inside the heat conducting pad body 1;

the heat conduction mechanism comprises a heat conduction layer 2, the bottom of the heat conduction layer 2 is fixedly connected with a base layer 3, a plurality of reinforcing layers 4 are embedded in the bottom of the base layer 3, the bottom of the base layer 3 is fixedly connected with an even layer 5, the bottom of the even layer 5 is fixedly connected with an adhesive layer 6, the bottom of the adhesive layer 6 is provided with an isolation layer 7, and one side of the isolation layer 7 is fixedly connected with a sheet 8;

in the embodiment, the arrangement of the middle heat-conducting layer 2, the base layer 3, the uniform layer 5 and the connecting layer 11 of the utility model can not only ensure the heat-conducting efficiency, but also avoid the single mechanism of the heat-conducting pad, and the arrangement of the reinforcing layer 4 can increase the mechanical property of the heat-conducting pad, thereby avoiding the deformation;

wherein, in order to realize the purpose that can carry out gradual transfer to the heat, this device adopts following technical scheme to realize: the heat conduction layer 2 is made of graphene materials, a heat dissipation main groove 9 is formed in the heat conduction layer 2, a plurality of heat dissipation auxiliary grooves 10 are formed in the bottom of the heat dissipation main groove 9, the heat dissipation auxiliary grooves 10 are linearly and uniformly distributed, the base layer 3 is made of heat conduction silica gel materials, the reinforcing layer 4 is made of glass fiber materials, the arrangement of the graphene materials can ensure the heat conduction efficiency and can also increase the mechanical strength of the whole heat conduction pad, the arrangement of the heat dissipation main groove and the heat dissipation auxiliary grooves can greatly increase the heat dissipation efficiency, the arrangement of the heat conduction silica gel materials can be matched with other materials well, so that heat conduction is completed, and the arrangement of the glass fiber materials can also greatly increase the strength of the whole heat conduction pad;

wherein, in order to realize can preventing to paste the purpose that layer 6 can stick other objects before using the heat conduction pad, this device adopts following technical scheme to realize: the uniform layer 5 is made of copper foil, the adhesive layer 6 is made of acrylic resin adhesive material, the isolation layer 7 is made of PET material, the arrangement of the copper foil can well ensure the uniformity of heat conduction, the acrylic resin adhesive material has good viscosity and heat resistance, and the arrangement of the PET material can prevent the adhesive layer from contacting other objects and protect the adhesive layer;

wherein, in order to realize the purpose that can make radiating heat can be transferred evenly, this device adopts following technical scheme to realize: paste 6 inside inlays of layer and be equipped with a plurality of articulamentum 11, articulamentum 11 is made by the aluminium foil material, and the setting of aluminium foil material can cooperate with the copper foil, not only can accomplish thermal transmission, can make the heat more even when the transmission simultaneously to the efficiency of conduction has been increased.

The utility model discloses a use as follows: firstly pull the thin sheet 8 and tear the isolation layer 7 down, just so can expose pasting the layer 6, and paste layer 6 and paste heat conduction pad body 1 on the object surface of required heat conduction, later when the object during operation, the heat that it gived off will be through articulamentum 11 and uniform layer 5, articulamentum 11 and uniform layer 5 are made by aluminium foil and copper foil material respectively, thereby can make the heat can be by even conduction, later the heat passes through basic layer 3, basic layer 3 not only can conduct the heat effectively, enhancement layer 4 in basic layer 3 can increase the mechanicalness of heat conduction pad effectively simultaneously, thereby avoided the heat conduction pad can take place the deformation, later heat dissipation main trough 9 and heat dissipation auxiliary trough 10 can disperse the heat, heat conduction layer 2 also can pass through outside cooling device, cool down the heat dissipation to the heat.

The above description is only a preferred embodiment of the present invention, and any person skilled in the art may modify the present invention or modify it into an equivalent technical solution by using the technical solutions described above. Therefore, any simple modifications or equivalent replacements made according to the technical solution of the present invention belong to the scope of protection claimed by the present invention as far as possible.

Claims

1. The utility model provides a silica gel heat conduction pad of high-efficient heat conduction, includes heat conduction pad body (1), its characterized in that: a heat conducting mechanism is arranged inside the heat conducting pad body (1);

heat-conducting mechanism includes heat-conducting layer (2), heat-conducting layer (2) bottom fixed connection has basal layer (3), basal layer (3) bottom is inside to be inlayed and is equipped with a plurality of enhancement layers (4), basal layer (3) bottom fixedly connected with uniform layer (5), uniform layer (5) bottom fixedly connected with pastes layer (6), it is equipped with isolation layer (7) to paste layer (6) bottom, isolation layer (7) one side fixedly connected with thin slice (8).

2. The silica gel heat conduction pad with high efficiency of heat conduction as claimed in claim 1, wherein: the heat conduction layer (2) is made of graphene materials.

3. The silica gel heat conduction pad with high efficiency of heat conduction as claimed in claim 1, wherein: heat-conducting layer (2) inside heat dissipation owner groove (9) of having seted up, a plurality of heat dissipation auxiliary tank (10) have been seted up to heat dissipation owner groove (9) bottom, and a plurality of heat dissipation auxiliary tank (10) are linear evenly distributed.

4. The silica gel heat conduction pad with high efficiency of heat conduction as claimed in claim 1, wherein: the base layer (3) is made of a heat-conducting silica gel material.

5. The silica gel heat conduction pad with high efficiency of heat conduction as claimed in claim 1, wherein: the reinforcing layer (4) is made of a glass fiber material.

6. The silica gel heat conduction pad with high efficiency of heat conduction as claimed in claim 1, wherein: the uniform layer (5) is made of copper foil.

7. The silica gel heat conduction pad with high efficiency of heat conduction as claimed in claim 1, wherein: the adhesive layer (6) is made of acrylic resin adhesive material.

8. The silica gel heat conduction pad with high efficiency of heat conduction as claimed in claim 1, wherein: the isolation layer (7) is made of PET material.

9. A silica gel heat conduction pad with high efficiency of heat conduction as claimed in claim 1, wherein: a plurality of connecting layers (11) are embedded in the pasting layer (6).

10. The silica gel heat conduction pad with high efficiency of heat conduction as claimed in claim 9, wherein: the connecting layer (11) is made of an aluminum foil material.