CN218827021U

CN218827021U - Scanning manipulator

Info

Publication number: CN218827021U
Application number: CN202222852074.0U
Authority: CN
Inventors: 郝瀚
Original assignee: Beijing Jingyi Automation Equipment Co Ltd
Current assignee: Beijing Jingyi Automation Equipment Co Ltd
Priority date: 2022-10-27
Filing date: 2022-10-27
Publication date: 2023-04-07
Anticipated expiration: 2032-10-27

Abstract

The utility model provides a scanning manipulator, which relates to the technical field of semiconductor manufacturing, and comprises a substrate and an opposite sensor assembly, wherein the substrate comprises a substrate main body and two supporting parts, the two supporting parts are arranged at the first end of the substrate main body at intervals, the substrate main body and the two supporting parts are positioned on the same plane, and a gap is formed between the two supporting parts; the correlation sensor assembly comprises an incidence sensor and a receiving sensor, and the incidence sensor and the receiving sensor are respectively arranged at one end, far away from the substrate main body, of the two supporting parts in a one-to-one correspondence mode. The utility model provides a scanning mechanical arm sets up correlation sensor assembly through the one end of keeping away from the base plate main part at manipulator base plate supporting part, can scan the quantity of the interior storage wafer of definite wafer casket to the manipulator transports the whole transportation of wafer in the wafer casket at actual in-process accuracy.

Description

Scanning manipulator

Technical Field

The utility model relates to a semiconductor manufacturing technical field especially relates to a scanning manipulator.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. Wafers are the carrier used in the production of integrated circuits, and are the most commonly used semiconductor materials, and are classified into 6-inch and 8-inch specifications according to their diameters, and in recent years, 12-inch and larger wafers have been developed to meet the needs of semiconductor manufacturing. With the increasing size of wafers, the requirements for the wafer manufacturing process are also increasing.

A wafer cassette is a device for storing and transferring wafers. In the wafer manufacturing process, wafers need to be taken out of the wafer cassette and sent to the processing station for many times, and then sent to the wafer cassette for storage or transfer after the processing is completed. A robot is a device for taking wafers out of a cassette, transferring wafers from a processing station into a cassette, and transferring wafers between different processing stations.

Due to the fact that the number of the wafers stored in the wafer box is different, the technical problem that all the wafers in the wafer box cannot be accurately transferred exists in the actual wafer transferring process of the manipulator.

SUMMERY OF THE UTILITY MODEL

The utility model provides a scanning manipulator for solve among the prior art can't the accuracy with the whole technical problem who transports of wafer in the wafer casket.

The utility model provides a scanning manipulator, include:

the substrate comprises a substrate main body and two supporting parts, wherein the two supporting parts are arranged at the first end of the substrate main body at intervals, the substrate main body and the two supporting parts are positioned on the same plane, and a gap is formed between the two supporting parts;

the correlation sensor assembly comprises an incidence sensor and a receiving sensor, wherein the incidence sensor and the receiving sensor are respectively arranged at one end, far away from the substrate main body, of the two supporting parts in a one-to-one correspondence mode.

According to the utility model provides a scanning manipulator, incident sensor with receiving sensor all outstanding in the supporting part is kept away from the one end of base plate main part.

According to the utility model discloses the embodiment provides a scanning manipulator still includes:

the two sensor cover plates are arranged at one ends, far away from the base plate main body, of the supporting parts in a one-to-one correspondence mode and detachably connected with the corresponding supporting parts, and the incident sensors and the receiving sensors are arranged on the corresponding sensor cover plates and located between the sensor cover plates and the supporting parts.

According to the utility model provides a pair of scanning manipulator, the supporting part is kept away from the one end of base plate main part is provided with the mounting groove, incident sensor with receiving sensor inlays and locates correspondingly in the mounting groove.

According to the utility model provides a pair of scanning manipulator, scanning manipulator's maximum thickness is less than 4mm.

According to the utility model provides a pair of scanning manipulator, the surface of base plate is provided with the wire casing, incident sensor with the cable of receiving sensor inlays and locates in the wire casing.

the contact pieces are arranged on the base plate, a plurality of air suction holes are formed in the base plate, air passages communicated with the air suction holes are formed in the base plate, and fixing parts are arranged on the periphery of the air suction holes; the plurality of contact pieces are arranged around the periphery of the air suction hole in a one-to-one correspondence manner and are connected with the fixing part.

According to the utility model provides a scanning manipulator, the fixed part includes the annular dovetail, the contact inlays to be located the annular dovetail.

According to the utility model provides a scanning manipulator, the contact includes the sealing washer, the sealing washer inlays to be located in the annular dovetail.

According to the utility model provides a scanning manipulator, the contact includes the sucking disc, the sucking disc inlays to be located in the annular dovetail.

The embodiment of the utility model provides a scanning manipulator can confirm the quantity of the interior storage wafer of wafer casket through correlation sensor assembly to the manipulator accuracy is with the whole transports of wafer in the wafer casket. In addition, the notch is arranged on the substrate, so that the weight of the substrate can be reduced, and the bearing capacity of the manipulator is improved.

Drawings

In order to more clearly illustrate the technical solutions of the present invention or the prior art, the following briefly introduces the drawings required for the embodiments or the prior art descriptions, and obviously, the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic front view of a scanning robot according to an embodiment of the present invention;

fig. 2 is a schematic diagram of a scanning robot according to an embodiment of the present invention;

fig. 3 is a second schematic view of a front view structure of a scanning robot according to an embodiment of the present invention;

fig. 4 isbase:Sub>A schematic side view ofbase:Sub>A scanning robot according to an embodiment of the present invention, alongbase:Sub>A section linebase:Sub>A-base:Sub>A;

fig. 5 is a schematic view illustrating an assembly relationship between a sealing ring and a fixing portion according to an embodiment of the present invention;

fig. 6 is a schematic view of an assembly relationship structure between the suction cup and the fixing portion according to an embodiment of the present invention.

Reference numerals:

100. a substrate; 110. an airway; 120. a suction hole; 130. a fixed part; 140. a substrate main body; 150. a support portion; 200. a contact member; 210. a seal ring; 220. a suction cup; 221. a connecting portion; 300. a correlation sensor assembly; 310. an incident sensor; 320. receiving a sensor; 400. a sensor cover plate; 500. a wire slot; 600. a mechanical arm connecting shaft; 700. an optical fiber amplifier; 800. a wafer cassette; 900. and (5) a wafer.

Detailed Description

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description of the embodiments and for simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the embodiments of the present invention can be understood in specific cases by those skilled in the art.

In embodiments of the invention, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

A scanning robot according to an embodiment of the present invention will be described with reference to fig. 1 to 6.

Fig. 1 illustrates one of the schematic structural diagrams of the main view of the scanning robot provided in the embodiment of the present invention, and fig. 2 illustrates the working schematic diagram of the scanning robot provided in the embodiment of the present invention, as shown in fig. 1 and fig. 2, the scanning robot includes a substrate 100 and a correlation sensor assembly 300. The substrate 100 includes a substrate main body 140 and two supporting parts 150. The two supporting portions 150 are disposed at the first end of the substrate body 140 at intervals, the substrate body 140 and the two supporting portions 150 are in the same plane, and a gap is formed between the two supporting portions 150. The correlation sensor assembly 300 includes an incident sensor 310 and a receiving sensor 320. The incident sensors 310 and the receiving sensors 320 are respectively disposed at one end of the two supporting parts 150 away from the substrate body 140 in a one-to-one correspondence manner.

When the robot scans the wafer 900 in the wafer cassette 800, the robot extends the substrate 100 to the outside of the wafer 900 in the wafer cassette 800, and the opposite-type sensor assembly senses the outer arc edge of the wafer 900. The robot scans vertically from top to bottom across all the wafers 900 in the cassette 800, thereby counting the number of wafers 900 in the cassette 800.

Specifically, when the wafer 900 is between the incident sensor 310 and the receiving sensor 320 as a shield, the correlation sensor assembly 300 outputs a signal "0". By counting the output times of the "0" signal, the number of the wafers 900 in the wafer cassette 800 can be known, which is convenient for the robot to accurately adsorb, transfer and store all the wafers 900 in the wafer cassette 800.

In addition, the provision of the notch in the substrate 100 can reduce the weight of the substrate 100 and increase the carrying weight of the robot.

In the embodiment of the present invention, the material of the substrate 100 may be a non-metallic material such as ceramic, silicon carbide, or quartz with good corrosion resistance. The substrate 100 is made of a non-metallic material with good corrosion resistance, which has two functions: on one hand, the wafer 900 can be prevented from being polluted by substances generated by self corrosion of the substrate 100 in the process of adsorbing the wafer 900; on the other hand, the life of the substrate 100 can be prevented from being shortened by the cleaning with the corrosive liquid.

Of course, the material of the substrate 100 may also be an aluminum alloy with good corrosion resistance and light density. On one hand, the corrosion resistance of the aluminum alloy is good, on the other hand, the aluminum alloy has light weight, and the bearing weight of the manipulator can be reduced.

In the embodiment of the present invention, the substrate 100 is a Y-shaped plate. The two support parts 150 forming the Y-shaped fork increase the distance for supporting the wafer 900 compared to the single support part 150, so that the chuck 220 has better stability for adsorbing the wafer 900.

In the embodiment of the present invention, the incident sensor 310 and the receiving sensor 320 protrude from one end of the supporting portion 150 away from the substrate body 140, so that the incident sensor 310 and the receiving sensor 320 can transmit and receive signals.

In an embodiment of the present invention, the scanning robot further includes two sensor cover plates 400. The two sensor cover plates 400 are correspondingly disposed at one ends of the two supporting portions 150 far away from the substrate body 140, and are detachably connected to the corresponding supporting portions 150. The incident sensor 310 and the receiving sensor 320 are mounted to the corresponding sensor cover 400 and between the sensor cover 400 and the support 150. When the correlation sensor assembly 300 is not needed, the correlation sensor assembly 300 can be conveniently removed, and the correlation sensor assembly 300 is prevented from being damaged.

In the embodiment of the present invention, the sensor cover 400 is detachably mounted on the support part 150 by screws.

In an embodiment of the present invention, the sensor cover 400 may be detachably mounted on the supporting portion 150 by a snap connection or a hinge connection.

In the embodiment of the present invention, the end of the supporting portion 150 away from the substrate main body 140 is provided with a mounting groove, and the incident sensor 310 and the receiving sensor 320 are embedded in the corresponding mounting grooves. Embedding the incident sensor 310 and the receiving sensor 320 in the corresponding mounting grooves has two functions. On one hand, the mounting groove can fix the incident sensor 310 and the receiving sensor 320, so as to prevent the incident sensor 310 and the receiving sensor 320 from shaking, and protect the incident sensor 310 and the receiving sensor 320. On the other hand, since the distance between two wafers 900 in the wafer cassette 800 is only 10mm, the thickness of the scanning robot can be reduced by embedding the incident sensor 310 and the receiving sensor 320 in the corresponding mounting slots, and the robot is prevented from scratching other wafers 900 during the process of transferring the wafers 900.

The utility model discloses an in the embodiment, scanning manipulator's maximum thickness is less than 4mm, further avoids the manipulator at the in-process of transporting wafer 900 with wafer 900 fish tail.

In the embodiment of the present invention, the surface of the substrate 100 is provided with the wire groove 500, and the cables of the incident sensor 310 and the receiving sensor 320 are embedded in the wire groove 500. Embedding the cables of the incident sensor 310 and the receiving sensor 320 in the raceway arrangement 500 has two functions. On the one hand, the wire duct 500 can fix the cables incident to the sensor 310 and the receiving sensor 320, so as to prevent the cables from shaking and protect the cables. On the other hand, the cables of the incident sensor 310 and the receiving sensor 320 are embedded in the wire chase 500, so that the thickness of the scanning robot can be reduced, and the wafer 900 is prevented from being scratched by the robot in the process of transferring the wafer 900.

In an embodiment of the present invention, the cables of the incident sensor 310 and the receiving sensor 320 are embedded in the wire chase 500 and connected to the optical fiber amplifier 700. The optical fiber amplifier 700 is installed inside the robot connecting shaft 600, and the robot connecting shaft 600 connects the substrate and the robot arm. By installing the optical fiber amplifier 700 inside the robot connecting shaft 600, the operation surface is on the outside for easy observation operation. When the manipulator connecting shaft drives the substrate to vertically scan the outer sides of the wafers 900 in the wafer cassette 800 from top to bottom, the correlation sensor assembly senses the outer circular arc edges of the wafers 900, so that the position information of the wafers can be counted conveniently.

Fig. 3 illustratesbase:Sub>A second schematic view of the front view structure of the scanning manipulator provided by the embodiment of the present invention, and fig. 4 illustratesbase:Sub>A schematic view ofbase:Sub>A cross-sectional side view of the scanning manipulator provided by the embodiment of the present invention along the section linebase:Sub>A-base:Sub>A, as shown in fig. 3 and fig. 4, in the embodiment of the present invention, the scanning manipulator further includesbase:Sub>A plurality of contact elements 200. The substrate 100 is provided with a plurality of suction holes 120, a gas passage 110 communicating with the suction holes 120 is formed inside the substrate 100, and a fixing portion 130 is provided on the outer circumference of the suction holes 120. The plurality of contactors 200 are provided around the outer circumference of the suction hole 120 in a one-to-one correspondence, and are connected to the fixing portion 130.

When the suction holes 120 generate a negative pressure, the gas between the wafer 900 and the suction holes 120 is sucked from the gas passage, and the wafer 900 is sucked and contacts the contact 200. Since the wafer 900 is firmly fixed on the substrate 100, the wafer 900 does not fall off during the transfer process, thereby improving the quality and yield of the wafer 900.

The portion of the robot in contact with the surface of the wafer 900 in the related art is prone to accumulate small particles of matter, which may lead to instances where the wafer 900 is scrapped due to surface contamination. The scanning manipulator of the present invention has only the contact member 200 in surface contact with the wafer 900. Because the contact area between the mechanical arm and the surface of the wafer 900 is greatly reduced, the surface of the wafer 900 is prevented from being polluted when the mechanical arm adsorbs the wafer 900.

In an embodiment of the present invention, the air channel 110 is embedded in the hollow inside of the substrate 100, one end of the air channel 110 is connected to the suction hole 120, and the other end is connected to the negative pressure device. The negative pressure device sucks gas between the suction hole 120 and the wafer 900 through the gas passage 110 so that the robot can suck the wafer 900.

In an embodiment of the present invention, the air passage 110 and the negative pressure device can be connected by a quick coupling, so that the air passage 110 and the negative pressure device can be quickly disconnected or quickly connected.

In the embodiment of the present invention, two supporting portions 150 and the substrate main body 140 are formed with one suction hole 120, and the three suction holes 120 are respectively located at three vertexes of a regular triangle. In one aspect, the three suction holes 120 are located on the same plane, and the three force points forming the regular triangle structure can limit the wafer 900 to slide in all directions of the plane. On the other hand, the three suction holes 120 constituting the regular triangle structure simultaneously suck the wafer 900, and the stability of the robot sucking the wafer 900 is also better.

In the embodiment of the present invention, the air passages 110 connected to the air suction holes 120 at three vertexes of the regular triangle are distributed inside the substrate 100 in a Y-shape. The Y-shaped air passage 110 is simple in structure and convenient to manufacture.

In an embodiment of the present invention, the fixing portion 130 includes an annular dovetail groove, and the contact 200 is embedded in the annular dovetail groove. The width of the bottom of the annular dovetail groove is greater than the width of the top notch, and the contact 200 protrudes from the notch of the dovetail groove. The contact 200 can be conveniently embedded in the annular dovetail groove, and the contact 200 is not easy to fall off after being embedded in the annular dovetail groove.

In an embodiment of the present invention, the annular dovetail groove may be filled with a glue, such as glass cement. The filling colloid can play a role in fixing the contact element 200 on one hand, and prevent the contact element 200 from falling off in the process of adsorbing the wafer 900 by the manipulator, and can play a role in enhancing the sealing performance on the other hand.

In an embodiment of the present invention, the fixing portion 130 is not limited to the annular dovetail groove, but may be an elliptical dovetail groove, a rectangular dovetail groove, or a dovetail groove with other shapes, and the shape of the cross section of the fixing portion 130 is not limited to a trapezoid, and may also be a rectangle, a semicircle, or the like.

In the embodiment of the present invention, the circle center of the annular dovetail groove is overlapped with the circle center of the air suction hole 120. When the wafer 900 is sucked by the scanning robot, the suction hole 120 sucks the gas between the wafer 900 and the suction hole 120. Because the circle center of the contact element 200 is overlapped with the circle center of the air suction hole 120, the negative pressure acting force of the air suction hole 120 at any position of the contact surface of the contact element 200 and the wafer 900 is the same, and the stability of the manipulator in wafer 900 transportation is improved.

Fig. 5 illustrates an assembly relationship structure diagram of the sealing ring 210 and the fixing portion 130 according to an embodiment of the present invention, and as shown in fig. 5, in an embodiment of the present invention, the contact element 200 includes the sealing ring 210, and the sealing ring 210 is embedded in the annular dovetail groove. By adopting the annular dovetail groove to install the sealing ring 210, the installation of the sealing ring 210 is facilitated, and the sealing ring 210 is more firm after being installed.

The sealing ring 210 is made of rubber, and the deformation rate of the rubber material is large. When the seal ring 210 deforms, the contact surface between the seal ring 210 and the wafer 900 is increased, so that good contact between the seal ring 210 and the wafer 900 can be effectively ensured, and the sealing performance between the seal ring 210 and the wafer 900 is enhanced. Since the sealing ring 210 is elastically deformed when being pressed by the wafer 900, the sealing ring 210 may further fill the inner space of the annular dovetail groove, and further perform a sealing function between the wafer 900 and the suction hole 120. In addition, the stability of the sealing ring 210 assembled in the annular dovetail groove can be enhanced after the sealing ring 210 deforms. Since the contact 200 is not easy to fall off in the process of adsorbing the wafer 900 by the manipulator, the stability of adsorbing the wafer 900 is improved. Because the seal ring 210 is made of a flexible material, the scanning robot does not damage the wafer 900 due to excessive negative pressure.

In an embodiment of the present invention, the sealing ring 210 may be made of polyurethane rubber. The sealing ring 210 made of the urethane rubber has good wear resistance, and is less worn when the manipulator adsorbs the wafer 900, so that the sealing ring 210 made of the urethane rubber has a long service life.

In an embodiment of the present invention, the material of the sealing ring 210 may be nitrile rubber or fluorine rubber. Because the air permeability of the nitrile rubber or fluororubber sealing ring 210 is low, and the performance is stable in a high-temperature environment, the nitrile rubber or fluororubber sealing ring 210 has good sealing performance, and air leakage is not easy to occur in the process of adsorbing the wafer 900 by the manipulator.

In an embodiment of the present invention, a coating layer for preventing adhesion, such as a teflon coating, may be disposed on the surface of the sealing ring 210 directly contacting the wafer 900. When the vacuum is released, van der waals force is easily generated between the sealing ring 210 and the wafer 900, so that the wafer 900 and the sealing ring 210 are adhered. By providing the adhesion-preventing coating on the surface of the sealing ring 210 directly contacting the wafer 900, the adhesion between the sealing ring 210 and the wafer 900 when the wafer 900 is released can be avoided.

In an embodiment of the present invention, when the cross-section of the fixing portion 130 is semicircular and the contact 200 includes the sealing ring 210, the buffer portion is formed on the inner wall surface of the annular semicircular groove. The buffer portion provides a buffer space for the contact 200 that is expanded and deformed when the contact 200 is subjected to the negative pressure of the wafer 900 and is expanded and deformed. By providing the buffer portion on the inner wall surface of the annular semicircular groove, the internal stress of the contact element 200 can be effectively reduced, and the damage of the contact element 200 due to continuous stress accumulation can be reduced, thereby prolonging the service life of the contact element 200.

In an embodiment of the present invention, when the fixing portion 130 is a rectangular dovetail groove and the contact member 200 includes the sealing ring 210, the contact member 200 can be uniformly deformed in all aspects by the negative pressure. Because the contact piece has higher filling degree in the rectangular dovetail groove, the reciprocating movement of the contact piece 200 can be reduced when the pressure changes, and the contact piece 200 is prevented from driving the wafer 900 to slide.

Fig. 6 illustrates an assembly relationship structure diagram of the suction cup 220 and the fixing portion 130 according to an embodiment of the present invention, as shown in fig. 6, in an embodiment of the present invention, the contact element 200 includes the suction cup 220, and the suction cup 220 is embedded in the annular dovetail groove.

In the embodiment of the present invention, the suction cup 220 is ring-shaped, the suction cup 220 forms the connection portion 221 toward one side of the suction hole 120, the connection portion 221 is bonded to the substrate 100, the center of the connection portion 221 is formed with a through hole, and the through hole is communicated with the suction hole 120. By arranging the connecting part 221, the contact surface of the sucker 220 and the substrate 100 is increased when being adhered, the bonding force between the sucker 220 and the substrate 100 is enhanced, and the sucker 220 is ensured not to fall off the substrate 100 easily.

The embodiment of the utility model provides an in, the internal diameter of through-hole is greater than the internal diameter of suction hole 120, can improve the inspiratory rate, and the gas between suction hole 120 and wafer 900 is taken away more fast, and the efficiency that the wafer 900 was adsorbed to the manipulator is higher.

In one embodiment of the present invention, the surface of the chuck 220 contacting the wafer 900 is provided with a detachable pad, which is in direct contact with the wafer 900. As the robot continues to pick up the wafer 900, the surface of the chuck 220 in direct contact with the wafer 900 accumulates small particles of material, eventually necessitating cleaning of the entire chuck 220 and hence the robot. By providing a removable pad on the surface of the chuck 220 that contacts the wafer 900, the entire chuck 220 and hence the robot need not be cleaned. Along with gasket and wafer 900 direct contact, little material granule constantly accumulates, only need with the gasket dismantle change can, prolonged the operating time of manipulator.

In the embodiment of the present invention, the suction cup 220 is made of polymer material. When the chuck 220 is made of a polymer material, no adhesion occurs between the chuck 220 and the wafer 900.

In another embodiment of the present invention, a coating layer for preventing adhesion, such as teflon coating, is disposed on the portion of the chuck 220 directly contacting the wafer 900 to prevent the wafer 900 from adhering to the chuck 220 when the wafer 900 is released.

To avoid the robot scratching the wafer 900, the thickness of the substrate 100 is set to 3 mm. The thickness of the substrate 100 and the sealing ring 210 is not more than 4mm after the sealing ring 210 is installed. The overall thickness of the substrate 100 and chuck 220 after mounting of the chuck 220 is also no greater than 4mm.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. A scanning robot, comprising:

2. The scanning robot of claim 1, wherein the incident sensor and the receiving sensor each protrude from an end of the support portion away from the substrate body.

3. The scanning robot of claim 1, further comprising:

the two sensor cover plates are arranged at one end, far away from the base plate main body, of the supporting part in a one-to-one correspondence mode and detachably connected with the corresponding supporting part, and the incident sensor and the receiving sensor are installed on the corresponding sensor cover plates and located between the sensor cover plates and the supporting part.

4. The scanning robot of claim 3, wherein an end of the supporting portion away from the substrate main body is provided with a mounting groove, and the incident sensor and the receiving sensor are embedded in the corresponding mounting grooves.

5. A scanning robot as claimed in any of claims 1 to 3, wherein the maximum thickness of the scanning robot is less than 4mm.

6. The scanning robot of claim 5, wherein the surface of the base plate is provided with a wire slot in which the cables of the incident sensor and the receiving sensor are embedded.

7. The scanning robot of any of claims 1-3, further comprising:

the contact pieces are arranged on the substrate, a plurality of air suction holes are formed in the substrate, an air passage communicated with the air suction holes is formed in the substrate, and a fixing part is arranged on the periphery of each air suction hole; the plurality of contact pieces are arranged around the periphery of the air suction hole in a one-to-one correspondence manner and are connected with the fixing part.

8. The scanning robot of claim 7, wherein said fixing portion comprises an annular dovetail groove, and said contact member is fitted in said annular dovetail groove.

9. The scanning robot of claim 8, wherein the contact member comprises a seal ring embedded in the annular dovetail slot.

10. The scanning robot of claim 8, wherein said contact member comprises a suction cup, said suction cup being embedded in said annular dovetail slot.