CN218826973U

CN218826973U - Silicon chip detection structure

Info

Publication number: CN218826973U
Application number: CN202320047981.XU
Authority: CN
Inventors: 徐新华; 冯会来
Original assignee: Zhejiang Lishui Zhongxin Wafer Semiconductor Technology Co ltd
Current assignee: Zhejiang Lishui Zhongxin Wafer Semiconductor Technology Co ltd
Priority date: 2023-01-03
Filing date: 2023-01-03
Publication date: 2023-04-07
Anticipated expiration: 2033-01-03

Abstract

The utility model belongs to the technical field of silicon chip production, especially, relate to a silicon chip detects structure, include: the detection box body is internally provided with a detection camera; the conveying belt can penetrate through the detection box body; further comprising: the surface cleaning piece is arranged in the detection box body and positioned on the front side of the detection camera and used for cleaning residual liquid on the surface of the silicon wafer before the silicon wafer is detected; the rotating piece is arranged below the conveying belt and used for rotating the silicon wafer on the conveying belt; wherein, the rotating member is located and detects the camera under, for prior art, the utility model discloses can improve the silicon chip and detect the precision.

Description

Silicon chip detection structure

Technical Field

The utility model belongs to the technical field of silicon chip production facility, especially, relate to a silicon chip detects structure.

Background

A chip made of a silicon chip is a famous 'magic calculator', has remarkable calculation capability, no matter how complex mathematical problems, physical problems and engineering problems are, no matter how large the calculation workload is, a worker only needs to tell the problem through a computer keyboard and issues thinking and instructions for solving the problem, a computer can tell the answer in a very short time, and in the production process of the silicon chip, the silicon chip needs to be detected through a detection structure to screen out unqualified chips with cracks, broken edges and stress concentration points so as to improve the production quality of the silicon chip.

SUMMERY OF THE UTILITY MODEL

The utility model aims at the technical problem who exists to the aforesaid, provide a silicon chip detection mechanism, reach the effect that improves the detection precision.

In view of this, the utility model provides a silicon chip detects structure, include:

the detection box body is internally provided with a detection camera;

the conveying belt can penetrate through the detection box body;

further comprising:

the surface cleaning piece is arranged in the detection box body and positioned on the front side of the detection camera and used for cleaning residual liquid on the surface of the silicon wafer before the silicon wafer is detected;

the rotating piece is arranged below the conveying belt and used for rotating the silicon wafer on the conveying belt;

wherein, the rotating member is positioned right below the detection camera.

In this technical scheme, when detecting the silicon chip, place the silicon chip and make the silicon chip remove to detecting the camera along with the removal of conveyer belt after on the conveyer belt, the silicon chip is removing to the in-process that detects is carried out to detecting the camera before the camera through surface cleaning spare, surface cleaning spare can clear up silicon chip surface remaining liquid, thereby improve the precision that the silicon chip detected, the silicon chip is moving to detecting the camera below and is detecting simultaneously, the rotating member can drive the silicon chip and rotate, thereby prevent to lead to the phenomenon of missing the detection to appear in the defect on silicon chip surface because of the angle problem, the detection precision of silicon chip has further been improved.

In the above technical solution, further, the surface cleaning member further includes:

the air curtain generating device is arranged in the detection box body;

the air curtain spray head is arranged above the conveying belt and used for generating an air curtain on the surface of the silicon wafer;

wherein, the air curtain spray head is connected with the air curtain generating device.

In the above technical solution, further, the rotating member further includes:

the lifting device is provided with a plurality of suckers;

the rotating device is arranged below the lifting device;

the rotating device is connected with the lifting device to drive the lifting device to rotate, and the conveying belt is provided with a lifting hole for the lifting device to extend out.

In the above technical solution, further, the method further includes:

the limiting rings are provided with a plurality of limiting rings, and the plurality of limiting rings are uniformly distributed at intervals along the length direction of the conveying belt and used for fixing the silicon wafers.

In the above technical solution, further, the method further includes:

and the liquid suction roller is arranged at the discharge end of the conveying belt and is used for cleaning liquid on the conveying belt.

The utility model has the advantages that:

1. the arrangement of the surface cleaning piece and the rotating piece improves the detection precision of the silicon wafer, and prevents gaps of false detection and missed detection;

2. the arrangement of the limiting ring improves the placing stability of the silicon wafer and prevents the silicon wafer from displacement in the conveying process;

3. the liquid suction roller is arranged to ensure the cleanliness of the surface of the conveyor belt and reduce the liquid residue on the surface of the conveyor belt.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of an embodiment of the present invention.

Fig. 2 is a schematic view of the top view structure of the present invention.

Fig. 3 is a schematic view of the cross-sectional structure of the present invention.

Fig. 4 is a schematic structural view of the surface cleaning member of the present invention.

Fig. 5 is a schematic structural view of the rotating member of the present invention.

The labels in the figures are:

the method comprises the following steps of 1-detecting a box body, 2-detecting a camera, 3-conveying belt, 4-surface cleaning piece, 40-air curtain generating device, 41-air curtain spray head, 5-rotating piece, 50-lifting device, 51-suction cup, 52-rotating device, 53-lifting hole, 6-limiting ring and 7-liquid suction roller.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present application, it is to be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. For convenience of description, the dimensions of the various features shown in the drawings are not necessarily drawn to scale. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

Example 1:

the embodiment of the application provides a silicon chip detection structure, including: the detection device comprises a detection box body 1, wherein a detection camera 2 is arranged in the detection box body 1; the conveying belt 3 can penetrate through the detection box body 1;

further comprising: the surface cleaning piece 4 is arranged in the detection box body 1 and is positioned on the front side of the detection camera 2 and used for cleaning residual liquid on the surface of the silicon wafer before the silicon wafer is detected; the rotating piece 5 is arranged below the conveying belt 3 and used for rotating the silicon wafers on the conveying belt 3;

wherein, the rotating member 5 is positioned right below the detection camera 2.

And, the both sides of detecting the box can be opened and be equipped with the opening that supplies the conveying to pass, and the conveyer belt passes the detection box by the opening, and the conveyer belt is conventional through motor drive's conveyer belt, and the silicon chip can be placed at the upper band surface of conveyer belt and move along with the removal of conveyer belt, detects camera fixed mounting and just is located the top of conveyer belt in the inside of detecting the box, thereby the conveyer belt can carry out under the drive of motor step-by-step silicon chip that awaits measuring to the below of detecting the camera in proper order.

In this embodiment, when detecting the silicon chip, place the silicon chip and make the silicon chip remove to detecting the camera along with the removal of conveyer belt after on the conveyer belt, the silicon chip is removing to passing through surface cleaning spare before detecting the camera, surface cleaning spare can clear up the remaining liquid in silicon chip surface, thereby improve the precision that the silicon chip detected, the silicon chip is moving to the in-process that detects to detecting the camera below simultaneously, the rotating member can drive the silicon chip and rotate, thereby prevent to lead to the phenomenon of missing the detection to appear in the defect on silicon chip surface because of the angle problem, the detection precision of silicon chip has further been improved.

Example 2:

the embodiment provides a silicon wafer detection structure, which includes the technical solutions of the above embodiments, and further has the following technical features, and the surface cleaning member 4 further includes: the air curtain generating device 40, the air curtain generating device 40 is set up in the detection container body 1; the air curtain spray head 41 is arranged above the conveying belt 3 and used for generating an air curtain on the surface of the silicon wafer;

wherein, the air curtain nozzle 41 is connected with the air curtain generating device 40.

Moreover, the air curtain generating device 40 is a conventional air curtain generating device such as an air curtain machine, the air curtain generating device 40 is fixedly installed in the detection box body 1, the air curtain generating device 40 can be connected with an air curtain spray head 41 through an air pipe, the air curtain spray head 41 can spray a fan-shaped air curtain, the area of the air curtain is larger than the surface area of the silicon wafer, and the air curtain can clean liquid attached to the surface of the silicon wafer along with the movement of the silicon wafer.

In the embodiment, when the silicon wafer moves to the surface cleaning member 4 along with the conveyor belt 3, the air curtain generating device 40 generates air flow and the air flow is sprayed out through the air curtain nozzle 41 to form an air curtain, and the air curtain cleans liquid remaining on the surface of the silicon wafer in the process of blowing along the surface of the silicon wafer, so that the surface of the silicon wafer is smooth and clean, and the detection precision of the detection camera 2 on the silicon wafer is improved.

Example 3:

the embodiment provides a silicon wafer detection structure, which includes the technical solutions of the above embodiments, and also has the following technical features, and the rotating member 5 further includes: the lifting device 50 is provided with a plurality of suckers 51; a rotating device 52, the rotating device 52 being disposed below the lifting device 50;

the rotating device 52 is connected to the lifting device 50 to drive the lifting device 50 to rotate, and the conveying belt 3 is provided with a lifting hole 53 through which the lifting device 50 extends.

Furthermore, the lifting device 50 is a conventional lifting device such as a lifting motor, a hydraulic cylinder or an air cylinder, the plurality of suction cups 51 are installed at a driving end of the lifting device 50, the rotating device 52 is a conventional rotating device such as a rotating motor, and a driving point of the rotating device 52 is connected to a lower end of the lifting device 50.

In this embodiment, after the silicon chip moves to the detection camera 2 below, lifting device 50 can drive a plurality of sucking discs 51 rebound and with the contact of silicon chip lower surface to adsorb the silicon chip, thereby rotary device 52 drives lifting device 50 and rotates and drive the silicon chip and rotate, adjusts the angle between silicon chip and the detection camera 2, prevents to appear the phenomenon of lou examining.

Example 4:

the embodiment provides a silicon wafer detection structure, which includes the following technical features in addition to the technical solutions of the above embodiments, and further includes: the limiting rings 6 are arranged, the limiting rings 6 are provided with a plurality of limiting rings 6, and the plurality of limiting rings 6 are uniformly distributed at intervals along the length direction of the conveying belt 3 and used for fixing the silicon wafers.

Moreover, the limiting ring 6 can be composed of two half rings, the limiting ring 6 is concentric with the lifting hole 53 on the conveying belt 3, and the silicon wafer can be placed in the limiting ring 6 for limiting.

In this embodiment, the arrangement of the limiting ring 6 improves the placing stability of the silicon wafer, and prevents the silicon wafer from displacement in the conveying process.

Example 5:

the embodiment provides a silicon wafer detection structure, which includes the following technical features in addition to the technical solutions of the above embodiments, and further includes: and the liquid suction roller 7 is arranged at the discharge end of the conveying belt 3 and used for cleaning liquid on the conveying belt 3.

The suction roller 7 may be a sponge roller, and the suction roller 7 is rotatably mounted at the discharge end of the conveyor belt 3 and abuts against the conveyor belt 3 to absorb the liquid on the silicon wafer which is cleaned and flows onto the conveyor belt 3.

In this embodiment, the cleanness on the surface of the conveying belt 3 is ensured by the arrangement of the liquid suction roller 7, and the liquid residue on the surface of the conveying belt 3 is reduced.

While the embodiments of the present application have been described in connection with the drawings, the embodiments and features of the embodiments of the present application can be combined with each other without conflict, and the present application is not limited to the above-mentioned embodiments, which are only illustrative and not restrictive, and those skilled in the art can make many forms without departing from the spirit and scope of the present application and the claims.

Claims

1. A silicon wafer inspection structure comprising:

the device comprises a detection box body (1), wherein a detection camera (2) is arranged in the detection box body (1);

the conveying belt (3), the conveying belt (3) can pass through the detection box body (1);

it is characterized by also comprising:

the surface cleaning piece (4) is arranged in the detection box body (1) and is positioned on the front side of the detection camera (2) and used for cleaning residual liquid on the surface of the silicon wafer before the silicon wafer is detected;

the rotating piece (5) is arranged below the conveying belt (3) and used for rotating the silicon wafers on the conveying belt (3);

wherein, the rotating piece (5) is positioned right below the detection camera (2).

2. A silicon wafer detection structure according to claim 1, wherein the surface cleaning member (4) further comprises:

the air curtain generating device (40), the said air curtain generating device (40) is set up in detecting the container body (1);

the air curtain spray head (41) is arranged above the conveying belt (3) and used for generating an air curtain on the surface of the silicon wafer;

wherein the air curtain spray head (41) is connected with an air curtain generating device (40).

3. A silicon wafer inspection structure according to claim 2, wherein the rotary member (5) further comprises:

the lifting device (50), wherein a plurality of suckers (51) are arranged on the lifting device (50);

a rotating device (52), the rotating device (52) being arranged below the lifting device (50);

the rotating device (52) is connected with the lifting device (50) to drive the lifting device (50) to rotate, and the conveying belt (3) is provided with lifting holes (53) for the lifting device (50) to extend out.

4. The silicon wafer detecting structure according to claim 3, further comprising:

the silicon chip fixing device comprises a limiting ring (6), wherein the limiting ring (6) is provided with a plurality of limiting rings, and the plurality of limiting rings (6) are uniformly distributed at intervals along the length direction of the conveying belt (3) and are used for fixing silicon chips.

5. The silicon wafer detecting structure according to claim 2, further comprising:

and the liquid absorbing roller (7) is arranged at the discharge end of the conveying belt (3) and used for cleaning liquid on the conveying belt (3).