CN218822165U

CN218822165U - Laser alignment assembly for chuck and lens in wafer detection process

Info

Publication number: CN218822165U
Application number: CN202223065699.9U
Authority: CN
Inventors: 王孟哲; 梁正南; 赖勉力; 李恩全
Original assignee: Ningbo Jiuzong Intelligent Technology Co ltd
Current assignee: Ningbo Jiuzong Intelligent Technology Co ltd
Priority date: 2022-11-18
Filing date: 2022-11-18
Publication date: 2023-04-07
Anticipated expiration: 2032-11-18

Abstract

The utility model relates to a laser counterpoint field, specifically speaking relates to a be arranged in wafer testing process chuck and camera lens laser to counterpoint subassembly. The positioning device comprises a positioning device main body, a positioning device main body and a positioning device, wherein the positioning device main body comprises a first positioning part horizontally placed on a chuck surface and a second positioning part arranged at a lens; a laser source is arranged inside the first positioning part, and a laser path formed by laser emitted by the laser source is vertical to the chuck surface; the second aligning part is sequentially provided with a multiple reflection area and a light spot observation area along the extending direction of the laser light path, and the multiple reflection area surrounds the laser light path. The utility model can more intuitively and accurately determine the calibration result through the facula observation area, and simultaneously, the second contraposition part and the first contraposition part can be respectively matched with the base and the lens, thereby calibrating the lenses at different positions; thereby can guarantee the utility model discloses higher accuracy and suitability have.

Description

Laser alignment assembly for chuck and lens in wafer detection process

Technical Field

The utility model relates to a laser field of counterpointing, specifically speaking relates to a be arranged in wafer test process chuck and camera lens laser to counterpoint subassembly.

Background

Wafer (wafer) refers to a substrate (also called a wafer or a baseboard) from which semiconductor transistors or integrated circuits are fabricated. Since it is a crystalline material, it is called a wafer because it is circular in shape. Wafers are named and classified differently according to the substrate material. The wafer or chip can be processed into various circuit element structures or optical structures, so that the wafer or chip becomes a product with specific photoelectric function.

In order to reduce the subsequent unnecessary loss, before the wafer is put into use, the wafer needs to be subjected to defect detection to ensure that the quality of the wafer reaches the standard. During the inspection process, the chuck for placing the wafer and the lens for wafer inspection need to be kept vertical to improve the accuracy of the inspection result. Therefore, before detection, vertical alignment calibration needs to be performed on the chuck and the lens.

The existing calibration method usually adopts a naked eye calibration or a vertical calibrator for calibration, on one hand, the wafer detection needs higher precision requirements, but the calibration precision of the existing calibration method is difficult to achieve the higher requirements. On the other hand, because a plurality of lenses with different heights are needed in the wafer detection process, the lenses with different heights need to be calibrated and aligned; however, the existing calibration method is difficult to ensure the calibration precision and is suitable for the calibration alignment of lenses with different heights.

SUMMERY OF THE UTILITY MODEL

The utility model discloses to the problem that exists among the prior art, a it is used for among the wafer testing process chuck and camera lens laser alignment subassembly to provide one kind.

In order to solve the technical problem, the utility model discloses a following technical scheme can solve:

a laser alignment assembly for a chuck and a lens in a wafer detection process comprises an alignment assembly body, wherein the alignment assembly body comprises a first alignment part horizontally placed on the surface of the chuck and a second alignment part installed at the lens; a laser source is arranged inside the first positioning part, and a laser path formed by laser emitted by the laser source is vertical to the chuck surface; the second aligning part is sequentially provided with a multiple reflection area and a light spot observation area along the extending direction of the laser light path, and the multiple reflection area surrounds the laser light path.

The utility model discloses when using, the level is placed in the first counterpoint portion on chuck surface and can provide stable support in order to ensure the stability of laser light path for the laser source. In addition, when the lens adjusting device is used, the second aligning part can be arranged at the positions of the lenses with different heights so as to perform alignment and alignment on the lenses with different heights, and the lens adjusting device has better applicability.

Further, after the second positioning part is installed, the first positioning position is adjusted to enable a laser path emitted by the laser source to pass through the multiple reflection area; and after the adjustment is finished, the alignment can be carried out through the light spot observation area.

Preferably, the first aligning part comprises a base, a first aligning cylinder and a laser pen; the second aligning part comprises a second aligning cylinder. The bottom surface of the base is flatly and horizontally attached to the chuck surface; a plurality of openings are formed in the circumferential outer wall of the first aligning cylinder; another terminal surface department that base and bottom surface are parallel is located to first counterpoint section of thick bamboo and laser pen, and the outside of first counterpoint section of thick bamboo is located to the laser pen, and the outer wall department of first counterpoint section of thick bamboo is equipped with the circular through-hole that supplies laser to pass, and the inside of first counterpoint section of thick bamboo is equipped with the reflection lens with laser reflection to laser light path, and the laser after the reflection is the laser source.

The utility model provides a laser counterpoint subassembly is through setting up the laser pen in the first counterpoint section of thick bamboo outside as the laser emission point, when the unable normal emission laser of laser pen problem appearing, and the user of service can change more conveniently.

Preferably, one axial end of the first contraposition cylinder is connected with the base, and the other end of the first contraposition cylinder is provided with an open annular limiting groove; an installation groove used for being installed at the lens is formed at one end of the second alignment cylinder in the axial direction, and an annular limiting block used for being matched with the annular limiting groove is formed at the other end of the second alignment cylinder; the first contraposition cylinder and the second contraposition cylinder are detachably connected through an annular limiting groove and an annular limiting block.

The utility model discloses an annular spacing groove and annular stopper can be assembled and dismantle first counterpoint section of thick bamboo and second counterpoint section of thick bamboo better. During actual use, the first aligning cylinder and the second aligning cylinder are disassembled and then are calibrated and aligned; after the alignment is finished, the first alignment cylinder and the second alignment cylinder can be combined and then stored, so that the next use is facilitated.

Preferably, a laser through hole for the laser light path to pass through is formed at the annular limiting block, and a multiple reflection area is formed on the inner wall of the laser through hole.

When the utility model is used, when laser passes through the laser through hole, if the chuck is not vertical to the lens, the laser can generate multiple emission in the multiple reflection area, thereby forming a larger light spot in the light spot observation area; the observer can judge the calibration result through the size of the light spot.

Preferably, a through observation window is formed between two ends of the second alignment cylinder in the axial direction, and a light spot observation area is formed on the inner wall of the observation window at one side close to the installation groove.

The utility model discloses when using, observer accessible observation window is direct to observe the region in order to judge the calibration condition to the facula observation region, so the utility model discloses when using, the observer can be convenient for the observer to survey the judgement better through observation window's setting.

Drawings

Fig. 1 is a schematic structural view of an alignment assembly body in embodiment 1;

FIG. 2 is a schematic structural view of a base and a first aligning cylinder in embodiment 1;

fig. 3 is a schematic structural view of a second aligning cylinder in embodiment 1.

Detailed Description

Example 1

Referring to fig. 1-3, the present embodiment provides a chuck and lens laser alignment device for wafer inspection, including an alignment device body 100, the alignment device body 100 including a first alignment portion 110 horizontally disposed on the chuck surface and a second alignment portion 120 mounted on the lens; a laser source is arranged inside the first positioning portion 110, and a laser light path formed by laser emitted by the laser source is vertical to the chuck surface; the second positioning portion 120 is sequentially provided with a multiple reflection area and a light spot observation area along the extending direction of the laser light path, and the multiple reflection area surrounds the laser light path.

In use, the first alignment portion 110, which is horizontally disposed on the chuck surface, can provide stable support for the laser source to ensure stability of the laser path. In addition, when in use, the second aligning portion 120 can be installed at the positions of the lenses with different heights to perform alignment and alignment on the lenses with different heights, so that the present invention has better applicability.

Further, after the second positioning portion 120 is installed, the position of the first positioning portion 110 is adjusted so that the laser path emitted by the laser source passes through the multiple reflection area; and after the adjustment is finished, the alignment can be carried out through the light spot observation area.

Specifically, when the laser device is used, the laser source emits laser, the laser reaches the spot observation area through a laser optical path, if the angle between the chuck and the lens is not accurately kept perpendicular, the laser can be subjected to multiple reflection when passing through the multiple reflection area, and the laser can form a large spot which can be recognized by naked eyes at the spot observation area after being subjected to multiple reflection.

Compared with the prior art, on one hand, the laser alignment assembly has higher sensitivity on the deviation angle between the chuck and the lens when being used for calibrating and aligning through the light spot observation area, and the light spot at the light spot observation area can be obviously changed due to a smaller deviation angle, so that the calibration precision can meet the high-precision requirement of wafer detection; on the other hand, this laser is counterpointed calibration of subassembly and is judged and can directly obtain through naked eye identification, and need not to use other observation equipment, has the convenience of preferred.

The first aligning portion 110 includes a base 111, a first aligning barrel 113 and a laser pointer 112; the second aligning portion 120 includes a second aligning cylinder 121. The bottom surface of the base 111 is flatly attached to the chuck surface; a plurality of openings 1133 are formed in the outer wall of the first alignment cylinder 113 in the circumferential direction; the first counterpoint barrel 113 and the laser pen 112 are arranged on the other end face of the base 111 parallel to the bottom face, the laser pen 112 is arranged on the outer side of the first counterpoint barrel 113 through the mounting base 140, a circular through hole 1132 for laser to pass through is arranged on the outer wall of the first counterpoint barrel 113, a reflecting lens 1131 for reflecting laser to a laser path is arranged inside the first counterpoint barrel 113, and the laser after reflection is a laser source.

It can be understood that, the laser alignment assembly in this embodiment uses the laser pen 112 disposed outside the first alignment cylinder 113 as a laser emitting point, and laser emitted by the laser pen 112 is reflected by the reflecting mirror 1131 and then used as a laser source of a laser light path. Locate the outside of first counterpoint section of thick bamboo 113 with the laser emission point, when laser pen 112 goes wrong unable normal emission laser, the user of service can change more conveniently. In addition, the observer can directly observe whether the laser pointer 112 and the mirror 1131 are working normally through the opening 1133 provided at the outer wall of the first aligning barrel 113.

One axial end of the first alignment cylinder 113 is connected with the base 111, and the other end is formed with an open annular limiting groove 1134; an installation groove 1211 for installing the second alignment cylinder 121 at the lens is formed at one end of the second alignment cylinder in the axial direction, and an annular limiting block 1212 for matching with the annular limiting groove 1134 is formed at the other end of the second alignment cylinder; the first alignment cylinder 113 and the second alignment cylinder 121 are detachably connected through an annular limiting groove 1134 and an annular limiting block 1212.

Specifically, the first alignment barrel 113 and the second alignment barrel 121 can be preferably assembled and disassembled through the annular limiting groove 1134 and the annular limiting block 1212. In practical use, the first aligning cylinder 113 and the second aligning cylinder 121 are disassembled and then are calibrated and aligned; after the alignment is completed, the first alignment cylinder 113 and the second alignment cylinder 121 can be combined and stored, so that the next use is facilitated.

The annular limiting block 1212 is formed with a laser through hole 1213 for the laser light path to pass through, and the inner wall of the laser through hole 1213 forms a multiple reflection area.

When the laser calibration device is used, if the chuck and the lens are kept perpendicular, laser emitted by the laser source directly passes through the laser through hole 1213 along a laser light path to reach the light spot observation area, and multiple reflection with the inner wall of the laser through hole 1213 is avoided, so that an observer cannot observe a light spot in a large range at the light spot observation area, and a calibration result that the chuck and the lens are kept perpendicular accurately can be obtained. If the chuck and the lens are not vertical, a deflection angle exists between the chuck and the lens, and when the laser passes through the laser through hole 1213, the laser can be reflected by the inner wall of the laser through hole 1213, so that a large-range light spot appears in a light spot observation area, and an observer can judge the calibration condition through the light spot condition.

Furthermore, a through observation window 1214 is formed between two ends of the second aligning cylinder 121 in the axial direction, and a light spot observation region is formed on the inner wall of the observation window 1214 near the mounting groove 1211.

It can be understood that, in use, an observer can directly observe the light spot observation region through the observation window 1214 to determine the calibration condition, so that the observation and the determination of the observer can be better facilitated through the arrangement of the observation window 1214 in the embodiment.

It is easily understood that a person skilled in the art can combine, split, recombine and the like the embodiments of the present application on the basis of one or more of the embodiments provided in the present application to obtain other embodiments, all of which do not depart from the scope of the present application.

The present invention and its embodiments have been described above schematically, and the description is not limited thereto, and what is shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. Therefore, if the person skilled in the art receives the teaching of the present invention, without departing from the inventive spirit of the present invention, the person skilled in the art should also design the similar structural modes and embodiments without creativity to the technical solution, and all shall fall within the protection scope of the present invention.

Claims

1. The utility model provides a chuck and camera lens laser alignment subassembly for among wafer test process which characterized in that: the positioning device comprises a positioning device body (100), wherein the positioning device body (100) comprises a first positioning part (110) horizontally placed on a chuck surface and a second positioning part (120) installed at a lens; a laser source is arranged in the first positioning part (110), and a laser path formed by laser emitted by the laser source is vertical to the chuck surface; the second aligning part (120) is provided with a multiple reflection area and a light spot observation area in sequence along the extending direction of the laser light path, and the multiple reflection area surrounds the laser light path.

2. The assembly of claim 1, wherein the assembly comprises a chuck and a lens laser alignment assembly for use in a wafer inspection process, the assembly comprising: the first contraposition part (110) comprises a base (111), a first contraposition cylinder (113) and a laser pen (112); the second aligning portion (120) includes a second aligning cylinder (121).

3. The assembly of claim 2, wherein the assembly is used for positioning a chuck and a lens in a wafer inspection process, and comprises: the bottom surface of the base (111) is flatly and horizontally attached to the chuck surface; a plurality of openings (1133) are formed in the circumferential outer wall of the first aligning cylinder (113); the base (111) is located with the parallel other terminal surface department of bottom surface with laser pen (112) to first counterpoint section of thick bamboo (113), and the outside of first counterpoint section of thick bamboo (113) is located through mount pad (140) to laser pen (112), and the outer wall department of first counterpoint section of thick bamboo (113) is formed with circular through-hole (1132) that are used for passing laser, and the inside of first counterpoint section of thick bamboo (113) is equipped with reflection mirror piece (1131) with laser reflection to laser light path, and the laser after the reflection is the laser source.

4. The assembly of claim 2, wherein the assembly is used for positioning a chuck and a lens in a wafer inspection process, and comprises: one axial end of the first contraposition cylinder (113) is connected with the base (111), and the other end is provided with an open annular limiting groove (1134); one end of the second alignment cylinder (121) along the axial direction is provided with a mounting groove (1211) for mounting at the lens, and the other end is provided with an annular limiting block (1212) for limiting and matching with the annular limiting groove (1134); the first contraposition cylinder (113) and the second contraposition cylinder (121) are detachably connected through an annular limiting groove (1134) and an annular limiting block (1212).

5. The assembly of claim 4, wherein the assembly comprises a laser alignment assembly for chuck and lens in wafer inspection, the laser alignment assembly comprising: the annular limiting block (1212) is provided with a laser through hole (1213) for the laser light path to pass through, and the inner wall of the laser through hole (1213) forms a multiple reflection area.

6. The assembly of claim 4, wherein the assembly comprises a laser alignment assembly for chuck and lens in wafer inspection, the laser alignment assembly comprising: a through observation window (1214) is formed between the two ends of the second alignment cylinder (121) in the axial direction, and the inner wall of the observation window (1214) forms a light spot observation area.