CN218812181U - Electroplating solution cyclic utilization system - Google Patents

Electroplating solution cyclic utilization system Download PDF

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Publication number
CN218812181U
CN218812181U CN202223141727.0U CN202223141727U CN218812181U CN 218812181 U CN218812181 U CN 218812181U CN 202223141727 U CN202223141727 U CN 202223141727U CN 218812181 U CN218812181 U CN 218812181U
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pipeline
pump
valve
copper
plating
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CN202223141727.0U
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Chinese (zh)
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赵德甫
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Dongguan Speed Copper Technology Co ltd
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Dongguan Speed Copper Technology Co ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Abstract

The utility model provides a plating solution cyclic utilization system, purify the line including plating bath and circulation, the circulation purifies the line and includes pipeline one and all connects pump one on the pipeline one, online carbon processing system, management groove and pump two, the both ends of pipeline one all are connected with the plating bath, install temperature regulation apparatus in the management groove. Through the utility model discloses can purify and cyclic utilization the plating solution, can also adjust the temperature to the plating solution and make brightener wherein be in normal efficiency of performance in order to exert, can also reduction in production cost.

Description

Electroplating solution cyclic utilization system
Technical Field
The utility model relates to an electroplate technical field, specifically be an electroplate liquid cyclic utilization system.
Background
In the production process of a gantry type PCB plating line, organic additives such as brightener and the like need to be periodically supplemented into plating solution in a plating bath, TOC (total organic pollutants) can be generated after the organic additives are consumed in the plating process, the TOC content continuously rises after the organic additives are supplemented for a long time, when the TOC content reaches a peak value, the lattice structure of a cathode workpiece plating copper layer can be seriously influenced, in order to solve the defect and maintain the continuous production of the PCB plating line, at least 50 percent of TOC in the plating solution is removed by an online carbon plating treatment system, and the plating solution is purified and recycled.
The existing online carbon electroplating treatment system comprises a pipeline, a first pump, an online carbon treatment system and a second pump, wherein the first pump, the online carbon treatment system and the second pump are sequentially connected to the pipeline, two ends of the pipeline are connected with an electroplating bath, in the working process, the first pump is matched with the pipeline to pump and discharge electroplating solution in the electroplating bath to the online carbon treatment system, at least 50% of TOC is removed through the first pump, and finally the purified electroplating solution is pumped back to the electroplating bath through the second pump which is matched with the pipeline.
Disclosure of Invention
An object of the utility model is to provide an electroplate liquid cyclic utilization system to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the electroplating solution recycling system comprises an electroplating bath and a circulating purification line, wherein the circulating purification line comprises a pipeline I, a pump I, an online carbon treatment system, a management tank and a pump II, the pump I, the online carbon treatment system, the management tank and the pump II are all connected to the pipeline I, two ends of the pipeline I are all connected with the electroplating bath, and a temperature adjusting device is installed in the management tank.
Furthermore, the first pump, the online carbon treatment system, the management tank and the second pump are sequentially arranged along the flow direction of the liquid in the first pipeline.
The device further comprises a first electric valve connected to the first pipeline, and the first electric valve is located between the input end of the first pipeline and the first pump.
Furthermore, a carbon powder filtering device is installed in the management tank.
Further, still include the automatic metering and add pump, the automatic metering adds the pump and is connected with the management groove.
And furthermore, the device also comprises a temporary storage tank, a valve and a pump III which are all connected to the pipeline I, wherein the temporary storage tank, the valve and the pump III are sequentially arranged along the flow direction of liquid in the pipeline I and are all positioned between the output ends of the pump II and the pipeline I.
And further, the device also comprises a filtering device connected to the first pipeline, and the filtering device is positioned between the third pump and the output end of the first pipeline.
The electrolytic copper plating device further comprises an electrolytic copper plating ion supplementing line, wherein the electrolytic copper plating ion supplementing line comprises a pipeline II, a pump IV, a dissolved copper filter barrel I and an electric valve III which are all connected to the pipeline II, two ends of the pipeline II are all connected with an electrolytic bath, the pump IV and the dissolved copper filter barrel I are sequentially arranged along the flow direction of liquid in the pipeline II, and the electric valve III is located between the input of the pipeline II and the pump IV or between the pump IV and the dissolved copper filter barrel I.
Further, still include the reserve supplementary line of valve two and electro-coppering ion, valve two is connected on pipeline two and is located pump four and dissolve between the copper filter vat two, the reserve supplementary line of electro-coppering ion includes pipeline three and all connects valve three on pipeline three and dissolve copper filter vat two, valve three and dissolve copper filter vat two and arrange in proper order along the flow direction of liquid in pipeline three, three one end of pipeline is connected on pipeline two and is located pump four and valve two, the three other ends of pipeline are connected with the plating bath.
Further, still include the reserve supplementary line of valve two and copper electroplating ion, valve two is connected on pipeline two and is located pump four and dissolve between the copper filter vat one, the reserve supplementary line of copper electroplating ion includes pipeline three and all connects valve three on the pipeline three, dissolve copper filter vat two and valve three, dissolve copper filter vat two and valve three arrange in proper order along the flow direction of liquid in the pipeline three, valve three, dissolve copper filter vat two and valve three lead pipeline three and valve two and dissolve copper filter vat one and parallelly connected.
The utility model has the advantages that:
the utility model discloses the during operation, through pump one cooperation pipeline one with the plating solution pump drainage in the plating bath to online carbon processing system, get rid of 50% TOC in the plating solution through it at least, realize purifying the plating solution, the plating solution after the purification advances the management groove through pipeline one, detect the temperature of plating solution in the management groove through temperature regulation apparatus and with this temperature regulation to the operating temperature of brightener, pump two cooperation pipeline one with the plating solution pump drainage after the temperature regulation in the plating bath.
Through the utility model discloses can not only purify and cyclic utilization the plating solution, can also adjust the temperature to the plating solution, make brightener wherein be in normal efficiency of performance in order to work temperature.
Drawings
FIG. 1: a schematic top view of a first embodiment of a plating solution recycling system.
FIG. 2: schematic top view of second embodiment of electroplating solution recycling system
Detailed Description
The invention is further described below with reference to the accompanying drawings:
as shown in fig. 1, a plating solution recycling system includes a plating tank 1 and a circulation purification line 2, wherein the circulation purification line 2 includes a first pipeline 201, a first valve 202, a first pump 203, a first electric valve 204, an online carbon treatment system 205, a management tank 206, the first valve 202, a second pump 207, a temporary storage tank 208, the first valve 202, a third pump 209 and a filtering device 210, which are sequentially connected to the first pipeline 201 along a flow direction of an internal liquid, both ends of the first pipeline 201 are connected to the plating tank 1, a temperature adjusting device and a carbon powder filtering device are installed in the management tank 206, the temperature adjusting device is used for detecting a temperature of a plating solution in the management tank 206 and adjusting the temperature of the plating solution to a working temperature of a brightener, the carbon powder filtering device is used for filtering residual carbon powder in the plating solution, the filtering device 210 is used for filtering impurity particles in the plating solution, the automatic metering pump 211 is connected to the management tank 206, and the automatic metering pump 211 is used for automatically and quantitatively supplying organic additives such as a brightener to the plating solution in the management tank 206.
Preparation work of the circulation purification line 2: 1. manually closing a valve I202 between the temporary storage tank 208 and a pump III 209; 2. the first pump 203 pumps the plating solution in the plating vessel 1 to the on-line carbon treatment system 205 through the first pipe 201, thereby removing at least 50% of TOC in the plating solution to purify the plating solution; 3. the purified electroplating solution enters a management tank 206 through a first pipeline 201, the temperature of the electroplating solution is regulated to the working temperature of a brightener through a temperature regulating device in the management tank 206, the electroplating solution from the online carbon treatment system 205 is provided with a small amount of carbon powder, and the carbon powder can be filtered through a carbon powder filtering device in the management tank 206; 4. pumping the plating solution with the adjusted temperature and the filtered carbon powder into a temporary storage tank 208 through a pump II 207 matched with a pipeline I201; 5. when a certain amount of plating liquid is accumulated in the temporary storage tank 208, the first pump 203 and the second pump 207 are suspended, and the plating liquid in the temporary storage tank 208 is manually sampled and checked.
When the TOC content result of the sampling inspection meets the production requirement, manually starting a valve I202 positioned between a temporary storage tank 208 and a pump III 209, and formally operating the circulating purification line 2, wherein when the pump I203, the pump II 207 and the pump III 209 synchronously perform intermittent operation, and the intermittent operation can set the time for performing a plurality of times of operation per week and operation each time of the pump I203, the pump II 207 and the pump III 209 according to the production requirement on site and the production period;
in the preparation work of the circulation purifying line 2, when the TOC content result of the sampling inspection does not meet the production requirement, debugging work is carried out: 1. manually closing a first valve 202 between the management tank 206 and a second pump 207; 2. manually opening the discharge port of the temporary storage tank 208 to discharge the plating solution in the temporary storage tank 208 to a wastewater station; 3. closing the discharge port and adjusting the operating parameters of the on-line carbon treatment system 205 accordingly, such as increasing the amount of carbon powder to increase the purification level; 4. manually opening a first valve 202 between the management tank 206 and a second pump 207; and (5) repeating the steps 2 to 5 of the preparation work of the circulating purification line 2, and if the TOC content result of the sampling inspection does not meet the production requirement, continuing repeating the steps 1 to 4 of the debugging work and the steps 2 to 5 of the preparation work of the circulating purification line 2.
As shown in fig. 1, further comprises a copper-electroplating ion supplementing line 3 and a copper-electroplating ion standby supplementing line 4, wherein the copper-electroplating ion standby supplementing line 4 is used as a standby of the copper-electroplating ion supplementing line 3 and is used for supplementing copper ions required by production instead of the copper-electroplating ion supplementing line 3 so as to carry out continuous production.
As shown in fig. 1, the copper electroplating ion supplementing line 3 includes a second pipeline 31, a fourth pump 32, a first dissolved copper filter tank 33 and a third electric valve 34, which are all connected to the second pipeline 31, two ends of the second pipeline 31 are all connected to the electroplating bath 1, the fourth pump 32 and the first dissolved copper filter tank 33 are sequentially arranged along the flow direction of the liquid in the second pipeline 31, and the third electric valve 34 is located between the input end of the second pipeline 31 and the fourth pump 32 or between the fourth pump 32 and the first dissolved copper filter tank 33.
In operation, the fourth pump 32 pumps the electroplating solution in the electroplating tank 1 to the first copper-dissolving filter barrel 33 and finally returns to the electroplating tank 1 through the output end of the second pipeline 31, and in the process, ferric ions in the electroplating solution react with pure copper in the first copper-dissolving filter barrel 33 to generate ferrous ions and copper ions, namely 2Fe 3+ +Cu 0 →2Fe 2+ +Cu 2+ And the copper ions of the electroplating solution are supplemented to meet the requirement of copper ions required by the copper layer electroplating.
As shown in fig. 1, the first embodiment of the electroplated copper ion standby replenishment line 4: the device also comprises a second valve 35 and a standby copper ion electroplating supplementing line 4, wherein the second valve 35 is connected to the second pipeline 31 and is positioned between the fourth pump 32 and the first dissolved copper filter vat 33, the standby copper ion electroplating supplementing line 4 comprises a third pipeline 41, a third valve 42 and a second dissolved copper filter vat 43 which are both connected to the third pipeline 41, the third valve 42 and the second dissolved copper filter vat 43 are sequentially arranged along the flowing direction of liquid in the third pipeline 41, one end of the third pipeline 41 is connected to the second pipeline 31 and is positioned between the fourth pump and the second valve 35, and the other end of the third pipeline 41 is connected with an electroplating bath.
As shown in fig. 2, the second embodiment of the electroplated copper ion standby replenishment line 4: the device also comprises a second valve 35 and a standby copper ion electroplating replenishing line 4, wherein the second valve 35 is connected to the second pipeline 31 and is positioned between the fourth pump 32 and the first dissolved copper filter vat 33, the standby copper ion electroplating replenishing line 4 comprises a third pipeline 41, a third valve 42, a second dissolved copper filter vat 43 and a third valve 42 which are all connected to the third pipeline 41, the third valve 42, the second dissolved copper filter vat 43 and the third valve 42 are sequentially arranged along the flowing direction of liquid in the third pipeline 41, and the third valve 42, the second dissolved copper filter vat 43 and the third valve 42 are connected with the second valve 35 and the first dissolved copper filter vat 33 in parallel through the third pipeline 41.
When the pure copper material in the first dissolved copper filter barrel 33 is consumed to a certain degree and is about to meet the production condition, the standby replenishment line 4 for electroplated copper ions is opened, when the first standby replenishment line 4 for electroplated copper ions is opened, the third valve 42 between the input end of the third pipeline 41 and the second dissolved copper filter barrel 43 is manually opened, the second valve 35 between the fourth pump 32 and the first dissolved copper filter barrel 33 is closed, and the fourth pump 32 pumps the electroplating solution to the second dissolved copper filter barrel 43 and finally returns to the electroplating tank 1 through the output end of the third pipeline 41.
When the second embodiment of the standby replenishment line for copper ion plating 4 is opened, the third valve 42 between the input end of the third pipeline 41 and the second dissolved copper filter tank 43 and the third valve 42 between the second dissolved copper filter tank 43 and the output end of the third pipeline 41 are manually opened, the second valve 35 between the fourth pump 32 and the first dissolved copper filter tank 33 is closed, and the fourth pump 32 pumps the plating solution to the second dissolved copper filter tank 43 and finally returns to the plating tank 1 through the output end of the second pipeline 31.
When adopting insoluble anode in plating bath 1, need add the replenishment of oxidation copper powder as the copper electroplating ion to the plating solution in plating bath 1, change the high cost that oxidation copper powder is changed into by the copper for the unit price of oxidation copper powder will be higher than phosphorus copper ball and pure copper material far away, and manufacturing cost is higher, the utility model discloses a copper electroplating ion complementary wire 3 or the reserve complementary wire 4 of copper electroplating ion can utilize ferric iron ion in the plating solution and dissolve copper filter vat 33 or dissolve the pure copper material in the copper filter vat two 43 and react and generate the copper electroplating ion, realize supplementing the copper electroplating ion of plating solution, manufacturing cost is lower.
The system comprises a main control system, wherein the first pump 203, the first electric valve 204, the online carbon treatment system 205, a temperature regulating device, the second pump 207, the third pump 209, the automatic metering pump 211, the fourth pump 32 and the third electric valve 34 are electrically connected with and controlled by the main control system, and the first pump 203, the first electric valve 204, the online carbon treatment system 205, the temperature regulating device, the second pump 207, the third pump 209, the automatic metering pump 211, the fourth pump 32, the third electric valve 34 and the main control system are electrically connected with a power supply.
Through the utility model discloses can purify and cyclic utilization the plating solution, can also adjust the temperature to the plating solution and make brightener wherein be in normal efficiency of performance in order to exert, can also reduction in production cost.
The above is not intended to limit the technical scope of the present invention, and any modifications, equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention are all within the scope of the technical solution of the present invention.

Claims (10)

1. A plating solution cyclic utilization system which characterized in that: the device comprises an electroplating bath and a circulating purification line, wherein the circulating purification line comprises a first pipeline, a first pump, an online carbon treatment system, a management tank and a second pump, the first pump, the online carbon treatment system, the management tank and the second pump are all connected to the first pipeline, two ends of the first pipeline are all connected with the electroplating bath, and a temperature regulation device is installed in the management tank.
2. The plating solution recycling system as claimed in claim 1, wherein: the first pump, the online carbon treatment system, the management tank and the second pump are sequentially arranged along the flow direction of liquid in the first pipeline.
3. The plating solution recycling system as recited in claim 2, wherein: the device also comprises a first electric valve connected to the first pipeline, and the first electric valve is positioned between the input end of the first pipeline and the first pump.
4. The plating solution recycling system as recited in claim 1, wherein: and a carbon powder filtering device is arranged in the management tank.
5. The plating solution recycling system as recited in claim 1, wherein: still include the automatic metering and add the pump, the automatic metering adds the pump and is connected with the management groove.
6. The plating solution recycling system as recited in claim 2, wherein: still including all connecting temporary storage groove, valve and the pump three on pipeline one, temporary storage groove, valve and pump three arrange in proper order and all lie in between the output of pump two and pipeline one along the flow direction of pipeline one interior liquid.
7. The plating solution recycling system as recited in claim 6, wherein: the device also comprises a filtering device connected to the first pipeline, and the filtering device is positioned between the third pump and the output end of the first pipeline.
8. The plating solution recycling system as claimed in claim 1, wherein: the electrolytic copper plating device is characterized by further comprising an electrolytic copper plating ion supplementing line, wherein the electrolytic copper plating ion supplementing line comprises a pipeline II, a pump IV, a dissolved copper filter vat I and an electric valve III, the pump IV, the dissolved copper filter vat I and the electric valve III are all connected to the pipeline II, the two ends of the pipeline II are all connected with an electroplating bath, the pump IV and the dissolved copper filter vat I are sequentially arranged along the flow direction of liquid in the pipeline II, and the electric valve III is located between the input of the pipeline II and the pump IV or between the input of the pump IV and the dissolved copper filter vat I.
9. The plating solution recycling system as recited in claim 8, wherein: still include valve two and the reserve supplementary line of copper ion plating, valve two is connected on pipeline two and is located pump four and dissolve between the copper filter vat one, the reserve supplementary line of copper ion plating includes pipeline three and all connects valve three on the pipeline three and dissolve copper filter vat two, valve three and dissolve copper filter vat two and arrange in proper order along the flow direction of liquid in the pipeline three, pipeline three one end is connected on pipeline two and is located pump four and valve two, the three other ends of pipeline are connected with the plating bath.
10. The plating solution recycling system as recited in claim 8, wherein: still include valve two and the reserve supplementary line of copper ion plating, valve two is connected on pipeline two and is located pump four and dissolve between the copper filter vat one, the reserve supplementary line of copper ion plating includes pipeline three and all connects valve three on the pipeline three, dissolve copper filter vat two and valve three, dissolve copper filter vat two and valve three and arrange in proper order along the flow direction of liquid in the pipeline three, valve three, dissolve copper filter vat two and valve three cross pipeline three and valve two and dissolve copper filter vat two parallelly connected.
CN202223141727.0U 2022-11-25 2022-11-25 Electroplating solution cyclic utilization system Active CN218812181U (en)

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Application Number Priority Date Filing Date Title
CN202223141727.0U CN218812181U (en) 2022-11-25 2022-11-25 Electroplating solution cyclic utilization system

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Application Number Priority Date Filing Date Title
CN202223141727.0U CN218812181U (en) 2022-11-25 2022-11-25 Electroplating solution cyclic utilization system

Publications (1)

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CN218812181U true CN218812181U (en) 2023-04-07

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