CN218804393U - Mounting structure of flexible high-thermal-conductivity film - Google Patents
Mounting structure of flexible high-thermal-conductivity film Download PDFInfo
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- CN218804393U CN218804393U CN202220462523.8U CN202220462523U CN218804393U CN 218804393 U CN218804393 U CN 218804393U CN 202220462523 U CN202220462523 U CN 202220462523U CN 218804393 U CN218804393 U CN 218804393U
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Abstract
The utility model relates to the technical field of heat-conducting film mounting of electronic products, and provides a mounting structure of a flexible high heat-conducting film, which comprises a flexible high heat-conducting film and an electronic device, wherein the flexible high heat-conducting film comprises a heat-conducting layer and a protective film layer; the heat conduction layer is in a plane film shape; the protective film layer is attached to the outer surface of the heat conduction layer and completely wraps the heat conduction layer to form an integral attachment structure; the electronic device comprises a folding part, and the electronic device is in a plate shape and can be bent or folded through the folding part; the flexible high-thermal-conductivity film is adhered to the surface of the electronic device, and the flexible high-thermal-conductivity film is provided with an arch part in the folding part. The utility model discloses a thin film structure number of piles is few, and whole thickness is little, can reduce the overall thermal resistance of film for the heat conduction effect of film is better, can adapt to the consumption of intelligent terminal product and the development trend that generates heat and increase, still can not lead to the fracture because of bending or folding.
Description
Technical Field
The utility model relates to a heat conduction film of electronic product pastes dress technical field, in particular to subsides dress structure of flexible high heat conduction film.
Background
Currently, some smart terminals (such as mobile phones) are configured as foldable products for portability, and therefore, foldable electronic devices, such as foldable mobile phone screens, need to be correspondingly equipped. Such electronic devices have heat dissipation requirements, and a heat conductive film is generally required to be disposed on the electronic devices having the heat dissipation requirements.
The existing flexible heat-conducting film is often broken after being bent or folded for many times, and the service life of the intelligent terminal is seriously influenced. In addition, the development trend of intelligent terminals (such as mobile phones, tablet computers, wearable devices, and the like) is multifunctional and light and thin, and the multifunctional inevitably increases power consumption and heat generation, so that the demand for heat dissipation effect is increased, but the thickness of the existing flexible heat-conducting film is not suitable for the development trend.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a surface mounting structure of a flexible high heat conduction film, which comprises a flexible high heat conduction film, a heat conduction layer and a protective film layer;
the heat conduction layer is in a plane film shape; the protective film layer is attached to the outer surface of the heat conduction layer and completely wraps the heat conduction layer to form an integral attachment structure;
the electronic device comprises a folding part, and is in a plate shape and can be bent or folded through the folding part;
the flexible high-thermal-conductivity film is adhered to the surface of the electronic device and provided with an arch part at the folding part; and a gap is formed between the folding part and the arch part.
Optionally, the heat conducting layer and the protective film layer are uniform in thickness, and the outer surface of the protective film layer is smooth.
Optionally, the heat conducting layer is made of a flexible graphite material or a flexible graphene material.
Optionally, the heat conducting layer is made of a single-layer or multi-layer flexible graphite material or a flexible graphene material, and the thickness of the heat conducting layer is 5-100 μm.
Optionally, the protective film layer is made of a single-sided adhesive of polyethylene terephthalate, and the thickness of the protective film layer is 5-30 μm.
Optionally, the flexible high thermal conductive film is adhered to the surface of the electronic device by double-sided adhesive.
Optionally, the double-sided adhesive tape is a double-sided pressure-sensitive adhesive tape, and the thickness of the double-sided adhesive tape is 5-25 μm.
Optionally, the arch part comprises a plurality of arches, and the connecting part of adjacent arches is adhered to the surface of the electronic device by double-sided adhesive.
Optionally, the electronic device is a foldable mobile phone screen, and the foldable mobile phone screen is made of an organic light emitting diode.
The flexible high-heat-conductivity film of the utility model, by making the heat-conducting layer and the protective film layer into an integrated laminating structure and wrapping the heat-conducting layer with the protective film layer, namely, the protective film layer is arranged on the front, back, left, right, upper and lower surfaces of the heat-conducting layer, the service life of the film can be prolonged; the film structure of the utility model has few layers and small overall thickness, can reduce the overall thermal resistance of the film, enables the heat conduction effect of the film to be better, and can adapt to the development trend of power consumption and heating increase of intelligent terminal products; the mounting structure of the flexible high-thermal-conductivity film is characterized in that the flexible high-thermal-conductivity film is pasted on the surface of the foldable plate-type electronic device, and the flexible high-thermal-conductivity film can be pasted on the front side of the electronic device and also can be pasted on the back side of the electronic device; when pasting, let flexible high heat conduction film form convex hunch portion at plate-type electronic device's folding portion, hunch portion can be the arch, arc or fold shape, the width size setting of general hunch portion is not less than the width size of electronic device folding portion, there is the clearance between folding portion and the hunch portion, when electronic device bends or folds through folding portion, the hunch portion reservation of flexible high heat conduction film has tensile surplus, when experiencing to bend or fold the action, can not the inside great internal stress that produces of the hunch portion of flexible high heat conduction film, can not let the thickness of the flexible high heat conduction film of hunch portion take place to warp, thereby maintain the inner structure stability of flexible high heat conduction film when bending or folding, make high heat conduction film itself can not lead to the fracture because of bending or folding.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
The technical solution of the present invention is further described in detail by the accompanying drawings and examples.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic cross-sectional view of a flexible high thermal conductive film according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of a mounting structure of a flexible high thermal conductive film according to an embodiment of the present invention;
fig. 3 is a schematic cross-sectional view of the embodiment of the mounting structure of the flexible high thermal conductive film in a bending state.
In the figure: 1-heat conduction layer, 2-protective film layer, 3-electronic device, 4-folding part, 5-arching part and 6-double faced adhesive tape.
Detailed Description
The preferred embodiments of the present invention will be described hereinafter with reference to the accompanying drawings, and it should be understood that the preferred embodiments described herein are merely for purposes of illustration and explanation, and are not intended to limit the present invention.
As shown in fig. 1, an embodiment of the present invention provides a flexible high thermal conductive film, which includes a thermal conductive layer 1 and a protective film layer 2;
the heat conduction layer 1 is in a plane film shape; the protective film layer 2 is attached to the outer surface of the heat conduction layer 1 and completely wraps the heat conduction layer 1 to form an integrated attachment structure.
The working principle and the beneficial effects of the technical scheme are as follows: according to the scheme, the heat conduction layer and the protective film layer are manufactured into an integral laminating structure, the heat conduction layer is wrapped by the protective film layer, namely the protective film layer is arranged on the front surface, the rear surface, the left surface, the right surface, the upper surface and the lower surface of the heat conduction layer, so that the service life of the film can be prolonged; the film structure layer number of this scheme is few, and whole thickness is little, can reduce the overall thermal resistance of film for the heat conduction effect of film is better, can adapt to the consumption of intelligent terminal product and the development trend that generates heat and increase.
In one embodiment, as shown in fig. 1, the heat conduction layer 1 and the protection film layer 2 have uniform thickness, and the outer surface of the protection film layer 2 is smooth; the heat conduction layer 1 is made of a flexible graphite material or a flexible graphene material; if the heat conducting layer 1 is made of a single-layer flexible graphite material or a flexible graphene material, the thickness of the heat conducting layer 1 is 5-100 μm, for example, the thickness may be set to be 8 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 50 μm, 60 μm, 65 μm, 75 μm or 85 μm; if the heat conducting layer 1 is made of multiple layers of flexible graphite materials or flexible graphene materials, the thickness of the heat conducting layer 1 may be 20-240 μm, for example, the thickness may be set to 25 μm, 30 μm, 45 μm, 60 μm, 85 μm, 100 μm, 135 μm, 180 μm, or 200 μm; the protective film layer 2 is made of polyethylene terephthalate single-sided adhesive, and the thickness of the protective film layer 2 is 5-30 μm, for example, the thickness may be set to 8 μm, 10 μm, 15 μm, 18 μm, 20 μm, 25 μm or 28 μm.
The working principle and the beneficial effects of the technical scheme are as follows: the heat conducting layer is made of a flexible graphite material or a flexible graphene material, and can be made of a single-layer or multi-layer flexible graphite material or a flexible graphene material; the flexible graphite material or the flexible graphene material has higher crystallinity, good lattice orientation and high thermal conductivity, and has higher reliability compared with the traditional heat conduction material; the graphite or graphene also has good processability, low thermal expansion rate, good heat resistance and chemical corrosion resistance, and anisotropic characteristics; the graphite or graphene is adopted, so that a good heat dissipation effect can be guaranteed, good bending and recovery performance can be realized, and the manufacturing process is easy to realize; the protective film layer is made of polyethylene terephthalate (PET) single-sided adhesive, the surface of the protective film layer is smooth, the protective film layer has excellent physical and mechanical properties in a wider temperature range, the impact strength is high, the folding resistance is good, and the protective film layer can play a good role in protecting the heat conducting layer; the material has good temperature resistance, and can keep the performance for a long time without reducing under the condition that the temperature is up to 120 ℃; the material also has good electrical insulation and mechanical properties, can resist oil, fat, dilute acid, dilute alkali and most organic solvents, can prevent gas and water vapor from permeating, has high transparency, is nontoxic and odorless, and has good sanitary safety; the diversity protection to the heat-conducting layer can be realized.
As shown in fig. 2 and fig. 3, an embodiment of the present invention provides a mounting structure of a flexible high thermal conductive film, which adopts the foregoing flexible high thermal conductive film, and includes an electronic device 3, where the electronic device 3 includes a folding portion 4, and the electronic device 3 is in a plate shape and can be bent or folded through the folding portion 4;
the flexible high-thermal-conductivity film is adhered to the surface of the electronic device 3, and an arch part 5 is arranged on the folding part 4 of the flexible high-thermal-conductivity film; a gap is formed between the folded part 4 and the arched part 5.
The working principle and the beneficial effects of the technical scheme are as follows: according to the scheme, the flexible high-heat-conductivity film is adhered to the surface of the foldable plate type electronic device, and the flexible high-heat-conductivity film can be adhered to the front side of the electronic device and can also be adhered to the back side of the electronic device; when pasting, let flexible high heat conduction film form convex hunch portion in plate-type electronic device's folding portion, hunch portion can be the arch, arc or fold shape, the width size setting of general hunch portion is not less than the width size of electronic device folding portion, there is the clearance between folding portion and the hunch portion, when electronic device bends or folds through folding portion, the hunch portion reservation of flexible high heat conduction film has tensile surplus, when experiencing to bend or fold the action, can not the inside great internal stress that produces of the hunch portion of flexible high heat conduction film, can not let the thickness of the flexible high heat conduction film of hunch portion take place to warp, thereby maintain the inner structure stability of flexible high heat conduction film when bending or folding, make flexible high heat conduction film itself can not lead to the fracture because of bending or folding.
In one embodiment, as shown in fig. 2 and fig. 3, the flexible high thermal conductive film is adhered to the surface of the electronic device 3 by using a double-sided adhesive tape 6; the double-sided adhesive tape 6 is a double-sided pressure-sensitive adhesive tape, the thickness of the double-sided adhesive tape 6 is 5-25 μm, for example, the thickness of the double-sided adhesive tape can be set to be 8 μm, 10 μm, 12 μm, 15 μm, 18 μm or 20 μm;
the arch part 5 can comprise a plurality of arches, and the connecting parts of the adjacent arches are adhered to the surface of the electronic device by double-sided adhesive.
The working principle and the beneficial effects of the technical scheme are as follows: the flexible high-thermal-conductivity film and the electronic device are bonded by the double-sided adhesive tape, and except the arched part, the surfaces of the flexible high-thermal-conductivity film and the electronic device are flat surfaces, so that the film and the electronic device can be bonded to maintain enough bonding area, the film and the electronic device are bonded more firmly, the film is not easy to fall off, and the product quality and the service life are improved; the double-sided adhesive tape adopts double-sided pressure-sensitive adhesive, has good adhesive performance and can ensure the firmness of adhesion; the arched part is provided with a plurality of arches, the cross section of each arch can be in a curve shape, an arc shape or a folding shape, the arch heights of the arches can be reduced by arranging the arches, so that the surface of a product is smoother when the product is unfolded, the connecting parts of the adjacent arches are adhered to the surface of the electronic device by double-faced adhesive, on one hand, each arch can still keep the shape after being bent or folded, and on the other hand, the firm degree of adhesion of the film and the electronic device can be enhanced.
In one embodiment, the electronic device 3 is a folding mobile phone screen, and the folding mobile phone screen is made of organic light emitting diodes.
The working principle and the beneficial effects of the technical scheme are as follows: the electronic device is a folding mobile phone screen, the screen of the current smart mobile phone is mostly in a square flat plate shape, the folding mobile phone screen is made of organic light emitting diodes, so that the screen can be bent or folded, the folding mobile phone screen can be more conveniently carried when not needed, the screen is unfolded when the mobile phone is used, the display area of the screen is increased, more contents or larger pictures can be displayed, and the display definition is improved; an Organic Light-Emitting Diode (abbreviated as an OLED) is different from a traditional LCD in a display mode requiring a backlight, the OLED does not need the backlight, the Organic Light-Emitting Diode is made of a very thin Organic material coating and a glass substrate (or a flexible Organic substrate), and when the Organic Light-Emitting Diode is powered on, the Organic Light-Emitting Diode can emit Light; the OLED display screen can be made thinner in size, has a larger visual angle and can remarkably reduce power consumption.
It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (9)
1. A mounting structure of a flexible high-thermal-conductivity film is characterized by comprising the flexible high-thermal-conductivity film, wherein the flexible high-thermal-conductivity film comprises a thermal conduction layer and a protective film layer;
the heat conduction layer is in a plane film shape; the protective film layer is attached to the outer surface of the heat conduction layer and completely wraps the heat conduction layer to form an integral attachment structure;
the electronic device comprises a folding part, is in a plate shape and can be bent or folded through the folding part;
the flexible high-thermal-conductivity film is adhered to the surface of the electronic device and provided with an arch part at the folding part; and a gap is formed between the folding part and the arch part.
2. The mounting structure of a flexible high thermal conductive film according to claim 1, wherein the heat conductive layer and the protective film layer have uniform thickness, and the outer surface of the protective film layer is smooth.
3. The mounting structure of a flexible high thermal conductive film according to claim 1, wherein the thermal conductive layer is made of flexible graphite material or flexible graphene material.
4. The mounting structure of a flexible high thermal conductive film according to claim 1, wherein the thermal conductive layer is made of single-layer or multi-layer flexible graphite material or flexible graphene material.
5. The mounting structure of the flexible high thermal conductive film according to claim 1, wherein the protective film layer is made of polyethylene terephthalate single-sided adhesive, and the thickness of the protective film layer is 5-30 μm.
6. The mounting structure of the flexible high thermal conductive film according to claim 1, wherein the flexible high thermal conductive film is adhered to the surface of the electronic device by double-sided adhesive.
7. The mounting structure of the flexible high thermal conductive film according to claim 6, wherein the double-sided adhesive tape is a double-sided pressure sensitive adhesive tape, and the thickness of the double-sided adhesive tape is 5-25 μm.
8. The mounting structure of a flexible high thermal conductive film according to claim 1, wherein the arch portion comprises a plurality of arches, and the connection portion of adjacent arches is adhered to the surface of the electronic device by double-sided adhesive.
9. The mounting structure of a flexible high thermal conductive film according to claim 1, wherein the electronic device is a foldable mobile phone screen, and the foldable mobile phone screen is made of organic light emitting diodes.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220462523.8U CN218804393U (en) | 2022-03-04 | 2022-03-04 | Mounting structure of flexible high-thermal-conductivity film |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202220462523.8U CN218804393U (en) | 2022-03-04 | 2022-03-04 | Mounting structure of flexible high-thermal-conductivity film |
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| CN218804393U true CN218804393U (en) | 2023-04-07 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116887574A (en) * | 2023-07-21 | 2023-10-13 | 苏州安洁科技股份有限公司 | Folding mobile phone graphene heat dissipation structure and corresponding heat dissipation method thereof |
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- 2022-03-04 CN CN202220462523.8U patent/CN218804393U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116887574A (en) * | 2023-07-21 | 2023-10-13 | 苏州安洁科技股份有限公司 | Folding mobile phone graphene heat dissipation structure and corresponding heat dissipation method thereof |
| CN116887574B (en) * | 2023-07-21 | 2024-04-19 | 苏州安洁科技股份有限公司 | Folding mobile phone graphene heat dissipation structure and corresponding heat dissipation method thereof |
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