CN218788900U

CN218788900U - Integrated circuit with good heat dissipation effect

Info

Publication number: CN218788900U
Application number: CN202222619335.4U
Authority: CN
Inventors: 请求不公布姓名
Original assignee: Xi'an Ruicheng Information Technology Co ltd
Current assignee: Xi'an Ruicheng Information Technology Co ltd
Priority date: 2022-10-07
Filing date: 2022-10-07
Publication date: 2023-04-04
Anticipated expiration: 2032-10-07

Abstract

The utility model discloses an integrated circuit that radiating effect is good, including the integrated circuit that is provided with the pin, the pin surface is all scribbled and is equipped with the heat dissipation coating, integrated circuit top surface periphery evenly glues around central point puts and is equipped with the solid circle of card, the solid circle top of card is equipped with a set, it is provided with the semiconductor refrigeration piece through screw and support to prop up a set bottom surface correspondence integrated circuit position. The device has a coating with a heat conduction effect so as to realize a better heat dissipation effect.

Description

Integrated circuit with good heat dissipation effect

Technical Field

The utility model relates to an integrated circuit technical field, in particular to integrated circuit that radiating effect is good.

Background

An integrated circuit (integrated circuit) is a type of microelectronic device or component.

At present, the pin structures of integrated circuits produced in the market are all made of pure metal materials without heat conductivity, so that the heat dissipation effect is reduced.

The existing integrated circuit has the following defects: the pin structure is made of pure metal materials and does not have heat conductivity, so that the heat dissipation effect is reduced. Therefore, an integrated circuit with good heat dissipation effect is provided.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide an integrated circuit with good heat dissipation effect, which can effectively solve the problems in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

an integrated circuit with a good heat dissipation effect comprises an integrated circuit provided with pins, wherein heat dissipation coatings are coated on the surfaces of the pins, clamping rings are uniformly adhered to the periphery of the top surface of the integrated circuit around a central position, a supporting disc is arranged on the tops of the clamping rings, and semiconductor refrigeration pieces are arranged on the bottom surface of the supporting disc corresponding to the position of the integrated circuit through screws and a support.

Furthermore, clamping legs are arranged on the periphery of the bottom of the support disc corresponding to the clamping rings, the support disc is clamped and fixed on the clamping rings through the clamping legs, and the clamping rings, the support disc and the clamping legs are all made of PVC materials; and the semiconductor refrigeration piece is supported and fixed through the supporting disc.

Further, the heat dissipation coating is a silicone grease coating; the silicone grease coating has better heat conductivity through the heat dissipation coating.

Further, the pins are respectively positioned at the periphery of the integrated circuit.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. through setting up the heat dissipation coating, the heat dissipation coating of utilizing pin surface to scribble to establish has better heat conductivity for the silicone grease coating to promote its radiating effect.

2. Through setting up rim plate and semiconductor refrigeration piece, utilize the rim plate to support fixedly to the semiconductor refrigeration piece to utilize the semiconductor refrigeration piece to carry out refrigeration cooling to integrated circuit top surface, in order to avoid integrated circuit internals to be heated for a long time and reduce life.

Drawings

Fig. 1 is a schematic diagram of an overall structure of an integrated circuit with a good heat dissipation effect.

Fig. 2 is the utility model discloses a solid circle structural diagram of integrated circuit's card that radiating effect is good.

Fig. 3 is the utility model relates to a semiconductor refrigeration piece structure diagram of integrated circuit that the radiating effect is good.

In the figure: 1. an integrated circuit; 2. a pin; 3. a heat-dissipating coating; 4. a clamping ring; 5. supporting a disc; 6. clamping the legs; 7. semiconductor refrigeration piece.

Detailed Description

In order to make the utility model realize, the technical means, the creation characteristics, the achievement purpose and the efficacy are easy to understand and understand, the utility model is further explained by combining the specific implementation mode.

As shown in fig. 1-3, an integrated circuit with good heat dissipation effect includes an integrated circuit 1 provided with pins 2, the surfaces of the pins 2 are coated with heat dissipation coatings 3, the periphery of the top surface of the integrated circuit 1 is uniformly adhered with clamping rings 4 around a central position, the tops of the clamping rings 4 are provided with supporting discs 5, and the bottom surfaces of the supporting discs 5 are provided with semiconductor refrigerating sheets 7 corresponding to the positions of the integrated circuit 1 through screws and supports.

The clamping legs 6 are arranged on the periphery of the bottom of the supporting disc 5 and correspond to the clamping rings 4, the supporting disc 5 is clamped on the clamping rings 4 through the clamping legs 6, and the clamping rings 4, the supporting disc 5 and the clamping legs 6 are all made of PVC materials.

In the embodiment, as shown in fig. 1, 2 and 3, the clamping legs 6 of the support disc 5 are clamped and fixed by the clamping ring 4.

Wherein, the heat dissipation coating 3 is a silicone grease coating.

In this embodiment, as shown in fig. 1, the silicone grease coating used as the heat dissipation coating 3 has good thermal conductivity.

Wherein, the pins 2 are respectively positioned at the periphery of the integrated circuit 1.

In the embodiment, as shown in fig. 1 and 2, the pins 2 are used to facilitate the mounting and connection of the integrated circuit 1.

It should be noted that, the utility model relates to an integrated circuit that the radiating effect is good, during the installation, connect fixedly through pin 2 to integrated circuit 1, during the use, the heat dissipation coating 3 of establishing is scribbled through 2 surfaces of pin has better heat conductivity for the silicone grease coating, thereby promote its radiating effect, and utilize the solid circle 4 of card so that prop up 5 and block in integrated circuit 1 top through card leg 6, thereby realize supporting semiconductor refrigeration piece 7 in the purpose of integrated circuit 1 top surface, connect semiconductor refrigeration piece 7 external power supply again, when integrated circuit 1 long-term use, refrigerate the cooling through semiconductor refrigeration piece 7 to integrated circuit 1 top surface, so as to avoid integrated circuit 1 internals to be heated for a long time and reduce life.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides an integrated circuit that radiating effect is good, is including integrated circuit (1) that is provided with pin (2), its characterized in that, pin (2) surface is all scribbled and is equipped with heat dissipation coating (3), integrated circuit (1) top surface periphery is put around central point and evenly glues and be equipped with clamping ring (4), clamping ring (4) top is equipped with a set (5), it is provided with semiconductor refrigeration piece (7) through screw and support to prop up set (5) bottom surface and correspond integrated circuit (1) position.

2. The integrated circuit of claim 1, wherein: the clamping device is characterized in that clamping legs (6) are arranged on the periphery of the bottom of the supporting disc (5) and correspond to the clamping rings (4), the supporting disc (5) is clamped and fixed on the clamping rings (4) through the clamping legs (6), and the clamping rings (4), the supporting disc (5) and the clamping legs (6) are all made of PVC materials.

3. The integrated circuit of claim 1, wherein: the heat dissipation coating (3) is a silicone grease coating.

4. The integrated circuit of claim 1, wherein: the pins (2) are respectively positioned on the periphery of the integrated circuit (1).