CN218788885U

CN218788885U - Radio communication structure of electron in membrane

Info

Publication number: CN218788885U
Application number: CN202222603944.0U
Authority: CN
Inventors: 熊主利
Original assignee: Alma Technology Co ltd
Current assignee: Alma Technology Co ltd
Priority date: 2022-09-29
Filing date: 2022-09-29
Publication date: 2023-04-04
Anticipated expiration: 2032-09-29

Abstract

The utility model provides a wireless communication structure of electron in membrane relates to the circuit structure body field, a wireless communication structure of electron in membrane, and top-down includes first substrate layer, printing ink layer in proper order, pastes layer, plastic layer, first glue layer, first circuit layer, second circuit layer and second substrate layer, at least one first electronic components has been pasted to first circuit layer facial make-up, at least one second electronic components has been pasted to second circuit layer facial make-up, the utility model discloses can place first electronic components, second electronic components on first circuit layer, second circuit layer, then adopt the mode integrated into one piece of moulding plastics, with first electronic components, second electronic components respectively with plastic layer together, isolated first electronic components, second electronic components and air's contact, very big improvement first electronic components, second electronic components's stability, the circuit shape also can change along with the product appearance change, practices thrift the product space.

Description

Radio communication structure of electron in membrane

Technical Field

The present invention relates to the field of circuit structures, and more particularly, to a wireless communication structure for electrons in a film.

Background

The appearance structure body of the traditional household appliance product, the automobile interior trim part, the consumer electronic product and the like is formed by assembling plastic parts and parts such as an integrated circuit board behind the plastic parts, the integrated circuit board consists of a printed circuit board (blank board) and electronic components welded on the printed circuit board, and the integrated circuit board has the defects of complex structure, heavy volume, complex manufacturing process, poor waterproof performance, poor weather resistance, poor impact resistance and the like, and has the problem of environmental pollution during printing and manufacturing.

The current electronic product is realized by adding a circuit board inside a plastic shell to realize indication and control of air energy, the circuit board is in contact with air and is greatly influenced by the temperature and humidity of the environment, an electronic part is easily affected by damp, oxidation and electrostatic breakdown, and the circuit board cannot change along with the change when the appearance is a curved surface.

Disclosure of Invention

An object of the embodiment of the present application is to provide a wireless communication structure of in-film electronics, which can solve the technical problems of a wet circuit board and easy deformation.

The embodiment of the application provides a wireless communication structure of in-film electron, top-down include first substrate layer, printing ink layer in proper order, paste layer, plastic layer, first glue layer, first circuit layer, second circuit layer and second substrate layer, first circuit layer surface second circuit layer surface all is provided with the insulating layer, at least one first electronic components has been pasted to first circuit layer facial make-up, at least one second electronic components has been pasted to second circuit layer facial make-up, first electronic components upper end second electronic components upper end all is located in the plastic layer.

Preferably, the first circuit layer and the second circuit layer are externally connected with connecting terminals, and the connecting terminals are at least one of a printed FPC (flexible printed circuit), a transfer printing FPC (flexible printed circuit) and a pin header terminal.

Preferably, the first base material layer and the second base material layer are made of deformation materials.

Preferably, the insulating layer is an insulating oil layer, and the insulating layer is sprayed on the outer surface of the first circuit layer and the outer surface of the second circuit layer.

Preferably, the thickness of the plastic layer is 0.5-5mm.

Preferably, protective layers are arranged on two sides of the first base material layer and two sides of the second base material layer.

The utility model has the advantages that:

the utility model provides a pair of wireless communication structure of in-film electron, top-down include first substrate layer, printing ink layer in proper order, paste layer, plastic layer, first glue layer, first circuit layer, second circuit layer and second substrate layer, first circuit layer surface second circuit layer surface all is provided with the insulating layer, first circuit layer facial make-up has pasted at least one first electronic components, second circuit layer facial make-up has pasted at least one second electronic components, first electronic components upper end second electronic components upper end all is located in the plastic layer, the utility model discloses can place first electronic components, second electronic components on first circuit layer, second circuit layer, then adopt the mode integrated into one piece of moulding plastics, melt first electronic components, second electronic components together with the plastic layer respectively, isolated first electronic components, second electronic components and the contact of air, very big improvement first electronic components, second electronic components's stability, the circuit shape also can change along with the product appearance change, practices thrift the product space appearance.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a structural sectional view of the present invention.

The reference numerals are respectively:

the printed circuit board comprises a first substrate layer, a first ink layer, a second adhesive layer, a first adhesive layer, a second adhesive layer, a first circuit layer, a second circuit layer, a protective layer, a first electronic component, a second electronic component, a protective layer, a second electronic component, a first adhesive layer, a second adhesive layer, a first adhesive layer and a second adhesive layer, wherein the first substrate layer is 1, the ink layer is 2, the adhesive layer is 3, the plastic layer is 4, the first adhesive layer is 5, the first circuit layer is 6, the second circuit layer is 7, the second substrate layer is 8, the first electronic component is 9, the second electronic component is 10, the protective layer is 11, and the insulating layer is 12.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the application usually place when in use, and are used only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the devices or elements being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

As shown in fig. 1, a wireless communication structure of in-film electronics, top-down include first substrate layer 1, printing ink layer 2 in proper order, paste layer 3, plastic layer 4, first glue layer 5, first circuit layer 6, second circuit layer 7 and second substrate layer 8, first circuit layer 6 surface second circuit layer 7 surface all is provided with insulating layer 12, first circuit layer 6 facial make-up has at least one first electronic components 9, second circuit layer 7 facial make-up has at least one second electronic components 10, first electronic components 9 upper end second electronic components upper end all is located in plastic layer 4, the utility model discloses can place first electronic components 9, second electronic components 10 on first circuit layer 6, second circuit layer 7, then adopt the mode integrated into one piece of moulding plastics, melt first electronic components 9, second electronic components 10 with plastic layer 4 respectively together, isolated first electronic components 9, second electronic components 10 and the contact of air, very big improvement first electronic components 9, second electronic components 10, the appearance shape that can practice thrift the circuit product along with the change of electronic components and also the shape.

In this embodiment, the first circuit layer 6 and the second circuit layer 7 are externally connected with a connection terminal, the connection terminal is at least one of a printed FPC, a transfer FPC and a pin header terminal, and the connection terminal is used for supplying power and transmitting an electrical signal.

In this embodiment, first substrate layer 1 the second substrate layer 8 all adopts the deformation material to make, the utility model discloses a concrete flexible structure.

In this embodiment, the insulating layer 12 is an insulating oil layer, and the insulating layer 12 is sprayed on the outer surface of the first circuit layer 6 and the outer surface of the second circuit layer 7.

In this embodiment, the thickness of the plastic layer 4 is 0.5-5mm.

In this embodiment, first substrate layer 1 both sides second substrate layer 8 both sides all are provided with protective layer 11, and protective layer 11 can prevent the utility model discloses a lateral part gets into liquid.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A radio communication structure of electrons in a film, characterized in that: top-down includes first substrate layer, printing ink layer in proper order, pastes layer, plastic layer, first glue layer, first circuit layer, second circuit layer and second substrate layer, first circuit layer surface the second circuit layer surface all is provided with the insulating layer, first circuit layer facial make-up posts at least one first electronic components, second circuit layer facial make-up posts at least one second electronic components, first electronic components upper end second electronic components upper end all is located in the plastic layer.

2. The structure of claim 1, wherein the structure further comprises: the first circuit layer and the second circuit layer are externally connected with wiring terminals, and the wiring terminals are at least one of printed FPC (flexible printed circuit), transfer printed FPC (flexible printed circuit) and pin header terminals.

3. The structure of claim 1, wherein the structure further comprises: the first base material layer and the second base material layer are made of deformation materials.

4. The structure of claim 1, wherein the structure further comprises: the insulating layer is an insulating oil layer, and the insulating layer is sprayed on the outer surface of the first circuit layer and the outer surface of the second circuit layer.

5. The structure of claim 1, wherein the structure further comprises: the thickness of the plastic layer is 0.5-5mm.

6. The structure of claim 1, wherein the structure further comprises: and protective layers are arranged on two sides of the first base material layer and two sides of the second base material layer.