CN218499344U

CN218499344U - Dual-mode electronic foil injection molding structure

Info

Publication number: CN218499344U
Application number: CN202222602298.6U
Authority: CN
Inventors: 熊主利
Original assignee: Alma Technology Co ltd
Current assignee: Alma Technology Co ltd
Priority date: 2022-09-29
Filing date: 2022-09-29
Publication date: 2023-02-17
Anticipated expiration: 2032-09-29

Abstract

The utility model provides a bimodulus electron foil membrane injection structure relates to foil membrane injection structure field, a bimodulus electron foil membrane injection structure, the utility model discloses mould plastics first circuit layer, second circuit layer inside the resin layer, can prevent first circuit layer, second circuit layer, first electronic components, second electronic components and air contact, and the utility model discloses after moulding plastics, do not change the original shape of product, can realize showing and control function again, saved external circuit board, component processing, the fixed material of installation, artifical and the required space of product, strengthened the product waterproof, dampproofing, prevent erosion, prevent ability such as static, can realize multiple external connected mode, be particularly suitable for water heater, washing machine etc. and be applied to the abominable product in environment, be particularly suitable for the occasion that reliability such as equipment, car required higher.

Description

Dual-mode electronic foil injection molding structure

Technical Field

The application relates to the field of foil injection molding structures, in particular to a dual-mode electronic foil injection molding structure.

Background

The appearance structure body of the traditional household appliance product, the automobile interior trim part, the consumer electronic product and the like is formed by assembling plastic parts and parts such as an integrated circuit board behind the plastic parts, the integrated circuit board consists of a printed circuit board (blank board) and electronic components welded on the printed circuit board, and the integrated circuit board has the defects of complex structure, heavy volume, complex manufacturing process, poor waterproof performance, poor weather resistance, poor impact resistance and the like, and has the problem of environmental pollution during printing and manufacturing.

The realization mode of present electronic product is that plastic shell installs the circuit board additional inside, realizes instructing and control empty can, but circuit board and air contact, it is great to receive the influence of environment humiture, and the electron part is easily dampened, oxidized, is punctured by static, cockroach and bug infestations to when the appearance is the curved surface, the circuit board can't change along with the change, needs the compatible circuit board size in bigger space.

Disclosure of Invention

An object of the embodiment of the present application is to provide a dual-mode electronic foil injection structure, which can solve the technical problem that a circuit board contacts air.

The embodiment of the application provides a bimodulus electronic foil membrane injection structure, include top-down in proper order that first basic unit, first layer, pattern layer, protective layer, the second of pasting paste layer, resin layer, third and paste layer, first circuit layer, second circuit layer, fourth and paste layer and second basic unit, first circuit layer with be provided with the insulating layer between the second circuit layer, first circuit layer facial make-up has at least one first electronic components, second circuit layer facial make-up has at least one second electronic components, first electronic components upper end second electronic components upper end all is located in the resin layer.

Preferably, the first adhesive layer, the second adhesive layer, the third adhesive layer and the fourth adhesive layer are adhesive layers.

Preferably, the first circuit layer and the second circuit layer are externally connected with connecting terminals, and the connecting terminals are at least one of a printed FPC (flexible printed circuit), a transfer printing FPC (flexible printed circuit) and a pin header terminal.

Preferably, the first base layer and the second base layer are made of flexible materials.

Preferably, the upper part of the first base layer and the lower part of the second base layer are both provided with wear-resistant layers.

Preferably, the pattern layer is replaceable.

The utility model has the advantages that:

the utility model provides a pair of bimodulus electron foil membrane injection structure, paste layer, pattern layer, protective layer, second and paste layer, resin layer, third and paste layer, first circuit layer, second circuit layer, fourth and paste layer and second basic unit including top-down in proper order, first circuit layer with be provided with the insulating layer between the second circuit layer, first circuit layer facial make-up has posted at least one first electronic components, second circuit layer facial make-up has posted at least one second electronic components, first electronic components upper end second electronic components upper end all is located in the resin layer, the utility model discloses mould plastics first circuit layer, second circuit layer inside the resin layer, can prevent that first circuit layer, second circuit layer, first electronic components, second electronic components and air contact, and after the utility model discloses mould plastics, do not change the shape of product, can realize again that display and control function, saved circuit board, component processing, installation fixed material, artifical product and product required space, strengthened product, waterproof moisture-proof capability, waterproof and anti-static, can be applied to external connection reliability such as the high-off-line equipment, be applicable to multiple high reliability, be particularly suitable for the automobile and the like.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a structural sectional view of the present invention.

The reference numbers are respectively:

a first base layer-1, a first pasting layer-2, a pattern layer-3, a protective layer-4, a second pasting layer-5, a resin layer-6, a third pasting layer-7, a first circuit layer-8, a second circuit layer-9, a fourth pasting layer-10, a second base layer-11, a first electronic component-12 and a second electronic component-13.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, as generally described and illustrated in the figures herein, could be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the application usually place when in use, and are used only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the devices or elements being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical", "suspended" and the like do not imply that the components are absolutely horizontal or suspended, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

As shown in fig. 1, a bimodulus electronic foil membrane injection structure, paste layer 7, first circuit layer 8, second circuit layer 9, fourth and paste layer 10 and second basic unit 11 including top-down in proper order on first basic unit 1, the first layer 2 of pasting, pattern layer 3, protective layer 4, second, paste layer 5, resin layer 6, third, first circuit layer 8, second circuit layer 9, fourth, first circuit layer 8 with be provided with the insulating layer between the second circuit layer 9, first circuit layer 8 facial make-up has pasted at least one first electronic components 12, second circuit layer 9 facial make-up has pasted at least one second electronic components 13, first electronic components 12 upper end, second electronic components upper end all is located in the resin layer 6, the utility model discloses mould plastics first circuit layer 8, second circuit layer 9 inside the resin layer 6, can prevent first circuit layer 8, second circuit layer 9, first electronic components 12, second electronic components 13 and air contact, and the utility model discloses after moulding plastics, do not change the shape of product, can realize again and show that the control function, save the fixed and the material, the improvement of the high reliability of the artifical processing that can be applicable to the water heater, the special use for the high requirement of preventing.

In this embodiment, the first adhesive layer 2, the second adhesive layer 5, the third adhesive layer 7, and the fourth adhesive layer 10 are all adhesive layers.

In this embodiment, the first circuit layer 8 and the second circuit layer 9 are externally connected with a connection terminal, the connection terminal is at least one of a printed FPC, a transfer FPC, and a pin header terminal, and the connection terminal is used for supplying power and transmitting an electrical signal.

In this embodiment, first basic unit 1 second basic unit 11 all adopts flexible material to make, the utility model discloses a concrete flexible construction.

In this embodiment, in order to prevent the first base layer 1 and the second base layer 11 from being scratched during use, the upper portion of the first base layer 1 and the lower portion of the second base layer 11 are both provided with wear-resistant layers.

In this embodiment, the pattern layer 3 can be replaced, and in a specific use process, the pattern layer 3 can be replaced according to requirements.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A dual-mode electronic foil injection structure is characterized in that: paste layer, resin layer, third and paste layer, first circuit layer, second circuit layer, fourth and paste layer and second basic unit including top-down in proper order including first basic unit, first layer, pattern layer, protective layer, second of pasting, first circuit layer with be provided with the insulating layer between the second circuit layer, at least one first electronic components has been pasted to first circuit layer facial make-up, at least one second electronic components has been pasted to second circuit layer facial make-up, first electronic components upper end second electronic components upper end all is located in the resin layer.

2. The dual-mode electronic foil injection molding structure of claim 1, wherein: the first pasting layer, the second pasting layer, the third pasting layer and the fourth pasting layer are all glue layers.

3. The dual-mode electronic foil injection molding structure of claim 1, wherein: the first circuit layer the second circuit layer is externally connected with a wiring terminal, and the wiring terminal is at least one of a printing FPC (flexible printed circuit), a transfer printing FPC (flexible printed circuit) and a pin header terminal.

4. The dual-mode electronic foil injection molding structure of claim 1, wherein: the first base layer and the second base layer are made of flexible materials.

5. The dual-mode electronic foil injection molding structure of claim 1, wherein: and the upper part of the first base layer and the lower part of the second base layer are both provided with wear-resistant layers.

6. The dual-mode electronic foil injection molding structure of claim 1, wherein: the pattern layer can be replaced.