CN218769502U - Packaging structure of embedded double-sided heat dissipation power device - Google Patents
Packaging structure of embedded double-sided heat dissipation power device Download PDFInfo
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- CN218769502U CN218769502U CN202222626300.3U CN202222626300U CN218769502U CN 218769502 U CN218769502 U CN 218769502U CN 202222626300 U CN202222626300 U CN 202222626300U CN 218769502 U CN218769502 U CN 218769502U
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Abstract
The utility model provides an embedded double-sided heat dissipation power device's packaging structure, include: the inner surface of the first metal insulating substrate is provided with N first strip-shaped grooves, and N is a positive integer greater than or equal to 2; the second metal insulation substrate is arranged in parallel with the first metal insulation substrate, the inner surface of the second metal insulation substrate is correspondingly provided with N second strip-shaped grooves and N embedding bodies, one end of each embedding body is embedded into the first strip-shaped groove, and the other end of each embedding body is embedded into the corresponding second strip-shaped groove; n-1 metal alloy gaskets, wherein the N-1 metal alloy gaskets are sequentially arranged between the two connected embedded bodies, and one end of each metal alloy gasket is connected with the inner surface of the first metal insulating substrate; and the N-1 power chips are respectively arranged between the other ends of the N-1 metal alloy gaskets and the inner surface of the second metal insulating substrate. The heat dissipation capability of the packaging structure can be greatly improved.
Description
Technical Field
The utility model relates to a packaging structure encapsulation technical field of power device, concretely relates to packaging structure of embedded two-sided heat dissipation power device.
Background
In a semiconductor power device, a power chip is connected to an external circuit through a package. The performance depends on the support of the package.
In the related art, the package structure of the semiconductor power module has a weak heat dissipation capability.
SUMMERY OF THE UTILITY MODEL
The utility model provides an solve above-mentioned technical problem, provide an embedded two-sided heat dissipation power device's packaging structure, adopt two metal insulation base plates of parallel arrangement, realize the balanced design of two-sided heat dissipation, increased the heat dissipation route to, space department places the embedding body between the chip, reduces the thermal coupling between the parallelly connected chip, thereby has improved power device's packaging structure's heat-sinking capability greatly.
The utility model adopts the technical scheme as follows:
an embedded double-sided heat dissipation power device packaging structure, comprising: the metal-clad laminate comprises a first metal insulation substrate, wherein the inner surface of the first metal insulation substrate is provided with N first strip-shaped grooves, wherein N is a positive integer greater than or equal to 2; the second metal insulation substrate is arranged in parallel with the first metal insulation substrate, and N second strip-shaped grooves are correspondingly formed in the inner surface of the second metal insulation substrate; one end of each embedded body is embedded into the first strip-shaped groove, and the other end of each embedded body is embedded into the corresponding second strip-shaped groove; n-1 metal alloy gaskets, wherein the N-1 metal alloy gaskets are sequentially arranged between the two connected embedded bodies, and one end of each metal alloy gasket is connected with the inner surface of the first metal insulating substrate; n-1 power chips, wherein the N-1 power chips are respectively arranged between the other ends of the N-1 metal alloy gaskets and the inner surface of the second metal insulation substrate.
Specifically, each metal alloy gasket and the corresponding power chip are connected with two corresponding adjacent embedded bodies through a connecting layer.
Specifically, each power chip is connected with the corresponding metal alloy gasket, each power chip is connected with the inner surface of the second metal insulation substrate, and each metal alloy gasket is connected with the inner surface of the first metal insulation substrate through a welding layer.
Specifically, both sides of each of the inserts are provided with heat radiating fins.
Specifically, each of the metal alloy shims is cylindrical.
Specifically, the embedded body is made of a high-thermal-conductivity material.
In particular, the insert is made of a high temperature material with high electrical resistance.
The utility model has the advantages that:
the utility model discloses a two metal insulation base plates of parallel arrangement realize the balanced design of two-sided heat dissipation, have increased the heat dissipation route to, space department places the embedding body between the chip, reduces the thermal coupling between the parallelly connected chip, thereby has improved power device's packaging structure's heat-sinking capability greatly.
Drawings
Fig. 1 is an exploded view of an encapsulation structure of an embedded double-sided heat dissipation power device according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of an embedded double-sided heat dissipation power device according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Fig. 1 is an exploded view of an encapsulation structure of an embedded double-sided heat dissipation power device according to an embodiment of the present invention.
As shown in fig. 1, the package structure of the embedded double-sided heat dissipation power device according to the embodiment of the present invention may include: the chip comprises a first metal insulation substrate 100, a second metal insulation substrate 200, N embedded bodies 300, N-1 metal alloy gaskets 400 and N-1 power chips 500.
The inner surface of the first metal insulation substrate 100 is provided with N first bar-shaped grooves 110, where N is a positive integer greater than or equal to 2; the second metal insulation substrate 200 is parallel to the first metal insulation substrate 100, and N second strip-shaped grooves 210 are correspondingly formed in the inner surface of the second metal insulation substrate 200; one end of each insert 300 is inserted into the first bar-shaped groove 110, and the other end of each insert 300 is inserted into the corresponding second bar-shaped groove 210; n-1 metal alloy shims 400 are sequentially disposed between the two connected inserts 300, and one end of each metal alloy shim 400 is connected to the inner surface of the first metal insulation substrate 100; the N-1 power chips 500 are respectively disposed between the other ends of the N-1 metal alloy pads 400 and the inner surface of the second metal insulation substrate 200.
Specifically, the first metal-insulator substrate 100 and the second metal-insulator substrate 200 are disposed in parallel, and the surface of the first metal-insulator substrate 100 facing the second metal-insulator substrate 200 is the inner surface of the first metal-insulator substrate 100, and similarly, the surface of the second metal-insulator substrate 200 facing the first metal-insulator substrate 100 is the inner surface of the second metal-insulator substrate 200. The inner surface of the first metal insulation substrate 100 is provided with N first bar-shaped grooves 110, wherein two first bar-shaped grooves 110 of the N first bar-shaped grooves 110 are formed on two sides of the inner surface of the first metal insulation substrate 100; the inner surface of the second metal-insulating substrate 200 is provided with N second bar-shaped grooves 210, the N second bar-shaped grooves 210 are disposed in one-to-one correspondence with the N first bar-shaped grooves 110, wherein two second bar-shaped grooves 210 of the N second bar-shaped grooves 210 are disposed on two sides of the inner surface of the second metal-insulating substrate 200, where N is a positive integer greater than or equal to 2 (for example, as shown in fig. 1, N is 3). That is to say, the metal insulating substrates can be used at the top and the bottom of the packaging structure of the power device, and the heat dissipation path is increased to realize double-sided cooling, so that the heat dissipation path is balanced, and the reliability of the module is improved.
An embedded body 300 is embedded in the first strip-shaped groove 110 and the second strip-shaped groove 210 which are correspondingly arranged, a power chip 500 and a metal alloy gasket 400 are arranged between two adjacent embedded bodies 300, one end of each metal alloy gasket 400 is connected with the inner surface of the first metal insulation substrate 100, and the power chip 500 is respectively arranged between the other end of each metal alloy gasket 400 and the inner surface of the second metal insulation substrate 200.
In one embodiment of the present invention, the metal alloy gasket 400 is cylindrical. Specifically, the metal alloy gasket 400 has a cylindrical design, rounded edges, and uniform stress distribution, wherein the metal alloy can be doped with different amounts of metal alloy (e.g., molybdenum-copper alloy) to have an adjustable thermal expansion coefficient, thereby avoiding thermal stress damage of the structure and the high-temperature material due to too large difference of the thermal expansion coefficients. Therefore, the interconnection between the power chip 500 and the metal insulating substrate on the other side is completed by using the metal alloy gasket 400 in the middle of the packaging structure of the power device, and the metal alloy with good electric conduction and heat conduction characteristics is adopted, so that the heat transfer area is increased, the crusting thermal resistance of the power chip 500 is effectively reduced, and the heat dissipation capability is further increased.
In one embodiment of the present invention, the insert 300 is made of a material with high thermal conductivity. Specifically, as one possible implementation, the insert 300 may be made of a high thermal conductivity material (e.g., aluminum nitride) to increase heat dissipation performance.
In another embodiment of the present invention, the insert 300 is an insert made of a high temperature material with high resistance. Specifically, as another possible embodiment, the insert 300 may be made of a high temperature material (e.g., ceramic, glass, etc.) with high electrical resistance to enhance the insulating properties.
In one embodiment of the present invention, as shown in fig. 1, each insert 300 is provided with cooling fins 310 on both sides.
Specifically, the adjustable embedded body 300 is adopted in the gap between the two sides of the power chip 500, so that on one hand, the heat dissipation area is increased, the thermal coupling between the parallel power chips 500 is reduced, the heat dissipation capability is further improved, on the other hand, the mechanical structure is balanced, the stress distribution is uniform, the packaging strength is enhanced, and in addition, the heat dissipation fins 310 are arranged on the two sides of the embedded body 300. In addition, the material of the embedded body 300 can be adjusted according to the capability of the power chip 500, so that the flexibility of packaging design is increased.
In an embodiment of the present invention, as shown in fig. 2, each of the metal alloy gaskets 400 and the corresponding power chip 500 is connected to two corresponding adjacent inserts 300 through a connection layer 600. The connection layer 600 is made of a dielectric material.
In an embodiment of the present invention, as shown in fig. 2, each of the power chips 500 and the corresponding metal alloy gasket 400, the power chips 500 and the inner surface of the second metal-insulation substrate 200, and the metal alloy gasket 400 and the inner surface of the first metal-insulation substrate 100 are connected by a welding layer 700. Wherein the solder layer 700 is a solder material, such as a Sn-containing solder material or silver sintered.
In summary, according to the embodiment of the present invention, the packaging structure of the embedded double-sided heat dissipation power device comprises a first metal insulation substrate, a second metal insulation substrate, N inserts, N-1 metal alloy gaskets, and N-1 power chips, wherein N first bar-shaped grooves are formed on the inner surface of the first metal insulation substrate, the second metal insulation substrate is parallel to the first metal insulation substrate, N second bar-shaped grooves are correspondingly formed on the inner surface of the second metal insulation substrate, one end of each insert is embedded into the first bar-shaped groove, the other end of each insert is embedded into the corresponding second bar-shaped groove, the N-1 metal alloy gaskets are sequentially disposed between two consecutive inserts, and one end of each metal alloy gasket is connected to the inner surface of the first metal insulation substrate, and the N-1 power chips are respectively disposed between the other end of the N-1 metal alloy gaskets and the inner surface of the second metal insulation substrate. Therefore, the two metal insulation substrates which are arranged in parallel are adopted, the double-sided heat dissipation balance design is realized, the heat dissipation path is increased, the embedded body is placed in the gap between the chips, the thermal coupling between the chips connected in parallel is reduced, and the heat dissipation capacity of the packaging structure of the power device is greatly improved.
In the description of the present invention, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or as implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. The meaning of "plurality" is two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present application, unless expressly stated or limited otherwise, a first feature "on" or "under" a second feature may be directly contacting the second feature or the first and second features may be indirectly contacting the second feature through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
It should be understood that portions of the present invention may be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, the various steps or methods may be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or combination of the following technologies, which are well known in the art, may be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application specific integrated circuit having an appropriate combinational logic gate circuit, a Programmable Gate Array (PGA), a Field Programmable Gate Array (FPGA), or the like.
It will be understood by those skilled in the art that all or part of the steps carried by the method for implementing the above embodiments may be implemented by hardware related to instructions of a program, which may be stored in a computer readable storage medium, and when the program is executed, the program includes one or a combination of the steps of the method embodiments.
In addition, each functional unit in the embodiments of the present invention may be integrated into one processing module, or each unit may exist alone physically, or two or more units are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode. The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may also be stored in a computer readable storage medium.
The storage medium mentioned above may be a read-only memory, a magnetic or optical disk, etc. Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.
Claims (7)
1. The utility model provides an embedded two-sided heat dissipation power device's packaging structure which characterized in that includes:
the metal-clad laminate comprises a first metal insulation substrate, wherein the inner surface of the first metal insulation substrate is provided with N first strip-shaped grooves, wherein N is a positive integer greater than or equal to 2;
the second metal insulation substrate is arranged in parallel with the first metal insulation substrate, and N second strip-shaped grooves are correspondingly formed in the inner surface of the second metal insulation substrate;
one end of each embedded body is embedded into the first strip-shaped groove, and the other end of each embedded body is embedded into the corresponding second strip-shaped groove;
n-1 metal alloy gaskets, wherein the N-1 metal alloy gaskets are sequentially arranged between the two connected embedded bodies, and one end of each metal alloy gasket is connected with the inner surface of the first metal insulating substrate;
n-1 power chips, wherein the N-1 power chips are respectively arranged between the other ends of the N-1 metal alloy gaskets and the inner surface of the second metal insulation substrate.
2. The package structure of the embedded double-sided heat dissipation power device as recited in claim 1,
each metal alloy gasket and the corresponding power chip are connected with two corresponding adjacent embedding bodies through connecting layers.
3. The package structure of the embedded double-sided heat dissipation power device as recited in claim 2,
and each power chip is connected with the corresponding metal alloy gasket, each power chip is connected with the inner surface of the second metal insulating substrate, and each metal alloy gasket is connected with the inner surface of the first metal insulating substrate through a welding layer.
4. The package structure of the embedded double-sided heat dissipation power device as recited in claim 1,
and radiating fins are arranged on two sides of each embedded body.
5. The package structure of the embedded double-sided heat dissipation power device as recited in claim 1,
each of the metal alloy shims is cylindrical.
6. The package structure of the embedded double-sided heat dissipation power device as recited in claim 1,
the embedded body is made of a high-thermal-conductivity material.
7. The package structure of the embedded double-sided heat dissipation power device as recited in claim 1,
the insert is made of a high-temperature material with high resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222626300.3U CN218769502U (en) | 2022-09-30 | 2022-09-30 | Packaging structure of embedded double-sided heat dissipation power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222626300.3U CN218769502U (en) | 2022-09-30 | 2022-09-30 | Packaging structure of embedded double-sided heat dissipation power device |
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| Publication Number | Publication Date |
|---|---|
| CN218769502U true CN218769502U (en) | 2023-03-28 |
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| CN202222626300.3U Active CN218769502U (en) | 2022-09-30 | 2022-09-30 | Packaging structure of embedded double-sided heat dissipation power device |
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- 2022-09-30 CN CN202222626300.3U patent/CN218769502U/en active Active
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