CN218765760U - Single-mode differential pressure sensor packaging structure with circuit board and shell - Google Patents
Single-mode differential pressure sensor packaging structure with circuit board and shell Download PDFInfo
- Publication number
- CN218765760U CN218765760U CN202222437191.0U CN202222437191U CN218765760U CN 218765760 U CN218765760 U CN 218765760U CN 202222437191 U CN202222437191 U CN 202222437191U CN 218765760 U CN218765760 U CN 218765760U
- Authority
- CN
- China
- Prior art keywords
- pressure sensor
- circuit board
- shell
- sensor chip
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 22
- 239000000565 sealant Substances 0.000 claims abstract description 11
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 7
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The invention provides a single-mode differential pressure sensor packaging structure with a circuit board and a shell, which is small in size, simple in structure, low in cost and suitable for popularization and application. The method is characterized in that: the packaging structure comprises a circuit board, a pressure sensor chip, a metal terminal pin and a shell; the circuit board is fixedly welded with the pressure sensor chip and the metal terminal pins through bonding pads, a through hole is formed in the circuit board, and the through hole is communicated with an air inlet hole in the bottom of the pressure sensor chip; the shell comprises an upper shell with an air tap and a lower shell with the air tap, the upper shell with the air tap is fixed on the upper surface of the circuit board through sealant, and the pressure sensor chip is positioned in a cavity of the upper shell with the air tap; the lower shell with the air tap is fixed on the lower surface of the circuit board through sealant, and the through hole is positioned in the cavity of the lower shell with the air tap; the metal terminal pins are located outside the housing.
Description
Technical Field
The invention relates to the technical field related to pressure sensors, in particular to a single-mode differential pressure sensor packaging structure with a circuit board and a shell.
Background
A differential pressure sensor is a pressure sensor used to measure the difference between two pressures, and is typically used to measure the pressure difference across a piece of equipment or component. The method is typically applied to measuring the exhaust pressure difference of the front channel and the rear channel of the automobile engine exhaust particle catcher. In the prior art, a common differential pressure sensor is a dual-mode differential pressure sensor, which respectively senses pressure differences between high-pressure gas and low-pressure gas and atmospheric pressure through two pressure chips mounted on a circuit board, and performs conversion processing and signal transmission on output signals of the two pressure chips through a pressure signal interface processing chip on the circuit board. The pressure sensor has larger size, complex structural design and higher cost, and limits the popularization and application. Therefore, there is a need to design a new differential pressure sensor.
Disclosure of Invention
In order to solve the problems mentioned in the above, the invention provides a single-mode differential pressure sensor packaging structure with a circuit board and a shell, which has the advantages of small size, simple structure, low cost and suitability for popularization and application.
The technical scheme is as follows:
the utility model provides a circuit board adds single mode differential pressure sensor packaging structure of shell which characterized in that: the packaging structure comprises a circuit board, a pressure sensor chip, a metal terminal pin and a shell;
the circuit board is fixedly welded with the pressure sensor chip and the metal terminal pins through bonding pads, a through hole is formed in the circuit board, and the through hole is communicated with a bottom air inlet hole of the pressure sensor chip;
the pressure sensor chip is positioned in a cavity of the upper shell with the air faucet, and a top air inlet of the pressure sensor chip is communicated with the outside through the air faucet of the upper shell with the air faucet; the lower shell with the air tap is fixed on the lower surface of the circuit board through sealant, the through hole is positioned in the cavity of the lower shell with the air tap, and the air inlet hole at the bottom of the pressure sensor chip is communicated with the outside through the through hole and the air tap of the lower shell with the air tap; the metal terminal pins are located outside the housing.
Furthermore, the type of the pressure sensor chip is a double-sided air inlet gauge pressure type pressure sensor chip.
Further, the circuit board is selected to be a printed circuit board or a ceramic circuit board.
Furthermore, the sealant is used for sealing the seam between the upper shell with the air tap and the lower shell with the air tap and the circuit board.
Furthermore, the metal terminal pins are used for leading out signals of the pressure sensor chip to the outside.
Further, the metal terminal pins are S-shaped.
Furthermore, the size of the through hole is consistent with that of the bottom air inlet hole of the pressure sensor chip.
The beneficial effects of the invention are as follows:
according to the invention, the upper shell with the air tap and the lower shell with the air tap are respectively and hermetically mounted on the upper surface and the lower surface of the circuit board, so that the air inlet hole at the top of the pressure sensor chip is communicated with the outside through the air tap of the upper shell with the air tap, the air inlet hole at the bottom of the pressure sensor chip is communicated with the outside through the through hole of the circuit board and the air tap of the lower shell with the air tap, and then the signal of the pressure sensor chip is led out to the outside through the metal terminal pins for use, thereby realizing a single-mode differential pressure sensor packaging structure.
Drawings
FIG. 1 is a schematic top view of the structure of the present invention.
FIG. 2 is a schematic side view of an air faucet of the present invention.
Fig. 3 is a side view of a metal terminal pin according to the structure of the present invention.
FIG. 4 is a top view of a pressure sensor die in accordance with the present invention.
FIG. 5 is a bottom view of a pressure sensor die in the configuration of the present invention.
FIG. 6 is a schematic top view of a circuit board according to the present invention.
Detailed Description
The present invention will be further described with reference to the following examples.
The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention. The conditions in the embodiments can be further adjusted according to specific conditions, and simple modifications of the method of the present invention based on the concept of the present invention are within the scope of the claimed invention.
As shown in fig. 1-6, a circuit board and shell single-mode differential pressure sensor package structure includes a circuit board 1, a pressure sensor chip 2, metal terminal pins 3 and a shell 4.
The circuit board 1 is fixedly welded with the pressure sensor chip 2 and the metal terminal pins 3 through bonding pads, the metal terminal pins 3 lead out signals of the pressure sensor chip 2 to the outside through the bonding pads and wiring of the circuit board 1, and the signals comprise power lines, ground lines, input signals, output signals and the like of the pressure sensor chip 2.
A through hole 11 is formed in the circuit board 1, and the through hole 11 is communicated with a bottom air inlet 22 of the pressure sensor chip 2; the through hole 11 corresponds to the size of the bottom air inlet hole 22 of the pressure sensor chip 2.
The housing 4 includes an upper housing 41 with air nozzles and a lower housing 42 with air nozzles. The upper housing 41 with the air tap is fixed on the upper surface of the circuit board 1 through a sealant (not labeled in the figure), the pressure sensor chip 2 is located inside the cavity 411 of the upper housing with the air tap, and the top air inlet 21 of the pressure sensor chip 2 is communicated with the outside through the air tap 412 of the upper housing with the air tap. The pressure sensor chip 2 is connected with other electrical components on the circuit board 1 through a bonding pad and a wiring on the circuit board 1 to form a working circuit, which is a conventional pressure sensor chip working circuit in the field and is not described herein again. Other electrical components are also positioned in the cavity 411 of the upper shell with the air tap, and the upper shell 41 with the air tap plays a role in protecting a working circuit, so that the service life of the pressure sensor is prolonged, and the reliability of the pressure sensor is improved.
The lower shell 42 with the air tap is fixed on the lower surface of the circuit board 1 through a sealant, the through hole 11 is located inside the cavity 421 of the lower shell with the air tap, and the bottom air inlet 22 of the pressure sensor chip 2 is communicated with the outside through the through hole 11 and the air tap 422 of the lower shell with the air tap.
The metal terminal pins 3 are located outside the housing 4. The metal terminal pin 3 is used for leading out a signal of the pressure sensor chip 2 to the outside. The metal terminal pins 3 are S-shaped and are matched with the shapes of the circuit board 1 and the shell 4.
The sealant is used for sealing the joint between the upper shell 41 with the air tap and the lower shell 42 with the air tap and the circuit board 1, so that liquid, gas and solid are prevented from entering the cavities of the upper shell 41 with the air tap and the lower shell with the air tap, and an internal working circuit is protected. The sealant is cured at high temperature.
Preferably, the type of the pressure sensor chip 2 is a double-sided intake gauge pressure type pressure sensor chip. The specific types can be as follows: the core senses the intelligent GZP130 type pressure sensor chip, and a GDP1704 series gauge pressure type pressure sensor wafer is pasted inside the core senses the intelligent GZP130 type pressure sensor chip, and the gas isolation of double-sided air inlets is realized.
Preferably, the circuit board 1 is a printed circuit board or a ceramic circuit board.
The working principle of the invention is as follows: when high-pressure gas and low-pressure gas act on the top air inlet hole 21 and the bottom air inlet hole 22 of the pressure sensor chip through the upper shell 41 with the air tap and the lower shell 42 with the air tap respectively, the pressure sensor chip 2 senses the gas pressure difference to generate a signal, and outputs the signal to the outside for use through the metal terminal pins 3.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a circuit board adds single mode differential pressure sensor packaging structure of shell which characterized in that: the packaging structure comprises a circuit board, a pressure sensor chip, a metal terminal pin and a shell;
the type of the pressure sensor chip is selected to be a double-sided air inlet gauge pressure type pressure sensor chip;
the circuit board is fixedly welded with the pressure sensor chip and the metal terminal pins through the bonding pads, a through hole is formed in the circuit board, the through hole is communicated with a bottom air inlet hole of the pressure sensor chip, and the size of the through hole is consistent with that of the bottom air inlet hole of the pressure sensor chip;
the shell comprises an upper shell with an air tap and a lower shell with the air tap, the upper shell with the air tap is fixed on the upper surface of the circuit board through sealant, the pressure sensor chip is positioned in a cavity of the upper shell with the air tap, and a top air inlet of the pressure sensor chip is communicated with the outside through the air tap of the upper shell with the air tap; the lower shell with the air faucet is fixed on the lower surface of the circuit board through sealant, the through hole is positioned in the cavity of the lower shell with the air faucet, and the bottom air inlet hole of the pressure sensor chip is communicated with the outside through the through hole and the air faucet of the lower shell with the air faucet; the metal terminal pins are positioned outside the shell; the metal terminal pin is S-shaped.
2. The circuit board-encased single-mode differential pressure sensor package of claim 1, wherein: the circuit board is selected to be a printed circuit board or a ceramic circuit board.
3. The circuit board-encased single-mode differential pressure sensor package of claim 1, wherein: the sealant is used for sealing the joint between the upper shell with the air tap and the lower shell with the air tap and the circuit board.
4. The circuit board-encased single-mode differential pressure sensor package of claim 1, wherein: the metal terminal pin is used for leading out a signal of the pressure sensor chip to the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222437191.0U CN218765760U (en) | 2022-09-15 | 2022-09-15 | Single-mode differential pressure sensor packaging structure with circuit board and shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222437191.0U CN218765760U (en) | 2022-09-15 | 2022-09-15 | Single-mode differential pressure sensor packaging structure with circuit board and shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218765760U true CN218765760U (en) | 2023-03-28 |
Family
ID=85694352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222437191.0U Active CN218765760U (en) | 2022-09-15 | 2022-09-15 | Single-mode differential pressure sensor packaging structure with circuit board and shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218765760U (en) |
-
2022
- 2022-09-15 CN CN202222437191.0U patent/CN218765760U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100707923B1 (en) | Pressure sensor having sensor chip and signal processing circuit mounted on a common stem | |
| CN100456007C (en) | Pressure sensor | |
| CN1112236A (en) | Pressure sensor possessing air-tight seal stress isolation seat for protecting sensor core | |
| CN2938053Y (en) | Silicon pressure sensor | |
| CN109696273B (en) | Automobile brake boosting vacuum pressure sensor device | |
| CN110207885A (en) | Pressure sensor core, core manufacture and packaging method and pressure sensor based on upside-down mounting welding core | |
| CN212409938U (en) | MEMS pressure sensor oil-filled core | |
| CN218765760U (en) | Single-mode differential pressure sensor packaging structure with circuit board and shell | |
| CN201107149Y (en) | High reliable electronic type automobile pressure sensor | |
| CN202710237U (en) | Absolute pressure sensor packaging structure | |
| CN108275648A (en) | A kind of pressure sensor packaging structure based on silicon piezoresistance type | |
| CN217006189U (en) | Pressure sensor assembly and electronic equipment | |
| CN110672259A (en) | Packaging module and pressure sensor adopting same | |
| CN217878130U (en) | Packaging structure of micro differential pressure sensor | |
| CN217442736U (en) | Pressure sensor's packaging structure | |
| CN207163634U (en) | A kind of differential pressure pickup | |
| CN215492197U (en) | Micro-differential pressure sensor | |
| CN210689903U (en) | High-reliability pressure sensor | |
| CN214224383U (en) | Special temperature measuring instrument | |
| CN2856942Y (en) | High temp pressure guiding level transmitter | |
| CN208190607U (en) | S-band balanced type clipping low-noise amplifier | |
| CN110749394A (en) | High-reliability pressure sensor | |
| CN110174209A (en) | Media-isolated pressure sensor | |
| CN220170432U (en) | Board-mounted air pressure sensor structure | |
| CN216191069U (en) | Differential pressure sensor packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: No. 100-17 Dicui Road, Liyuan Development Zone, Wuxi City, Jiangsu Province, 214000 Patentee after: WUXI SENCOCH SEMICONDUCTOR Co.,Ltd. Address before: 214000 north side of 3 / F podium, building A10, No. 777, Jianshe West Road, Binhu District, Wuxi City, Jiangsu Province Patentee before: WUXI SENCOCH SEMICONDUCTOR Co.,Ltd. |