CN218735824U - Light emitting element - Google Patents

Abstract

A light-emitting element comprises a substrate, a plurality of light shielding layers, a covering layer, a conductive layer and a plurality of bumps. The plurality of light blocking layers are arranged below the substrate. The cover layer contacts the first surface of the substrate and covers the plurality of light blocking layers. The conductive layer contacts the second surface of the substrate. The plurality of bumps are arranged on the second surface of the substrate and cover a part of the conductive layer, and an organic light-emitting unit containing organic materials is arranged between two adjacent bumps in the plurality of bumps. One of the plurality of bumps has an edge that is offset from an edge of one of the plurality of light blocking layers in the longitudinal direction.

Description

Light emitting element

Technical Field

The present disclosure relates to a light emitting device, and more particularly, to an organic light emitting device.

Background

Organic light emitting displays have been widely used in the top-most electronic devices. However, due to the limitations of the prior art, the light emitting effect of the light emitting material in the organic light emitting display cannot be effectively controlled, which leads to the problems of easy generation of halo and optical crosstalk, and the optical effect of the organic light emitting display is not as expected. In the prior art, some extra polarizers are added to improve the above problem, but the halo cannot be effectively eliminated, and the extra polarizers increase the thickness of the display and increase the cost. The present disclosure provides a device that addresses the above-mentioned dilemma.

SUMMERY OF THE UTILITY MODEL

The present invention provides a light-emitting device, which includes a substrate, a plurality of light shielding layers, a covering layer, a conductive layer, and a plurality of bumps. The light blocking layers are disposed below the substrate. The cover layer contacts the first surface of the substrate and covers the plurality of light blocking layers. The conductive layer contacts the second surface of the substrate. The plurality of bumps are arranged on the second surface of the substrate and cover a part of the conductive layer, and an organic light-emitting unit containing an organic material is arranged between two adjacent bumps in the plurality of bumps. One of the plurality of bumps has an edge that is offset from an edge of one of the plurality of light blocking layers in the longitudinal direction.

In some embodiments, an area of each of the plurality of light blocking layers in the lateral direction is larger than an area of each of the plurality of bumps.

In some embodiments, the conductive layer comprises a transparent conductive film comprising ITO (indium tin oxide), IZO (indium zinc oxide), or IGZO (indium gallium zinc oxide).

In some embodiments, the light emitting element includes a release layer under the cover layer, wherein the release layer is separated from the plurality of light blocking layers by the cover layer.

In some embodiments, a distance between edges of the two adjacent bumps of the organic light emitting unit is greater than a distance between edges of two adjacent light shielding layers of the plurality of light shielding layers.

In some embodiments, one of the plurality of light blocking layers may include a recess having a cross-shaped profile, which may expose light emitted from a single organic light emitting unit.

In some embodiments, one of the plurality of light blocking layers may include a recess having a cross-shaped profile, which may expose light emitted from the plurality of organic light emitting units.

The present invention provides a light emitting device, which includes a substrate, a patterned light shielding layer, a covering layer, a plurality of bumps, and a release layer. The patterned light shielding layer is arranged below the substrate and provided with an opening. The cover layer is below the patterned light blocking layer. The plurality of bumps are arranged on the substrate, and organic light emitting units containing organic light emitting materials are arranged between two adjacent bumps in the plurality of bumps respectively, wherein each organic light emitting unit comprises a first light emitting unit, a second light emitting unit and a third light emitting unit, and the edge of the patterned light shielding layer is not aligned with the edge of one of the plurality of bumps. The release layer is below the cover layer, wherein the release layer is separated from the patterned light blocking layer by the cover layer.

In some embodiments, the organic light emitting material includes a molecular structure having a resonance structure, and may be selected from the group consisting of spiro-triarylamines, bis-triarylamines, and combinations thereof.

In some embodiments, each of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit has an effective light-emitting area defined by an anode under each light-emitting unit, each light-emitting unit has a black area and a bright area when emitting light, and the total area of the black area is less than 50% of the effective light-emitting area.

In some embodiments, the first light emitting unit, the second light emitting unit, and the third light emitting unit each have an organic light emitting stack layer including an organic material, wherein the organic light emitting stack layer includes: carrier injection layer, carrier transport layer, organic emission layer and organic carrier transport layer.

In some embodiments, the light shielding layer and the cover layer comprise organic materials, and the release layer comprises inorganic materials.

In certain embodiments, the substrate comprises a transparent material.

In some embodiments, a distance between each edge of two adjacent bumps of the first light emitting unit is greater than a width of the opening of the patterned light blocking layer.

Drawings

Fig. 1 is a plan view illustrating an intermediate product of a light emitting element.

Fig. 2 is a sectional view illustrating along line AA in fig. 1.

Fig. 3 is a cross-sectional view showing the relative relationship between the light emitting element and the mucosa.

Fig. 4A to 4K illustrate a process of manufacturing a light emitting device according to an embodiment.

Fig. 5A and 5B show top views of a light blocking layer according to an embodiment.

Detailed Description

Fig. 1 is a plan view illustrating an intermediate product of the light-emitting element 10. The light emitting element 10 has a light emitting layer 20 and a cover layer 40 over the light emitting layer 20. For the light emitting layer 20, the spacers 21 may be designed to provide an array of recesses for accommodating an array of light emitting pixels. In some embodiments, spacers 21 may comprise a light sensitive material.

Fig. 2 is a cross-sectional view illustrating along a line AA in fig. 1 and illustrates only a light emitting region. The cover layer 40 is omitted here for the sake of clarity. The spacer 21 has a plurality of bumps 105 to define the light-emitting pixel pattern. The concave portion is between two adjacent bumps 105 and provides a space to accommodate a light emitting pixel. It will be understood by those skilled in the art that the bumps 105 are shown in a broken manner when viewed in cross section, but they may be connected to each other through other portions of the spacers 21 when viewed from the top in fig. 1.

The light emitting element 10 includes a light emitting array including a first organic light emitting unit 10a, a second organic light emitting unit 10b, and a third organic light emitting unit 10c. The organic light emitting unit may also be referred to as a light emitting pixel in this case. In some embodiments, the light emitting cell 10a includes a first electrode 104, a carrier injection layer 106L1 over the bump 105 and the first electrode 104, a carrier transport layer 106L2 over the carrier injection layer 106L1, an organic emissive layer 106L3 over a portion of the carrier transport layer 106L2, and an organic carrier transport layer 106L4 over the organic emissive layer 106L3. The carrier injection layer 106L1, the carrier transport layer 106L2, the organic emissive layer 106L3, and the organic carrier transport layer 106L4 may be collectively referred to as an organic light emitting stack layer.

In some embodiments, the carrier injection layer 106L1 is disposed between the first electrode 104 and the carrier transport layer 106L2. The light-emitting unit 10a includes an organic material, which may be disposed in any one of a carrier transport layer, a carrier injection layer, or an emitter layer of the light-emitting unit 10a according to various embodiments. And the organic material has an absorbance for a specific wavelength of greater than or equal to 50% in some embodiments, greater than or equal to 60% in some embodiments, greater than or equal to 70% in some embodiments, greater than or equal to 80% in some embodiments, greater than or equal to 90% in some embodiments, and greater than or equal to 95% in some embodiments.

In some embodiments, the particular wavelength is no greater than 400nm, in some embodiments, the particular wavelength is no greater than 350nm, in some embodiments, the particular wavelength is no greater than 300nm, in some embodiments, the particular wavelength is no greater than 250nm, in some embodiments, the particular wavelength is no greater than 200nm, in some embodiments, the particular wavelength is no greater than 150nm, in some embodiments, the particular wavelength is no greater than 100nm.

The substrate 100 is positioned under the light emitting layer 20. In some embodiments, the substrate 100 may include a Thin Film Transistor (TFT) array. In some embodiments, the substrate 100 includes a substrate (not shown), a dielectric layer (not shown), and one or more circuits (not shown) disposed on or within the substrate. In some embodiments, the substrate is a transparent substrate, or at least a portion is transparent. In some embodiments, the substrate is a non-flexible substrate, and the material of the substrate may include glass, quartz, low temperature poly-silicon (LTPS), or other suitable materials. In some embodiments, the substrate is a flexible substrate, and the material of the substrate may include transparent epoxy, polyimide, polyvinyl chloride, methyl methacrylate, or other suitable materials. The dielectric layer may be disposed on the substrate as desired. In some embodiments, the dielectric layer may comprise silicon oxide, silicon nitride, silicon oxynitride, or other suitable material.

In some embodiments, the circuit may comprise a Complementary metal-oxide-semiconductor (CMOS) circuit or may comprise a plurality of transistors and a plurality of capacitors adjacent to the transistors, wherein the transistors and the capacitors are formed on a dielectric layer. In some embodiments, the transistor is a thin-film transistor (TFT). Each transistor includes source/drain regions (including at least a source region and a drain region), a channel region between the source/drain regions, a gate electrode disposed over the channel region, and a gate insulator between the channel region and the gate electrode. The channel region of the transistor may be made of a semiconductor material, such as silicon or another element selected from group IV or group III and group V.

A plurality of light blocking layers 101 are formed under the substrate 100. A plurality of light blocking layers 101 are formed on the first surface 100a of the substrate 100. The plurality of light blocking layers 101 are spaced apart from the substrate 100. The plurality of light blocking layers 101 may also be collectively referred to as a patterned light blocking layer 101. The plurality of light blocking layers 101 are separated from each other by a distance W1. The portions of the plurality of light blocking layers 101 separated from each other may also be referred to as openings, and the openings have a width W1. The light shielding layers 101 can absorb more than 90% of visible light. In some embodiments, the light blocking layer 101 may comprise a black body material. In some embodiments, the light blocking layer 101 comprises a layer of a single material. In some embodiments, the light blocking layer 101 comprises a composite layer of multiple materials. In some embodiments, the light blocking layer 101 comprises an organic material. In some embodiments, the light blocking layer 101 comprises an inorganic material.

The cover layer 102 contacts the first surface 100a of the substrate 100 and covers the plurality of light blocking layers 101. The cover layer 102 is formed in the gap between the plurality of light blocking layers 101. The cover layer 102 is formed in the opening of the patterned light blocking layer 101. The cover layer 102 covers the bottom surface and two side surfaces of the light blocking layer 101. The cover layer 102 separates the substrate 100 from the plurality of light blocking layers 101. In some embodiments, the capping layer 102 comprises an organic material. In some embodiments, the cover layer 102 can protect the light blocking layer 101 from scratches during the manufacturing process.

A plurality of first electrodes 104 are formed on the second surface 100b of the substrate 100. The plurality of first electrodes 104 contact the substrate 100. The plurality of first electrodes 104 contact the second surface 100b of the substrate 100. The plurality of first electrodes 104 are spaced apart from each other. The plurality of first electrodes 104 are electrically connected to the substrate 100.

As shown in fig. 2, the bumps 105 are disposed on the second surface of the substrate 100 and cover a portion of the first electrode 104. The peripheral region of the first electrode 104 is covered with a bump 105. In some embodiments, the edge corners of the first electrode 104 are completely surrounded by the bumps 105. In some embodiments, the sidewalls of the first electrode 104 are fully in contact with the bump 105. In some embodiments, the two bumps 105 in the gap between the two first electrodes 104 are separated from each other.

In this case, the first electrode 104 may be an anode. In this case, the first electrode 104 may be a conductive layer. The first electrode 104 of the light emitting cell 10a may define the size of the effective light emitting area. In some examples, the light emitting unit 10a has a black region and a bright region when emitting light. The total area of the black region is less than 50% of the effective light emitting region. The active light emitting area may also be referred to as an active illumination area.

In some embodiments, the active illumination area has a width of at least less than 10 microns. In some embodiments, the active illumination area has a width of about 3 to 6 microns. In some embodiments, the active illumination area has a width of about 4 to 6 microns. The effective illumination area determines the pixel size of the light emitting element 10 in fig. 1. Since the size of the effective illumination area can be controlled to be 10 μm or less, the pixel density of the light emitting element 10 can exceed 1000 or 2000ppi.

In fig. 2, the light blocking layer 101 has a thickness 101T. The first electrode 104 has a thickness 104T. In some embodiments, the thickness 101T of the light blocking layer 101 is greater than the thickness 104T of the first electrode 104. In some embodiments, the thickness 101T of the light blocking layer 101 is equal to the thickness 104T of the first electrode 104. In some embodiments, the thickness 101T of the light blocking layer 101 is less than the thickness 104T of the first electrode 104.

The first electrode 104 may have a thickness of about

To about->

Of the substrate is described. In some embodiments, the first electrode 104 has about +>

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Of the substrate is described. In some embodiments, the first electrode 104 has about +>

Of the substrate is described. The first electrode 104 may be a conductive layer. The first electrode 104 may comprise ITO, IZO, IGZO, alCu alloy, agMo alloy, or substantially ^ or greater>

To/is>

ITO (or IZO or IGZO) and->

To/is>

Metal film (Ag, al, mg, au) and about->

To

ITO (or IZO or IGZO).

In some embodiments, the electrode 104 is a composite structure. For example, the electrode 104 has a conductive film and a transparent conductive film thereon. The conductive film is located between the transparent conductive film and the substrate 100. In some embodiments, the conductive film comprises aluminum, gold, silver, copper, or the like. In some embodiments, the transparent conductive film comprises indium, tin, graphene, zinc, oxygen, and the like. In some embodiments, the electrode 104 comprises a transparent conductive film. In some embodiments, the electrode 104 comprises ITO (indium tin oxide). In some embodiments, the electrode 104 comprises IZO (indium zinc oxide). In some embodiments, the electrode 104 comprises IGZO (indium gallium zinc oxide). In some embodiments, the roughness of the transparent conductive film

The thickness of the conductive film can be about->

To about->

In the meantime. The transparent conductive film can have a thickness of about +>

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In between.

In some embodiments, the first electrode 104 has at least three different films. A conductive film (e.g., al, cu, ag, au, etc.) is interposed between the two transparent conductive films. In some cases, one of the two transparent conductive films is ITO, one side of which is in contact with the substrate 100 and the other side of which is in contact with the conductive film. In some cases, one of the two transparent conductive films is ITO, one side of which is in contact with the conductive film and the other side of which is in contact with the bump 105 or the light emitting material.

In some embodiments, each bump 105 has a curved surface that protrudes away from the substrate 100 and covers a peripheral region of the first electrode 104. The bumps 105 may be of different shapes. In some embodiments, bumps 105 have curved surfaces. In some embodiments, the shape of the bump 105 is trapezoidal. In some embodiments, the shape of the bump 105 is rectangular. The pattern of the bump 105 is designed according to the pixel arrangement, and the patterned bump 105 may be referred to as a Pixel Defined Layer (PDL). The bump 105 is disposed on the substrate 100. Each bump 105 fills a gap between two adjacent first electrodes 104. Each first electrode 104 is partially covered by a bump 105. The bumps 105 may include a photosensitive material. In fig. 2, the area of each of the plurality of light blocking layers 101 is larger than that of each of the bumps 105 in the lateral direction.

One of the bumps 105 has an edge 105a on an upper surface covering the first electrode 104. The light blocking layer 101 has an edge 101a near the center of the first electrode 104. The edge 101a of the light blocking layer 101 is not aligned with the edge 105a of the bump 105. The edge 105a of the bump 105 is offset from the edge 101a of the light blocking layer by an offset d in the longitudinal direction. The percentage of the offset d to the width of the light blocking layer 101 may be greater than or equal to 1%. The percentage of the offset d to the width of the light blocking layer 101 may be greater than or equal to 5%. The percentage of the offset d to the width of the light blocking layer 101 may be greater than or equal to 10%. The percentage of the offset d to the width of the light blocking layer 101 may be greater than or equal to 15%.

One of the bumps 105 'has an edge 105' a on an upper surface covering the first electrode 104. The light shielding layer 101 'has an edge 101' a near the center of the first electrode 104. Edge 101'a of light shielding layer 101' is not aligned with edge 105'a of bump 105'. There is an offset d 'between the edge 105' a of the bump 105 'and the edge 101' a of the light shielding layer. The percentage of the offset d to the width of the light blocking layer 101' may be greater than or equal to 1%. The percentage of the offset d to the width of the light blocking layer 101' may be greater than or equal to 5%. The percentage of the offset d to the width of the light blocking layer 101' may be greater than or equal to 10%. The percentage of the offset d to the width of the light blocking layer 101' may be greater than or equal to 15%. In some embodiments, offset d is equal to offset d'. In some embodiments, the offset d is greater than the offset d'. In some embodiments, the offset d is less than the offset d'.

In fig. 2, the distance between the plurality of light shielding layers 101 and 101' is W1, and the distance between each of the edges 105a and 105' a of the two adjacent bumps 105 and 105' is W2. Due to the offsets d and d ', a distance W2 between one edges 105a and 105' a of two adjacent bumps 105 and 105' is greater than a distance W1 between one edges 101a and 101' a of two adjacent light shielding layers 101 and 101' of the plurality of light shielding layers. In fig. 2, a distance W2 between each edge 105a and 105'a of two adjacent bumps 105 and 105' may be a sum of a distance W1 between two of the light shielding layers 101 and 101 'and an offset d' in the plurality of light shielding layers 101. A distance W2 between each edge 105a and 105'a of two adjacent bumps 105 and 105' defines an area of the active light emitting region. Since the distance W1 between the plurality of light blocking layers 101 and 101 'is smaller than W2, the plurality of light blocking layers 101 and 101' can control the light emitted from the first electrode 104, thereby improving the imaging effect of the pattern.

In some embodiments, the absorption rate of the bumps 105 for a specific wavelength is greater than or equal to 50%, in some embodiments, the absorption rate of the bumps 105 for a specific wavelength is greater than or equal to 60%, in some embodiments, the absorption rate of the bumps 105 for a specific wavelength is greater than or equal to 70%, in some embodiments, the absorption rate of the bumps 105 for a specific wavelength is greater than or equal to 80%, in some embodiments, the absorption rate of the bumps 105 for a specific wavelength is greater than or equal to 90%, and in some embodiments, the absorption rate of the bumps 105 for a specific wavelength is greater than or equal to 95%. In some embodiments, the particular wavelength is no greater than 400nm, in some embodiments, the particular wavelength is no greater than 350nm, in some embodiments, the particular wavelength is no greater than 300nm, in some embodiments, the particular wavelength is no greater than 250nm, in some embodiments, the particular wavelength is no greater than 200nm, in some embodiments, the particular wavelength is no greater than 150nm, in some embodiments, the particular wavelength is no greater than 100nm.

A carrier implant layer 106L1 is disposed on exposed surfaces of the capping layer 102, the bump 105, and the first electrode 104. The carrier injection layer 106L1 continuously covers the bump 105 and the exposed surface of the first electrode 104. In some embodiments, the exposed surface of each first electrode 104 is an effective light emitting area configured for one light emitting cell 10 a. Optionally, the carrier injection layer 106L1 contacts the bump 105. In some embodiments, the carrier injection layer 106L1 is in contact with the first electrode 104. In some embodiments, the carrier injection layer 106L1 is an organism. In some embodiments, the carrier injection layer 106L1 is configured to perform hole injection. In some embodiments, the carrier injection layer 106L1 is a hole injection layer. In some embodiments, the carrier injection layer 106L1 may have a thickness of about

To about->

Is measured.

A carrier transport layer 106L2 is disposed on exposed surfaces of the capping layer 102, the bump 105, and the first electrode 104. The carrier transport layer 106L2 is disposed above the carrier injection layer 106L1 and completely covers the carrier injection layer 106L1. The carrier injection layer 106L1 is disposed below the carrier transport layer 106L2. The carrier transport layer 106L2 continuously covers the carrier injection layer 106L1. The carrier transport layer 106L2 covers the plurality of bumps 105 and the plurality of first electrodes 104. Optionally, the carrier transport layer 106L2 is in contact with the carrier injection layer 106L1. In some embodiments, the carrier transport layer 106L2 is an organism. In some embodiments, the carrier transport layer 106L2 is configured to perform hole transport. In some embodiments, the carrier transport layer 106L2 is a first hole transport layer. In some embodiments, the carrier injection layer 106L1 may have a thickness of about

To about->

Is measured.

An organic emission layer 106L3 is disposed on exposed surfaces of the capping layer 102, the bump 105, and the first electrode 104. The organic emissive layer 106L3 is disposed over the carrier transport layer 106L2 and completely covers the carrier transport layer 106L2. The carrier transport layer 106L2 is disposed under the organic emission layer 106L3. The organic emissive layer 106L3 continuously covers the carrier transport layer 106L2. The organic emission layer 106L3 covers the plurality of bumps 105 and the plurality of first electrodes 104. Optionally, the organic emissive layer 106L3 is in contact with the carrier transport layer 106L2. The organic emission layer 106L3 is configured to emit a first color.

In some embodiments, the absorbance of the organic emission layer 106L3 for a specific wavelength is greater than or equal to 50%, in some embodiments, the absorbance of the organic emission layer 106L3 for a specific wavelength is greater than or equal to 60%, in some embodiments, the absorbance of the organic emission layer 106L3 for a specific wavelength is greater than or equal to 70%, in some embodiments, the absorbance of the organic emission layer 106L3 for a specific wavelength is greater than or equal to 80%, in some embodiments, the absorbance of the organic emission layer 106L3 for a specific wavelength is greater than or equal to 90%, and in some embodiments, the absorbance of the organic emission layer 106L3 for a specific wavelength is greater than or equal to 95%. In some embodiments, the particular wavelength is no greater than 400nm, in some embodiments, the particular wavelength is no greater than 350nm, in some embodiments, the particular wavelength is no greater than 300nm, in some embodiments, the particular wavelength is no greater than 250nm, in some embodiments, the particular wavelength is no greater than 200nm, in some embodiments, the particular wavelength is no greater than 150nm, in some embodiments, the particular wavelength is no greater than 100nm.

In some embodiments, at least one of the carrier transport layer 106L2 and the organic emissive layer 106L3 comprises an organic material. The organic material may include a molecular structure having a resonance structure. The organic material may be selected from the group consisting of spiro-triarylamines, bis-triarylamines, and combinations thereof. In some embodiments, at least one of the carrier transport layer 106L2 and the organic emissive layer 106L3 comprises a spiro-triarylamine. In some embodiments, the carrierAt least one of the bulk transport layer 106L2 and the organic emissive layer 106L3 includes a bis-triarylamine. In some embodiments, the carrier transport layer 106L2 and the organic emissive layer 106L3 comprise the same material. In some embodiments, the carrier transport layer 106L2 includes

And the organic emission layer 106L3 comprises +>

In some embodiments of the present invention, the, carrier transport layer 106L2 includes { [ MEANS ]>

And the organic emission layer 106L3 comprises +>

An organic carrier transport layer 106L4 is disposed on exposed surfaces of the capping layer 102, the bump 105, and the first electrode 104. The organic carrier transport layer 106L4 is disposed over the organic emission layer 106L3 and completely covers the organic emission layer 106L3. The organic emission layer 106L3 is disposed under the organic carrier transport layer 106L4. The organic carrier transport layer 106L4 continuously covers the organic emissive layer 106L3. The organic carrier transport layer 106L4 covers the plurality of bumps 105 and the plurality of first electrodes 104. Optionally, the organic carrier transport layer 106L4 is in contact with the organic emissive layer 106L3.

The second electrode 106D is disposed on exposed surfaces of the capping layer 102, the bump 105, and the first electrode 104. The second electrode 106D is disposed over the organic carrier transport layer 106L4 and completely covers the organic carrier transport layer 106L4. In some cases, the second electrode 106D is patterned to cover only the effective light emitting areas of the individual light emitting pixels. In some cases, the second electrode 106D is in contact with the organic carrier transport layer 106L4.

The second electrode 106D may have a thickness of about

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Of (c) is used. In some embodiments, the second electrode 106D can have an approximate @>

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Is measured. In some embodiments, the second electrode 106D can have an approximate @>

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Of (c) is used. In some embodiments, the second electrode 106D can have an approximate @>

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Is measured. In some embodiments, the second electrode 106D can have an area about +>

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Is measured. In some embodiments, the second electrode 106D can have an approximate @>

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Is measured.

In this case, the second electrode 106D may be a cathode. The second electrode 106D may be a metal material, such as Ag, mg, etc. In some embodiments, the second electrode 106D includes ITO (indium tin oxide) or IZO (indium zinc oxide).

In some embodiments, the second electrode 106D is a composite structure. For example, the second electrode 106D has a conductive film and a transparent conductive film thereon. The conductive film is located between the transparent conductive film and the organic carrier transport layer 106L4. In some embodiments, the conductive film comprises aluminum, gold, silver, copper, magnesium, molybdenum, and the like. In some embodiments, the transparent conductive film comprises indium, tin, graphene, zinc, oxygen, and the like. In some embodiments, the transparent conductive film is ITO (indium tin oxide). In some embodiments, the transparent conductive film is IZO (indium zinc oxide). In some embodiments, a transparent conductive film is positioned between the conductive film and the organic carrier transport layer 106L4. In some embodiments, the second electrode 106D may be a patterned conductive layer, or a patterned conductive layer with a patterned insulating layer.

In fig. 2, the light emitting element 10 includes a substrate 100, a plurality of bumps 105 on the substrate 100, and a plurality of light emitting cells separated by the bumps 105.

The light emitting units include a first light emitting unit 10a, a second light emitting unit 10b, and a third light emitting unit 10c. In some embodiments, the first light emitting cell 10a, the second light emitting cell 10b, and the third light emitting cell 10c are adjacent to each other. In some embodiments, the second and third light emitting units 10b and 10c have a similar configuration to the first light emitting unit 10 a. In addition, although the first, second, and third light emitting units 10a, 10b, and 10c are illustrated as having similar features, this is merely an example and is not intended to limit the embodiments. The first, second, and third light emitting units 10a, 10b, and 10c may have similar structures or different structures to meet desired functional requirements.

The first, second, and third light emitting cells 10a, 10b, and 10c may be different from each other at least in the thickness of the organic light emitting stack layer. In some embodiments, the first light emitting unit 10a emits green light, the second light emitting unit 10b emits red light, and the third light emitting unit 10c emits blue light.

In some embodiments, the light emitting units 10a, 10b, 10c are configured to be divided into at least three different groups, wherein each group emits a color different from the colors emitted by the other groups. The thickness of each organic light emitting stack layer may be related to the color displayed by the corresponding light emitting cell 10a, 10b, 10c. In some embodiments, the first light emitting cell 10a emits green light, and the organic light emitting stack layer of the first light emitting cell 10a may have a minimum thickness, as compared to other light emitting cells configured to emit different colors. In some embodiments, the second light emitting unit 10b emits red light compared to other light emitting units configured to emit different colors, and the thickness of the organic light emitting stack layer within the second light emitting unit 10b may be between the thickness of the organic light emitting stack layer within the first light emitting unit 10a and the thickness of the organic light emitting stack layer within the third light emitting unit 10c. In some embodiments, the third light emitting unit 10c emits blue light, and the organic light emitting stack layer of the third light emitting unit 10c may have a maximum thickness, as compared to other light emitting units configured to emit different colors. The organic light emitting stack layers of the first, second, and third light emitting cells 10a, 10b, and 10c may be formed through various processes such as vapor deposition, liquid ejection, or ink jet printing.

In some embodiments, the first, second and third light emitting cells 10a, 10b, 10c may be different from each other at least in a difference in thickness of the carrier transport layers of the first, second and third light emitting cells 10a, 10b, 10c.

In some embodiments, the light emitting units 10a, 10b, 10c are configured to be divided into at least three different groups, wherein each group emits a color different from the colors emitted by the other groups. The thickness of the carrier transport layer may be related to the color displayed by the corresponding light emitting unit 10 a. In some embodiments, the first light emitting unit 10a emits green light compared to other light emitting units configured to emit different colors, and the carrier transport layer of the first light emitting unit 10a may have a minimum thickness. In some embodiments, the second light emitting cell 10b emits red light compared to other light emitting cells configured to emit different colors, and the thickness of the carrier transport layer within the second light emitting cell 10b may be between the thickness of the carrier transport layer within the first light emitting cell 10a and the thickness of the carrier transport layer within the third light emitting cell 10c. In some embodiments, the third light emitting unit 10c emits blue light, and the carrier transport layer of the third light emitting unit 10c may have a maximum thickness, as compared to other light emitting units configured to emit different colors.

Fig. 3 is a cross-sectional view showing the relative relationship between the light emitting element and the mucosa. The release layer 103 is formed under the capping layer 102. In some embodiments, the release layer 103 may protect the cover layer 102. In some embodiments, the cover layer 102 may protect the light blocking layer 101. In some embodiments, the release layer 103 may protect the light blocking layer 101. The release layer 103 is separated from the plurality of light blocking layers 101 by the cover layer 102. In some embodiments, the release layer 103 comprises an inorganic material. In some embodiments, the release layer 103 comprises silicon oxide or silicon nitride. In some embodiments, the release layer 103 may include silicon.

During the manufacturing process, a release film 107 is provided to fix the plurality of light emitting elements 10'. As shown in fig. 3, the release layer 103 is formed between the cover layer 102 and the release film 107, and the release layer 103 contacts the release film 107. The adhesive-releasing film 107 is used to fix the wafer on which the light-emitting device is formed, so as to ensure the cutting accuracy when the light-emitting device is divided. When the cutting is completed, the light emitting element 10' is separated from the mucosa 107. In some embodiments, the mucosa 107 comprises an organic material. When the light emitting device 10' and the release film 107 are separated by irradiating ultraviolet rays, the release layer 103 and the release film 107 are easily peeled off because the release layer 103 is an inorganic material and the release film 107 is an organic material, thereby improving the process yield in dividing the light emitting device. In some embodiments, the releasing layer 103 can achieve the technical effect of easy peeling. In some embodiments, the releasing layer 103 can protect the light blocking layer 101. In some embodiments, the release layer 103 comprises a scratch resistant material. In some embodiments, the releasing layer 103 prevents the light blocking layer 101 from diffusing.

In some embodiments, the releasing layer 103 comprises a layer of a single material. In some embodiments, the releasing layer 103 includes a composite layer of multiple materials. In some embodiments, the releasing layer 103 may be coated (coating) or sprayed (spraying) on the capping layer 102. In some embodiments, the thickness of the release layer 103 can be less than 15um, such as between 1um to 10 um. In some embodiments, the releasing layer 103 may comprise a photoresist material, such as carbon, hydrogen, oxygen, other suitable materials, or a mixture of the foregoing. In some embodiments, one side surface of the releasing layer 103 may be coated with a releasing agent having separability. In some embodiments, the releasing force of the releasing layer 103 may be less than 15 grams/centimeter (g/mm), such as less than 10 grams/mm.

Fig. 4A to 4K illustrate a process of manufacturing a light emitting device according to an embodiment.

In fig. 4A, a substrate 100 is provided.

In fig. 4B, a plurality of light blocking layers 101 are disposed on the first surface 100a of the substrate 100. Each light blocking layer 101 is disposed on the same side of the substrate. The respective light blocking layers 101 are separated from each other.

In fig. 4C, a cover layer 102 is provided on each light shielding layer 101 on the first surface 100a of the substrate 100. The cover layer 102 surrounds the upper surface and both side surfaces of each of the plurality of light blocking layers 101. The cover layer 102 contacts the substrate 100. The capping layer 102 is formed on the plurality of light blocking layers 101 by one of Chemical Vapor Deposition (CVD), physical Vapor Deposition (PVD) and Spin on glass (SOG Spin coating).

In fig. 4D, a plurality of first electrodes 104 are disposed on the second surface 100b of the substrate 100. Each first electrode 104 is configured to be electrically connected to the substrate 100. The array pattern of the first electrodes 104 is designed in consideration of the arrangement of the pixels.

In fig. 4E, a photosensitive layer 105L is disposed on the first electrode 104. In some embodiments, a photosensitive layer 105L is coated on the first electrode 104 and the capping layer 102. The photosensitive layer 105L fills the gap between the adjacent first electrodes 104. The photosensitive layer 105L is heated to a predetermined temperature and then exposed to a prescribed wavelength. The photosensitive layer 105L can absorb more than 90% of visible light. After exposure, the photosensitive layer 105' is wetted in a solution for development.

As shown in fig. 4F, a portion of the photosensitive layer 105L is removed, and the remaining portion partially covers the gap between the adjacent first electrodes 104. In the cross-sectional view, the remaining photosensitive layer 105L forms a plurality of bumps 105, and each bump 105 is formed on a portion of the upper surface of the first electrode 104 and covers a side surface of the first electrode 104. The bumps 105 partially cover the respective first electrodes 104.

Bumps 105 may be formed in different shapes. In fig. 4F, the bump 105 has a curved surface. In some embodiments, the shape of the bump 105 is trapezoidal. After the bump 105 is formed, a cleaning operation is performed to clean the bump 105 and the exposed surface of the first electrode 104. In one embodiment, the deionized water is heated to a temperature between 30 ℃ and 80 ℃ during the cleaning operation. After the temperature of the deionized water is raised to a predetermined temperature, the deionized water is introduced to the exposed surfaces of the bump 105 and the first electrode 104.

In some embodiments, ultrasonic waves are used during the cleaning operation. The ultrasonic waves are introduced into a cleaning agent (e.g., water or isopropyl alcohol (IPA)). In some embodiments, carbon dioxide is introduced into the cleaning agent. After the cleaning operation, the cleaning agent is removed from the exposed surface via a heating operation. During the heating operation, the substrate 100 and the bumps 105 may be heated to a temperature between 80 ℃ and 110 ℃. In some examples, compressed air is directed to the exposed surfaces to help remove residues of the cleaning agent while heating.

After the heating operation, the exposed surface may be treated with O2, N2, or Ar plasma. The plasma is used to roughen the exposed surface. In some embodiments, ozone is used to condition the surface of the exposed surface.

As shown in fig. 4G, a carrier injection layer 106L1 is disposed on the bump 105, a portion of the exposed surface of the capping layer 102, and the exposed surface of the first electrode 104. The carrier injection layer 106L1 is continuously lined (lining) along the exposed surface. More specifically, the exposed surface of each first electrode 104 is configured as an effective light emitting area of a light emitting unit (i.e., a pixel). In this embodiment, all the light emitting cells use the carrier injection layer 106L1. In some embodiments, the carrier injection layer 106L1 is used for hole injection. In some embodiments, the carrier injection layer 106L1 is used for electron injection. The carrier injection layer 106L1 continuously covers the plurality of bumps 105 and the exposed surface of the first electrode 104. Optionally, the carrier injection layer 106L1 is in contact with the bump 105. In one embodiment, the carrier injection layer 106L1 is in contact with the first electrode 104. In some embodiments, the carrier injection layer 106L1 is organic.

As shown in fig. 4H, a carrier transport layer 106L2 is disposed on the bump 105, a portion of the exposed surface of the capping layer 102, and the exposed surface of the first electrode 104. The carrier injection layer 106L1 is disposed below the carrier transport layer 106L2. The carrier transport layer 106L2 is continuously lined along the carrier injection layer 106L1. In this embodiment, all the light emitting cells use the carrier transport layer 106L2. In some embodiments, the carrier transport layer 106L2 is used for hole injection. In some embodiments, the carrier transport layer 106L2 is used for electron injection. The carrier transport layer 106L2 continuously covers the plurality of bumps 105 and the first electrode 104. Optionally, the carrier transport layer 106L2 is in contact with the carrier injection layer 106L1. In some embodiments, carrier transport layer 106L2 is organic.

In fig. 4I, an organic emission layer 106L3 is disposed on the bump 105, a portion of the exposed surface of the capping layer 102, and the exposed surface of the first electrode 104. The organic emission layer 106L3 covers the carrier transport layer 106L2. The organic emission layer 106L3 completely covers the exposed carrier transport layer 106L2. The organic emissive layer 106L3 is configured to emit a first color.

As shown in fig. 4J, an organic carrier transport layer 106L4 is disposed on the organic emission layer 106L3. The organic carrier transport layer 106L4 may be a hole or electron transport layer. In some embodiments, organic carrier transport layer 106L4 and carrier transport layer 106L2 are each configured in opposite valence states.

In fig. 4K, a second electrode 106D is disposed on the organic carrier transport layer 106L4. The second electrode 106D covers the organic carrier transport layer 106L4. The second electrode 106D may be a metal material, such as Ag, mg, etc. In some embodiments, the second electrode 106D includes ITO (indium tin oxide) or IZO (indium zinc oxide). In some embodiments, each light emitting cell (i.e., pixel) has an independent second electrode 106D as viewed in cross-section.

The operations shown in fig. 4A-4K may be repeatedly performed to form light emitting units of different colors.

As shown in fig. 4K, the light L1 generated by the light emitting unit can be emitted outward toward the substrate, and a part of the light L2 is also emitted outward toward the second electrode 106D. When the light L2 hits the second electrode 106D, different reflected light L2r may be generated due to different materials in the second electrode 106D. The reflected light L2r may interfere with the light L1 generated by the light emitting unit, thereby generating problems of halo and optical crosstalk, which may cause the optical effect of the organic light emitting display to be less than expected. The light shielding layer 101 according to the present disclosure is configured appropriately (for example, as discussed above, it can shield the ambient light), so that the interference of the reflected light L2r to the light L1 can be greatly reduced, and thus the problems of halo and optical crosstalk can be solved, and the contrast of the light emitting unit can be improved.

Referring to fig. 5A, in some embodiments, the light blocking layer 101 may have a recess 500 (which may correspond to the portion W1 indicated in fig. 2) having a cross-shaped profile from a top view. The cross-shaped profile 500 allows light emitted by the light emitting unit (e.g., 10a, 10b, or 10 c) to pass through. In some embodiments, the cruciform profile 500 allows light emitted by a single light emitting unit to escape. In some embodiments, the cross-shaped profile 500 allows for the transmission of light from multiple light units.

Referring to fig. 5B, in some embodiments, the light blocking layer 101 may include a first recess 502 and second recesses 504, 506, 508, 510. The first recess 502 has a cross-shaped profile; the second recesses 504, 506, 508, 510 are located on four sides of the first recess 502 and have an L-shaped profile, such that the first recess 502 and the second recesses 504, 506, 508, 510 together form a centered pattern. The quasi-centered pattern allows light emitted from the light emitting unit (e.g., 10a, 10b, or 10 c) to pass through. In some embodiments, the first recess 502 may overlap with an effective light emitting area of a single light emitting unit, so that light emitted from the single light emitting unit can be transmitted. In some embodiments, the first recess 502 may overlap with effective light emitting areas of the light emitting units to allow light emitted from the light emitting units to pass through. In some embodiments, each of the second recesses 504, 506, 508, 510 may overlap with an effective light emitting area of the single light emitting unit, respectively, to allow light emitted from the single light emitting unit to pass through. In some embodiments, each of the second recesses 504, 506, 508, 510 may overlap with an effective light emitting area of the plurality of light emitting units, so that light emitted from the plurality of light emitting units can be transmitted.

In some embodiments, the first recess 502 and the second recesses 504, 506, 508, 510 may overlap with an effective light emitting area of a single light emitting unit, so that light emitted by the single light emitting unit can be transmitted. In some embodiments, the first recess 502 and the second recesses 504, 506, 508, 510 may overlap with the effective light emitting areas of the light emitting units, so that light emitted by the light emitting units can be transmitted.

The patterning can be adjusted to the expected shape according to actual requirements.

The foregoing outlines features of some embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.

Description of the figures

10. Light-emitting element

10a light emitting unit

10b light emitting unit

10c light emitting unit

100. Substrate

101. Light blocking layer/patterned light blocking layer

101' light shielding layer

101a edge

101' a edge

101T thickness

102. Covering layer

103. Release layer

104. A first electrode

104T thickness

105. Bump

105' bump

105a edge

105' a edge

106L1 carrier injection layer

106L2 carrier transport layer

106L3 organic emission layer

106L4 organic carrier transport layer

106D second electrode

107. Mucosa removal

d offset

d' offset

Distance W1

The distance W2.

Claims (13)

1. A light-emitting element, comprising:

a substrate;

a plurality of light blocking layers under the substrate;

a cover layer contacting the first surface of the substrate and covering the plurality of light blocking layers;

a conductive layer contacting the second surface of the substrate;

a plurality of bumps disposed on the second surface of the substrate and covering a portion of the conductive layer, wherein an organic light emitting unit including an organic material is disposed between two adjacent bumps;

wherein one of the plurality of bumps has an edge that is offset from an edge of one of the plurality of light blocking layers in a longitudinal direction.

2. The light-emitting element according to claim 1, wherein an area of each of the plurality of light blocking layers in a lateral direction is larger than an area of each of the plurality of bumps.

3. The light-emitting element according to claim 1, wherein the conductive layer comprises a transparent conductive film comprising ITO (indium tin oxide), IZO (indium zinc oxide), or IGZO (indium gallium zinc oxide).

4. The light-emitting element according to claim 1, further comprising a release layer under the cover layer, wherein the release layer is separated from the plurality of light blocking layers by the cover layer.

5. The light-emitting element according to claim 1, wherein a distance between edges of the two adjacent bumps of the organic light-emitting unit is greater than a distance between edges of two adjacent light shielding layers of the plurality of light shielding layers.

6. The light-emitting device according to claim 1, wherein one of the light-blocking layers comprises a recess having a cross-shaped profile, the recess having the cross-shaped profile exposing light emitted from the single organic light-emitting unit.

7. The light-emitting device according to claim 1, wherein one of the light blocking layers comprises a recess having a cross-shaped profile, the recess having the cross-shaped profile exposing light emitted from the organic light-emitting units.

8. A light-emitting element characterized by comprising:

a substrate;

a patterned light blocking layer below the substrate and having an opening;

a cover layer under the patterned light blocking layer;

the plurality of bumps are arranged on the substrate, and organic light-emitting units containing organic light-emitting materials are respectively arranged between two adjacent bumps in the plurality of bumps, wherein the organic light-emitting units comprise a first light-emitting unit, a second light-emitting unit and a third light-emitting unit, and the edge of the opening of the patterned light shielding layer is not aligned with the edge of one of the plurality of bumps;

a release layer below the cover layer, wherein the release layer is separated from the patterned light blocking layer by the cover layer.

9. The light-emitting element according to claim 8, wherein the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit each have an effective light-emitting area defined by an anode under each light-emitting unit, each light-emitting unit has a black region and a bright region when emitting light, and wherein a total area of the black region is less than 50% of the effective light-emitting area.

10. The light-emitting element according to claim 8, wherein each of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit has an organic light-emitting stack layer containing an organic material, wherein the organic light-emitting stack layer includes:

a carrier injection layer;

a carrier transport layer;

an organic emission layer; and

an organic carrier transport layer.

11. The light-emitting element according to claim 8, wherein the patterned light-shielding layer and the cover layer comprise an organic material, and wherein the release layer comprises an inorganic material.

12. The light-emitting element according to claim 8, wherein the substrate comprises a transparent material.

13. The light-emitting device according to claim 8, wherein a distance between edges of two adjacent bumps of the first light-emitting unit is greater than a width of the opening of the patterned light shielding layer.

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