CN218735035U

CN218735035U - Heating carrier for wafer bonding

Info

Publication number: CN218735035U
Application number: CN202222707202.2U
Authority: CN
Inventors: 李奕; 谢华伟
Original assignee: Suzhou Rhenium Platinum Electromechanical Technology Co ltd
Current assignee: Suzhou Rhenium Platinum Electromechanical Technology Co ltd
Priority date: 2022-10-14
Filing date: 2022-10-14
Publication date: 2023-03-24
Anticipated expiration: 2032-10-14

Abstract

The utility model discloses a heating carrier for wafer bonding, including carrier upper portion and carrier lower part, the bottom surface on carrier upper portion is equipped with the heating chamber, the heating intracavity is equipped with the heating disc, the top surface of heating disc with the top surface butt in heating chamber, the bottom surface of heating disc is hugged closely there is the conducting strip, the carrier lower part is equipped with the heat dissipation coil pipe, the carrier lower part with carrier upper portion fixed connection, the conducting strip with heat dissipation coil pipe's top surface in close contact with. The utility model discloses heating and cooling efficiency are high, can carry out the bonding at wafer substrate and wafer to under 0 ℃ -300 ℃'s operating mode, have improved work efficiency, facilitate the use and operate.

Description

Heating carrier for wafer bonding

Technical Field

The utility model relates to a heating carrier of wafer gold bonding belongs to semiconductor wafer processing apparatus technical field.

Background

The wafer is baked using the heating carrier in the wafer bonding process. As shown in fig. 1, a heating carrier in the prior art is heated by inserting a plurality of heating rods 100 into the middle of the carrier, annular heat dissipation grooves are formed around the heating rods 100, tubular heat dissipation cold discharge pipes 200 are arranged in the grooves for heat dissipation, the heat dissipation cold discharge pipes 200 are vertically and spirally arranged, and only the top surface of the top annular pipe body can be in close contact with the heating carrier. Because the edge of the overall arrangement and the heat effect of the heating rod is overlapped, the surface temperature difference of the heating carrier is uneven, the effective contact area of the cold exhaust pipe is small, the cooling time is long, the final cooling efficiency is low, the production beat is prolonged, and the production quality is influenced.

SUMMERY OF THE UTILITY MODEL

To the defects of the prior art, the utility model provides a heating carrier for wafer bonding, the purpose promotes the temperature homogeneity on heating carrier surface and improves cooling efficiency.

The utility model discloses technical scheme as follows: the utility model provides a heating carrier for wafer bonding, includes carrier upper portion and carrier lower part, the bottom surface on carrier upper portion is equipped with the heating chamber, the heating intracavity is equipped with the heating disc, the top surface of heating disc with the top surface butt in heating chamber, the bottom surface of heating disc is hugged closely has the conducting strip, the carrier lower part is equipped with the heat dissipation coil pipe, the carrier lower part with carrier upper portion fixed connection, the conducting strip with heat dissipation coil pipe's top surface in close contact with.

Further, the carrier lower part is equipped with the heat dissipation chamber, the heat dissipation coil pipe set up in the heat dissipation intracavity, the diameter in heating chamber is less than the diameter of heat dissipation coil pipe, the top surface of heat dissipation coil pipe with be located heating chamber is all around the bottom surface in close contact with on carrier upper portion.

Further, in order to improve the heat dissipation efficiency of the heat dissipation coil to the heat conducting fins and the heating efficiency when the heating disc is heated, a heat insulation gasket is arranged between the bottom surface of the heat dissipation coil and the lower portion of the carrier.

Furthermore, the periphery of the heat conducting sheet is in close contact with the peripheral cavity wall of the heating cavity.

Further, the water inlet of the heat dissipation coil pipe is arranged at the periphery of the heat dissipation coil pipe, and the water outlet of the heat dissipation coil pipe is arranged at the center of the heat dissipation coil pipe.

Further, the heat conducting sheet is a red copper sheet.

The utility model provides a technical scheme's advantage lies in:

the utility model discloses an adopt the mode of heating disc, conducting strip and heat dissipation coil pipe superpose to heat and cool off the heating carrier, can carry out the bonding at wafer substrate and wafer to under 0 ℃ -300 ℃'s operating mode, both can practice thrift the cost greatly, the operating mode scope that again can the lifting means bonding, it is long when used to have reduced the final cooling, has shortened the production beat, has improved work efficiency, facilitates the use and operates.

Drawings

Fig. 1 is a schematic structural view of a prior art heating carrier for wafer bonding.

Fig. 2 is a schematic perspective view of a heating carrier for wafer bonding according to an embodiment.

Fig. 3 is a schematic sectional view of a heating carrier for wafer bonding according to an embodiment.

Detailed Description

The present invention is further described in the following examples, which should be construed as merely illustrative and not a limitation of the scope of the present invention, and modifications of equivalent forms to those skilled in the art will fall within the scope of the present invention as defined in the appended claims after reading the present specification.

Referring to fig. 2 and 3, the heating carrier for wafer bonding of the present embodiment includes a carrier upper portion 1 and a carrier lower portion 2, and the peripheries of the carrier upper portion 1 and the carrier lower portion 2 are fixedly connected by screws to form an integral body. The top surface of the carrier upper part 1 is used for placing wafers and wafer substrates for bonding. A circular heating cavity is arranged on the bottom surface of the carrier upper part 1. A heating disk 3 and a heat conducting fin 4 are arranged in the heating cavity. The top surface of heating disk 3 and the top surface butt of heating chamber, the bottom surface of heating disk 3 hugs closely with conducting strip 4, and heating disk 3 adopts the mica heating piece, and conducting strip 4 is the red copper sheet, and both are fixed with carrier upper portion 1 through the screw. As a preferred embodiment, after fixing, the bottom surface of the heat conducting sheet 4 can be flush with the bottom surface of the carrier upper portion 1, and the periphery of the heat conducting sheet 4 is in close contact with the peripheral cavity wall of the heating cavity to improve the heat conducting efficiency.

The carrier lower part 2 is provided with a heat dissipation cavity, a heat dissipation coil pipe 5 is arranged in the heat dissipation cavity, the diameter of the heat dissipation coil pipe 5 is slightly larger than that of the heating cavity of the carrier upper part 1, a water inlet 5a of the heat dissipation coil pipe is arranged on the periphery of the heat dissipation coil pipe 5, and a water outlet 5b of the heat dissipation coil pipe is arranged in the center of the heat dissipation coil pipe 5. As a preferred embodiment, a sheet of graphite insulation 6 may be provided between the radiator coil 5 and the bottom surface of the radiator chamber. After the carrier lower part 2 and the carrier upper part 1 are fixed, the top surface of the heat dissipation coil 5 is in close contact with the bottom surface of the carrier upper part 1 positioned around the heating cavity and the bottom surface of the heat conducting fin 4.

The heating disc 3 is adopted for heating, the heating area of a heat source is large and is closer to the top surface of the carrier, so that the temperature of the top is quickly raised, and the temperature is more uniform. The contact area of the structure of the heat radiation coil pipe 5 and the upper part 1 of the carrier is large, and the heat radiation effect is good. The diameter of the heat dissipation coil 5 is larger than that of the heating cavity, so that the heat dissipation coil 5 can dissipate heat of the upper part 1 of the carrier through the heat conduction of the heat conducting sheet 4 and the heating disc 3, and the other side can also directly contact with the upper part 1 of the carrier to dissipate heat, and the efficiency is improved. Further, the graphite heat insulation sheet 6 is additionally arranged, so that the loss of heat energy of the heating disc 3 from the heat radiation coil 5 to the lower part 2 of the carrier during heating can be reduced, the heat preservation effect is realized, and the time required by temperature rise is shortened. When radiating, the heat release of the lower part 2 of the carrier to the radiating coil pipe 5 can be reduced, and the radiating speed is accelerated. In the embodiment, the heating uniformity of the heating disc 3 is utilized to ensure that the temperature of the surface of the heating carrier is consistent, and the excellent thermal conductivity of the heat conducting strip 4 and the large contact area of the heat radiating coil 5 are utilized to reduce the time required by cooling and improve the working efficiency.

It should be noted that the above embodiment is only a preferred embodiment, wherein the carrier lower portion 2 may not be provided with a heat dissipation cavity, and the heat dissipation coil 5 is located in the heating cavity after the carrier lower portion 2 and the carrier upper portion 1 are fixedly connected by thinning the heat conduction sheet 4, so as to ensure that the heat dissipation coil 5 is in close contact with the heat conduction sheet 4, and the purpose of improving the heating and heat dissipation efficiency can also be achieved.

Claims

1. The utility model provides a heating carrier for wafer bonding, its characterized in that, includes carrier upper portion and carrier lower part, the bottom surface on carrier upper portion is equipped with the heating chamber, the heating intracavity is equipped with the heating disc, the top surface of heating disc with the top surface butt in heating chamber, the bottom surface of heating disc is hugged closely there is the conducting strip, the carrier lower part is equipped with heat dissipation coil, the carrier lower part with carrier upper portion fixed connection, the conducting strip with heat dissipation coil's top surface in close contact with.

2. The wafer bonding heating carrier as claimed in claim 1, wherein the carrier has a heat dissipation cavity at a lower portion thereof, the heat dissipation coil is disposed in the heat dissipation cavity, the diameter of the heat dissipation cavity is smaller than that of the heat dissipation coil, and a top surface of the heat dissipation coil is in close contact with a bottom surface of the upper portion of the carrier located around the heat dissipation cavity.

3. The heating carrier for wafer bonding as claimed in claim 1 or 2, wherein a heat insulating spacer is provided between the bottom surface of the heat dissipating coil and the lower portion of the carrier.

4. The heating carrier as claimed in claim 1, wherein the periphery of the heat-conducting strip is in close contact with the peripheral wall of the heating cavity.

5. The wafer bonded heating carrier as claimed in claim 1, wherein the water inlet of the heat dissipation coil is disposed at the periphery of the heat dissipation coil, and the water outlet of the heat dissipation coil is disposed at the center of the heat dissipation coil.

6. The heating carrier for wafer bonding as claimed in claim 1, wherein the heat conductive sheet is a copper sheet.