CN218730915U

CN218730915U - Chip packaging structure

Info

Publication number: CN218730915U
Application number: CN202222717226.6U
Authority: CN
Inventors: 周建军; 陈高利
Original assignee: Jiangsu Xinfeng Integrated Circuit Co ltd
Current assignee: Jiangsu Xinfeng Integrated Circuit Co ltd
Priority date: 2022-10-14
Filing date: 2022-10-14
Publication date: 2023-03-24
Anticipated expiration: 2032-10-14

Abstract

The utility model discloses a chip packaging structure, including the chip, still include base and radiating seat, the chip sets up in the mounting groove of seting up on the first side of base, wherein: the heat dissipation seat is arranged on the first side surface of the base, and the first side surface of the heat dissipation seat is abutted against the chip; the heat dissipation seat is provided with an air outlet and an air inlet which are communicated with each other to form an L-shaped heat dissipation air duct. The utility model discloses a chip package structure who provides, the bottom face that utilizes the radiating seat is contradicted and is installed the chip on the base in order to carry out the heat transfer, and set up the heat dissipation wind channel of L type on the radiating seat, the fan in the heat dissipation wind channel is rotatory so that external air gets into from going into the wind gap, and flow out in order to take away the heat on chip transmission to the radiating seat from the air outlet through the heat dissipation wind channel, reduce the temperature of chip in order to dispel the heat, guarantee the normal work of chip, and because the existence in heat dissipation wind channel, flow direction disorder and slowed down when avoiding the air current to flow through the radiating seat, improve the radiating efficiency to the chip.

Description

Chip packaging structure

Technical Field

The utility model relates to an packaging structure technical field relates to a chip packaging structure particularly.

Background

The chip can produce a large amount of heats in high frequency working process, and these heats can reduce work efficiency, still can shorten components and parts's life simultaneously, in order to guarantee components and parts's normal work, must consider its heat dissipation problem in chip packaging process.

According to patent No. 202121302673.4, publication (publication) date: 2022.01.11, a chip package structure is disclosed, the on-line screen storage device comprises a base, the base is box-like structure and base internal fixation and has the chip, there is the square frame top through bolt fixed mounting, the inside of square frame is provided with the metal copper through the block mechanism is fixed, it has heat conduction silica gel to fill between chip and the metal copper, the fixed radiating fin that is provided with a plurality of equidistance and distributes on the metal copper, the fixed riser that is provided with in symmetry both sides of square frame top surface, fixed welding has the long straight pole of two parallels between two risers, equal fixed mounting has two micromotors about long straight pole centrosymmetric on two long straight poles, micromotor's output fixed mounting has the flabellum. The utility model provides an among the prior art also can rise to the electronic component temperature near causing the copper billet when having the heat to transmit on the copper billet to influence other electronic component's the shortcoming of normal use, beneficial effect is obvious, is fit for promoting.

Including among the prior art of foretell patent, install the chip in the base, make metal copper and heat conduction silica gel contact the chip with the conduction heat, and through when fan-shaped rotation so that the air flows to the external world from between two risers in order to the heat effluvium on the metal copper, but because the rear of flabellum does not go into the wind gap, do not form complete wind channel, when fan-shaped rotation so that hot-air flow direction is external, external cold air also can be because the negative pressure between the riser and from the place ahead of flabellum by the suction, but cold air and hot-air are located and meet between two risers and can lead to the two flow velocity all slowed down and flow direction disorder in opposite directions, consequently can lead to the radiating efficiency lower.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a chip packaging structure for the solution device does not have complete heat dissipation wind channel and leads to the lower problem of radiating efficiency.

In order to achieve the above object, the present invention provides the following technical solutions: the utility model provides a chip packaging structure, includes the chip, still includes base and radiating seat, the chip set up in the mounting groove of seting up on the first side of base, wherein:

the heat dissipation seat is arranged on the first side surface of the base, and the first side surface of the heat dissipation seat is abutted against the chip;

the heat dissipation seat is provided with an air outlet and an air inlet which are communicated with each other to form an L-shaped heat dissipation air channel, and a plurality of fans distributed in a linear array are rotationally arranged in the air inlet.

Preferably, the first side of the heat dissipation seat is symmetrically provided with a collision part, the cross section of the collision part is trapezoidal, and the lower bottom of the collision part is collided with the bottom of the installation groove.

Preferably, the heat dissipation air duct may be divided into a horizontal portion and a vertical portion, the horizontal portion is parallel to the chip, and a convex arc-shaped protrusion portion is disposed on a side surface of the horizontal portion of the heat dissipation air duct, the side surface being close to the chip.

Preferably, the air inlet is internally provided with a plurality of installation parts distributed in a linear array, the driving motor is fixedly connected to the installation parts, and the fan is fixedly connected to the output end of the driving motor.

Preferably, the base is symmetrically provided with a plurality of first fixing holes, the heat dissipation seat is symmetrically provided with a plurality of second fixing holes, and the base and the heat dissipation seat are connected with the second fixing holes through the first fixing holes by bolts.

Preferably, the second side surface of the base is provided with a plurality of pins distributed in a rectangular array.

Preferably, the base is a polymer synthetic resin member.

Preferably, the heat dissipation seat is made of copper.

Preferably, the driving motor is a micro motor.

Preferably, the surface of the pin is provided with a gold plating layer.

In the technical scheme, the utility model provides a pair of chip packaging structure possesses following beneficial effect: utilize the bottom face of radiating seat to contradict and install the chip on the base in order to carry out the heat transfer, and set up the heat dissipation wind channel of L type on the radiating seat, the fan in the heat dissipation wind channel is rotatory so that external air gets into from going into the wind gap to flow out in order to take away the heat that the chip transmitted to the radiating seat from the air outlet through the heat dissipation wind channel, reduce the temperature of chip in order to dispel the heat, guarantee the normal work of chip, and because the existence in heat dissipation wind channel, can avoid the air to flow to disorderly and be slowed down when flowing through the radiating seat, improve the radiating efficiency to the chip.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to these drawings.

Fig. 1 is a general structural sectional view provided by an embodiment of the present invention;

fig. 2 is a schematic diagram of an overall explosion structure provided by an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a heat sink according to an embodiment of the present invention.

Description of the reference numerals:

1. a base; 11. mounting grooves; 12. a first fixing hole; 2. a chip; 3. a heat sink; 31. a heat dissipation air duct; 311. an air outlet; 312. an air inlet; 32. an installation part; 33. a boss portion; 34. a contact part; 35. a second fixing hole; 4. a fan; 5. a drive motor; 6. and (4) stitching.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without inventive step, are within the scope of protection of the disclosure.

As shown in fig. 1-3, a chip package structure includes a chip 2, a base 1 and a heat sink 3, the chip 2 is disposed in a mounting groove 11 formed on a first side surface of the base 1, wherein: the heat dissipation seat 3 is arranged on the first side surface of the base 1, and the first side surface of the heat dissipation seat 3 is abutted against the chip 2; the heat dissipating seat 3 is provided with an air outlet 311 and an air inlet 312 communicated with each other to form an L-shaped heat dissipating air duct 31, and a plurality of fans 4 distributed in a linear array are rotatably disposed in the air inlet 312.

Specifically, as shown in fig. 2, the top surface of the base 1 is a first side surface, the bottom surface is a second side surface, the bottom surface of the heat sink 3 is a first side surface, the chip 2 is disposed in the mounting groove 11 of the base 1, and the heat sink 3 is mounted on the base 1 so that the bottom surface of the heat sink 3 abuts against the top surface of the chip 2, and a heat-conducting silica gel layer is filled in a gap between the bottom surface of the heat sink 3 and the top surface of the chip 2 so that the heat sink 3 and the chip 2 are in full contact, the top of the chip 2 generates more heat, the generated heat is transferred to the heat sink 3 through heat transfer, an L-shaped heat dissipation air duct 31 is disposed in the heat sink 3, an air outlet 311 of the heat dissipation air duct 31 faces perpendicular to the chip 2, an air inlet 312 faces parallel to the chip 2, and a rotating fan 4 is disposed in the air inlet 312, the fan 4 rotates to draw air into the air inlet 312, and drives the air to drive the heat on the heat sink 3 through the inside of the heat sink 3, and then the air flows out from the air outlet 311 to the outside to achieve a higher temperature reduction effect than that the air drawn into the heat sink 2 and the heat sink 2, and the air inlet 312 is higher than that the air inlet of the chip 2, and the air can be sucked into the chip 2, and the chip 2, thereby increasing the chip.

Among the above-mentioned technical scheme, utilize the bottom face of radiating seat 3 to contradict and install chip 2 on base 1 in order to carry out the heat transfer, and set up the heat dissipation wind channel 31 of L type on the radiating seat 3, fan 4 in the heat dissipation wind channel 31 is rotatory so that external air gets into from income wind gap 312, and flow out from air outlet 311 through heat dissipation wind channel 31 and in order to take away the heat that chip 2 transmitted to radiating seat 3, in order to dispel the heat and reduce the temperature of chip 2, guarantee chip 2's normal work, and because the existence of heat dissipation wind channel 31, can avoid the air to flow to disorderly and be slowed down when flowing through radiating seat 3, improve the radiating efficiency to chip 2.

As the embodiment that this utility further provided, the symmetry is provided with conflict portion 34 on the first side of heat dissipation seat 3, and conflict portion 34 is transversal personally submitted trapezoidally, and conflict portion 34's lower bottom is contradicted in mounting groove 11 bottom.

Specifically, as shown in fig. 1, the cross section of conflict portion 34 is trapezoidal, conflict portion 34's lower bottom is in the mounting groove 11 bottom, so that radiating seat 3 and base 1 direct contact, because chip 2 all can generate heat in one side that is close to radiating seat 3 at the during operation and the one side of installing on base 1, consequently, base 1's temperature also can rise along with chip 2 work, make conflict portion 34 direct conflict base 1, so that the heat on the base 1 also can transmit and dispel the heat on radiating seat 3, further improve holistic radiating efficiency, and conflict portion 34's cross section is trapezoidal, its bottom surface is long-pending great, conflict base 1 is in order to increase heat-conducting area down, accelerate thermal transmission.

As a further embodiment of the present invention, the heat dissipation air duct 31 may be divided into a horizontal portion and a vertical portion, the horizontal portion is parallel to the chip 2, and a convex portion 33 in a convex arc shape is disposed on a side surface of the horizontal portion of the heat dissipation air duct 31 close to the chip 2.

Specifically, as shown in fig. 3, the heat dissipation duct 31 may be divided into a horizontal portion and a vertical portion, the horizontal portion is parallel to the chip 2, a convex arc-shaped protrusion 33 is disposed on a side surface of the horizontal portion of the heat dissipation duct 31 near the chip 2, that is, when the fan 4 rotates to make the external air enter the horizontal portion from the air inlet 312, the air is driven by the fan 4 to flow from the horizontal portion to the vertical portion, but due to the protrusion 33, the air flows along the surface of the protrusion 33 when passing through the horizontal portion, and when the air continues to flow to the vertical portion, the flowable cross-sectional area is reduced, so that the air flow speed at this position is increased, that is, more air passes through the surface of the protrusion 33 at the same time, so as to achieve the effect of taking away more heat, and further improve the heat dissipation efficiency.

As the embodiment that this utility further provides, still include driving motor 5, be provided with a plurality of installation departments 32 that are linear array and distribute in the income wind gap 312, driving motor 5 fixed connection is on installation department 32, and fan 4 fixed connection is in driving motor 5's output.

Specifically, driving motor 5 fixed connection is in installation department 32, and driving motor 5's output clockwise rotation is rotatory in order to drive fan 4 rotatory, and fan 4 is rotatory at this moment in order to order about external air to get into and flow out from air outlet 311 from going into wind gap 312, utilizes driving motor 5 in order to order about fan 4's rotation, guarantees fan 4 rotational operation's stability.

As the embodiment that the utility model further provides, a plurality of first fixed orificess 12 have been seted up to the symmetry on base 1, and a plurality of second fixed orificess 35 are seted up to the symmetry on the radiating seat 3, and base 1 and radiating seat 3 are through first fixed orificess 12 and second fixed orifices 35 bolted connection.

Specifically, as shown in fig. 1, the first fixing hole 12 of the base 1 and the second fixing hole 35 of the heat sink 3 are aligned, and the base 1 and the heat sink 3 are relatively fixed by passing through the first fixing hole 12 and the second fixing hole 35 through bolts, so that the fixing stability of the heat sink 3 is ensured, and the heat sink 3 is conveniently disassembled and assembled.

As a further embodiment provided by the present application, a plurality of pins 6 distributed in a rectangular array are disposed on the second side surface of the base 1.

Specifically, the pin 6 is used for inserting the base 1 onto the PCB, and the pin 6 is electrically connected with the PCB.

As a further embodiment of the present invention, the base 1 is a polymer synthetic resin member.

Specifically, the base 1 made of polymer synthetic resin is nonconductive, low in cost, and convenient to produce.

As a further embodiment of the present invention, the heat sink 3 is made of copper.

Specifically, the copper heat dissipation base 3 has high thermal conductivity, which is beneficial to transferring heat on the chip 2 to the heat dissipation base 3, and improves heat dissipation efficiency.

As a further embodiment provided by the present application, the driving motor 5 is a micro motor.

Specifically, the driving motor 5 is a micro motor to reduce the overall volume, and the specific model of the driving motor 5 may be PGM-W043.

As a further embodiment provided by the present application, the surface of the pin 6 is provided with a gold plating layer.

Specifically, the gold plating layer is arranged on the pins 6 to avoid oxidation of the pins 6, and the service life of the pins 6 is prolonged.

The working principle is as follows: the chip 2 is disposed in the mounting groove 11 of the base 1, so that the first fixing hole 12 of the base 1 is aligned with the second fixing hole 35 of the heat sink 3, and the base 1 and the heat sink 3 are relatively fixed by passing through the first fixing hole 12 and the second fixing hole 35 through a bolt, at this time, the bottom surface of the heat sink 3 abuts against the top of the chip 2, the abutting portion 34 directly abuts against the base 1, so that heat on the base 1 can also be transferred to the heat sink 3 for heat dissipation, and then the output end of the driving motor 5 rotates clockwise to drive the fan 4 to rotate, and at this time, the fan 4 rotates to draw air into the air inlet 312, when the fan 4 rotates to make outside air enter the horizontal portion from the air inlet 312, the air is driven by the fan 4 to flow from the horizontal portion to the vertical portion, but due to the existence of the protrusion 33, the air flows along the surface of the protrusion 33 when passing through the horizontal portion, when the air continues to flow to the vertical portion, the cross-sectional area is reduced, and the air flow speed is increased, and then the air flows out from the air outlet 311 to the outside, that the heat is driven by the heat sink 3 and the heat sink 2 and the heat sink 3.

While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the present invention. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the invention.

Claims

1. The utility model provides a chip packaging structure, includes chip (2), its characterized in that still includes base (1) and radiating seat (3), chip (2) set up in mounting groove (11) seted up on base (1) first side, wherein:

the heat dissipation seat (3) is arranged on the first side face of the base (1), and the first side face of the heat dissipation seat (3) abuts against the chip (2);

the heat dissipation seat (3) is provided with an air outlet (311) and an air inlet (312) which are communicated with each other to form an L-shaped heat dissipation air duct (31), and the air inlet (312) is internally and rotatably provided with a plurality of fans (4) which are distributed in a linear array.

2. The chip packaging structure according to claim 1, wherein the first side surface of the heat spreader (3) is symmetrically provided with an abutting portion (34), the cross section of the abutting portion (34) is trapezoidal, and the bottom of the abutting portion (34) abuts against the bottom of the mounting groove (11).

3. The chip package structure according to claim 1, wherein the heat dissipation duct (31) is divided into a horizontal portion and a vertical portion, the horizontal portion is parallel to the chip (2), and a convex portion (33) is disposed on a side surface of the horizontal portion of the heat dissipation duct (31) close to the chip (2).

4. The chip packaging structure according to claim 1, further comprising a driving motor (5), wherein a plurality of mounting portions (32) are disposed in the air inlet (312) and distributed in a linear array, the driving motor (5) is fixedly connected to the mounting portions (32), and the fan (4) is fixedly connected to an output end of the driving motor (5).

5. The chip packaging structure according to claim 1, wherein a plurality of first fixing holes (12) are symmetrically formed in the base (1), a plurality of second fixing holes (35) are symmetrically formed in the heat spreader (3), and the base (1) and the heat spreader (3) are connected to the second fixing holes (35) through the first fixing holes (12) by bolts.

6. The chip package structure according to claim 1, wherein a plurality of pins (6) are disposed on the second side of the base (1) in a rectangular array.

7. The chip packaging structure according to claim 1, wherein the base (1) is a polymer synthetic resin member.

8. The chip package structure according to claim 1, wherein the heat spreader (3) is a copper part.

9. The chip packaging structure according to claim 4, wherein the driving motor (5) is a micro motor.

10. The chip packaging structure according to claim 6, wherein the surface of the pins (6) is provided with a gold plating layer.