CN218730901U

CN218730901U - Novel special net type liquid cooling radiator of high density ASIC chip

Info

Publication number: CN218730901U
Application number: CN202222336027.0U
Authority: CN
Inventors: 段高峰; 段非存; 段雄伟
Original assignee: Foshan Kuangmi Technology Co ltd
Current assignee: Foshan Kuangmi Technology Co ltd
Priority date: 2022-09-01
Filing date: 2022-09-01
Publication date: 2023-03-24
Anticipated expiration: 2032-09-01

Abstract

The utility model provides a novel special net type liquid cooling radiator of high density ASIC chip relates to heat-radiating equipment technical field, including the metal framework, be provided with feed liquor pipe and drain pipe in the metal framework, be formed with circuitous tortuous passageway in the metal framework, the feed liquor pipe with the one end intercommunication of circuitous tortuous passageway, the drain pipe with the other end intercommunication of circuitous tortuous passageway. The utility model discloses an useful part is, is formed with circuitous tortuous passageway in the metal framework, and circuitous tortuous passageway supplies the circulation of radiating liquid medium, and the ASIC chip meets in the bottom surface of metal framework, and the heat that the ASIC chip transmitted to the metal framework can be taken away under the radiating liquid medium flows and reach radiating purpose, need not to adopt the fan heat dissipation like the tradition, can realize silence work, long service life.

Description

Novel special net type liquid cooling radiator of high density ASIC chip

Technical Field

The utility model belongs to the technical field of the radiating equipment technique and specifically relates to a novel special net type liquid cooling radiator of high density ASIC chip.

Background

ASIC chips refer to integrated circuit chips designed and manufactured to meet the needs of a particular user and the needs of a particular electronic system. The ASIC chip is characterized by facing the requirements of specific users, and compared with a general integrated circuit, the ASIC chip has the advantages of smaller volume, lower power consumption, improved reliability, improved performance, enhanced confidentiality, reduced cost and the like during batch production, so that the ASIC chip is widely applied at present.

Because ASIC chip generates heat in the use, the heat gives off when not in time and can take place the damage easily, but traditional ASIC chip adopts the fan to carry out the forced air cooling usually, but the noise that produces in the fan working process is great to long service life takes place the damage easily, and is very inconvenient.

SUMMERY OF THE UTILITY MODEL

The utility model overcomes the shortcoming among the prior art, a novel special net type liquid cooling radiator of high density ASIC chip is provided, be formed with circuitous tortuous passageway in the metal framework, circuitous tortuous passageway is for the circulation of radiating liquid medium, the ASIC chip meets in the bottom surface of metal framework, the heat that the ASIC chip transmitted to the metal framework can be taken away under the flow of radiating liquid medium and reach radiating purpose, need not to adopt the fan heat dissipation like the tradition, can realize silence work, long service life.

In order to solve the technical problem, the utility model discloses a realize through following technical scheme:

the utility model provides a novel special net type liquid cooling radiator of high density ASIC chip, includes the metal framework, be provided with feed liquor pipe and drain pipe in the metal framework, be formed with circuitous tortuous passageway in the metal framework, the feed liquor pipe with the one end intercommunication of circuitous tortuous passageway, the drain pipe with the other end intercommunication of circuitous tortuous passageway.

Furthermore, the device comprises a cover plate, wherein the shape of the cover plate is matched with that of the tortuous channel, and the cover plate covers the tortuous channel.

Further, when the cover plate is installed on the tortuous channel, the upper surface of the cover plate is flush with the upper surface of the metal frame.

Furthermore, the lower surface of the metal frame body is provided with a plurality of convex plates which are used for being connected with the ASIC chip, and the convex plates are arranged in a square shape and matched with the size of the ASIC chip.

Furthermore, the metal frame body comprises a plurality of reinforcing plates, the reinforcing plates are positioned between the circuitous and tortuous channels, and connecting holes are formed in part of the reinforcing plates.

Furthermore, the lower surfaces of the plurality of convex plates are positioned on the same horizontal plane.

Furthermore, the convex plates are uniformly arrayed on the lower surface of the metal frame body.

Furthermore, the liquid inlet pipe and the liquid outlet pipe are arranged on the same side of the metal frame body.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses a circuitous tortuous passageway is formed with in the metal framework, circuitous tortuous passageway supplies the circulation of radiating liquid medium, and this radiating liquid medium can be water, antifreeze or other radiating liquid, and the ASIC chip meets in the bottom surface of metal framework, and the heat that the ASIC chip transmitted to the metal framework can be taken away under the radiating liquid medium flows and reach radiating purpose, need not to adopt the fan heat dissipation like the tradition, can realize the silence work, long service life, and the structure is ingenious.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, together with the embodiments of the invention, and do not constitute a limitation on the invention, in which:

FIG. 1 is a schematic diagram of the present heat sink in a detached state from an ASIC chip;

FIG. 2 is a first perspective view of the heat sink;

FIG. 3 is a second perspective view of the heat sink;

fig. 4 is a schematic view of the state where the metal frame and the cover plate are separated from each other in the heat sink.

In the figure: 1-metal frame body, 101-convex plate, 102-reinforcing plate, 1021-connecting hole, 2-liquid inlet pipe, 3-liquid outlet pipe, 4-tortuous channel, 5-cover plate and 6-ASIC chip.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

As shown in fig. 1 to 4, a novel grid type liquid cooling radiator special for a high-density ASIC chip includes a metal frame 1, the metal frame 1 is made of aluminum material and has the characteristics of light weight and good heat conductivity, a liquid inlet pipe 2 and a liquid outlet pipe 3 are arranged on the metal frame 1, a tortuous channel 4 is formed in the metal frame 1, the liquid inlet pipe 2 is communicated with one end of the tortuous channel 4, the liquid outlet pipe 3 is communicated with the other end of the tortuous channel 4, a heat dissipation liquid medium flows into the tortuous channel 4 from the liquid inlet pipe 2 and is finally discharged from the liquid outlet pipe 3, so that heat in the metal frame 1 is taken away; the heat dissipation liquid medium can be water, antifreeze or other heat dissipation liquid.

The lower surface of the metal frame body 1 is provided with a plurality of convex plates 101 which are connected with the ASIC chips 6, and the convex plates 101 are arranged in a square shape and are matched with the ASIC chips 6 in size and in one-to-one correspondence; the metal frame body 1 comprises a plurality of reinforcing plates 102, the reinforcing plates 102 are located between the circuitous and tortuous channels 4, the reinforcing plates 102 have the function of reinforcing the whole structure, connecting holes 1021 are formed in part of the reinforcing plates 102, as seen from fig. 1, a plurality of ASIC chips 6 are arranged on the chip board, the number and the positions of the reinforcing plates 102 correspond to the ASIC chips 6, hole sites corresponding to the connecting holes 1021 are also formed in the chip board, after the ASIC chips 6 correspond to the convex plates 101 during cooling, the connecting holes 1021 correspond to the hole sites of the chip board, bolts are locked in the connecting holes 1021 and the hole sites to lock the chip board and the metal frame body 1, the ASIC chips 6 cling to the convex plates 101 at the moment, heat generated during the operation of the ASIC chips 6 can be transferred to the convex plates 101, namely to the metal frame body 1, and the heat dissipation medium in the circuitous and tortuous channels 4 flows to take away the heat. The convex plate 101 is designed to protrude from the lower surface of the metal frame 1, and contributes to enhancing the adhesion and the tightness of the contact with the ASIC chip 6.

As shown in fig. 4, the winding and meandering channel 4 is formed on the metal frame 1 in a winding manner, which is helpful for extending the flow path of the heat dissipation medium in the metal frame 1, enhancing the heat dissipation effect on the metal frame 1, and also capable of providing as many arrangement numbers of the convex plates 101 as possible, thereby increasing the heat dissipation number on the ASIC chip 6.

The heat dissipation device comprises a cover plate 5, wherein the arrangement shape of the cover plate 5 is matched with that of a tortuous channel 4, the cover plate 5 covers the tortuous channel 4, in the actual design, the edge of the inner wall of the tortuous channel 4 can be provided with a step position for supporting the cover plate 5, the cover plate 5 has a sealing effect on the tortuous channel 4, and the heat dissipation medium in the tortuous channel 4 is prevented from being easily polluted; in addition, as seen from fig. 2, when the cover plate 5 is installed on the tortuous passage 4, the upper surface of the cover plate 5 is flush with the upper surface of the metal frame 1, the structure is compact, the appearance is attractive, and the subsequent assembly with other components is facilitated.

The lower surfaces of the plurality of convex plates 101 are positioned on the same horizontal plane, so that the lower surfaces of the plurality of convex plates are favorably attached to the ASIC chip 6 to be flat; the convex plates 101 are uniformly arrayed on the lower surface of the metal frame 1, and are neat and beautiful.

Feed liquor pipe 2 and drain pipe 3 are installed in same one side of metal framework 1, are favorable to inserting the installation of outside pipeline, make outside pipeline can be connected with feed liquor pipe 2 and drain pipe 3 with one side, can not take place outside pipeline and bend or twine the problem, also do benefit to the assembly.

The radiator can meet the requirement of high-power and high-density ASIC chip on mute heat dissipation, is simple to install and easy to process, can realize on-line detection of the working state of the ASIC chip, can realize on-line maintenance and mute work.

Finally, it should be noted that: although the present invention has been described in detail with reference to the embodiments, it will be apparent to those skilled in the art that modifications, equivalents, improvements and the like can be made in the technical solutions of the foregoing embodiments or in some technical features of the foregoing embodiments, but all modifications, equivalents, improvements and the like within the spirit and principle of the present invention are intended to be included in the scope of the present invention.

Claims

1. The utility model provides a novel special net type liquid cooling radiator of high density ASIC chip which characterized in that, includes the metal framework, last feed liquor pipe and the drain pipe of being provided with of metal framework, be formed with circuitous tortuous passageway in the metal framework, the feed liquor pipe with circuitous tortuous passageway's one end intercommunication, the drain pipe with circuitous tortuous passageway's other end intercommunication.

2. The new grid type liquid cooling radiator as claimed in claim 1, wherein said radiator comprises a cover plate, said cover plate is configured to match the shape of said tortuous path, said cover plate covers said tortuous path.

3. The new grid-type liquid-cooled heat sink for high-density ASIC chips as defined in claim 2, wherein when said cover plate is mounted on said tortuous path, the upper surface of said cover plate is flush with the upper surface of said metal frame.

4. The novel grid type liquid cooling radiator for high density ASIC chip as claimed in claim 1, wherein the lower surface of the metal frame is provided with a plurality of convex plates for connecting with the ASIC chip, and the convex plates are arranged in a square shape to match the size of the ASIC chip.

5. The novel grid type liquid cooling radiator for high-density ASIC chips as claimed in claim 1, wherein said metal frame comprises a plurality of reinforcing plates between said circuitous and tortuous channels, wherein a portion of said reinforcing plates are provided with connecting holes.

6. The new grid-type liquid-cooled heat sink for high-density ASIC chip as defined in claim 4, wherein the lower surfaces of said plurality of said convex plates are located on the same horizontal plane.

7. The novel grid type liquid-cooled heat sink for high density ASIC chip as claimed in claim 6, wherein said raised plates are uniformly arrayed on the lower surface of said metal frame.

8. The novel grid-type liquid-cooled heat sink for high-density ASIC chips as claimed in claim 1, wherein said liquid inlet pipe and said liquid outlet pipe are installed on the same side of said metal frame.