CN218728962U

CN218728962U - Electronic information processor

Info

Publication number: CN218728962U
Application number: CN202223170943.8U
Authority: CN
Inventors: 马子龙
Original assignee: Guangxi Technological College of Machinery and Electricity
Current assignee: Guangxi Technological College of Machinery and Electricity
Priority date: 2022-11-29
Filing date: 2022-11-29
Publication date: 2023-03-24
Anticipated expiration: 2032-11-29

Abstract

The utility model discloses an electronic information processor belongs to treater technical field. The utility model provides an electronic information processor, including radiator fan, radiator fan sets up at the mounting panel middle part, the equal fixedly connected with bracing piece in mounting panel bottom four corners department, the bracing piece is close to radiator fan lateral wall upper portion and all is provided with the spout, the equal sliding connection of the inside downside of spout has the slider, four group's sliders are close to one side fixedly connected with connecting plate mutually, connecting plate roof fixedly connected with multiunit evenly distributed's fin, the connecting plate back wall runs through and fixedly connected with multiunit evenly distributed's heat pipe. The utility model discloses a cooperation of frame plate, cooling fan, heat conduction silica gel, fin, connecting plate, heat pipe, liquid core and coolant liquid can constantly take out the inside heat source of treater main part and give off to the external world, has improved the heat-sinking capability and the work efficiency of treater main part 13 greatly.

Description

Electronic information processor

Technical Field

The utility model belongs to the technical field of the treater, concretely relates to electronic information processor.

Background

The information processor is also called as Central Processing Unit (CPU), and is composed of logic unit, register unit, arithmetic unit and control unit, which are one of the main devices of electronic computer, and the core accessory in computer, and its function is mainly to interpret computer instructions and process data in computer software.

The processor can produce heat during operation among the prior art, if these heats handle in time, can influence the operation of processor, present practice is unified at quick-witted incasement and prepares radiator fan, carry out the heat dissipation to quick-witted incasement portion and handle to rely on the inside bulk temperature of forced air cooling heat dissipation reduction machine case, and then indirect carry out the heat dissipation to the processor and handle, but this kind of radiating mode can only take away the processor to give off the heat in the outside air to the processor, can not handle its inside heat, the radiating effect is general.

Therefore, an electronic information processor is needed to solve the problem that the working efficiency is reduced due to low processing and heat dissipation efficiency in the prior art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electronic information processor to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

an electronic information processor comprises a mounting plate, wherein a quick heat dissipation mechanism is arranged on the lower side of the mounting plate;

quick heat dissipation mechanism includes radiator fan, radiator fan sets up at the mounting panel middle part, the equal fixedly connected with bracing piece in mounting panel bottom four corners department, the bracing piece is close to radiator fan lateral wall upper portion and all is provided with the spout, the equal sliding connection of the inside downside of spout has the slider, four groups the slider is close to one side fixedly connected with connecting plate mutually, connecting plate roof fixedly connected with multiunit evenly distributed's fin, the connecting plate back wall runs through and fixedly connected with multiunit evenly distributed's heat pipe, the heat pipe inner wall all is fixed with the liquid core, the inside coolant liquid that all is provided with of liquid core.

What need explain in the scheme is that heat conduction silica gel is fixedly connected with bottom of the heat conduction pipe, and the shape of the heat conduction pipe is U-shaped.

It is further worth explaining that a processor body is arranged on the lower side of the heat-conducting silica gel, and a plurality of groups of uniformly distributed pins are arranged on the periphery of the processor body.

It should be further noted that the bottom of the support rod is fixedly connected with a connecting piece, and one side of the connecting piece, which is far away from the cooling fan, is provided with a threaded hole.

Preferably, the connecting pieces are fixedly connected to the front portion and the rear portion of the frame plate far away from one side wall respectively, and the frame plates are arranged on the left side and the right side of the bottom of the processor main body respectively.

Preferably, the two groups of the frame plates are fixedly connected with a fixing plate close to the middle part of one side wall.

Compared with the prior art, the utility model provides an electronic information processor has following beneficial effect:

the utility model discloses an use two sets of frame plates to put up treater main part off the ground, provide the space for the heat dissipation of treater main part, avoid its inside accumulated heat, absorb the inside heat of treater through upside heat conduction silica gel simultaneously, and transmit it for upside heat pipe, the inside coolant liquid evaporation behind the heat pipe absorbed heat, make the inside atmospheric pressure of heat pipe strengthen, thereby make inside the high temperature coolant liquid upwards remove the entering connecting plate, and give the fin with self temperature, the fin gives off the absorptive temperature to the air after, the heat dissipation to the treater is taken out with this to the heat around the fin in radiator work, for the heat radiation structure of the single radiator fan of traditional treater, can get rid of the heat that does not give off in the treater, thereby the work efficiency of treater has been improved greatly.

Drawings

Fig. 1 is a schematic view of a top-down perspective structure of the present invention;

FIG. 2 is a schematic side view of the three-dimensional structure of the present invention;

fig. 3 is a schematic bottom perspective view of the present invention;

fig. 4 is a schematic diagram of a part of the internal structure of the present invention.

Description of the reference numerals:

1. mounting a plate; 2. a fast heat dissipation mechanism; 3. a heat radiation fan; 4. a support bar; 5. a chute; 6. a slider; 7. a connecting plate; 8. a heat sink; 9. a heat conducting pipe; 10. a liquid core; 11. cooling liquid; 12. heat conducting silica gel; 13. a processor body; 14. a pin; 15. connecting sheets; 16. a threaded hole; 17. a frame plate; 18. and (7) fixing the plate.

Detailed Description

The present invention will be further described with reference to the following examples.

Referring to fig. 1-4, the present invention provides an electronic information processor, which includes a mounting plate 1, wherein a quick heat dissipation mechanism 2 is disposed at a lower side of the mounting plate 1;

quick heat dissipation mechanism 2 includes radiator fan 3, radiator fan 3 can take away the heat that gives off to in the air in order to reach radiating purpose, radiator fan 3 sets up at mounting panel 1 middle part, it is fixed to install radiator fan 3 through mounting panel 1, the equal fixedly connected with bracing piece 4 in 1 bottom four corners department of mounting panel, bracing piece 4 is provided with spout 5 when supporting mounting panel 1, bracing piece 4 all is provided with spout 5 near 3 lateral wall upper portions of radiator fan, the equal sliding connection of the inside downside of spout 5 has slider 6, spout 5 makes connecting plate 7 can reciprocate with slider 6 cooperation, four group's sliders 6 are close to one side fixedly connected with connecting plate 7 mutually, connecting plate 7 roof fixedly connected with multiunit evenly distributed's fin 8, connecting plate 7 back wall runs through and fixedly connected with multiunit evenly distributed's heat pipe 9, connecting plate 7 is used for connecting fin 8 and heat pipe 9, the heat pipe 9 inner wall all is fixed with liquid core 10, the inside all is provided with coolant liquid core 11 that is provided with of liquid core 10, coolant 11 is heated to evaporate and makes the inside atmospheric pressure of heat pipe 9 rise, thereby extrude gaseous state coolant liquid coolant 11 to the upside, thereby the downside can be shifted to the liquid state again and absorb the heat transfer to the upside again after the coolant 11 absorbs, thereby the downside can absorb the heat.

As further shown in fig. 1, 2 and 3, it should be specifically described that a heat conductive silica gel 12 is fixedly connected to the bottom of the heat pipe 9, the heat conductive silica gel 12 contacts with the processor body 13 to absorb heat inside the processor body 13, and the shape of the heat pipe 9 is U-shaped, so that the heat pipe 9 can receive heat in the largest area and transmit the heat to the heat sink 8.

As further shown in fig. 3, it is worth specifically describing that a processor body 13 is disposed on the lower side of the heat conductive silicone rubber 12, a plurality of groups of pins 14 are uniformly distributed on the periphery of the processor body 13, and the processor body 13 is a core component of a computer.

The scheme has the following working processes: when the processor is provided with the heat dissipation device and starts to work, part of heat generated during the work of the processor is dissipated to the air, the residual heat is remained in the processor and cannot be dissipated, the heat in the processor main body 13 is absorbed through the heat conduction silica gel 12 and is transferred to the upper side heat conduction pipe 9, the lower side cooling liquid 11 in the heat conduction pipe 9 is evaporated after the heat is absorbed by the heat conduction pipe 9, the air pressure in the heat conduction pipe 9 is enhanced, the lower side high-temperature gaseous cooling liquid 11 moves upwards to enter the connecting plate 7 and transfers the temperature of the lower side high-temperature gaseous cooling liquid to the heat dissipation fins 8, the heat dissipation fan 3 works to draw away the heat around the heat dissipation fins 8 so as to dissipate the heat of the processor, meanwhile, the high-temperature gaseous cooling liquid 11 in the heat conduction pipe 9 loses the heat of the lower side high-temperature gaseous cooling liquid 11 and is liquefied again to be transferred to the lower side after being absorbed by the upper side liquid core 10, and heat transfer is continued, and continuous heat dissipation of the processor main body 13 is achieved.

According to the working process, the following steps are known: the heat inside the processor main body 13 can be continuously extracted and dissipated to the outside through the matching of the frame plate 17, the heat dissipation fan 3, the heat conduction silica gel 12, the heat dissipation fins 8, the connecting plate 7, the heat conduction pipe 9, the liquid core 10 and the cooling liquid 11, and the heat dissipation capacity and the working efficiency of the processor main body 13 are greatly improved.

Further as shown in fig. 1, fig. 2 and fig. 3, it is worth specifically explaining that the bottom of the support rod 4 is fixedly connected with a connection piece 15, one side of the connection piece 15 away from the cooling fan 3 is provided with a threaded hole 16, the connection piece 15 is used for connecting the frame plate 17 with the support rod 4, and the connection piece 15 can be fixed inside the chassis through the threaded hole 16.

Further, as shown in fig. 2, it is worth specifically describing that the connecting pieces 15 are respectively fixedly connected to the front and rear portions of the frame plate 17 far from one side wall, the frame plates 17 are respectively disposed on the left and right sides of the bottom of the processor body 13, and the frame plates 17 enable a gap to exist between the processor body 13 and the chassis wall, so that the heat dissipation capability of the processor body 13 is improved.

As further shown in fig. 1 and fig. 3, it is worth specifically describing that the two sets of shelf boards 17 are fixedly connected with a fixing plate 18 near the middle of one side wall, and the two sets of shelf boards 17 are connected through the fixing plate 18 to form a whole.

To sum up: the connecting piece 15 is used for connecting a frame plate 17 and the supporting rod 4, the connecting piece 15 can be fixed inside the case through the threaded hole 16, the frame plate 17 enables a gap to exist between the processor main body 13 and the wall of the case, therefore, the heat dissipation capacity of the processor main body 13 is improved, and the two groups of frame plates 17 are connected through the fixing plate 18 to form a whole.

Claims

1. An electronic information processor comprising a mounting board (1), characterized in that: a quick heat dissipation mechanism (2) is arranged on the lower side of the mounting plate (1);

quick heat dissipation mechanism (2) are including radiator fan (3), radiator fan (3) set up at mounting panel (1) middle part, equal fixedly connected with bracing piece (4) of mounting panel (1) bottom four corners department, bracing piece (4) are close to radiator fan (3) a lateral wall upper portion and all are provided with spout (5), the equal sliding connection of the inside downside of spout (5) has slider (6), four groups slider (6) are close to one side fixedly connected with connecting plate (7) mutually, connecting plate (7) roof fixedly connected with multiunit evenly distributed's fin (8), connecting plate (7) back wall runs through and fixedly connected with multiunit evenly distributed's heat pipe (9), heat pipe (9) inner wall all is fixed with liquid core (10), inside all is provided with coolant liquid (11) of liquid core (10).

2. An electronic information processor according to claim 1, characterized in that: the heat conduction device is characterized in that the bottom of the heat conduction pipe (9) is fixedly connected with heat conduction silica gel (12), and the shape of the heat conduction pipe (9) is U-shaped.

3. An electronic information processor according to claim 2, characterized in that: heat conduction silica gel (12) downside is provided with treater main part (13), treater main part (13) periphery all is provided with multiunit evenly distributed's pin (14).

4. An electronic information processor according to claim 1, characterized in that: the bottom of the support rod (4) is fixedly connected with a connecting piece (15), and one side, away from the cooling fan (3), of the connecting piece (15) is provided with a threaded hole (16).

5. An electronic information processor according to claim 4, characterized in that: connection piece (15) are equallyd divide respectively fixed connection and keep away from a lateral wall front and back two in frame plate (17) mutually, frame plate (17) set up respectively in treater main part (13) bottom left and right sides.

6. An electronic information processor according to claim 5, characterized in that: two groups of the frame plates (17) are fixedly connected with a fixing plate (18) close to the middle part of one side wall.