CN218728854U

CN218728854U - Intelligent heat dissipation case

Info

Publication number: CN218728854U
Application number: CN202222718548.2U
Authority: CN
Inventors: 江兴方; 李文方; 陈�光
Original assignee: Suzhou Inspur Intelligent Technology Co Ltd
Current assignee: Suzhou Inspur Intelligent Technology Co Ltd
Priority date: 2022-10-14
Filing date: 2022-10-14
Publication date: 2023-03-24
Anticipated expiration: 2032-10-14

Abstract

The utility model relates to the technical field of servers, in particular to an intelligent heat dissipation case, which comprises a shell, wherein the lower end of the shell is provided with a bottom heat dissipation structure, the bottom heat dissipation structure is provided with a bottom heat dissipation hole communicated with the interior of the shell, the upper end of the shell is provided with an opening, the opening is provided with an upper cover and a driving assembly, and the driving assembly can drive the upper cover to move up and down to open or close the opening; when the opening is opened on the upper cover, convection is formed between the heat dissipation holes at the bottom and the opening. The scheme conforms to the principle of hot air flow rising and can obviously increase the heat dissipation capacity of the case. When the core temperature of the CPU is identified by the chip, when the core temperature of the CPU exceeds a set value, an instruction is sent out to extend the telescopic rod, and the upper cover is ejected out of the shell to dissipate heat; when the temperature is lower than the set value, an instruction is sent out to enable the telescopic rod to retract, the upper cover and the shell are sealed, the heat dissipation capacity of the case can be increased and the case can be dustproof when the heat dissipation capacity is narrow, and the case can be sealed and dustproof when the heat dissipation demand is low.

Description

Intelligent heat dissipation case

Technical Field

The utility model relates to a server technical field, concretely relates to quick-witted case of intelligence heat dissipation.

Background

At present, with the rapid development of science and technology, the integration level of a chip is higher and higher, and the power consumption of a product is higher and higher, so that the heat dissipation problem of the chip is more and more serious. However, in the PC field, the CPU chip and the GPU chip have increasingly large power consumption, which makes heat dissipation increasingly difficult.

Products tend to use larger heat sinks and system fans for better heat dissipation. But at the same time, heat dissipation still has an upper limit due to space limitations and noise requirements. The existing case mainly conducts hole opening heat dissipation on a front panel and a rear window, and the upper part of the existing case is not provided with holes generally due to the consideration of the dustproof problem, so that the existing case is not beneficial to floating heat dissipation of hot air, and therefore the heat dissipation capacity of the case is limited.

Disclosure of Invention

The utility model discloses to the limited scheduling problem of heat-sinking capability of present machine case, provided an intelligence heat dissipation machine case.

In order to achieve the above object, the present invention adopts the technical solution that, the intelligent heat dissipation case comprises a casing, wherein a bottom heat dissipation structure is arranged at the lower end of the casing, the bottom heat dissipation structure is provided with a bottom heat dissipation hole communicated with the inside of the casing, an opening is arranged at the upper end of the casing, an upper cover and a driving assembly are arranged at the opening, and the driving assembly can drive the upper cover to move up and down to open or close the opening; and convection is formed between the bottom heat dissipation hole and the opening when the opening is opened by the upper cover.

Preferably, the driving assembly comprises a partition supporting plate and a telescopic rod, the partition supporting plate is fixed on the inner wall of the shell, the lower end of the telescopic rod is fixed on the partition supporting plate, the upper end of the telescopic rod is connected with the upper cover, and the telescopic rod can stretch out and draw back to drive the upper cover to move up and down.

Preferably, the partition supporting plate is provided with a plurality of vent holes.

Preferably, the upper end face of the partition supporting plate is covered with an upper dust screen.

Preferably, the upper end surface of the bottom heat dissipation structure is covered with a lower dustproof net.

Preferably, a plurality of blowing plates are inserted into the interior of the housing.

Preferably, a gravity heat pipe is further arranged inside the shell.

Preferably, the shell and the partition supporting plate are made of hot-dip galvanized steel plates.

Preferably, the telescopic rod is an electric telescopic rod.

Preferably, the upper dust screen is made of polycarbonate material, and the porosity of the upper dust screen is between 30% and 50%.

The utility model has the advantages that:

the scheme of the utility model accords with the principle that the hot gas flow rises, can show the heat-sinking capability of increase machine case. When the core temperature of the CPU is identified by the chip, when the core temperature of the CPU exceeds a set value, an instruction is sent out to extend the telescopic rod, the upper cover is ejected out of the shell, the opening is exposed, and heat dissipation is carried out; when the temperature is lower than the set value, an instruction is sent out to enable the telescopic rod to retract, the upper cover and the shell are sealed, the heat dissipation capacity of the case can be increased and the case can be dustproof when the heat dissipation capacity is narrow, and the case can be sealed and dustproof when the heat dissipation demand is low.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of a three-dimensional structure of an intelligent heat dissipation case.

In the figure: 1. the heat dissipation structure comprises a shell, 2, a bottom heat dissipation structure, 3, bottom heat dissipation holes, 4, an opening, 5, an upper cover, 6, a partition support plate, 7, a telescopic rod, 8 and ventilation holes.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments, and obviously, the embodiments described below are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the scope of protection of this patent.

As shown in fig. 1, in this embodiment, the intelligent heat dissipation case provided by the present invention includes a casing 1, a bottom heat dissipation structure 2 is disposed at a lower end of the casing 1, the bottom heat dissipation structure 2 is provided with a bottom heat dissipation hole 3 communicated with an inside of the casing 1, an opening 4 is disposed at an upper end of the casing 1, an upper cover 5 and a driving assembly are disposed at the opening 4, and the driving assembly can drive the upper cover 5 to move up and down to open or close the opening 4; convection is formed between the bottom radiating hole 3 and the opening 4 in a state where the opening 4 is opened in the upper cover 5. Specifically, drive assembly cuts off backup pad 6 and telescopic link 7 including cutting off, cuts off backup pad 6 and is fixed in the inner wall of casing 1, and the lower extreme of telescopic link 7 is fixed in and cuts off backup pad 6, and the upper end and the upper cover 5 of telescopic link 7 are connected, and telescopic link 7 can stretch out and draw back in order to drive upper cover 5 up-and-down motion. The partition supporting plate 6 can be directly welded on the inner wall of the shell 1, the telescopic rod 7 can be fixed on the partition supporting plate 6 through screws and connected with the movable upper cover 5 in a welding, hinging or screw mode, and the used telescopic rod 7 is a small telescopic arm structure commonly used in the market, such as a small electric telescopic arm and the like.

The shell 1 can be made of hot dip galvanized steel Sheets (SGCC), and the whole shell 1 is manufactured into a structure with a cavity through processes such as stamping and the like.

Because cut off backup pad 6 welding at the inner wall of casing 1, consequently cut off backup pad 6 itself and can produce the separation to the flow of air current, for this reason, this scheme has seted up a plurality of ventilation holes 8 on cutting off backup pad 6. When the upper cover 5 is in a state of opening the opening 4, convection heat transfer is formed in the housing 1 due to the existence of the bottom heat dissipation holes 3 and the opening 4, and convection is formed without hindrance due to the existence of the ventilation holes 8. The material of the partition supporting plate 6 can also adopt a hot dip galvanizing steel plate (SGCC), and is the same as the material used by the shell 1, so that the welding between the two is convenient, and the connection strength is ensured. The partition supporting plate 6 is made into a structure with holes through stamping or laser cutting, and the porosity of the structure is between 50 and 70 percent.

Because the existence of ventilation hole 8 and bottom louvre 3 on upper portion, can form the convection heat transfer in the casing 1, nevertheless, in outside dust impurity also can get into casing 1 through ventilation hole 8 and bottom louvre 3, causes inevitable pollution in the casing 1. Therefore, this scheme still is provided with the dust screen. Specifically, the upper end face of the partition supporting plate 6 is covered with an upper dustproof net, and the upper end face of the bottom heat dissipation structure 2 is covered with a lower dustproof net. The existence of upper portion dust screen and lower part dust screen makes also can not have dust impurity along with the air current gets into in the casing 1 when the convection current of casing 1 inside emergence gas, has also guaranteed dustproof ability when guaranteeing the heat dissipation.

The upper dustproof net is made of polycarbonate material, and the porosity of the upper dustproof net is 30% -50%.

In order to further increase the heat dissipation effect, a plurality of blowing plates are inserted in the shell 1, and a gravity assisted heat pipe is further arranged in the shell 1.

As shown in fig. 1, the working principle of the intelligent heat dissipation case is as follows:

the CPLD or the BIOS chip identifies the core temperature of the CPU, when the core temperature of the CPU exceeds a set value (the set value is referred to as 60-80 ℃), an instruction is sent out, the telescopic rod 7 is extended, the movable upper cover 4 is ejected out of the shell 1, the opening 4 is exposed, hot air flow inside the shell 1 naturally rises and is radiated through the vent hole 8 and the opening 4, the air pressure inside the shell 1 drops along with the outflow of the hot air flow, external air can enter the shell 1 from the heat radiation hole 3 at the bottom, and the temperature inside the shell 1 gradually drops in continuous air flow circulation; when the temperature is lower than the set value (the set value is referred to as 60-80 ℃), an instruction is sent out to retract the telescopic rod 7 and drive the upper cover 5 and the shell 1 to complete sealing.

The utility model has the advantages that:

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An intelligent heat dissipation case is characterized by comprising a shell, wherein a bottom heat dissipation structure is arranged at the lower end of the shell, bottom heat dissipation holes communicated with the inside of the shell are formed in the bottom heat dissipation structure, an opening is formed in the upper end of the shell, an upper cover and a driving assembly are arranged at the opening, and the driving assembly can drive the upper cover to move up and down to open or close the opening; and convection is formed between the bottom heat dissipation hole and the opening when the opening is opened by the upper cover.

2. The intelligent heat dissipation cabinet of claim 1, wherein the driving assembly comprises a partition supporting plate and a telescopic rod, the partition supporting plate is fixed to the inner wall of the housing, the lower end of the telescopic rod is fixed to the partition supporting plate, the upper end of the telescopic rod is connected with the upper cover, and the telescopic rod can stretch and retract to drive the upper cover to move up and down.

3. The intelligent heat dissipation case of claim 2, wherein the partition support plate is provided with a plurality of ventilation holes.

4. The intelligent heat dissipation case of claim 3, wherein the upper end face of the partition support plate is covered with an upper dust screen.

5. The intelligent heat dissipation case of claim 1, wherein an upper end surface of the bottom heat dissipation structure is covered with a lower dust screen.

6. The intelligent heat sink chassis of claim 1, wherein a plurality of expansion plates are inserted inside the housing.

7. The intelligent heat dissipation cabinet of claim 1, wherein a gravity heat pipe is further disposed inside the housing.

8. The intelligent heat dissipation cabinet of claim 2, wherein the housing and the partition support plates are made of hot-dip galvanized steel sheets.

9. The intelligent heat dissipation cabinet of claim 2, wherein the telescoping rod is configured as an electrically powered telescoping rod.

10. The intelligent heat dissipation cabinet of claim 4, wherein the upper dust screen is made of polycarbonate material, and the upper dust screen has a porosity of 30% to 50%.