CN218700921U - Carrier assembly for semiconductor packaging - Google Patents

Abstract

The utility model discloses a carrier subassembly of semiconductor package, including the bed die, the top end of bed die is provided with the pivot, and the top of pivot is provided with the mould, goes up mould and bed die through pivot swing joint, and the apron is installed to the top outer wall of going up the mould, and set up flutedly all around respectively at bed die top, fixedly connected with lug respectively all around of bed die bottom, the internally mounted of bed die has temperature sensor, the utility model discloses a merge mould and bed die, begin to mould plastics to base ring inside through the hole of moulding plastics, the resin of partly dissolving can wrap up the lead frame, the pin is owing to placing in putting the line inslot, has avoided the resin to carry out the overflow, the in-process of moulding plastics, the heating wire can continuously heat, avoids the inside resin of base ring to produce the solidification, accomplishes the back of moulding plastics to the base ring, and the heating wire stops to heat, reduces the temperature for the resin solidifies fast, has guaranteed the encapsulation effect to the semiconductor.

Description

Carrier assembly for semiconductor packaging

Technical Field

The utility model relates to a carrier subassembly technical field specifically is a carrier subassembly of semiconductor encapsulation.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like.

However, the prior patent numbers are: CN203491246U is a semiconductor packaging carrier, which passes through a straight pipe and tail plugs, wherein the tail plugs are plugged at two ends of the straight pipe; the cross section of straight tube is for sealing squarely, and the mid portion of this square one side is inside sunken, and a long side shape through the carrier cross section is through sunken buckling, carries out strict match with the specific shape of 16SDIP product, blocks up the tail stopper again at both ends, can encapsulate 16SDIP product safely and stably, and the product carrier has certain limitation, can't be suitable for to the product of difference, and lacks the isolation measure to the pin, is unfavorable for the processing to the product later stage.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

An object of the utility model is to provide a carrier subassembly of semiconductor encapsulation to it has the limitation to propose current semiconductor encapsulation carrier in solving above-mentioned background art, can only be applicable to the processing encapsulation of specific product, the comparatively loaded down with trivial details problem of product encapsulation post processing.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a carrier subassembly of semiconductor encapsulation, includes the bed die, the top end of bed die is provided with the pivot, the top of pivot is provided with the mould, it passes through pivot swing joint with the bed die to go up the mould, the apron is installed to the top outer wall of going up the mould, set up flutedly all around at the bed die top respectively, fixedly connected with lug respectively all around of bed die bottom, the internally mounted of bed die has temperature sensor, the base ring is installed to the top inboard of bed die, the base ring comprises fitting with a contraceptive ring, putting the line hole and lower ring, it is located the lower ring to fit with a contraceptive ring directly over, the arc hole has been seted up to the side outer wall of fitting with a contraceptive ring, the outer wall of lower ring side has seted up the arc wall, it forms by fitting with a contraceptive ring and the combination of lower ring joint to put the line hole.

Preferably, the outer wall of the side surface of the upper ring is fixedly connected with pull blocks, and the pull blocks are respectively and symmetrically arranged on two sides of the pull blocks.

Preferably, the inner wall of base ring is provided with the shrouding, the shrouding joint is in putting the inboard in line hole, the shrouding with put line hole align to grid.

Preferably, the control end of the temperature sensor is electrically connected with the output end of the heating wire, and the heating wire is arranged in the lower die in a surrounding manner.

Preferably, the top of the cover plate is provided with an injection molding hole in a penetrating manner, and the injection molding hole is positioned right above the base ring.

Preferably, four mounting brackets are evenly installed on the outer wall of the bottom end of the lower die, and four holes are formed in the bottoms of the mounting brackets in a penetrating mode.

(III) advantageous effects

The utility model provides a carrier subassembly of semiconductor package possesses following beneficial effect:

compared with the prior art, the utility model discloses improve and increase on the basis of original device, base ring through setting up, can keep apart the pin of lead frame, the injecting glue has been avoided producing the influence to the pin, be unfavorable for the degumming processing in later stage, when using this device, it makes up to go up mould and bed die, put on the die casting machine after the combination is accomplished, place the base ring in the inside of bed die, place the frame that the routing was accomplished in the lower ring in the base ring again, and put the pin on the lead frame in the arc wall, to fit with a contraceptive ring and merge the lower ring, make the pin fix to putting the downthehole, place the completion back, merge last mould and bed die, it moulds plastics to the base ring inside through the hole of moulding plastics to begin, the resin of semi-dissolving can wrap up the lead frame, the pin is owing to placing in putting the downthehole, avoided the resin to carry out the overflow, the in-process of moulding plastics, the heating wire can continuously heat, avoid the inside resin of base ring to produce the solidification, accomplish the back of moulding plastics, the heating wire stop heating wire, reduce the temperature, make the resin solidify fast, the encapsulation effect of semiconductor has been guaranteed the later stage, the product of removing the non-defective products is not convenient for the pin.

Drawings

Fig. 1 is a schematic view of the structure of the present invention;

FIG. 2 is a partial schematic view of the base ring of the present invention;

fig. 3 is a schematic view of a partial structure of the upper mold and the lower mold of the present invention;

fig. 4 is a cross-sectional view of the middle and lower molds of the present invention.

In the figure: 1. a lower die; 101. a mounting frame; 102. a temperature sensor; 103. an electric heating wire; 2. an upper die; 201. a rotating shaft; 3. a bump; 4. a cover plate; 401. injection molding holes; 5. a groove; 6. a base ring; 601. ring fitting; 602. a lower ring; 603. a wire placing hole; 604. pulling the block; 605. and (7) closing the plate.

The utility model discloses the instrument that mentions in all can obtain through purchase or private customization:

a temperature sensor: the ATE300.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a carrier subassembly of semiconductor encapsulation, including bed die 1, the top end of bed die 1 is provided with pivot 201, the top of pivot 201 is provided with mould 2, go up mould 2 and bed die 1 through pivot 201 swing joint, the apron 4 is installed to the top outer wall of going up mould 2, set up fluted 5 respectively around the bed die 1 top, fixedly connected with lug 3 respectively around the bed die 1 bottom, the internally mounted of bed die 1 has temperature sensor 102, bed ring 6 is installed to the top inboard of bed die 1, bed ring 6 is by fitting with a contraceptive ring 601, put line hole 603 and lower ring 602 and constitute, it is located lower ring 602 to fit with a contraceptive ring 601 directly over, the arc hole has been seted up to the side outer wall of fitting with a contraceptive ring 601, the arc groove has been seted up to the outer wall of lower ring 602 side, it forms by fitting with a contraceptive ring 601 and the combination of lower ring 602 joint to put line hole 603.

In this embodiment, specifically, the outer wall of the side of the upper ring 601 is fixedly connected with the pulling blocks 604, the pulling blocks 604 are respectively and symmetrically arranged on two sides of the pulling blocks 604, and after the injection molding of the base ring 6 is completed, the upper ring 601 is separated through the pulling blocks 604, and the demolding is completed by matching with the lower ring 602.

In this embodiment, specifically, the inner wall of the base ring 6 is provided with a sealing plate 605, the sealing plate 605 is clamped inside the wire placing hole 603, the sealing plate 605 and the wire placing hole 603 are uniformly arranged, and the sealing and the use of the wire placing hole 603 are completed through the sealing plate 605.

In this embodiment, specifically, the control end of the temperature sensor 102 is electrically connected to the output end of the heating wire 103, the heating wire 103 is disposed around the inside of the lower mold 1, and the temperature sensor 102 is used in cooperation with the heating wire 103 to control the temperature.

In this embodiment, specifically, the top of the cover plate 4 is provided with an injection hole 401 in a penetrating manner, the injection hole 401 is located right above the base ring 6, and resin is injected from the center of the base ring 6 through the injection hole 401, so that uniformity of glue injection is ensured.

In this embodiment, specifically, four mounting brackets 101 are evenly installed to the bottom outer wall of bed die 1, and the bottom of four mounting brackets 101 all runs through and is provided with the trompil, and the cooperation is fixed to the mould through trompil on the mounting bracket 101.

The working principle is as follows: at first inspect the utility model discloses a safety protection and fixed mounting, use this device, during the use this device, will go up mould 2 and bed die 1 and make up, put the die casting machine after the combination is accomplished on, place base ring 6 in the inside of bed die 1, place the frame that the routing was accomplished in base ring 6 under ring 602 again, and put the arc wall with the pin on the lead frame, merge upper ring 601 and under ring 602, make the pin fix to putting in the line hole 603, place the completion after, merge to upper mould 1 and bed die 2, begin to mould plastics to base ring 6 inside through injection hole 401, the resin that partly dissolves can wrap up the lead frame, the pin is owing to place in putting in line hole 603, avoided the resin to carry out the overflow, the in-process of moulding plastics, heating wire 103 can continuously heat, avoid the inside resin production solidification of base ring 6, accomplish the back of moulding plastics to base ring 6, heating wire 103 stops heating, reduce the temperature, make the resin solidify fast, the encapsulation effect to the semiconductor has been guaranteed, the later stage is not convenient for removing glue to the product, just the yields has been guaranteed, the utility model discloses a process of using has been used.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A carrier assembly for semiconductor packaging comprises a lower die (1), and is characterized in that: the utility model discloses a mould, including bed die (1), apron (1), base ring (6), upper ring (601), wire placing hole (603), lower ring (602), upper ring (601) and lower ring (602), the top end of bed die (1) is provided with pivot (201), the top of pivot (201) is provided with mould (2), go up mould (2) and bed die (1) through pivot (201) swing joint, go up the top outer wall of mould (2) and install apron (4), recess (5) have been seted up respectively all around at bed die (1) top, there are lug (3) fixedly connected with respectively all around of bed die (1) bottom, the internally mounted of bed die (1) has temperature sensor (102), base ring (6) are installed to the top inboard of bed die (1), base ring (6) comprise by last ring (601), wire placing hole (603) and lower ring (602), it is located directly over ring (602) to go up ring (601), the side outer wall of last ring (601) has seted up the arc hole, the outer wall of lower ring (602) side has seted up the arc groove, it forms by last ring (601) and lower ring (602) joint combination.

2. The carrier assembly of claim 1, wherein: the side outer wall of the upper ring (601) is fixedly connected with pulling blocks (604), and the pulling blocks (604) are respectively and symmetrically arranged on two sides of the pulling blocks (604).

3. The carrier assembly of claim 1, wherein: the inner wall of base ring (6) is provided with shrouding (605), shrouding (605) joint is in putting the inboard in line hole (603), shrouding (605) and putting line hole (603) align to grid.

4. The carrier assembly of claim 1, wherein: the control end of the temperature sensor (102) is electrically connected with the output end of the heating wire (103), and the heating wire (103) is arranged in the lower die (1) in a surrounding manner.

5. The carrier assembly of claim 1, wherein: the top of apron (4) is run through and is provided with injection molding hole (401), injection molding hole (401) are located the directly over of base ring (6).

6. The carrier assembly of claim 1, wherein: four mounting brackets (101) are evenly installed to the bottom outer wall of bed die (1), four the bottom of mounting bracket (101) all runs through and is provided with the trompil.

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