CN218679710U

CN218679710U - Mobile phone heat dissipation back splint

Info

Publication number: CN218679710U
Application number: CN202222217320.5U
Authority: CN
Inventors: 白学芳
Original assignee: Individual
Current assignee: Individual
Priority date: 2022-03-09
Filing date: 2022-08-23
Publication date: 2023-03-21
Anticipated expiration: 2032-08-23

Abstract

The utility model provides a mobile phone heat dissipation back clip, which comprises a bottom shell, a face shell fixed on the bottom shell, a semiconductor refrigeration sheet arranged between the bottom shell and the face shell, an annular metal radiator, a heat dissipation fan and a main control board, wherein a temperature sensor is fixedly arranged at the cold surface position of the semiconductor refrigeration sheet, so that the heat dissipation condition of the heat dissipation back clip can be collected in real time and fed back to a user through a display assembly; display module sets up in face-piece top surface fan air intake middle part display unit mounting hole, compares to set up at the side back splint volume littleer, adopts LED display panel stack to show diffusion barrier and PC lens design, and display module can be done very thin, reduces heat dissipation back splint thickness, and design like this, the centre gripping is occupation space when the cell-phone back is littleer, and weight is lighter, improves user and uses experience.

Description

Mobile phone heat dissipation back splint

Technical Field

The utility model relates to a cell-phone accessory technical field, in particular to cell-phone heat dissipation back splint.

Background

Today of rapid development of electronic products, smart phones are continuously developed, and due to the appearance of dual-core and multi-core mobile phones, the performance of mobile phones is higher and higher, and accompanying problems also start to appear, especially, the heat of the mobile phones becomes a common phenomenon of the smart phones, especially, the temperature of a high-end smart phone can even reach 45-50 ℃ when playing games or watching videos, so that the use of the mobile phones is influenced, the service lives of the mobile phones and batteries are also influenced, especially in summer, the heat generation condition is more serious, the mobile phone equipment can trigger a chip to reduce the frequency when continuously high temperature, the performance of the mobile phone is reduced, the phenomenon of blocking can occur when in use, a series of problems that a storage battery in the mobile phone equipment is in failure due to serious high temperature and the like can occur, and the use experience of users is seriously influenced.

In order to control the heat productivity of the mobile phone, an external heat dissipation back clip is provided in the market, as shown in the patent publication No. CN209420220U, external heat is transferred to a heat dissipation assembly for heat dissipation through the fixed connection of a heat conduction assembly and the heat dissipation assembly, without an indication function, and the cooling condition of the heat dissipation back clip cannot be known clearly; or an electronic display tube display device is additionally arranged at the edge of the radiating assembly disc in the existing market, so that the size and the thickness of the radiating back clamp are increased, and the use feeling of a user is influenced. Therefore, the structure of the heat dissipation back clip needs to be further improved, and the use experience of a user is improved.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a cell-phone heat dissipation back splint to prior art's problem, the design increases temperature sensor, and the air intake middle part sets up the LED display panel and replaces electronic display tube, solves current technical problem.

The utility model aims at realizing through the following technical scheme:

the utility model provides a cell-phone heat dissipation back splint, including the drain pan, fix the face-piece on the drain pan, the drain pan central point puts the undercut and forms the through hole position and correspond fixed semiconductor refrigeration piece, the drain pan downside sets up cell-phone fixture, the semiconductor refrigeration piece is installed and is put the cold face towards the drain pan downside behind the through hole at the drain pan central point, the hot face of semiconductor refrigeration piece is towards the drain pan side of going up, the hot face of semiconductor refrigeration piece supports the contact and is provided with annular metal radiator, annular metal radiator fixes and is living semiconductor refrigeration piece hot face at the drain pan side-pressing, annular metal radiator central space is fixed and is provided with radiator fan, annular metal radiator lateral surface rigidity is provided with the master control board, integrated power source interface inserts external power source on the master control board, semiconductor refrigeration piece, radiator fan are connected with the master control board electricity respectively, the face-piece covers radiator fan, master control board after-fixing in the side on the drain pan, be provided with the hole that connects of corresponding power source interface and the air intake that corresponds radiator fan on the face-piece, semiconductor refrigeration piece cold face position is fixed and is provided with temperature sensor, temperature sensor and master control board electricity are connected, face-phone top surface radiator fan middle part is provided with display unit mounting hole.

Furthermore, the main control panel is also integrated with control keys, and the face shell is provided with key holes corresponding to the control keys.

The display assembly comprises an LED display panel, a display diffusion film and a PC lens, wherein lamp beads in the shape of contents to be displayed are integrated on the LED display panel, the light transmission part of the display diffusion film corresponds to the position of the lamp beads on the display LED display panel, the display diffusion film is attached to the LED display panel, the PC lens is fixed on the display diffusion film, the LED display panel, the display diffusion film and the PC lens are sequentially fixed in the display component mounting hole in an overlapped mode from bottom to top and face to the outer side of the face shell, and the LED display panel is electrically connected with the main control panel.

The beneficial effects of the utility model reside in that:

the utility model discloses the fixed temperature sensor that sets up in cell-phone heat dissipation back splint semiconductor refrigeration piece cold side position can gather the heat dissipation back splint heat dissipation condition in real time, feeds back to the user through the display module; display module sets up in face-piece top surface fan air intake middle part display unit mounting hole, compares to set up at the side back splint volume littleer, adopts LED display panel stack to show diffusion barrier and PC lens design, and display module can be done very thin, reduces heat dissipation back splint thickness, and design like this, the centre gripping is occupation space when the cell-phone back is littleer, and weight is lighter, improves user and uses experience.

Drawings

Fig. 1 is the utility model discloses well cell-phone heat dissipation back splint split sketch map.

The reference numerals are explained below:

the mobile phone comprises a bottom shell 1, a face shell 2, a semiconductor refrigeration piece 3, a mobile phone clamping mechanism 4, an annular metal radiator 5, a radiating fan 6, a main control board 7, a temperature sensor 8, a display component mounting hole 9, a display assembly 10, an LED display board 101, a display diffusion film 102 and a PC lens 103.

Detailed Description

The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

The embodiments of the present disclosure are described below with specific examples, and other advantages and effects of the present disclosure will be readily apparent to those skilled in the art from the disclosure in the specification. It is to be understood that the described embodiments are merely illustrative of some, and not restrictive, of the embodiments of the disclosure. The disclosure may be carried into practice or applied to various other specific embodiments, and various modifications and changes may be made in the details within the description and the drawings without departing from the spirit of the disclosure. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

In order to reduce the volume and thickness of the heat dissipation back splint, the present invention is specifically as follows.

As shown in the figure 1, the embodiment of the utility model is a mobile phone heat dissipation back clip, which comprises a bottom shell 1, a face shell 2 fixed on the bottom shell, a through hole formed by sinking the center of the bottom shell 1 is corresponding to a fixed semiconductor refrigeration sheet 3, a mobile phone clamping mechanism 4 is arranged on the lower side of the bottom shell 1, the cold side of the semiconductor refrigeration sheet 3 is towards the lower side of the bottom shell 1 after being arranged in the through hole of the center of the bottom shell 1, the hot side of the semiconductor refrigeration sheet 3 is towards the upper side of the bottom shell 1, the hot side of the semiconductor refrigeration sheet 3 is provided with an annular metal radiator 5 in a propping contact manner, the annular metal radiator 5 is fixed on the upper side of the bottom shell 1 and presses the hot side of the semiconductor refrigeration sheet 3, a heat dissipation fan 6 is fixedly arranged in the center space of the annular metal radiator 5, a main control plate 7 is fixedly arranged on the outer side of the annular metal radiator 5, a power interface is integrated on the main control plate 7 and is connected with an external power supply, the semiconductor refrigeration sheet 3 and the heat dissipation fan 6 are respectively electrically connected with the main control plate 7, the face shell 2 covers the heat dissipation fan 6, the face shell is fixed on the upper side of the bottom shell 1 after the main control plate 7, a connection hole corresponding to the power interface and an air inlet of the heat dissipation fan is arranged on the face shell 2,

importantly, a temperature sensor 8 is fixedly arranged at the cold surface position of the semiconductor refrigeration piece 3, the temperature sensor 8 is electrically connected with the main control board 7, a display component mounting hole 9 is formed in the middle of an air inlet of the heat dissipation fan on the top surface of the face shell 2, a display component 10 is fixedly arranged in the middle of the display component mounting hole 9, and the display component 10 is electrically connected with the main control board 7;

by the design, the temperature sensor 8 can acquire the heat dissipation condition of the heat dissipation back clip in real time and feed the heat dissipation condition back to a user through the display component 10; the display assembly 10 is arranged in the middle of the fan air inlet on the top surface of the face shell 2, and the display component mounting hole 9 is smaller in size than the display component mounting hole arranged on the back clamp on the side surface.

The main control board 7 is further integrated with a control key, the face shell 2 is provided with a key hole corresponding to the control key, and the working operation condition of the mobile phone heat dissipation back clip can be controlled through the control key.

More specifically, the display assembly 10 includes an LED display panel 101, a display diffusion film 102, and a PC lens 103, wherein a lamp bead of a shape required to display content is integrated on the LED display panel 101, and different content is displayed by different lighting of the lamp bead; the display diffusion film 102 is an optical refraction device, the light transmission part corresponds to the position of a lamp bead on the LED display panel to help achieve a display effect, the PC lens 103 is a light transmission protective device, the display diffusion film 102 is attached to the LED display panel 101, the PC lens 103 is fixed on the display diffusion film 102, the LED display panel 101, the display diffusion film 102 and the PC lens 103 are sequentially overlapped and fixed in the display component mounting hole 9 from bottom to top and face the outer side of the panel shell, the LED display panel 101 is electrically connected with the main control panel 7, and the main control panel 7 controls the LED display panel 101 to display; thus, by adopting the design that the LED display panel 101 is overlapped with the display diffusion film 102 and the PC lens 103, the display assembly 10 can be made very thin, the thickness of the heat dissipation back clamp is reduced, and by the design, the clamping occupies a smaller space on the back of the mobile phone, the weight is lighter, and the use experience of a user is improved.

The above description is for illustrative purposes only and is not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. that do not depart from the spirit and principles of the present invention should be construed as within the scope of the present invention.

Claims

1. The utility model provides a cell-phone heat dissipation back splint, including the drain pan, fix the face-piece on the drain pan, the drain pan central point puts the undercut and forms the through hole position and correspond fixed semiconductor refrigeration piece, the drain pan downside sets up cell-phone fixture, the semiconductor refrigeration piece is installed and is put the cold face towards the drain pan downside behind the through hole at the drain pan central point, the hot face of semiconductor refrigeration piece is towards the drain pan side of going up, the hot face of semiconductor refrigeration piece supports the contact and is provided with annular metal radiator, annular metal radiator fixes and withholds the hot face of semiconductor refrigeration piece at the drain pan side of going up, annular metal radiator central space is fixed and is provided with radiator fan, annular metal radiator lateral surface rigidity is provided with the main control board, integrated power source inserts external power source on the main control board, semiconductor refrigeration piece, radiator fan is connected with the main control board electricity respectively, the face-piece covers radiator fan, the main control board back is fixed to the side on the drain pan, be provided with the hole that connects of corresponding power source and the air intake that corresponds radiator fan on the face-piece, its characterized in that: the semiconductor refrigeration piece cold face rigidity is provided with temperature sensor, temperature sensor and main control board electricity are connected, face shell top surface radiator fan air intake middle part is provided with the display unit mounting hole, the fixed display module that is provided with in the middle of the display unit mounting hole, display module and main control board electricity are connected.

2. The mobile phone heat dissipation back clip of claim 1, wherein: the main control panel is further integrated with control keys, and the face shell is provided with key holes corresponding to the control keys.

3. The mobile phone heat dissipation back clip of claim 1, wherein: the display assembly comprises an LED display panel, a display diffusion film and a PC lens, wherein lamp beads of which the shapes are required to be displayed are integrated on the LED display panel, the light transmission part of the display diffusion film corresponds to the positions of the lamp beads on the LED display panel, the display diffusion film is attached to the LED display panel, the PC lens is fixed on the display diffusion film, the LED display panel, the display diffusion film and the PC lens are sequentially overlapped and fixed in a display component mounting hole from bottom to top and face the outer side of a face shell, and the LED display panel is electrically connected with a main control panel.