CN218679070U - Single-chip integrated 800G transmitting-receiving optical chip - Google Patents

Abstract

The utility model discloses a monolithic integrated 800G's receiving and dispatching optical chip, including base plate, optical module shell and installation cover, the base plate is installed to the inner wall of optical module shell, the installation cover is installed to the one end of optical module shell, the optical module shell is used for fixing the position of base plate, first heat absorption board is installed to one side at base plate top, first heating panel is installed to the bottom of first heat absorption board, receiving and dispatching optical chip is installed at the top of first heat absorption board. The utility model discloses a setting of base plate, receiving and dispatching optical chip and optical module shell, receiving and dispatching optical chip's size can satisfy the dimensional requirement of optical module, and through the setting of first absorber plate, first heating panel, receiving and dispatching optical chip, second heating panel and radiating groove, be favorable to dispelling the heat to receiving and dispatching optical chip, prevent that too high temperature can cause the damage to electronic components, through first radiating block and second radiating block, be favorable to improving the radiating efficiency.

Description

Single-chip integrated 800G transmitting-receiving optical chip

Technical Field

The utility model relates to a receive and dispatch optical chip equipment technical field specifically is monolithic integrated's 800G receive and dispatch optical chip.

Background

The transmitting end is coupled to the waveguide through the optical lens by using a high-power external direct-current light source, so that effective numerical aperture matching is realized. The input light is divided into 8 paths of light through the optical waveguide, then 8 paths of high-speed PAM4 modulation signals are loaded to the 8 paths of light through the high-speed 8 paths of PAM4 distributed Mach-Zender modulators to achieve PAM4 modulation of light intensity, the 8 paths of PAM4 light are coupled with the silicon optical chip waveguide through the array optical fiber, and output of multiple paths of emission signals is completed.

The existing transceiving optical chip needs to ensure the heat dissipation effect in the using process so as to prevent the problem that the electronic element is damaged easily due to overheating after long-time use.

In view of the above, it is necessary to develop a monolithically integrated 800G transceiver optical chip, so as to improve the cooling effect of the transceiver optical chip during the use process.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a monolithic integrated 800G's receiving and dispatching optical chip to what put forward in solving above-mentioned background art prevents long-time the use, leads to appearing the technical problem that electronic component device damaged because of overheated easily.

In order to achieve the above object, the present invention provides a monolithic integrated 800G transceiver chip, which comprises a substrate, an optical module housing and an installation sleeve, wherein the substrate is installed on the inner wall of the optical module housing, the installation sleeve is installed at one end of the optical module housing, and the optical module housing is used for fixing the position of the substrate;

a first heat absorption plate is arranged on one side of the top of the substrate, and a first heat dissipation plate is arranged at the bottom of the first heat absorption plate;

the LED lamp is characterized in that a light receiving and emitting chip is installed at the top of the first heat absorbing plate, a second heat emitting plate is installed at the top of the light receiving and emitting chip, and a plurality of heat radiating grooves are formed in the top of the second heat emitting plate.

Preferably, a line interface is arranged at one end of the optical module housing, an MPO interface is installed at one side of the line interface, and the outer wall of the MPO interface is installed on the inner wall of the optical module housing.

Preferably, a plurality of limiting grooves are formed in the inner wall of the mounting sleeve, pressure springs are mounted on the inner wall of each limiting groove, limiting blocks are mounted at the output ends of the pressure springs, and the bottoms of the outer walls of the limiting blocks are mounted on the inner wall of each limiting groove.

Preferably, the other end of the substrate is provided with an electric port, the top of the substrate is provided with a connecting hole, the inner wall of the connecting hole is provided with a fixing bolt, the outer wall of the fixing bolt is arranged on the inner wall of the fixing sleeve, and the top of the fixing sleeve is arranged on the inner top wall of the optical module shell.

Preferably, a group of mounting holes are formed in the bottom of the optical module housing, and inner walls of the mounting holes are mounted on outer walls of the fixing bolts.

Preferably, a plurality of first heat dissipation blocks are installed at the top of the optical module housing, and a plurality of second heat dissipation blocks are installed at the bottom of the optical module housing.

Preferably, the tail end of the outer wall of the optical module shell is provided with a plurality of limiting holes, and the inner walls of the limiting holes are mounted on the outer wall of the limiting block.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a setting of base plate, receiving and dispatching optical chip and optical module shell, the size of receiving and dispatching optical chip can satisfy the dimensional requirement of optical module, and through the setting of first absorber plate, first heating panel, receiving and dispatching optical chip, second heating panel and radiating groove, be favorable to dispelling the heat to receiving and dispatching optical chip, prevent that too high temperature can cause the damage to electronic components, through first radiating block and second radiating block, be favorable to improving the radiating efficiency.

2. The utility model discloses an installation cover can play the protection effect to the one end and the electric port of optical module shell, presses through the one end of aligning the optical module shell with the installation cover, through the setting of restriction groove, compression spring, restriction piece and restriction hole, just can install the one end at the optical module shell with the installation cover, when needing to use the optical module, only need directly drag the installation cover can.

Drawings

FIG. 1 is a perspective view of the overall structure of the present invention;

FIG. 2 is a perspective view of the base plate structure of the present invention;

fig. 3 is a schematic structural diagram of an optical module housing according to the present invention;

fig. 4 is a schematic view of the structure of the mounting sleeve of the present invention;

fig. 5 is a schematic structural diagram of the transceiver chip of the present invention.

In the figure: 1. a substrate; 2. an optical module housing; 3. installing a sleeve; 101. a first heat absorption plate; 102. a first heat dissipation plate; 103. a light receiving and transmitting chip; 104. a second heat dissipation plate; 105. a heat sink; 201. a line interface; 202. MPO interface; 301. a limiting groove; 302. a pressure spring; 303. a limiting block; 401. an electrical port; 402. connecting holes; 403. fixing the bolt; 404. fixing a sleeve; 501. mounting holes; 601. a first heat dissipation block; 602. a second heat dissipation block; 701. the aperture is restricted.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

Referring to fig. 1, in an embodiment of the present invention, a monolithic integrated 800G transceiver chip includes a substrate 1, an optical module housing 2 and a mounting sleeve 3, the substrate 1 is mounted on an inner wall of the optical module housing 2, the mounting sleeve 3 is mounted at one end of the optical module housing 2, and the optical module housing 2 is used for fixing a position of the substrate 1;

referring to fig. 1, 2, 3 and 5, a first heat absorption plate 101 is installed on one side of the top of a substrate 1, a first heat dissipation plate 102 is installed at the bottom of the first heat absorption plate 101, a light receiving and emitting chip 103 is installed at the top of the first heat absorption plate 101, a second heat dissipation plate 104 is installed at the top of the light receiving and emitting chip 103, a plurality of heat dissipation grooves 105 are formed in the top of the second heat dissipation plate 104, an electric port 401 is formed in the other end of the substrate 1, a connection hole 402 is formed in the top of the substrate 1, a fixing bolt 403 is installed on the inner wall of the connection hole 402, the outer wall of the fixing bolt 403 is installed on the inner wall of a fixing sleeve 404, the top of the fixing sleeve 404 is installed on the inner top wall of an optical module shell 2, a plurality of first heat dissipation blocks 601 are installed at the top of the optical module shell 2, a plurality of second heat dissipation blocks 602 are installed at the bottom of the optical module shell 2, and the size of the light receiving and emitting chip 103 can meet the size requirements of the optical module through the arrangement of the substrate 1, the light receiving and emitting chips 103 and emitting chips and optical module shell 2, the heat dissipation grooves 105, the first heat absorption plate 102, the light receiving and emitting chips 103 can be used for preventing the electronic components from being damaged by the first heat absorption plate 601, thereby improving the heat dissipation efficiency of the heat dissipation blocks 601 and emitting chips 601 and the heat dissipation efficiency of the electronic components 601;

referring to fig. 1, 3 and 4, a line interface 201 is formed at one end of an optical module housing 2, an MPO interface 202 is installed at one side of the line interface 201, an outer wall of the MPO interface 202 is installed on an inner wall of the optical module housing 2, a plurality of limiting grooves 301 are formed in an inner wall of an installation sleeve 3, a pressure spring 302 is installed on an inner wall of the limiting groove 301, a limiting block 303 is installed at an output end of the pressure spring 302, a bottom of an outer wall of the limiting block 303 is installed on an inner wall of the limiting groove 301, a set of installation holes 501 are formed in a bottom of the optical module housing 2, an inner wall of the installation holes 501 is installed on an outer wall of a fixing bolt 403, a plurality of limiting holes 701 are formed in a tail end of the outer wall of the optical module housing 2, an inner wall of the limiting holes 701 is installed on an outer wall of the limiting block 303, an end of the optical module housing 2 and an electric port 401 can be protected by the installation sleeve 3, the installation sleeve 3 is pressed to be aligned with one end of the optical module housing 2, and the optical module housing can be installed at one end of the optical module housing 2 by the arrangement of the limiting grooves 301, the limiting blocks 303 and the limiting holes 701.

The working principle is that through the arrangement of the substrate 1, the light receiving and transmitting chip 103 and the optical module shell 2, the size of the light receiving and transmitting chip 103 can meet the size requirement of an optical module, through the arrangement of the first heat absorption plate 101, the first heat dissipation plate 102, the light receiving and transmitting chip 103, the second heat dissipation plate 104 and the heat dissipation groove 105, the heat dissipation of the light receiving and transmitting chip 103 is facilitated, the damage to electronic components caused by overhigh temperature can be prevented, through the arrangement of the first heat dissipation block 601 and the second heat dissipation block 602, the heat dissipation efficiency can be improved, the protection effect can be achieved on one end of the optical module shell 2 and the electric port 401 through the installation sleeve 3, the installation sleeve 3 can be installed at one end of the optical module shell 2 by pressing the installation sleeve 3 aligned to one end of the optical module shell 2, through the arrangement of the limiting groove 301, the pressure spring 302, the limiting block 303 and the limiting hole 701, and when the optical module is needed, only the installation sleeve 3 needs to be directly pulled.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (7)

1. Monolithic integrated 800G's receiving and dispatching optical chip, including base plate (1), optical module shell (2) and installation cover (3), its characterized in that: a substrate (1) is installed on the inner wall of the optical module shell (2), an installation sleeve (3) is installed at one end of the optical module shell (2), and the optical module shell (2) is used for fixing the position of the substrate (1);

a first heat absorption plate (101) is installed on one side of the top of the substrate (1), and a first heat dissipation plate (102) is installed at the bottom of the first heat absorption plate (101);

the top of the first heat absorption plate (101) is provided with a light receiving and emitting chip (103), the top of the light receiving and emitting chip (103) is provided with a second heat dissipation plate (104), and the top of the second heat dissipation plate (104) is provided with a plurality of heat dissipation grooves (105).

2. The monolithically integrated 800G transceiver optical chip of claim 1, wherein: a line interface (201) is arranged at one end of the optical module shell (2), an MPO interface (202) is installed on one side of the line interface (201), and the outer wall of the MPO interface (202) is installed on the inner wall of the optical module shell (2).

3. The monolithically integrated 800G transceiver optical chip of claim 1, wherein: a plurality of limiting groove (301) have been seted up to the inner wall of installation cover (3), and pressure spring (302) are installed to the inner wall in limiting groove (301), and limiting block (303) are installed to the output of pressure spring (302), and install in the inner wall in limiting groove (301) the bottom of limiting block (303) outer wall.

4. The monolithically integrated 800G transceiver optical chip of claim 1, wherein: the other end of the substrate (1) is provided with an electric port (401), the top of the substrate (1) is provided with a connecting hole (402), the inner wall of the connecting hole (402) is provided with a fixing bolt (403), the outer wall of the fixing bolt (403) is installed on the inner wall of the fixing sleeve (404), and the top of the fixing sleeve (404) is installed on the inner top wall of the optical module shell (2).

5. The monolithically integrated 800G transceiver optical chip of claim 1, wherein: a group of mounting holes (501) are formed in the bottom of the optical module shell (2), and the inner walls of the mounting holes (501) are mounted on the outer wall of the fixing bolt (403).

6. The monolithically integrated 800G transceiver optical chip of claim 1, wherein: a plurality of first radiating blocks (601) are installed at the top of the optical module shell (2), and a plurality of second radiating blocks (602) are installed at the bottom of the optical module shell (2).

7. The monolithically integrated 800G transceiver optical chip of claim 1, wherein: the tail end of the outer wall of the optical module shell (2) is provided with a plurality of limiting holes (701), and the inner walls of the limiting holes (701) are installed on the outer wall of the limiting block (303).

Images