CN218677969U

CN218677969U - 40W heat pipe fin heat dissipation laser

Info

Publication number: CN218677969U
Application number: CN202223195329.7U
Authority: CN
Inventors: 吴勇兵
Original assignee: Dongguan Lanyu Laser Co ltd
Current assignee: Dongguan Lanyu Laser Co ltd
Priority date: 2022-12-01
Filing date: 2022-12-01
Publication date: 2023-03-21
Anticipated expiration: 2032-12-01

Abstract

The utility model discloses a 40W heat pipe fin heat dissipation laser instrument, including the laser instrument shell, the inside one end of laser instrument shell is provided with initiative heat dissipation unit, the backplate is installed to one side of laser instrument shell bottom, and the top of backplate is inlayed and is installed heat pipe radiator, the PCB board is installed to heat pipe radiator's bottom, and the top of PCB board installs laser module, install cross optical marking head on the inner wall of laser instrument shell one side, the one end that initiative heat dissipation unit was kept away from to laser module is installed the lens hood body, the one end inside the laser instrument shell is fixed to the lens hood body. The utility model discloses a multiunit heat dissipation heat pipe fin and cooperation heat conduction copper pipe replace traditional aluminum alloy fin, and it is lighter thinner, and heat radiating area is bigger, can make PCB board, laser module obtain better radiating effect, guarantees the luminous efficiency of laser module, to low-power 40W's laser instrument, its structural cost is low, and heat dispersion is strong.

Description

40W heat pipe fin heat dissipation laser

Technical Field

The utility model relates to a laser instrument technical field specifically is a 40W heat pipe fin heat dissipation laser instrument.

Background

The laser is used for drilling, cutting and welding equipment and electronic components together in industry, and mainly comprises a laser working medium, an excitation source and a resonant cavity, aiming at a 40W low-power laser, an air-cooling heat dissipation mode is usually adopted, and an aluminum alloy heat dissipation fin is matched to conduct heat in the laser to the outside of a shell, so that the purpose of reducing the temperature of a laser chip is achieved.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a 40W heat pipe fin heat dissipation laser to it is relatively poor to provide the inside radiating efficiency of laser among the above-mentioned background art, the not strong problem of heat conduction effect.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a 40W heat pipe fin heat dissipation laser instrument, includes the laser instrument shell, the inside one end of laser instrument shell is provided with initiative heat dissipation unit, the backplate is installed to one side of laser instrument shell bottom, just the top of backplate is inlayed and is installed the heat pipe radiator, the PCB board is installed at the top of backplate, just laser module is installed on the top of PCB board, install cross optical marking head on the inner wall of laser instrument shell one side, laser module keeps away from the one end of initiative heat dissipation unit and installs the lens hood body, and the one end inside the laser instrument shell is fixed to the lens hood body, install focusing piece on the inner wall of laser instrument shell one side, install the handle knob on the outer wall of laser instrument shell one side.

Preferably, the active heat dissipation unit is a heat dissipation fan mounted at one end inside the laser housing, and a fan cover plate mounted on the back of the heat dissipation fan.

Preferably, the heat pipe radiator comprises lower radiating fins, a middle radiating plate and upper radiating fins, the lower radiating fins are installed at the top end of the back plate, the middle radiating plate is installed on the upper surfaces of the lower radiating fins, the upper surface of the middle radiating plate is bolted with the PCB, the lower radiating fins are installed at the top of the laser shell, and the lower surfaces of the upper radiating fins are in contact with the upper surface of the laser module.

Preferably, heat conduction copper pipes with equal intervals are installed inside the middle heat dissipation plate.

Preferably, the cross section of the tube body of the heat conduction copper tube is an oblate cross section.

Preferably, the heat conducting copper pipe is of a continuously bent S-shaped structure in the middle heat dissipation plate, and the tail end of the heat conducting copper pipe is led out of the middle heat dissipation plate.

Preferably, the upper surface of the back plate is provided with equidistant heat conducting ribs, and an air duct is formed between every two adjacent heat conducting ribs.

Preferably, a magnet is installed on one side of the bottom end of the light shield body, the light shield body is provided with a clip-shaped light shield support through magnetic attraction of the magnet, and the back of the clip-shaped light shield support is bolted to the outer wall of the back plate.

Preferably, the corner positions of the surface of the square-shaped light shield support are all provided with internal threaded holes, and the square-shaped light shield support is made of a component made of an aluminum alloy material.

Compared with the prior art, the beneficial effects of the utility model are that: this 40W heat pipe fin heat dissipation laser instrument is through being provided with the structure of mutually supporting such as heat pipe radiator and backplate, the PCB board is taken away respectively to the heat pipe radiator, the work heat of laser module, make the heat two-way derivation, initiative radiating element help heat pipe radiator, the PCB board, laser module initiative rapid cooling, the heat pipe radiator passes through multiunit heat radiation fin and cooperates heat conduction copper pipe to replace traditional aluminum alloy fin, it is lighter and thinner, heat radiating area is bigger, can make the PCB board, the laser module obtains better radiating effect, guarantee the luminous efficiency of laser module, to low-power 40W's laser instrument, its structure cost is low, heat dispersion is strong.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

fig. 2 is a schematic diagram of the explosion structure of the present invention;

FIG. 3 is a schematic view of the heat pipe radiator according to the present invention;

in the figure: 1. a laser housing; 2. a heat dissipation fan; 3. a fan cover plate; 4. a heat pipe radiator; 401. a lower heat dissipation fin; 402. a heat dissipation plate is arranged in the middle; 403. a heat conducting copper tube; 404. an upper heat dissipating fin; 5. a cross optical header; 6. a back plate; 601. heat conducting ribs; 7. a PCB board; 8. a focusing sheet; 9. a laser module; 10. a clip-shaped light shield bracket; 11. a lens hood body; 12. a handle knob.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides an embodiment: A40W heat pipe fin heat dissipation laser comprises a laser shell 1, wherein an active heat dissipation unit is arranged at one end inside the laser shell 1;

a back plate 6 is installed on one side of the bottom of the laser shell 1, a heat pipe radiator 4 is installed at the top end of the back plate 6 in an embedded mode, heat conducting ribs 601 with equal intervals are installed on the upper surface of the back plate 6, and an air channel is formed between every two adjacent heat conducting ribs 601;

the top of the back plate 6 is provided with a PCB 7, the top end of the PCB 7 is provided with a laser module 9, the laser module 9 emits laser in the working process of the laser, and the PCB 7 controls the working power of the laser module 9;

the active heat dissipation unit is a heat dissipation fan 2 arranged at one end inside the laser shell 1 and a fan cover plate 3 arranged on the back of the heat dissipation fan 2, and heat dissipation is carried out at the tail end of the laser shell 1 by the heat dissipation fan 2 along with the temperature rise of the PCB 7 and the laser module 9, so that external fresh air is sent to the positions of the PCB 7 and the laser module 9, and the working temperature of the PCB 7 and the laser module 9 is reduced;

the heat pipe radiator 4 comprises lower radiating fins 401, a middle radiating plate 402 and upper radiating fins 404, wherein the lower radiating fins 401 are arranged at the top end of the back plate 6, the middle radiating plate 402 is arranged on the upper surface of the lower radiating fins 401, the upper surface of the middle radiating plate 402 is bolted with the PCB 7, the lower radiating fins 401 are arranged at the top of the laser shell 1, the lower surfaces of the upper radiating fins 404 are mutually contacted with the upper surface of the laser module 9, and the upper radiating fins 404 and the middle radiating plate 402 are used for respectively taking away the working heat of the PCB 7 and the laser module 9, so that the heat is led out in two directions;

equidistant heat conduction copper pipes 403 are arranged in the middle heat dissipation plate 402, the section of the pipe body of each heat conduction copper pipe 403 is an oblate section, each heat conduction copper pipe 403 is in a continuously bent S-shaped structure in the middle heat dissipation plate 402, the tail end of each heat conduction copper pipe 403 is led out of the middle heat dissipation plate 402, and the middle heat dissipation plate 402 in each heat conduction copper pipe 403 plays a role in heat conduction and acceleration, so that heat can be quickly transferred to the lower heat dissipation fins 401;

the blown fresh air quickly cools the lower radiating fins 401, the middle radiating plate 402 and the upper radiating fins 404, so that the PCB 7 and the laser module 9 are maintained at proper working temperature, and when the fresh air is blown into the radiating fan 2, an air channel is formed between the adjacent heat conducting ribs 601 in the back plate 6 again, so that the fresh air is ensured to stably flow and take away heat;

the inner wall of one side of the laser shell 1 is provided with a cross optical mark head 5, one end of the laser module 9, which is far away from the active heat dissipation unit, is provided with a light shield body 11, the light shield body 11 is fixed at one end inside the laser shell 1, the inner wall of one side of the laser shell 1 is provided with a focusing sheet 8, and the outer wall of one side of the laser shell 1 is provided with a handle knob 12;

magnet is installed to one side of lens hood body 11 bottom, lens hood body 11 is installed back shape lens hood support 10 through magnet magnetism, the back of back shape lens hood support 10 and the outer wall bolt of backplate 6, the internal thread hole has all been seted up to the turning position department on back shape lens hood support 10 surface, it makes to return shape lens hood support 10 adoption aluminum alloy's component, set up lens hood body 11 at laser instrument shell 1's front end, magnet is installed to lens hood body 11's bottom, utilize magnet with lens hood body 11, it assembles together to return shape lens hood support 10 magnetism, it passes through the screw fixation with backplate 6 to return shape lens hood support 10, utilize lens hood body 11, it supports PCB board 7 to return shape lens hood support 10, backplate 6, laser module 9, improve the structural strength of laser instrument.

When the laser is used, firstly, the laser module 9 emits laser in the working process of the laser, the working power of the laser module 9 is controlled by the PCB 7, along with the temperature rise of the PCB 7 and the laser module 9, the heat dissipation fan 2 dissipates heat at the tail end of the laser shell 1, so that outside fresh air is sent to the positions of the PCB 7 and the laser module 9, the working temperature of the PCB 7 and the laser module 9 is reduced, meanwhile, the heat pipe radiator 4 conducts heat on the PCB 7 and the laser module 9, the bottom ends of the upper radiating fins 404 and the upper surface of the laser module 9 are in contact with each other in the process, the top end of the middle radiating plate 402 and the bottom end of the PCB 7 are in contact with each other, and the working heat of the PCB 7 and the laser module 9 is respectively taken away by the upper radiating fins 404 and the middle radiating plate 402, so that the heat is conducted out in two directions, the middle heat dissipation plate 402 in the heat conduction copper pipe 403 plays a role in heat conduction and acceleration, so that heat can be quickly transferred to the lower heat dissipation fins 401, the middle heat dissipation plate 402 and the upper heat dissipation fins 404, and then the blown fresh air quickly cools the lower heat dissipation fins 401, the middle heat dissipation plate 402 and the upper heat dissipation fins 404, so that the PCB 7 and the laser module 9 are maintained at proper working temperature, when the heat dissipation fan 2 blows fresh air, an air channel is formed again between adjacent heat conduction ribs 601 in the back plate 6, so as to ensure that the fresh air stably flows and takes away heat, the heat pipe radiator 4 replaces the traditional aluminum alloy heat dissipation plate through a plurality of groups of heat dissipation fins and the heat conduction copper pipe 403, is lighter and thinner, has a larger heat dissipation area, can obtain a better heat dissipation effect on the PCB 7 and the laser module 9, and ensures the light emitting efficacy of the laser module 9, and the middle heat dissipation structure aims at a low-power 40W laser, has low structure cost and strong heat dissipation performance, the high heat dissipation requirement of the PCB board 7 can be satisfied.

Claims

1. A40W heat pipe fin heat dissipation laser is characterized in that: including laser instrument shell (1), the inside one end of laser instrument shell (1) is provided with initiative radiating element, backplate (6) are installed to one side of laser instrument shell (1) bottom, just inlaying of backplate (6) installs heat pipe radiator (4), PCB board (7) are installed at the top of backplate (6), just laser module (9) are installed on the top of PCB board (7), install cross optical marking head (5) on the inner wall of laser instrument shell (1) one side, laser module (9) are kept away from initiative radiating element's one end and are installed lens hood body (11), and lens hood body (11) are fixed in the inside one end of laser instrument shell (1), install focusing piece (8) on the inner wall of laser instrument shell (1) one side, install handle knob (12) on the outer wall of laser instrument shell (1) one side.

2. A 40W heat pipe fin heat sinking laser as claimed in claim 1, wherein: the active heat dissipation unit is a heat dissipation fan (2) arranged at one end inside the laser shell (1) and a fan cover plate (3) arranged on the back of the heat dissipation fan (2).

3. A 40W heat pipe fin heat sinking laser as claimed in claim 1, wherein: the heat pipe radiator (4) comprises lower radiating fins (401), a middle radiating plate (402) and upper radiating fins (404), the lower radiating fins (401) are installed at the top end of the back plate (6), the middle radiating plate (402) is installed on the upper surface of the lower radiating fins (401), the upper surface of the middle radiating plate (402) is bolted with the PCB (7), the lower radiating fins (401) are installed at the top of the laser shell (1), and the lower surfaces of the upper radiating fins (404) are in contact with the upper surface of the laser module (9).

4. A 40W heat pipe fin heat sinking laser as claimed in claim 3, wherein: and heat conducting copper pipes (403) with equal intervals are arranged in the middle heat dissipation plate (402).

5. The 40W heat pipe fin heat sinking laser as claimed in claim 4, wherein: the section of the tube body of the heat conduction copper tube (403) is an oblate section.

6. The 40W heat pipe fin heat dissipation laser of claim 4, wherein: the heat conducting copper pipe (403) is in a continuously bent S-shaped structure in the middle heat dissipation plate (402), and the tail end of the heat conducting copper pipe (403) is led out of the middle heat dissipation plate (402).

7. A 40W heat pipe fin heat sinking laser as claimed in claim 1, wherein: the upper surface mounting of backplate (6) has heat conduction rib (601) of equidistance, is formed with the wind channel between adjacent heat conduction rib (601).

8. A 40W heat pipe fin heat sinking laser as claimed in claim 1, wherein: magnet is installed to one side of lens hood body (11) bottom, lens hood body (11) are installed back shape lens hood support (10) through magnet magnetism, the back of back shape lens hood support (10) and the outer wall bolt of backplate (6).

9. A 40W heat pipe fin heat sinking laser as claimed in claim 8, wherein: the inner threaded holes are formed in the corner positions of the surface of the square-shaped light shield support (10), and the square-shaped light shield support (10) is made of a component made of an aluminum alloy material.