CN218676624U - High-adaptability composite thermistor - Google Patents
High-adaptability composite thermistor Download PDFInfo
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- CN218676624U CN218676624U CN202220711070.8U CN202220711070U CN218676624U CN 218676624 U CN218676624 U CN 218676624U CN 202220711070 U CN202220711070 U CN 202220711070U CN 218676624 U CN218676624 U CN 218676624U
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- thermistor
- sensitive element
- inner cavity
- partition plate
- temperature
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The utility model discloses a compound thermistor of high adaptability in thermistor technical field, include: mounting a shell; thermistor, thermistor includes packaging shell, first compound thermistor and the compound thermistor of second, first compound thermistor is installed the inner chamber of packaging shell, first compound thermistor is positive temperature coefficient thermistor, the compound thermistor of second is installed the inner chamber of packaging shell, first compound thermistor is in the compound thermistor's of second upper end, the compound thermistor of second is negative temperature coefficient thermistor, the utility model discloses an encapsulate positive temperature coefficient thermistor and negative temperature coefficient thermistor simultaneously in packaging shell, only need when using with circuit connection to the corresponding pin as required can, can adapt to different circuits, improved thermistor's adaptability.
Description
Technical Field
The utility model relates to a thermistor technical field specifically is a compound thermistor of high adaptability.
Background
A thermistor is a sensor resistor whose resistance value changes with changes in temperature. The thermistor is classified into a positive temperature coefficient thermistor and a negative temperature coefficient thermistor according to the temperature coefficient. The resistance value of the positive temperature coefficient thermistor increases with an increase in temperature, and the resistance value of the negative temperature coefficient thermistor decreases with an increase in temperature.
When the existing thermistor is used, a positive temperature coefficient thermistor or a negative temperature coefficient thermistor needs to be selected according to the needs of a circuit, the two thermistors need to be prepared completely in the circuit connection process, and when the thermistors are connected to the circuit according to the needs, the thermistors need to be identified during installation, so that the installation errors of the thermistors are prevented, and the lower adaptability of the thermistors is caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a compound thermistor of high adaptability to current thermistor that proposes in solving above-mentioned background art need select positive temperature coefficient thermistor or negative temperature coefficient thermistor according to the needs of circuit when using, need be prepared these two kinds of thermistors multiple times at the circuit connection process, be connected to the circuit with thermistor as required on, need discern it when the installation, prevent thermistor installation mistake, thereby caused the lower problem of thermistor's adaptability.
In order to achieve the above object, the utility model provides a following technical scheme: a high-adaptability composite thermistor comprising:
mounting a shell;
the thermistor is arranged in the inner cavity of the installation shell and comprises a packaging shell, a first composite thermistor and a second composite thermistor, the packaging shell is arranged in the inner cavity of the installation shell, the first composite thermistor is arranged in the inner cavity of the packaging shell, the first composite thermistor is a positive temperature coefficient thermistor, the second composite thermistor is arranged in the inner cavity of the packaging shell, the first composite thermistor is arranged at the upper end of the second composite thermistor, and the second composite thermistor is a negative temperature coefficient thermistor.
Preferably, the mounting case includes:
installing a shell body;
the first partition plate is arranged in the inner cavity of the mounting shell body;
the second partition plate is arranged in the inner cavity of the mounting shell body, and the second partition plate is arranged on the left side of the first partition plate.
Preferably, the package includes:
the packaging shell is arranged in the inner cavity of the mounting shell body, is arranged between the first partition plate and the second partition plate, and is in contact with the first partition plate;
and the third partition plate is arranged in the inner cavity of the packaging shell.
Preferably, the first composite thermistor includes:
the first thermosensitive element is arranged in the inner cavity of the packaging shell and is arranged at the upper end of the third partition plate;
the first pressure sensitive element is arranged in the inner cavity of the packaging shell, the first pressure sensitive element is arranged at the upper end of the third partition plate, the first pressure sensitive element is arranged on the left side of the first thermosensitive element, and the first pressure sensitive element is electrically connected with the first thermosensitive element.
Preferably, the second composite thermistor includes:
the second thermosensitive element is arranged in the inner cavity of the packaging shell and is arranged at the lower end of the third partition plate;
the second pressure sensitive element is arranged in the inner cavity of the packaging shell, the second pressure sensitive element is arranged at the lower end of the third partition board, the second pressure sensitive element is arranged on the left side of the second thermosensitive element, and the second pressure sensitive element is electrically connected with the second thermosensitive element.
Preferably, the temperature measuring mechanism is installed in the inner cavity of the installation shell, the temperature measuring mechanism is located in a space formed by the first partition plate and the right side wall of the inner cavity of the installation shell body, the temperature measuring mechanism comprises a first temperature sensor and a second temperature sensor, the first temperature sensor is connected with the insulating thermocouple on one side, far away from the first pressure sensitive element, of the first thermosensitive element, and the second temperature sensor is connected with the insulating thermocouple on one side, far away from the second pressure sensitive element, of the second thermosensitive element.
Preferably, a control mechanism is installed in the inner cavity of the installation shell, the control mechanism is arranged in a space formed by the second partition plate and the left side wall of the inner cavity of the installation shell body, part of components on the control mechanism penetrate through the second partition plate and face one side of the first partition plate, the control mechanism comprises a microcontroller, a power-off mechanism and a cooling mechanism, the microcontroller is connected to the first temperature sensor and the second temperature sensor and used for executing receiving temperature data and outputting instructions according to the temperature data, and the power-off mechanism is used for executing power-off of the first thermosensitive element or the second thermosensitive element according to the instructions and connecting the power supply of the cooling mechanism.
Compared with the prior art, the beneficial effects of the utility model are that: according to the high-adaptability composite thermistor, the positive temperature coefficient thermistor and the negative temperature coefficient thermistor are packaged in the packaging shell simultaneously, and when the thermistor is used, a circuit is connected to corresponding pins according to needs, so that the thermistor can adapt to different circuits, and the adaptability of the thermistor is improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the structure of the mounting case of the present invention;
FIG. 3 is a schematic view of the thermistor structure of the present invention;
FIG. 4 is a schematic block diagram of the temperature measuring mechanism of the present invention;
FIG. 5 is a schematic block diagram of the control mechanism of the present invention;
fig. 6 is a schematic block diagram of the system of the present invention.
In the figure: the temperature-sensing device comprises a 100 mounting shell, a 110 mounting shell body, a 120 first partition plate, a 130 second partition plate, a 200 thermistor, a 210 packaging shell, a 211 packaging shell, a 212 third partition plate, a 220 first composite thermistor, a 221 first thermistor, a 222 first pressure-sensitive element, a 230 second composite thermistor, a 231 second thermistor, a 232 second pressure-sensitive element, a 300 temperature-measuring mechanism, a 310 first temperature sensor, a 320 second temperature sensor, a 400 control mechanism, a 410 microcontroller, a 420 power-off mechanism and a 430 temperature-reducing mechanism.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
The utility model provides a high-adaptability composite thermistor, which can automatically select a thermistor with a positive temperature coefficient or a negative temperature coefficient according to the requirement and adapt to different circuits, please refer to fig. 1, wherein the main body part of the thermistor comprises an installation shell 100 and a thermistor 200;
referring to fig. 1-2, the mounting housing (100) includes:
a mounting case body 110;
the first partition board 120 is disposed in the inner cavity of the mounting casing body 110, the first partition board 120 and the mounting casing body 110 are integrally formed, and the first partition board 120 is made of an insulating material;
the second partition 130 is disposed in the inner cavity of the mounting case body 110, the second partition 130 is disposed at the left side of the first partition 120, the second partition 130 and the mounting case body 110 are integrally processed, and the second partition 130 is made of an insulating material;
referring to fig. 1 to 3, the thermistor 200 is mounted in the inner cavity of the mounting case 100, and the thermistor 200 includes:
the package 210 is mounted in the inner cavity of the mounting housing 100, and the package 210 includes:
the package body 211 is installed in the inner cavity of the mounting case body 110, the package body 211 is between the first partition 120 and the second partition 130, and the package body 211 is in contact with the first partition 120;
the third partition 212 is arranged in the inner cavity of the package housing 211, the third partition 212 and the package housing 211 are integrally processed, and the third partition 212 is made of an insulating material;
the first composite thermistor 220 is mounted in the inner cavity of the package 210, the first composite thermistor 220 is a positive temperature coefficient thermistor, and the first composite thermistor 220 includes:
the first thermosensitive element 221 is installed in the inner cavity of the package housing 211, and the first thermosensitive element 221 is at the upper end of the third partition 212;
the first pressure sensitive element 222 is arranged in the inner cavity of the packaging shell 211, the first pressure sensitive element 222 is arranged at the upper end of the third partition 212, the first pressure sensitive element 222 is arranged at the left side of the first heat sensitive element 221, and the first pressure sensitive element 222 is electrically connected with the first heat sensitive element 221;
the second composite thermistor 230 is mounted in the inner cavity of the package 210, the first composite thermistor 220 is on the upper end of the second composite thermistor 230, the second composite thermistor 230 is a negative temperature coefficient thermistor, and the second composite thermistor 230 includes:
the second thermosensitive element 231 is arranged in the inner cavity of the packaging shell 211, the second thermosensitive element 231 is arranged at the lower end of the third partition 212, the first thermosensitive element 221 and the second thermosensitive element 231 are sealed by the third partition 212, the temperature on the first thermosensitive element 221 and the second thermosensitive element 231 can be effectively prevented from being influenced mutually, the first thermosensitive element 221 and the second thermosensitive element 231 are packaged by the packaging shell 211, as the first thermosensitive element 221 and the second thermosensitive element 231 are respectively a positive temperature coefficient thermosensitive element and a negative temperature coefficient thermosensitive element, the first thermosensitive element 221 or the second thermosensitive element 231 is only needed to be selected according to requirements when in use, and a thermistor or a negative temperature coefficient thermistor is not needed to be prepared when in circuit connection;
the second pressure sensitive element 232 is installed in the inner cavity of the package housing 211, the second pressure sensitive element 232 is located at the lower end of the third partition 212, the second pressure sensitive element 232 is located at the left side of the second thermal sensitive element 231, and the second pressure sensitive element 232 is electrically connected with the second thermal sensitive element 231.
In order to prevent the thermistor from being damaged due to the over-high temperature, please refer to fig. 1 again, the main body further includes a temperature measuring mechanism 300 and a control mechanism 400;
referring to fig. 1-4 and fig. 6, the temperature measuring mechanism 300 is installed in the inner cavity of the mounting case 100, the temperature measuring mechanism 300 is located in a space formed by the first partition 120 and the right side wall of the inner cavity of the mounting case body 110, the temperature measuring mechanism 300 includes a first temperature sensor 310 and a second temperature sensor 320, the first temperature sensor 310 is connected to an insulating thermocouple on a side of the first thermosensitive element 221 away from the first pressure sensitive element 222, and the second temperature sensor 320 is connected to an insulating thermocouple on a side of the second thermosensitive element 231 away from the second pressure sensitive element 232;
referring to fig. 1-6, a control mechanism 400 is installed in an inner cavity of the mounting case 100, the control mechanism 400 is disposed in a space formed by the second partition 130 and a left side wall of the inner cavity of the mounting case body 110, a part of components of the control mechanism 400 penetrate through the second partition 130 and face one side of the first partition 120, the control mechanism 400 includes a microcontroller 410, a power-off mechanism 420 and a temperature-reducing mechanism 430, the microcontroller 410 is connected to the first temperature sensor 310 and the second temperature sensor 320 and is configured to receive temperature data and output a command according to the temperature data, the power-off mechanism 420, the first thermal element 221, the second thermal element 231 and the temperature-reducing mechanism 430 are configured to perform power-off operation on the first thermal element 221 or the second thermal element 231 according to the command and power-on the temperature-reducing mechanism 430, the power-off mechanism 420 is a relay, the temperature-reducing mechanism 430 is a cooling plate, the temperature-reducing mechanism 430 is installed on a side wall of the second partition 130, a cooling portion of the temperature-reducing mechanism 430 penetrates through the second partition 130 and faces one side of the first partition 120, such that a cooling portion of the cooling mechanism 430 corresponds to the thermistor 200, the temperature-reducing mechanism 430 is in a power-off state, when the temperature-monitoring mechanism 430 is in a specific state, the case, the temperature-monitoring mechanism detects that the temperature of the first thermal element 221 and the second temperature-monitoring mechanism 221 passes through the temperature-monitoring mechanism 410, can effectively prevent the damage of the thermistor caused by overhigh temperature and prolong the service life.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the description of such combinations is not exhaustive in the present specification only for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (7)
1. A high-adaptability composite thermistor is characterized in that: the method comprises the following steps:
a mounting case (100);
the thermistor comprises a thermistor (200), wherein the thermistor (200) is arranged in an inner cavity of the installation shell (100), the thermistor (200) comprises a packaging shell (210), a first composite thermistor (220) and a second composite thermistor (230), the packaging shell (210) is arranged in the inner cavity of the installation shell (100), the first composite thermistor (220) is arranged in the inner cavity of the packaging shell (210), the first composite thermistor (220) is a positive temperature coefficient thermistor, the second composite thermistor (230) is arranged in the inner cavity of the packaging shell (210), the first composite thermistor (220) is arranged at the upper end of the second composite thermistor (230), and the second composite thermistor (230) is a negative temperature coefficient thermistor.
2. The high-adaptability composite thermistor according to claim 1, wherein: the mounting case (100) includes:
a mounting case body (110);
a first partition plate (120), wherein the first partition plate (120) is arranged in the inner cavity of the mounting shell body (110);
a second partition plate (130), the second partition plate (130) being disposed in the inner cavity of the mounting case body (110), the second partition plate (130) being on the left side of the first partition plate (120).
3. The high-adaptability composite thermistor according to claim 2, wherein: the package housing (210) comprises:
an encapsulation housing (211), wherein the encapsulation housing (211) is installed in the inner cavity of the installation housing body (110), the encapsulation housing (211) is arranged between the first partition plate (120) and the second partition plate (130), and the encapsulation housing (211) is in contact with the first partition plate (120);
a third partition (212), wherein the third partition (212) is arranged in the inner cavity of the packaging shell (211).
4. A highly adaptable composite thermistor according to claim 3, characterized in that: the first composite thermistor (220) includes:
a first heat-sensitive element (221), wherein the first heat-sensitive element (221) is installed in the inner cavity of the packaging shell (211), and the first heat-sensitive element (221) is arranged at the upper end of the third partition plate (212);
a first pressure sensitive element (222), wherein the first pressure sensitive element (222) is installed in the inner cavity of the packaging shell (211), the first pressure sensitive element (222) is arranged at the upper end of the third partition board (212), the first pressure sensitive element (222) is arranged at the left side of the first heat sensitive element (221), and the first pressure sensitive element (222) is electrically connected with the first heat sensitive element (221).
5. The high-adaptability compound thermistor according to claim 4, characterized in that: the second composite thermistor (230) includes:
a second heat-sensitive element (231), wherein the second heat-sensitive element (231) is installed in the inner cavity of the packaging shell (211), and the second heat-sensitive element (231) is arranged at the lower end of the third partition plate (212);
a second pressure sensitive element (232), wherein the second pressure sensitive element (232) is installed in the inner cavity of the packaging shell (211), the second pressure sensitive element (232) is arranged at the lower end of the third partition (212), the second pressure sensitive element (232) is arranged at the left side of the second heat sensitive element (231), and the second pressure sensitive element (232) is electrically connected with the second heat sensitive element (231).
6. The high-adaptability composite thermistor according to claim 5, wherein: the temperature measuring mechanism (300) is installed in the inner cavity of the installation shell (100), the temperature measuring mechanism (300) is arranged in a space formed by the first partition plate (120) and the right side wall of the inner cavity of the installation shell body (110), the temperature measuring mechanism (300) comprises a first temperature sensor (310) and a second temperature sensor (320), the first temperature sensor (310) is connected with one side of the first thermosensitive element (221) far away from the first pressure-sensitive element (222) in an insulating thermocouple mode, and the second temperature sensor (320) is connected with one side of the second thermosensitive element (231) far away from the second pressure-sensitive element (232) in an insulating thermocouple mode.
7. The high-adaptability composite thermistor according to claim 6, wherein: the inner cavity of the mounting shell (100) is provided with a control mechanism (400), the control mechanism (400) is arranged in a space formed by the second partition plate (130) and the left side wall of the inner cavity of the mounting shell body (110), part of components on the control mechanism (400) penetrate through the second partition plate (130) and face one side of the first partition plate (120), the control mechanism (400) comprises a microcontroller (410), a power-off mechanism (420) and a temperature-reducing mechanism (430), the microcontroller (410) is connected to the first temperature sensor (310) and the second temperature sensor (320) and used for receiving temperature data and outputting instructions according to the temperature data, and the power-off mechanism (420) and the first thermal element (221), the second thermal element (231) and the temperature-reducing mechanism (430) are used for powering off the first thermal element (221) or the second thermal element (231) and powering on the temperature-reducing mechanism (430) according to the instructions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220711070.8U CN218676624U (en) | 2022-03-29 | 2022-03-29 | High-adaptability composite thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220711070.8U CN218676624U (en) | 2022-03-29 | 2022-03-29 | High-adaptability composite thermistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218676624U true CN218676624U (en) | 2023-03-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220711070.8U Active CN218676624U (en) | 2022-03-29 | 2022-03-29 | High-adaptability composite thermistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218676624U (en) |
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2022
- 2022-03-29 CN CN202220711070.8U patent/CN218676624U/en active Active
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