CN217006129U - High-sensitivity temperature sensor - Google Patents
High-sensitivity temperature sensor Download PDFInfo
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- CN217006129U CN217006129U CN202220781961.0U CN202220781961U CN217006129U CN 217006129 U CN217006129 U CN 217006129U CN 202220781961 U CN202220781961 U CN 202220781961U CN 217006129 U CN217006129 U CN 217006129U
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Abstract
The application relates to a high sensitivity temperature sensor, include: the temperature sensing device comprises a shell, a temperature sensing head and a heat conducting rubber, wherein the shell is provided with a plurality of grooves which are formed in the positions of the side walls of the temperature sensing head, and the heat conducting rubber is coated in each groove; the thermistor is packaged in the temperature sensing head through the epoxy resin layer and is in contact with the inner wall of the temperature sensing head, and the thermistor is provided with a first pin and a second pin; and the connector comprises a first connecting piece and a second connecting piece, one end of the first connecting piece is connected with the first pin, one end of the second connecting piece is connected with the second pin, and the other end of the first connecting piece and the other end of the second connecting piece are both used for connecting the I/O end of the external MCU processor. Because the heat-conducting glue in the groove can rapidly transfer heat to the temperature sensing head, and the thermistor is in contact with the inner wall of the temperature sensing head, the first-time resistance value of the thermistor can be changed, an external MCU processor can read the first-time resistance value, and the change rate of the temperature sensor for sensing the ambient temperature is improved.
Description
Technical Field
The utility model relates to the technical field of sensors, in particular to a high-sensitivity temperature sensor.
Background
A temperature sensor (temperature transducer) refers to a sensor that senses temperature and converts it into a usable output signal. The temperature sensor is the core part of the temperature measuring instrument and has various varieties. The measurement method can be divided into a contact type and a non-contact type, and the measurement method can be divided into a thermal resistor and a thermocouple according to the characteristics of sensor materials and electronic elements.
In the related art, the temperature sensor comprises a metal shell, a thermistor and a connector, wherein the thermistor is encapsulated in the metal shell by epoxy resin, two pins of the thermistor are respectively connected with the connector, and the metal shell is provided with a temperature sensing end. When the ambient temperature changes, the temperature sensing end transmits heat to the thermistor through the epoxy resin layer, so that the resistance of the thermistor changes, and the external MCU processor reads the current resistance of the thermistor through the connector to realize temperature measurement. However, the temperature sensing end needs to transfer heat to the thermistor through the epoxy resin layer, so that the temperature sensor with the structure has insufficient sensitivity, and cannot quickly complete temperature sensing.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects in the prior art and provide a high-sensitivity temperature sensor which can quickly sense the change of the environmental temperature.
The purpose of the utility model is realized by the following technical scheme:
a high sensitivity temperature sensor comprising:
the temperature sensing device comprises a shell, a temperature sensing head and a heat conducting adhesive, wherein the shell is provided with a temperature sensing head, a plurality of grooves are formed in the position of the side wall of the temperature sensing head, and the heat conducting adhesive is coated in each groove;
the thermistor is packaged in the temperature sensing head through an epoxy resin layer, is in contact with the inner wall of the temperature sensing head and is provided with a first pin and a second pin;
the connector comprises a first connecting piece and a second connecting piece, one end of the first connecting piece is connected with the first pin, one end of the second connecting piece is connected with the second pin, and the other end of the first connecting piece and the other end of the second connecting piece are both used for being connected with an I/O end of an external MCU processor.
Preferably, the method further comprises the following steps: a heat insulation pad disposed between the thermistor and the epoxy layer.
Preferably, the MCU processing circuit further comprises a spare connecting piece, one end of the spare connecting piece is connected with the first pin, and the other end of the spare connecting piece is used for connecting with an I/O end of an external MCU processor.
Preferably, the other end of the first connecting piece, the other end of the second connecting piece and the other end of the spare connecting piece are all provided with thread locking heads.
Preferably, the housing is provided with a mounting head at a position of the side wall, and the mounting head is provided with an external thread.
Preferably, the shell is provided with a hexagonal nut at the position of the side wall.
Preferably, the housing, the mounting head and the hexagon nut are of an integrally formed structure.
Preferably, the temperature sensing device further comprises a copper powder layer, and the copper powder layer is filled between the thermistor and the inner wall of the temperature sensing head.
Compared with the prior art, the utility model has the following advantages and beneficial effects:
the technical scheme of this application includes: the temperature sensing device comprises a shell, a temperature sensing head and a heat conducting rubber, wherein the shell is provided with a plurality of grooves, and the grooves are formed in the positions of the side walls of the temperature sensing head; the thermistor is packaged in the temperature sensing head through the epoxy resin layer and is in contact with the inner wall of the temperature sensing head, and the thermistor is provided with a first pin and a second pin; and the connector comprises a first connecting piece and a second connecting piece, one end of the first connecting piece is connected with the first pin, one end of the second connecting piece is connected with the second pin, and the other end of the first connecting piece and the other end of the second connecting piece are both used for connecting the I/O end of the external MCU processor.
Through above-mentioned technical scheme, when ambient temperature changes, because the heat-conducting glue in the recess can be with heat fast transfer to the temperature sensing head on, and thermistor contacts with the inner wall of temperature sensing head, and thermistor can receive the heat the very first time, makes the resistance change, lets outside MCU treater read, improves temperature sensor response ambient temperature's rate of change greatly.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
FIG. 1 is a schematic diagram illustrating an assembly structure of a high-sensitivity temperature sensor in an embodiment of the present application;
FIG. 2 is a schematic sectional view of the high-sensitivity temperature sensor in the embodiment of the present application;
fig. 3 is a schematic circuit diagram of the high-sensitivity temperature sensor in the embodiment of the present application.
Reference numerals: a high-sensitivity temperature sensor 10; a housing 100; a thermistor 200; a connector 300; a temperature-sensitive head 110; a recess 111; a thermally conductive paste 111 a; an epoxy resin layer 200 a; a first pin 210; a second pin 220; a first connector 310; a second connecting member 320; a heat insulating pad 400; a spare connector 330; a mounting head 120; a hexagonal nut 130; a copper powder layer 500.
Detailed Description
To facilitate an understanding of the utility model, the utility model will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a single embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the correlation technique, because most temperature sensor need rely on the temperature sensing end to pass through epoxy layer with the heat and transmit to the thermistor in, accomplish the temperature-sensing for temperature sensor can't respond to ambient temperature's change fast, greatly reduced temperature sensor's sensitivity.
Therefore, to the above technical problem, the present application provides a high-sensitivity temperature sensor capable of rapidly sensing a change in an ambient temperature. For better understanding of the technical solutions of the present application, the technical solutions of the present application are described in detail below with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of an assembly structure of a high-sensitivity temperature sensor in the embodiment of the present application;
FIG. 2 is a sectional view of the high-sensitivity temperature sensor in the embodiment of the present application; fig. 3 is a schematic circuit diagram of the high-sensitivity temperature sensor in the embodiment of the present application.
Referring to fig. 1 and 2, a high-sensitivity temperature sensor 10 includes: a housing 100, a thermistor 200, and a connector 300. The housing 100 plays a role of encapsulation and protection, and all the structures of the high-sensitivity temperature sensor 10 are provided on the housing 100. The resistance value of the thermistor 200 changes correspondingly when the ambient temperature changes, and the external MCU processor reads the changed resistance value of the thermistor 200 in real time through the connector 300, and converts the resistance value into the ambient temperature according to a preset algorithm, thereby completing the temperature measurement.
Referring to fig. 1 and 2, the housing 100 has a temperature sensing head 110, the temperature sensing head 110 has a plurality of grooves 111 on a side wall, and each groove 111 is coated with a heat conductive adhesive 111 a. It should be noted that the temperature sensing head 110 is a temperature sensing structure, and a plurality of grooves 111 are formed thereon, and a heat conducting glue 111a is coated in each groove 111, and when the ambient temperature changes, the heat conducting glue 111a quickly transfers the heat to the thermistor 200.
Referring to fig. 2, the thermistor 200 is encapsulated in the thermal head 110 through an epoxy layer 200a, and the thermistor 200 contacts with an inner wall of the thermal head 110, and the thermistor 200 has a first lead 210 and a second lead 220. It should be noted that the thermistor 200 is a thermistor, and when heat is transferred into the thermistor 200, the resistance of the thermistor changes due to the change of the heat.
Referring to fig. 2, the connector 300 includes a first connector 310 and a second connector 320, one end of the first connector 310 is connected to the first pin 210, one end of the second connector 320 is connected to the second pin 220, and the other end of the first connector 320 and the other end of the second connector 320 are both used for connecting an I/O terminal of an external MCU (not shown). It should be noted that, when the resistance value of the thermistor 200 changes, the I/O terminal (i.e., the resistance value detection terminal) of the external MCU processor reads the current resistance value of the thermistor 200 through the first connection member 310 and the second connection member 320, and converts the read resistance value into a temperature according to a preset algorithm to complete temperature measurement.
The technical scheme of this embodiment, when ambient temperature changes, because on heat-conducting glue 111a in the recess 111 can be with heat fast transfer to temperature sensing head 110, and thermistor 200 contacts with the inner wall of temperature sensing head 110, and thermistor 200 can receive the heat the very first time, makes the resistance change, lets outside MCU treater read, improves temperature sensor response ambient temperature's rate of change greatly.
Referring to fig. 2, further, in some embodiments, the high-sensitivity temperature sensor 10 further includes: and a heat insulation pad 400, wherein the heat insulation pad 400 is arranged between the thermistor and the epoxy resin layer. It should be noted that the heat insulation pad 400 plays a role of heat insulation, and prevents heat transferred to the thermistor 200 from transferring into the epoxy resin layer 200a, so as to prevent excessive dissipation of heat of the thermistor 200, which may result in that an external MCU processor may not accurately calculate the current resistance value of the thermistor 200 corresponding to the current ambient temperature.
Referring to fig. 2 and 3, further, in some embodiments, the high-sensitivity temperature sensor 10 further includes a spare connector 330, one end of the spare connector 330 is connected to the first pin 210, and the other end of the spare connector 330 is used for connecting an I/O terminal of the external MCU processor. It should be noted that, in the actual use process, there may be a case where the first connection element 320 fails, and once the above problem occurs, the external MCU processor cannot read the resistance value of the thermistor 200, therefore, a spare connection element 330 is additionally provided, and in the case where the first connection element 320 fails and cannot be used, the I/O terminal of the external MCU processor may also be connected to the thermistor 200 through the spare connection element 330 (in fig. 3, the a terminal represents the first connection element 310, the B terminal represents the first connection element 320, and the C terminal represents the spare connection element 330), so as to complete the work of reading the resistance value.
Referring to fig. 2, further, in some embodiments, the other end of the first connector 310, the other end of the second connector 320 and the other end of the spare connector 330 are provided with a screw locking head 300 a. It should be noted that, an internal thread is provided in the thread locking head 300a, and correspondingly, an external thread head is provided at the I/O end processed by the external MCU, and the external thread head is in threaded connection with the thread locking head 300a, which can greatly improve the connection stability and prevent the I/O end processed by the external MCU from being disconnected from the thermistor 200.
Referring to fig. 1, further, in some embodiments, the housing 100 is provided with a mounting head 120 at a side wall position, and the mounting head 120 is provided with an external thread. It should be noted that, when the temperature sensor needs to be installed, the installation head 120 is screwed in by machining an internal thread at a position corresponding to the device or equipment to be installed.
Referring to fig. 1, further, in some embodiments, the housing 100 is provided with a hexagon nut 130 at a side wall position. It should be noted that the hex nut 130 is provided to allow an installer to rotate the mounting head 120 without an installation tool.
Referring to fig. 1, further, in some embodiments, the housing 100, the mounting head 110 and the hexagon nut 130 are formed as an integral structure. It should be noted that, the design of the integrated structure can greatly improve the overall mechanical strength of the temperature sensor, enhance the structural stability and prolong the service life of the temperature sensor.
Referring to fig. 1, further, in some embodiments, the high-sensitivity temperature sensor 10 further includes a copper powder layer 500, and the copper powder layer 500 is filled between the thermistor 200 and the inner wall of the thermal head 110. Since the copper powder layer 500 is made of a copper material and copper has good thermal conductivity, the copper powder layer 500 is filled between the thermistor 200 and the inner wall of the thermal head 110, thereby further improving the heat transfer efficiency, that is, the sensitivity of the temperature sensor.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. A high sensitivity temperature sensor, comprising:
the temperature sensing device comprises a shell, a temperature sensing head and a heat conducting rubber, wherein the shell is provided with a plurality of grooves which are formed in the side wall of the temperature sensing head, and the heat conducting rubber is coated in each groove;
the thermistor is packaged in the temperature sensing head through an epoxy resin layer, is in contact with the inner wall of the temperature sensing head and is provided with a first pin and a second pin;
the connector comprises a first connecting piece and a second connecting piece, one end of the first connecting piece is connected with the first pin, one end of the second connecting piece is connected with the second pin, and the other end of the first connecting piece and the other end of the second connecting piece are both used for being connected with an I/O end of an external MCU processor.
2. The high sensitivity temperature sensor according to claim 1, further comprising: and the heat insulation pad is arranged between the thermistor and the epoxy resin layer.
3. The high-sensitivity temperature sensor according to claim 1, further comprising a spare connector, wherein one end of the spare connector is connected to the first pin, and the other end of the spare connector is used for connecting an I/O terminal of an external MCU processor.
4. The high-sensitivity temperature sensor according to claim 3, wherein the other end of the first connecting member, the other end of the second connecting member and the other end of the backup connecting member are provided with screw locking heads.
5. The high sensitivity temperature sensor according to claim 1, wherein the housing is provided with a mounting head at a side wall position, the mounting head being provided with an external thread.
6. The high sensitivity temperature sensor according to claim 5, wherein the housing is provided with a hexagonal nut at a position of a side wall.
7. The high sensitivity temperature sensor of claim 6, wherein the housing, the mounting head and the hex nut are of an integrally formed construction.
8. The temperature sensor according to any one of claims 1 to 7, further comprising a copper powder layer filled between the thermistor and the inner wall of the temperature sensing head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220781961.0U CN217006129U (en) | 2022-04-02 | 2022-04-02 | High-sensitivity temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220781961.0U CN217006129U (en) | 2022-04-02 | 2022-04-02 | High-sensitivity temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217006129U true CN217006129U (en) | 2022-07-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220781961.0U Active CN217006129U (en) | 2022-04-02 | 2022-04-02 | High-sensitivity temperature sensor |
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| Country | Link |
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| CN (1) | CN217006129U (en) |
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- 2022-04-02 CN CN202220781961.0U patent/CN217006129U/en active Active
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