CN215598562U - Protective bin of thermal infrared imager - Google Patents
Protective bin of thermal infrared imager Download PDFInfo
- Publication number
- CN215598562U CN215598562U CN202121960796.7U CN202121960796U CN215598562U CN 215598562 U CN215598562 U CN 215598562U CN 202121960796 U CN202121960796 U CN 202121960796U CN 215598562 U CN215598562 U CN 215598562U
- Authority
- CN
- China
- Prior art keywords
- temperature
- shell
- signal processor
- thermal infrared
- infrared imager
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000001681 protective effect Effects 0.000 title description 4
- 238000010438 heat treatment Methods 0.000 claims abstract description 26
- 230000005540 biological transmission Effects 0.000 claims abstract description 14
- 238000005057 refrigeration Methods 0.000 claims description 12
- 239000011241 protective layer Substances 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000001931 thermography Methods 0.000 claims description 3
- 238000009529 body temperature measurement Methods 0.000 abstract description 6
- 230000009471 action Effects 0.000 abstract description 3
- 239000000428 dust Substances 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003331 infrared imaging Methods 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Landscapes
- Radiation Pyrometers (AREA)
Abstract
The utility model provides a thermal infrared imager protection bin which comprises a temperature sensor, a heating element, a refrigerating element, an information transmission element and a signal processor, wherein the temperature sensor is arranged in a shell and used for detecting the temperature of an inner cavity of the shell; the temperature sensor, the heating element and the refrigerating element are electrically connected with the signal processor. The combined action of the heating element and the refrigerating element is controlled by the signal processor, so that the thermal infrared imager is ensured to work at a proper temperature, the thermal infrared imager is ensured to have higher temperature measurement precision and longer service life, and the thermal infrared imager can adapt to a high-temperature (T >35 ℃) or low-temperature (T < -15 ℃) environment.
Description
Technical Field
The utility model relates to the technical field of thermal imagers, in particular to a thermal infrared imager protection bin.
Background
With the rapid development of infrared imaging and temperature measurement technologies, the application of real-time monitoring of the temperature of production equipment by using an infrared thermal imager in the metallurgical industry is more and more popular. However, the metallurgical industry has a relatively harsh workshop environment, and the industrial production is often required to be carried out in a high-temperature (T >35 ℃) or low-temperature (T < -15 ℃) environment.
Under normal conditions, the optimal use temperature of the thermal infrared imager is-15 ℃ to 35 ℃, and the thermal infrared imager can normally work within the temperature range. When the temperature is lower than-15 ℃, the temperature measurement accuracy of the thermal infrared imager is influenced to a certain extent, and the measured object temperature is generally low, which is not beneficial to industrial production. When the temperature is higher than 35 ℃, the service life of electronic components in the thermal infrared imager can be greatly shortened, the damage rate of products can be obviously increased, and the production cost of enterprises is further increased. However, the conventional thermal infrared imagers do not have the function of automatically controlling the self temperature, so that the thermal infrared imagers are difficult to work in high temperature (T >35 ℃) or low temperature (T < -15 ℃) environments, and therefore, a protection cabin capable of automatically adjusting the working temperature of the thermal infrared imagers is urgently needed to be designed.
SUMMERY OF THE UTILITY MODEL
In view of the above, the utility model provides a protection bin for a thermal infrared imager, which is used for solving the technical problem that the thermal infrared imager is difficult to normally work in a high-temperature (T >35 ℃) or low-temperature (T < -15 ℃) environment.
The technical scheme of the utility model is realized as follows:
the utility model provides a thermal infrared imager protection bin which comprises a shell (10) and a thermal infrared imager (20), wherein the thermal infrared imager (20) is arranged in the shell (10), a lens (21) of the thermal infrared imager (20) is arranged at an opening of the shell (10), and the thermal infrared imager protection bin also comprises a temperature sensor (30), a heating element (40), a refrigerating element (50), an information transmission element (60) and a signal processor (70);
the temperature sensor (30) is arranged in the shell (10) and is used for detecting the temperature of the inner cavity of the shell (10);
the heating element (40) is arranged in the shell (10) and is used for increasing the temperature of the inner cavity of the shell (10);
the refrigeration element (50) is communicated with the outside of the shell (10) and the inner cavity of the shell (10) and is used for reducing the temperature of the inner cavity of the shell (10);
the information transmission element (60) is electrically connected with the signal processor (70) and is used for acquiring the temperature information of the inner cavity of the shell (10) and transmitting the temperature information of the inner cavity of the shell (10) to the signal processor (70);
the temperature sensor (30), the heating element (40) and the refrigerating element (50) are all electrically connected with the signal processor (70).
On the basis of the above technical solution, preferably, the refrigeration element (50) is a fan, the housing (10) is provided with a fan mounting opening, and the fan is mounted in the fan mounting opening.
On the basis of the technical scheme, preferably, a filter screen (90) is installed at the fan installation opening, and the filter screen (90) covers the end face, far away from the inner cavity of the shell (10), of the fan.
On the basis of the technical scheme, preferably, the signal processor (70) is a single chip microcomputer, a clamping seat is arranged on the inner wall of the shell (10), and the single chip microcomputer is clamped on the clamping seat.
On the basis of the above technical solution, preferably, the temperature sensor (30) includes a first temperature sensor (31) and a second temperature sensor (32);
the first temperature sensor (31) and the second temperature sensor (32) are respectively connected to two opposite edges of the single chip microcomputer.
In addition to the above technical means, preferably, the information transmission element (60) includes an infrared thermopile sensor (61), a thermistor (63), and a heat collector (62);
the infrared thermopile sensor (61) is arranged in the shell (10) and electrically connected with the signal processor (70) and is used for converting temperature change in the shell (10) into an electric signal and transmitting the electric signal to the signal processor (70);
the heat collector (62) is connected to the inner wall of the shell (10) through a bottom plate (80) and is close to the thermal infrared imager (20), and the heat collector (62) is electrically connected with the signal processor (70) and used for receiving infrared radiant energy and transmitting the infrared radiant energy to the signal processor (70) after A/D conversion;
the thermistor (63) is connected to the bottom plate (80), electrically connected with the signal processor (70), and used for detecting the temperature of the inner cavity of the shell (10) and feeding back the temperature value to the signal processor (70).
On the basis of the above technical solution, preferably, the outer surface of the shell (10) is covered with a protective layer (100), and the protective layer (100) is rubber.
On the basis of the technical scheme, preferably, an outlet of the shell (10) is connected with a protection eaves (110), and the protection eaves (110) surround the edge of a lens (21) of the thermal infrared imager (20).
Compared with the prior art, the thermal infrared imager protection bin has the following beneficial effects:
(1) the temperature sensor is used for detecting the temperature of the inner cavity of the shell, and when the temperature sensor detects that the temperature of the inner cavity of the shell is lower than-15 ℃, the signal processor controls the heating element to heat so that the temperature of the inner cavity of the shell is increased; when the temperature sensor detects that the temperature of the inner cavity of the shell is higher than 35 ℃, the controller controls the refrigeration element to work, so that the temperature of the inner cavity of the shell is reduced; the information transfer element can detect the temperature of the inner cavity of the shell, when the temperature is proper (the proper temperature is-15-35 ℃), the information transfer element can transfer a signal with proper temperature to the signal processor, the signal processor controls the heating element and the refrigerating element to stop working, and the thermal infrared imager runs normally. The combined action of the heating element and the refrigerating element is controlled by the signal processor, so that the thermal infrared imager is ensured to work at a proper temperature, the thermal infrared imager is ensured to have higher temperature measurement precision and longer service life, and the thermal infrared imager can adapt to a high-temperature (T >35 ℃) or low-temperature (T < -15 ℃) environment.
(2) The refrigeration component is a fan, the shell is provided with a fan mounting opening, and the fan is mounted in the fan mounting opening. The fan is low in cost, simple in structure, easy to install and detach and convenient to maintain in the later period.
(3) The filter screen is installed to the fan installing port, and the filter screen covers the terminal surface of keeping away from the casing inner chamber at the fan, sets up the filter screen in installing port department, can effectively reduce the dust and get into in the casing.
(4) The signal processor is a single chip microcomputer, a clamping seat is arranged on the inner wall of the shell, and the single chip microcomputer is clamped on the clamping seat. The single chip microcomputer is small in size, simple in structure and high in reliability.
(5) The temperature sensor comprises a first temperature sensor and a second temperature sensor, and the first temperature sensor and the second temperature sensor are respectively connected to two opposite edges of the single chip microcomputer. The two temperature sensors can detect the temperature of the inner cavity of the shell, the average temperature of the two temperature sensors can be taken as the temperature of the inner cavity of the shell, and the two temperature sensors are arranged to improve the accuracy of temperature detection.
(6) The protective layer is made of rubber and can buffer the shell to prevent the lens from being broken when the shell falls on the ground.
(7) The opening part of the shell is connected with a protection brim which surrounds the edge of the lens of the thermal infrared imager, and the protection brim can effectively reduce dust accumulation on the outer surface of the lens.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural view of a protection cabin of a thermal infrared imager according to an embodiment of the utility model;
fig. 2 is a schematic structural view of a protection cabin of a thermal infrared imager according to another embodiment of the utility model.
Description of reference numerals:
10-a housing;
20-infrared thermal imaging system; 21-a lens;
30-a temperature sensor; 31-a first temperature sensor; 32-a second temperature sensor;
40-a heating element; 50-a refrigeration element;
60-an information transfer element; 61-infrared thermopile sensors; 62-a heat collector; 63-a thermistor;
70-a signal processor; 80-a bottom plate; 90-a filter screen; 100-a protective layer; 110-protective eaves.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
It should be noted that all the directional indicators in the embodiments of the present invention, such as upper, lower, left, right, front and rear … …, are only used to explain the relative position relationship between the components, movement, etc. in a specific posture, for example, as shown in the drawings, if the specific posture is changed, the directional indicator is changed accordingly.
The description relating to "first", "second", etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
The utility model provides a thermal infrared imager protection bin, which comprises a shell 10, a thermal infrared imager 20, a temperature sensor 30, a heating element 40, a refrigerating element 50, an information transmission element 60 and a signal processor 70, as shown in fig. 1.
The housing 10, as shown in fig. 1, plays a role of protection, and can protect various components disposed in the inner cavity of the housing 10, two openings are disposed on the housing 10, and one opening is matched with the lens 21 of the thermal infrared imager 20 and is used for accommodating the lens 21 of the thermal infrared imager 20; the other opening is used for mounting the cooling element 50. As shown in fig. 2, the outer surface of the casing 10 is covered with a protective layer 100, and the protective layer 100 is made of rubber, which can provide a buffer effect for the casing 10 to prevent the lens 21 from being broken when the casing 10 falls on the ground. The opening of the housing 10 close to the lens 21 is connected with a protection brim 110, the protection brim 110 surrounds the edge of the lens 21 of the thermal infrared imager 20, and the protection brim 110 can effectively reduce dust accumulation on the outer surface of the lens 21.
The thermal infrared imager 20 is used for monitoring the temperature of an object, as shown in fig. 1, the thermal infrared imager 20 is installed in the housing 10, the installation method is usually that the thermal infrared imager 20 is clamped on the inner wall of the protective housing 10, the lens 21 of the thermal infrared imager 20 is installed at an opening of the protective housing 10, and the lens 21 faces outwards.
As shown in fig. 1, the temperature sensor 30 is disposed in the housing 10 and electrically connected to the signal processor 70, and is used for detecting the temperature of the inner cavity of the housing 10 and transmitting the temperature information to the signal processor 70. The temperature sensors 30 include a first temperature sensor 31 and a second temperature sensor 32, the two temperature sensors 30 can be disposed on the upper and lower inner walls of the housing 10, and the average value of the temperatures measured by the two temperature sensors 30 is taken as the temperature of the inner cavity of the housing 10, so as to improve the accuracy of temperature measurement.
As shown in fig. 1, the refrigeration element 50 is connected to the outside of the housing 10 and the inner cavity of the housing 10, the refrigeration element 50 is electrically connected to the signal processor 70, and when the temperature of the inner cavity of the housing 10 is high, the signal processor 70 can control the refrigeration element 50 to operate, so that the temperature of the inner cavity of the housing 10 is reduced. The cooling element 50 may be a fan, and specifically, the other opening of the housing 10 is a fan mounting opening, and the fan is mounted in the fan mounting opening. The fan is low in cost, simple in structure, easy to install and detach and convenient to maintain in the later period. A filter screen 90 can be installed at the fan installation opening, and the filter screen 90 covers the end face of the fan far away from the inner cavity of the shell 10. The filter screen 90 is arranged at the mounting opening, so that dust entering the shell 10 can be effectively reduced.
The information transmission element 60, as shown in fig. 1, is installed in the housing 10 and electrically connected to the signal processor 70, and is used for acquiring the temperature information of the inner cavity of the housing 10 and transmitting the temperature information of the inner cavity of the housing 10 to the signal processor 70. The information transfer element 60 includes an infrared thermopile sensor 61, a thermistor 63, and a heat collector 62. The infrared thermopile sensor 61 is disposed in the housing 10 and beside the heating element 40, and is used for converting the temperature change in the housing 10 into an electrical signal and transmitting the electrical signal to the signal processor 70, and the signal processor 70 obtains the information of the temperature change in the inner cavity of the housing 10 through the infrared thermopile sensor 61. The heat collector 62 is connected to the inner wall of the housing 10 through a bottom plate 80 and is close to the thermal infrared imager 20, the inner wall of the housing 10 is provided with a clamping groove, the clamping groove is not shown in the figure, the bottom of the bottom plate 80 is provided with a clamping protrusion, the clamping protrusion is not shown in the figure, and the bottom plate 80 is clamped on the inner wall of the housing 10 through the matching of the clamping protrusion and the clamping groove. The heat collector 62 is electrically connected to the signal processor 70, and is configured to receive the infrared radiation energy, and transmit the infrared radiation energy to the signal processor 70 after a/D conversion. The thermistor 63 is connected to the bottom plate 80 and electrically connected to the signal processor 70, the thermistor 63 is close to the heat collector 62, specifically, the thermistor 63 and the heat collector 62 can be respectively connected to the upper and lower ends of the bottom plate 80, and the thermistor 63 is used for detecting the temperature value after the temperature change of the inner cavity of the housing 10 and feeding back the temperature value to the signal processor 70. When the information transmission element 60 detects that the temperature of the inner cavity of the housing 10 is the proper temperature, the proper temperature range is-15 ℃ to 35 ℃, the signal processor 70 controls the refrigeration element 50 and the heating element 40 to stop working, and the thermal infrared imager 20 can be in the proper temperature environment and normally work.
A signal processor 70, as shown in fig. 1, is installed in the housing 10 for controlling the operation of various components in the housing 10. The signal processor 70 can select a single chip microcomputer which has the advantages of small size, simple structure, high reliability and strong control capability. The inner wall of casing 10 is equipped with the cassette that is not shown in the cassette figure, and the singlechip joint is on the cassette, because vibrations phenomenon can often appear in the workshop, and the cassette also can select elasticity cassette. The first temperature sensor 31 and the second temperature sensor 32 may also be respectively connected to two opposite edges of the single chip microcomputer to detect the temperature value of the inner cavity of the thermal infrared imager 20. To the high-intensity magnetic field environment, can set up the shield cover in casing 10, the shield cover can be the metal mesh enclosure, and is concrete, and the shield cover laminates in the internal surface of casing 10, and the shield cover bottom is connected with outside bar magnet, and the earth connection then can be connected to the bar magnet, and the earth connection then is connected with ground to guarantee that the monolithic can work under the high-intensity magnetic field environment.
The principle of the thermal infrared imager protection bin is as follows:
the first temperature sensor 31 and the second temperature sensor 32 detect the temperature of the inner cavity of the shell 10 and transmit the respective measured temperature values to the signal processor 70, and the signal processor 70 takes the average value of the temperatures measured by the two temperature sensors 30 as the temperature value of the inner cavity of the shell 10; when the two temperature sensors 30 detect that the temperature of the inner cavity of the shell 10 is lower than-15 ℃, the signal processor 70 controls the heating element 40 to work, and the refrigerating element 50 stops, so that the temperature of the inner cavity of the shell 10 rises; the information transmission element 60 detects the temperature change value and the real-time temperature value of the inner cavity of the shell 10 and transmits the changed real-time temperature value to the signal processor 70, when the information transmission element 60 detects that the temperature of the inner cavity of the shell 10 is increased to be within-15-35 ℃, the information transmission element 60 transmits a signal with proper temperature to the signal processor 70, the proper temperature range is-15-35 ℃, and the signal processor 70 controls the heating element 40 to stop working; when the two temperature sensors 30 detect that the temperature of the inner cavity of the shell 10 is higher than 35 ℃, the signal processor 70 controls the refrigeration element 50 to work, and the heating element 40 stops, so that the temperature of the inner cavity of the shell 10 is reduced; when the information transmission element 60 detects that the changed temperature value is within-15-35 ℃, the information transmission element 60 transmits a signal of proper temperature to the signal processor 70, and the signal processor 70 controls the refrigeration element 50 to stop working; when the two temperature sensors 30 detect that the temperature of the inner cavity of the shell 10 is within-15 ℃ to 35 ℃, the heating element 40 and the refrigerating element 50 do not work.
The combined action of the heating element 40 and the cooling element 50 is controlled by the signal processor 70 to ensure that the thermal infrared imager 20 always works at a proper temperature, so that the thermal infrared imager 20 can adapt to a high-temperature or low-temperature environment, wherein the high temperature is T >35 ℃, and the low temperature is T < -15 ℃.
In this embodiment, the range of the suitable temperature may also be narrowed to reserve the time for the thermal infrared imager 20 to normally operate, for example, the suitable temperature is set to-5 ℃ to 25 ℃, when the temperature is-10 ℃, the thermal infrared imager 20 may still normally operate, and the heating element 40 starts to operate, so that the temperature is raised to-5 ℃ to 25 ℃; the proper reduction of the range of the proper temperature can ensure that the thermal infrared imager 20 is always in the normal working condition, so as to improve the temperature measurement precision and prolong the service life of the thermal infrared imager 20.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (8)
1. A protection cabin of a thermal infrared imager comprises a shell (10) and the thermal infrared imager (20), wherein the thermal infrared imager (20) is arranged in the shell (10), and a lens (21) of the thermal infrared imager (20) is arranged at an opening of the shell (10), and is characterized by further comprising a temperature sensor (30), a heating element (40), a refrigerating element (50), an information transmission element (60) and a signal processor (70);
the temperature sensor (30) is arranged in the shell (10) and is used for detecting the temperature of the inner cavity of the shell (10);
the heating element (40) is arranged in the shell (10) and is used for increasing the temperature of the inner cavity of the shell (10);
the refrigeration element (50) is communicated with the outside of the shell (10) and the inner cavity of the shell (10) and is used for reducing the temperature of the inner cavity of the shell (10);
the information transmission element (60) is electrically connected with the signal processor (70) and is used for acquiring the temperature information of the inner cavity of the shell (10) and transmitting the temperature information of the inner cavity of the shell (10) to the signal processor (70);
the temperature sensor (30), the heating element (40) and the refrigerating element (50) are all electrically connected with the signal processor (70).
2. The thermographic protection magazine according to claim 1, wherein the cooling element (50) is a fan, the housing (10) being provided with a fan mounting opening in which the fan is mounted.
3. The protection bin of claim 2, wherein the fan mounting port is provided with a filter screen (90), and the filter screen (90) covers an end surface of the fan far away from the inner cavity of the housing (10).
4. The thermal infrared imager protection bin of claim 3, wherein the signal processor (70) is a single chip microcomputer, a clamping seat is arranged on the inner wall of the shell (10), and the single chip microcomputer is clamped on the clamping seat.
5. The thermography protected cabin according to claim 4, characterized in that the temperature sensor (30) comprises a first temperature sensor (31) and a second temperature sensor (32);
the first temperature sensor (31) and the second temperature sensor (32) are respectively connected to two opposite edges of the single chip microcomputer.
6. The thermography protected cabin according to claim 5, wherein the information transfer element (60) comprises an infrared thermopile sensor (61), a thermistor (63) and a heat collector (62);
the infrared thermopile sensor (61) is arranged in the shell (10) and electrically connected with the signal processor (70) and is used for converting temperature change in the shell (10) into an electric signal and transmitting the electric signal to the signal processor (70);
the heat collector (62) is connected to the inner wall of the shell (10) through a bottom plate (80) and is close to the thermal infrared imager (20), and the heat collector (62) is electrically connected with the signal processor (70) and used for receiving infrared radiant energy and transmitting the infrared radiant energy to the signal processor (70) after A/D conversion;
the thermistor (63) is connected to the bottom plate (80), electrically connected with the signal processor (70), and used for detecting the temperature of the inner cavity of the shell (10) and feeding back the temperature value to the signal processor (70).
7. The thermal infrared imager protection cartridge according to claim 1, characterized in that the outer surface of the housing (10) is covered with a protective layer (100), the protective layer (100) being rubber.
8. The protection bin of claim 1, wherein a protection eave (110) is connected to an outlet of the housing (10), and the protection eave (110) surrounds an edge of a lens (21) of the thermal infrared imager (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121960796.7U CN215598562U (en) | 2021-08-20 | 2021-08-20 | Protective bin of thermal infrared imager |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121960796.7U CN215598562U (en) | 2021-08-20 | 2021-08-20 | Protective bin of thermal infrared imager |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215598562U true CN215598562U (en) | 2022-01-21 |
Family
ID=79882065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121960796.7U Expired - Fee Related CN215598562U (en) | 2021-08-20 | 2021-08-20 | Protective bin of thermal infrared imager |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215598562U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114609158A (en) * | 2022-05-12 | 2022-06-10 | 山东通广电子有限公司 | Substation equipment target and defect intelligent detection equipment based on deep learning |
-
2021
- 2021-08-20 CN CN202121960796.7U patent/CN215598562U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114609158A (en) * | 2022-05-12 | 2022-06-10 | 山东通广电子有限公司 | Substation equipment target and defect intelligent detection equipment based on deep learning |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN215598562U (en) | Protective bin of thermal infrared imager | |
| WO2016154820A1 (en) | Charge control method and apparatus, and charge cable | |
| CN109084409B (en) | Detection system for preventing over-temperature rise of air conditioner device, detection control method and air conditioner | |
| CN210039012U (en) | Security alarm device | |
| CN110649335A (en) | Thermal runaway prevention control system and method for lithium ion battery | |
| WO2002054029A1 (en) | Temperature monitor for electro-mechanical part | |
| CN217884233U (en) | Intelligent power distribution management terminal | |
| CN212516041U (en) | Fire monitoring equipment with positioning function | |
| CN216528031U (en) | Temperature control device based on solid state disk | |
| CN211429142U (en) | Wireless temperature sensor and assembly thereof, motor and air conditioner | |
| CN111122928B (en) | Separately excited power supply device for electric whole set of starting test and supply method thereof | |
| CN212113941U (en) | Unmanned aerial vehicle electricity core temperature acquisition device | |
| CN104677514A (en) | Wireless temperature measurement system for connection terminals of motor | |
| CN214277225U (en) | Coal selection mine electromechanical equipment maintenance management system | |
| CN215573234U (en) | Explosion-proof ultrasonic liquid level meter | |
| CN213364082U (en) | Thermocouple verification furnace with water cooling loop | |
| CN210400633U (en) | NTC thermistor temperature sensor | |
| CN218600626U (en) | Flow sensor of temperature resistant structure | |
| CN110729561B (en) | Room temperature collector and composite antenna device thereof | |
| CN113099688B (en) | Fan and electronic equipment | |
| CN210515580U (en) | NB-IoT intelligent temperature sensing alarm | |
| CN211373848U (en) | Join in marriage wireless temperature collector of electrical room | |
| CN220341309U (en) | Design structure of air-cooled battery PACK for energy storage | |
| CN212721841U (en) | Thermometer device, temperature display and temperature measuring system | |
| CN218039409U (en) | Battery and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220121 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |