CN218675655U - Heat dissipation device for light modulator and projection equipment - Google Patents

Abstract

The utility model provides a heat abstractor and projection equipment for light modulator. The heat dissipation device comprises a heat dissipation assembly and a heat conduction assembly. The heat dissipation assembly has an assembly surface. The heat conduction assembly is assembled on the heat dissipation assembly and comprises a heat conduction convex part, and the heat conduction convex part is arranged on the assembling surface. The heat conductive projection has a heat conductive surface for contacting the light modulator. The heat conduction assembly is further provided with a heat circulation channel, the heat circulation channel comprises an evaporation part and a condensation part which are communicated with each other, and the evaporation part is arranged on the heat conduction convex part. The condensation part is connected with the heat dissipation component in a heat conduction way. So, the heat conduction surface of the heat accessible heat conduction convex part that the radiating surface of light modulator gived off passes to the heat conduction convex part to quick effectual conduction gets into the thermal cycle passageway to evaporation portion, dispels the heat to radiator unit with realizing high efficiency heat conduction, thereby can increase substantially the radiating efficiency of light modulator, avoids the temperature of light modulator to surpass the service temperature scope, is favorable to prolonging the life of light modulator.

Description

Heat dissipation device for light modulator and projection equipment

Technical Field

The utility model relates to a projection technology field particularly, relates to a heat abstractor and projection equipment for light modulator.

Background

In the related art, a projection apparatus generally implements image formation by using a light modulator, for example, the light modulator may be a Digital Micro Device (DMD) chip, the light modulator may generate a large amount of heat during use, and the projection apparatus is generally provided with a heat dissipation Device to dissipate heat of the light modulator. However, the conventional heat dissipation device is generally provided with a heat sink connected to the optical modulator to dissipate heat of the optical modulator. However, when the projection brightness is increased, the light modulator cannot dissipate heat in time due to the limitation of the heat conductivity of the heat sink, so that the temperature of the light modulator exceeds the use temperature range.

SUMMERY OF THE UTILITY MODEL

An embodiment of the present invention provides a heat dissipation device for an optical modulator to improve at least one of the above problems.

The embodiment of the utility model realizes the above purpose through the following technical scheme.

In a first aspect, embodiments of the present invention provide a heat dissipation device for an optical modulator. The heat dissipation device comprises a heat dissipation assembly and a heat conduction assembly. The heat dissipation assembly has an assembly surface. The heat conduction assembly is assembled on the heat dissipation assembly and comprises a heat conduction convex part, and the heat conduction convex part is arranged on the assembling surface. The heat conductive projection has a heat conductive surface for contacting the light modulator. The heat conduction assembly is further provided with a heat circulation channel, the heat circulation channel comprises an evaporation part and a condensation part which are communicated with each other, and the evaporation part is arranged on the heat conduction convex part. The condensation part is connected with the heat dissipation component in a heat conduction way.

In some embodiments, the heat-conducting protrusion includes first and second opposite ends, the heat-conducting surface being located at the first end, and the second end being connected to the heat dissipation assembly. The heat conduction assembly further comprises a heat pipe, the heat pipe is provided with a heat circulation channel, one end of the heat pipe is provided with an evaporation part and is in heat conduction connection with the first end, and the heat pipe is provided with a heat conduction surface used for being in contact with the light modulator. The other end of the heat pipe is provided with a condensing part.

In some embodiments, the heat pipe includes a first heat pipe and a second heat pipe, the first heat pipe and the second heat pipe being located on opposite sides of the thermally conductive ledge. The heat circulation channel is arranged on the first heat pipe and the second heat pipe. The first heat pipe comprises a first pipe end and a second pipe end, the first pipe end is connected to the first end in a heat conduction mode, and the second pipe end is provided with a condensation portion. The second heat pipe includes a third pipe end and a fourth pipe end. The third pipe end is connected to the first end in a heat conduction mode, the fourth pipe end is provided with a condensation portion, the evaporation portion is arranged on the first pipe end and the third pipe end, the heat conduction surface of the heat pipe is located on the first pipe end and the third pipe end, and the distance between the second pipe end and the fourth pipe end is larger than the sum of the lengths of the first pipe end and the third pipe end.

In some embodiments, the heat conducting protrusion is provided with a through hole, one end of the first heat pipe penetrates through the through hole, and one end of the second heat pipe penetrates through the through hole.

In some embodiments, the heat conducting assembly further comprises a heat conducting column provided with a heat circulation channel. The heat conduction convex part is provided with a through groove which penetrates through the heat conduction surface. The heat conduction post comprises a first end part and a second end part which are opposite, the first end part is provided with an evaporation part and is inserted in the through groove, and the second end part is provided with a condensation part and is embedded in the heat dissipation assembly.

In some embodiments, the end surface of the first end portion is coplanar with the thermally conductive surface.

In some embodiments, the heat conducting assembly further includes a heat conducting substrate, the heat conducting substrate is connected to the assembling surface in a heat conducting manner, the heat conducting protruding portion is convexly arranged on one side of the heat conducting substrate, which is away from the heat dissipation assembly, the heat circulating channel is arranged on the heat conducting substrate and the heat conducting protruding portion, the heat conducting protruding portion is provided with the evaporation portion, and the heat conducting substrate is provided with the condensation portion.

In a second aspect, embodiments of the present invention further provide a projection apparatus. The projection apparatus includes a light modulator and the heat sink for the light modulator of the above embodiment. The light modulator has a heat dissipating surface. The heat conducting surface is in thermal contact with the heat dissipating surface.

In some embodiments, the heat-conducting protrusion includes a first end and a second end opposite to the first end, the heat-conducting surface is located at the first end, and the second end is connected to the heat dissipation assembly. The heat conduction assembly further comprises a heat pipe, and the heat pipe is provided with a heat circulation channel. One end of the heat pipe is provided with an evaporation part and is connected with the first end in a heat conduction way, and the heat pipe is provided with a heat conduction surface which is used for being in contact with the heat dissipation surface. The other end of the heat pipe is provided with a condensation part, and the heat conduction surface of the heat pipe is in thermal contact connection with the heat dissipation surface.

In some embodiments, the projection apparatus further includes an optical engine housing having a receiving cavity, and a circuit board, a line board and a pressing plate received in the receiving cavity. The circuit board, the wire arranging board and the pressing plate are sequentially arranged between the optical modulator and the heat conducting convex parts, the circuit board and the wire arranging board are pressed on the optical modulator by the pressing plate, and the circuit board, the wire arranging board and the pressing plate are all provided with avoiding holes. The area of the avoiding hole is larger than the sum of the areas of the heat conducting surface and the heat conducting surface of the heat pipe.

The utility model discloses embodiment provides a heat abstractor and projection equipment for light modulator, heat abstractor include radiator unit and assemble in radiator unit's heat-conducting component, and heat-conducting component's heat conduction convex part sets up in radiator unit's assembly face, and the heat conduction convex part has the heat conduction face that is used for with the contact of radiating surface, and heat-conducting component still is equipped with thermal cycle passageway, and thermal cycle passageway's evaporation portion sets up in the heat conduction convex part, and condensation portion heat-conduction is connected in radiator unit. So, heat conduction convex part is located to thermal cycle passageway evaporation plant, and be connected between heat conduction convex part and radiator unit, the heat conduction surface of the heat accessible heat conduction convex part that the radiating surface of light modulator gived off passes to the heat conduction convex part, and quick effectual conduction to evaporation plant, get into thermal cycle passageway, dispel the heat to radiator unit with realizing high efficiency heat conduction, thereby can increase substantially the radiating efficiency of light modulator, the temperature of avoiding the light modulator surpasss the service temperature scope, be favorable to prolonging the life of light modulator.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 shows a schematic structural diagram of an optical modulator provided in an embodiment of the present invention.

Fig. 2 shows a schematic structural diagram of a heat dissipation device for an optical modulator according to an embodiment of the present invention.

Fig. 3 is a schematic structural diagram illustrating a heat dissipation device for an optical modulator using light provided by another embodiment of the present invention.

Fig. 4 is a partially exploded view of the heat sink for the light modulator of fig. 3.

Fig. 5 is a schematic structural diagram illustrating a heat dissipation device for an optical modulator according to another embodiment of the present invention.

Fig. 6 shows a schematic view of the structure of the heat conductive assembly of fig. 5.

Fig. 7 shows a schematic structural diagram of a projection apparatus provided by an embodiment of the present invention.

Fig. 8 is an exploded view of the projection device of fig. 7.

Detailed Description

In order to make the technical field person understand the scheme of the present invention better, the following will combine the drawings in the embodiments of the present invention to clearly and completely describe the technical scheme in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of some, and not necessarily all, embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by the skilled person without creative work belong to the protection scope of the present invention.

The technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

As shown in fig. 1, the light modulator 700, also referred to as a Digital micro mirror Device (DMD) chip, is to be used in a projection apparatus. The DMD chip is capable of digitally modulating light and includes a rectangular array assembly of multiple micromirror mirrors. The DMD chip can realize the reflection of light by controlling and adjusting the mirror surface of the micro mirror. The back of the main light modulator 700 has a heat sink surface 701. The DMD chip has a front surface for reflecting light and a back surface 701 as a heat dissipation surface.

The utility model provides a heat abstractor 10 for light modulator, heat abstractor 10 can be applied to and dispel the heat to light modulator 700 in projection equipment 20. In the following embodiments, the heat dissipation device 10 is mainly used for heat dissipation of the optical modulator 700 in the projection apparatus as an example, and other apparatuses equipped with the optical modulator 700 may be referred to for implementation when the heat dissipation device 10 needs to be equipped.

Referring to fig. 1 and fig. 2, in the present embodiment, the heat dissipation device 10 includes a heat dissipation assembly 100 and a heat conduction assembly 200, and the heat conduction assembly 200 is assembled to the heat dissipation assembly 100. The heat conducting member 200 is connected between the light modulator 700 and the heat dissipating member 100, and heat dissipated from the heat dissipating surface of the light modulator 700 can be conducted to the heat dissipating member 100 through the heat conducting member 200 to dissipate the heat.

The heat dissipation assembly 100 includes a mounting frame 110 and heat dissipation fins 120. The number of the heat radiating fins 120 may be plural. The plurality of heat dissipation fins 120 are fixed on the mounting frame 110, for example, the plurality of heat dissipation fins 120 are sequentially arranged at intervals along the length direction of the mounting frame 110, so as to improve the heat dissipation effect of the heat dissipation assembly 100. The mounting frame 110 is provided with a mounting surface 111, and the mounting surface 111 may be, for example, one end surface of the mounting frame 110 in the longitudinal direction, which is also a surface opposite to the light modulator 700. The heat conducting element 200 assembled on the heat dissipating element 100 protrudes from the mounting surface 111, so that the heat conducting element 200 can be in contact with the heat dissipating surface 701, and the heat emitted from the light modulator 700 can be conducted to the heat dissipating element 100 for heat dissipation.

In addition, the heat dissipation assembly 100 may further include a fan (not shown) that drives an airflow to the heat dissipation fins 120, thereby increasing heat dissipation efficiency. The heat dissipation assembly 100 may also be a tube type heat sink, for example, the heat dissipation assembly 100 may include a plurality of heat dissipation tubes, and the heat dissipation tubes may be provided with a cooling medium therein, so as to facilitate the heat dissipation assembly 100 to absorb heat and dissipate heat.

The heat conducting assembly 200 may include a heat conducting protrusion 210 and a heat circulation channel 201. The heat-conducting convex part 210 can be in contact with the heat-dissipating surface 701, and the heat-circulating channel 201 is connected to the heat-conducting convex part 210 and the heat-dissipating component 100, so that the heat-circulating channel 201 and the heat-conducting convex part 210 can conduct heat of the light modulator 700 to a heat-dissipating device for heat dissipation, the heat-dissipating efficiency of the light modulator 700 can be greatly improved, the temperature of the light modulator 700 is prevented from exceeding the use temperature range, and the service life of the light modulator 700 is prolonged.

The heat conductive protrusion 210 is disposed on the mounting surface 111, for example, the heat conductive protrusion 210 may be connected to the mounting surface 111 and extend away from the heat sink assembly 100, so as to facilitate contact with the heat dissipating surface 701 of the light modulator 700. The heat-conductive protrusion 210 includes a first end 212 and a second end 213 opposite to each other, the first end 212 is disposed away from the mounting surface 111, and the second end 213 is disposed close to the mounting surface 111. The heat conductive protrusion 210 has a heat conductive surface 211 for contacting the heat dissipation surface 701. The heat conducting surface 211 is disposed on an end surface of the first end 212, and the second end 213 is connected to the heat dissipating assembly 100. When the heat-conducting surface 211 of the heat dissipation device 10 contacts the heat dissipation surface 701, heat can be conducted from the first end 212 to the second end 213 to the heat dissipation assembly 100 for heat dissipation.

The heat circulation passage 201 includes an evaporation portion 202 and a condensation portion 203 communicating with each other. The evaporation portion 202 is disposed on the heat conductive protrusion 210, for example, the evaporation portion 202 may contact the heat conductive protrusion 210, may be inserted into the heat conductive protrusion 210, or may be a cavity formed in the heat conductive protrusion 210. The condensation portion 203 is thermally conductively connected to the heat dissipation assembly 100, for example, the condensation portion 203 may abut against the heat dissipation assembly 100 or be embedded in the heat dissipation fins 120. Thus, the heat dissipated from the heat dissipating surface 701 of the optical modulator 700 can be transferred to the heat conducting convex portion 210 through the heat conducting surface 211 of the heat conducting convex portion 210, and then is rapidly and effectively transferred to the evaporation portion 202 to enter the thermal circulation channel 201, so that the heat dissipation from the heat dissipating component 100 can be realized with high efficiency, the heat dissipating efficiency of the optical modulator 700 can be greatly improved, the temperature of the optical modulator 700 is avoided exceeding the use temperature range, and the service life of the optical modulator 700 is prolonged.

In one embodiment, as shown in fig. 2, the heat conducting assembly 200 further includes a heat pipe 220, the heat pipe 220 is provided with a heat circulating channel 201, one end of the heat pipe 220 is provided with an evaporation portion 202 and is connected to the first end 212 in a heat conducting manner, and has a heat pipe heat conducting surface 223 for contacting with a heat dissipating surface 701, and the other end of the heat pipe 220 is provided with a condensation portion 203. Specifically, the heat circulation channel 201 may be a solid pipe or a hollow pipe, one end of the heat pipe 220 close to the optical modulator 700 may be the evaporation portion 202, and one side facing the optical modulator 700 is provided with a heat pipe heat conduction surface 223, the heat pipe heat conduction surface 223 and the heat conduction surface 211 may be in contact with the heat dissipation surface 701 at the same time, one end of the heat pipe 220 far away from the optical modulator 700 may be the condensation portion 203, which is beneficial for the heat of the optical modulator 700 to be quickly conducted to the heat dissipation assembly 100, thereby accelerating the heat dissipation efficiency.

Further, the heat pipe 220 includes a first heat pipe 221 and a second heat pipe 222. The first heat pipe 221 may or may not be connected to the second heat pipe 222. The first heat pipe 221 and the second heat pipe 222 are located at two opposite sides of the heat conducting protrusion 210, the heat circulation channel 201 is disposed on the first heat pipe 221 and the second heat pipe 222, that is, the first heat pipe 221 and/or the second hot end is provided with the evaporation portion 202, and the first heat pipe 221 and/or the second heat pipe 222 is provided with the condensation portion 203.

In some embodiments, the first heat pipe 221 includes a first tube end 221a and a second tube end 221b, the second tube end 221b communicating with the first tube end 221a. The first tube end 221a is thermally conductively coupled to the first end 212. For example, the first tube end 221a can be disposed through the first end 212 and in communication with the second heat pipe 222. The first pipe end 221a may be the evaporation section 202 and the second pipe end 221b may be the condensation section 203. The surface of the first tube end 221a that is connected to the heat transfer surface 223 may be the heat pipe heat transfer surface 223. Thus, the first heat pipe 221 can conduct heat from the heat conducting surface 211, and can also directly conduct heat from the heat dissipating surface 701 through the heat pipe heat conducting surface 223, and conduct heat from the first pipe end 221a to the second pipe end 221b to the heat dissipating assembly 100 for heat dissipation.

In some embodiments, the second heat pipe 222 includes a third pipe end 222a and a fourth pipe end 222b, the fourth pipe end 222b is in communication with the third pipe end 222a, the third pipe end 222a is thermally conductive coupled to the first end 212, e.g., the third pipe end 222a can be disposed through the first end 212 and in communication with the first pipe end 221a. The third tube end 222a may be the evaporation section 202 and the fourth tube end 222b may be the condensation section 203. The surface of the third tube end 222a that is connected to the heat transfer surface 223 may be the heat pipe heat transfer surface 223. In this way, the third heat pipe 220 can conduct heat from the heat conducting surface 211, and can also conduct heat directly from the heat dissipating surface 701 through the heat pipe heat conducting surface 223, and conduct heat from the third pipe end 222a to the fourth pipe end 222b to the heat dissipating assembly 100 for heat dissipation.

In addition, the first heat pipe 221 and the second heat pipe 222 may be provided with a refrigerant, and the first heat pipe 221 and the second heat pipe 222 are communicated, and the refrigerants at the first pipe end 221a and the third pipe end 222a may respectively flow to the second pipe end 221 or the fourth pipe end 222b, which is beneficial to the refrigerant to complete phase change rapidly, thereby improving heat dissipation efficiency.

The distance between the second tube end 221b and the fourth tube end 222b is greater than the sum of the lengths of the first tube end 221a and the third tube end 222 a. Specifically, the first tube end 221a and the third tube end 222a are coaxially arranged, the first tube end 221a is communicated with the third tube end 222a, the first tube end 221a and the second tube end 221b are in smooth transition, the third tube end 222a and the fourth tube end 222b are in smooth transition, and the distance between the second tube end 221b and the fourth tube end 222b is larger than the sum of the lengths of the first tube end 221a and the third tube end 222a, so that the first tube end 221a and the third tube end 222a are arranged on the heat dissipation surface 701 in a substantially D shape, the area of the heat conduction surface 223 of the heat pipe is increased, and the heat dissipation efficiency is improved.

Based on the above embodiment, the heat conducting protrusion 210 is further provided with a through hole (not shown), one end of the first heat pipe 221 is disposed through the through hole, and one end of the second heat pipe 222 is also disposed through the through hole. That is, the first pipe end 221a of the first heat pipe 221 is disposed through the through hole, and the third pipe end 222a of the second heat pipe 222 is also disposed through the through hole, so that the heat conducting protrusion 210 is connected to the heat pipe 220. Thus, the heat pipe 220 is connected to the heat conducting protrusion 210 and the heat dissipating assembly 100, and the heat pipe 220 is in contact with the heat dissipating surface 701 through the heat conducting surface 223 of the heat pipe, and the heat conducting protrusion 210 is in contact with the heat dissipating surface 701 of the optical modulator 700 through the heat conducting surface 211, so that the optical modulator 700 can conduct heat to the heat dissipating assembly 100 quickly, thereby greatly improving the heat dissipating efficiency of the optical modulator 700, preventing the temperature of the optical modulator 700 from exceeding the service temperature range, and being beneficial to prolonging the service life of the optical modulator 700.

Referring to fig. 3 and 4, in another embodiment, the heat conducting assembly 200a of the heat dissipating device 10a further includes a heat pipe 230, and the heat pipe 230 is provided with a heat circulating channel 201a. The heat pipe 230 is, for example, a column-type heat pipe (heat conducting column), and the heat pipe 230 may be a hollow pipe column or a solid pipe column, and in order to improve heat conduction efficiency, in the present embodiment, the heat pipe 230 is a hollow pipe column. Heat pipe 230 includes opposing first and second ends 231 and 232. The first end 231 may serve as the evaporation portion 202a, and the second end 232 may serve as the condensation portion 203a.

In the present embodiment, the heat-conducting protrusion 210 further includes a through groove 214 penetrating the heat-conducting surface 211, and the first end 231 is inserted into the through groove 214. The second end portion 232 may be embedded in the heat sink assembly 100, that is, the second end portion 232 is embedded in the plurality of heat sink fins 120, so that the light modulator 700 can rapidly conduct heat to the heat sink assembly 100.

Further, an end surface of the first end 231 may be in contact with the heat dissipation surface 701 as the heat pipe heat conduction surface 223a, thereby improving heat dissipation efficiency. The end surface of the first end 231 is coplanar with the heat conduction surface 211, that is, the heat pipe heat conduction surface 223a of the cylindrical heat pipe 230 is coplanar with the heat conduction surface 211. Thus, the cylindrical heat pipe 230 is connected to the heat-conducting convex portion 210 and the heat-dissipating component 100, and the cylindrical heat pipe 230 contacts with the heat-dissipating surface 701 through the heat-conducting surface 223a of the heat pipe, and the heat-conducting convex portion 210 contacts with the heat-dissipating surface 701 of the optical modulator 700 through the heat-conducting surface 211, so that the optical modulator 700 can rapidly conduct heat to the heat-dissipating component 100, thereby greatly improving the heat-dissipating efficiency of the optical modulator 700, avoiding the temperature of the optical modulator 700 from exceeding the service temperature range, and being beneficial to prolonging the service life of the optical modulator 700.

Referring to fig. 5 and 6, in another embodiment, the heat conducting element 200b of the heat dissipating device 10b further includes a heat conducting substrate 240. The heat conducting substrate 240 is thermally conductively connected to the mounting surface 111, i.e. the heat conducting substrate 240 is connected to the mounting frame 110. A side of the heat conducting substrate 240 facing away from the heat dissipation assembly 100 is protruded with a heat conducting protrusion 210. An evaporation cavity 241 is formed inside the heat-conducting protrusion 210, a condensation cavity 242 is formed inside the heat-conducting substrate 240, the condensation cavity 242 is communicated with the evaporation cavity 241, and a refrigerant is arranged in the evaporation cavity 241 and the condensation cavity 242. The heat-conducting substrate 240 is integrally formed on the heat-conducting protrusion 210, which is beneficial for forming a sealed cavity between the evaporation cavity 241 and the condensation cavity 242. In the present embodiment, the evaporation chamber 241 and the condensation chamber 242 are communicated to form the heat circulation path 201b, the evaporation chamber 241 may serve as the evaporation part 202b of the heat circulation path 201b, and the condensation chamber 242 may serve as the condensation part 203b of the heat circulation path 201 b. In this manner, the heat conductive protrusion 210 may conduct heat, thereby conducting heat of the light modulator 700 to the heat sink assembly 100.

Referring to fig. 7 and 8, the present invention also provides a projection apparatus 20, wherein the projection apparatus 20 includes a light modulator 700 and the heat dissipation devices 10, 10a and 10b for the light modulator of the above embodiments.

When the heat dissipation devices 10, 10a, and 10b are assembled to the light modulator 700, the heat conduction surface 211 is in heat-conductive contact with the heat dissipation surface 701. The specific structure of the heat sink is described with reference to the above embodiments, and fig. 7 and 8 only illustrate the heat sink 10 according to one embodiment, but not limited thereto. Since the heat dissipation device can adopt all technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and are not described in detail herein.

The projection device 20 further includes an optical engine housing 800 having a receiving cavity 801, and the circuit board 300, the line arrangement board 400 and the pressing plate 500 received in the receiving cavity 801. The circuit board 300, the wiring board 400, and the pressing plate 500 are sequentially arranged between the light modulator 700 and the heat conductive protrusion 210. The pressing plate 500 presses the circuit board 300 and the wiring board 400 against the optical modulator 700, and the heat dissipation surface 701 of the optical modulator 700 is exposed from the circuit board 300, the wiring board 400, and the pressing plate 500. In order to expose the heat dissipation surface 701, the circuit board 300, the line arrangement board 400, and the pressure plate 500 are provided with the escape holes 600, and the heat conduction surface 211 and/or the heat pipe heat conduction surface 223 may contact the heat dissipation surface 701 of the optical modulator 700 through the escape holes 600.

Based on the heat dissipation device 10 shown in fig. 2, the circuit board 300, the wire arranging plate 400 and the pressing plate 500 can be designed to be adaptive. For example, the area of the avoiding hole 600 is larger than the sum of the areas of the heat conducting surface 211 and the heat pipe heat conducting surface 223, so that the heat sink 10 is prevented from interfering with the circuit board 300, the wire arranging plate 400 and the pressing plate 500, and the heat sink 10 can normally operate.

In addition, the upper end and the lower end of the circuit board 300 can also be cut off, so that the area of the avoiding hole 600 is increased, the heat conducting surface 211 and/or the heat pipe heat conducting surface 223 can be in contact with the heat radiating surface 701 of the optical modulator 700 through the avoiding hole 600, the interference of the heat radiating device 10 with the circuit board 300, the wire arranging plate 400 and the pressing plate 500 is avoided, and the heat radiating device 10 can work normally.

In the present invention, the terms "mounted," "connected," and the like are to be construed broadly unless otherwise explicitly defined or limited. For example, the connection can be fixed connection, detachable connection, integral connection or transmission connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Furthermore, the terms "first," "second," and the like are used merely for distinguishing between descriptions and not intended to imply or imply a particular structure. The description of the term "some embodiments" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In the present disclosure, a schematic representation of the above terms does not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the various embodiments or examples and features of the various embodiments or examples described in this disclosure may be combined and combined by those skilled in the art without contradiction.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may be modified or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.

Claims (10)

1. A heat dissipation device for a light modulator, the heat dissipation device comprising:

a heat sink assembly having an assembly face; and

the heat conduction assembly is assembled on the heat dissipation assembly and comprises a heat conduction convex part, the heat conduction convex part is arranged on the assembling surface and is provided with a heat conduction surface used for being in contact with the light modulator, the heat conduction assembly is further provided with a heat circulation channel, the heat circulation channel comprises an evaporation part and a condensation part which are communicated with each other, the evaporation part is arranged on the heat conduction convex part, and the condensation part is in heat conduction connection with the heat dissipation assembly.

2. The heat dissipating device for an optical modulator as claimed in claim 1, wherein the heat conducting protrusion comprises a first end and a second end opposite to each other, the heat conducting surface is located at the first end, the second end is connected to the heat dissipating assembly, the heat conducting assembly further comprises a heat pipe, the heat pipe is provided with the heat circulating channel, one end of the heat pipe is provided with the evaporation portion and is thermally conductive connected to the first end, and has a heat conducting surface of the heat pipe for contacting with the optical modulator, and the other end of the heat pipe is provided with the condensation portion.

3. The heat dissipating device for an optical modulator according to claim 2, wherein the heat pipe includes a first heat pipe and a second heat pipe, the first heat pipe and the second heat pipe are located on opposite sides of the heat conducting convex portion, the heat circulation passage is provided in the first heat pipe and the second heat pipe, the first heat pipe includes a first pipe end and a second pipe end, the first pipe end is thermally connected to the first end, the second pipe end is provided with the condensation portion, the second heat pipe includes a third pipe end and a fourth pipe end, the third pipe end is thermally connected to the first end, the fourth pipe end is provided with the condensation portion, the evaporation portion is provided in the first pipe end and the third pipe end, and the heat pipe heat conducting surface is located in the first pipe end and the third pipe end, and a distance between the second pipe end and the fourth pipe end is larger than a sum of lengths of the first pipe end and the third pipe end.

4. The heat sink for the optical modulator according to claim 3, wherein the heat conducting protrusion has a through hole, one end of the first heat pipe penetrates through the through hole, and one end of the second heat pipe penetrates through the through hole.

5. The heat dissipating device for an optical modulator according to claim 2, wherein the heat conducting assembly further comprises a heat conducting pillar, the heat conducting pillar is provided with the heat circulating passage, the heat conducting protrusion is provided with a through groove penetrating the heat conducting surface, the heat conducting pillar comprises a first end portion and a second end portion opposite to each other, the first end portion is provided with the evaporation portion and is inserted into the through groove, and the second end portion is provided with the condensation portion and is embedded in the heat dissipating assembly.

6. The heat sink for a light modulator of claim 5 wherein an end surface of the first end portion is coplanar with the thermally conductive surface.

7. The heat dissipating device for an optical modulator according to claim 1, wherein the heat conducting assembly further comprises a heat conducting substrate, the heat conducting substrate is thermally connected to the mounting surface, the heat conducting protrusion is protruded from a side of the heat conducting substrate facing away from the heat dissipating assembly, the thermal circulation channel is disposed between the heat conducting substrate and the heat conducting protrusion, the heat conducting protrusion is provided with the evaporation portion, and the heat conducting substrate is provided with the condensation portion.

8. A projection device, comprising:

a light modulator having a heat dissipating surface; and

the heat spreading device for a light modulator of claim 1, said thermal conduction surface being in thermal contact with said heat spreading surface.

9. The projection device of claim 8, wherein the heat conducting protrusion includes a first end and a second end opposite to each other, the heat conducting surface is located at the first end, the second end is connected to the heat dissipating assembly, the heat conducting assembly further includes a heat pipe having the heat circulation channel, one end of the heat pipe is provided with the evaporation portion and is thermally connected to the first end, and has a heat pipe heat conducting surface for contacting the heat dissipating surface, the other end of the heat pipe is provided with the condensation portion, and the heat pipe heat conducting surface is thermally connected to the heat dissipating surface.

10. The projection apparatus according to claim 9, wherein the projection apparatus further includes an optical machine housing having a receiving chamber, and a circuit board, a line board, and a pressing plate received in the receiving chamber, the circuit board, the line board, and the pressing plate are sequentially arranged between the optical modulator and the heat-conducting protrusions, the pressing plate presses the circuit board and the line board against the optical modulator, the circuit board, the line board, and the pressing plate are both provided with avoiding holes, and the area of the avoiding holes is greater than the sum of the areas of the heat-conducting surface and the heat-pipe heat-conducting surface.

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