CN218657493U

CN218657493U - Chip welding equipment

Info

Publication number: CN218657493U
Application number: CN202222987102.XU
Authority: CN
Inventors: 廖兵; 沈礼福
Original assignee: Suzhou Createk Microelectronic Co ltd
Current assignee: Suzhou Createk Microelectronic Co ltd
Priority date: 2022-11-09
Filing date: 2022-11-09
Publication date: 2023-03-21
Anticipated expiration: 2032-11-09

Abstract

The utility model discloses a chip welding equipment, its packaging board that is used for placing the QFN chip is located between two limiting plates, be provided with a welding unit in conveyer belt one side and be located the packaging board top, the output of welding rifle all is towards the welding region of packaging board, linear actuator is connected with the welding rifle, the carriage further includes the dead lever, the threaded rod and on, the first gag lever post that distributes down, the second gag lever post, the threaded rod supplies the linear actuator suit to connect, first gag lever post, the second gag lever post is located between threaded rod and the dead lever, and first gag lever post is located second gag lever post top, thereby form a first spout between second gag lever post and dead lever, form the second spout between first gag lever post and second gag lever post, linear actuator is along first spout, the second spout removes. The utility model is simple in operation, convenient, improved machining efficiency greatly, still improved the stability that the welding rifle removed, improved the welding precision.

Description

Chip welding equipment

Technical Field

The utility model relates to a chip bonding technology field especially relates to a chip welding equipment.

Background

With the popularization of personal computers and the development of various data clouds, the application range of servers and personal computers is wider and wider. Servers and personal computers have more and more mainboards, more and more used IC parts, and because the space of the mainboards is limited, the conventional IC with pin package has less and less ICs, and the basic mainstream IC parts are all the QFN leadless packages at present.

Welding equipment refers to the equipment needed to implement a welding process. The welding equipment comprises a welding machine, welding process equipment and a welding auxiliary appliance. The prior patent (publication number: CN 212286204U) discloses an electronic chip welding device, which comprises an L-shaped mounting plate and an electric soldering iron body, wherein the electric soldering iron body is connected with the L-shaped mounting plate through a connecting rope, and a U-shaped positioning plate is fixedly connected to the outer side wall of the vertical section of the L-shaped mounting plate.

In the process of implementing the invention, when the device is used for welding the chip, the mounting plate needs to be fixed on the operating platform through the fixing device, and then the electric soldering iron body is taken out for welding, so that the chip welding is troublesome and the efficiency is low.

Disclosure of Invention

The utility model aims at providing a chip welding equipment, this chip welding equipment easy operation, convenient have improved machining efficiency greatly, have still improved the stability that the welding rifle removed, have improved the welding precision.

In order to achieve the above purpose, the utility model adopts the technical scheme that: a chip bonding apparatus comprising: the packaging plate for placing the QFN chip is positioned between the two limiting plates, the bottom of the packaging plate is contacted with the conveying belt, and a welding unit is arranged on one side of the conveying belt and above the packaging plate;

the welding unit further comprises a welding gun, a sliding frame and a linear driver, wherein the output end of the welding gun faces to the welding area of the packaging plate, and the linear driver is connected with the welding gun;

the carriage further includes dead lever, threaded rod and upper and lower first gag lever post, the second gag lever post that distributes, the threaded rod supplies sharp driver suit to connect, first gag lever post, second gag lever post are located between threaded rod and the dead lever, just first gag lever post is located the second gag lever post top to form a first spout between second gag lever post and dead lever, form the second spout between first gag lever post and second gag lever post, sharp driver removes along first spout, second spout.

The further improved scheme in the technical scheme is as follows:

1. in the above scheme, the linear actuator includes drive division, installation department, and the drive division of being connected with the threaded rod suit can be followed the second spout and slided, and the installation department that is provided with the welding rifle can be followed first spout and slided.

2. In the above scheme, a bottom plate is arranged below the packaging plate, and a support column is arranged between the bottom plate and the sliding frame.

3. In the above scheme, the number of the welding units is two.

4. In the above scheme, the two welding units are symmetrically arranged.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

the utility model discloses chip welding equipment, the output of its welding gun of installing on the carriage all faces the welding zone of packaging board, and linear actuator is connected with the welding gun, and the welding gun along linear motion can weld the chip on the same straight line and process, and easy operation, convenient has improved machining efficiency greatly; further, its threaded rod supplies the linear actuator suit to connect, first gag lever post, the second gag lever post is located between threaded rod and the dead lever, and first gag lever post is located the second gag lever post top, thereby form a first spout between second gag lever post and dead lever, form the second spout between first gag lever post and second gag lever post, linear actuator is along first spout, the second spout removes, linear actuator is respectively along the first spout of horizontally, vertical second spout removes, on the level, carry on spacingly to linear actuator in two vertical directions, the stability that linear actuator removed has been improved greatly, thereby welding precision of welding rifle has been improved.

Drawings

FIG. 1 is a schematic view of the overall structure of the chip bonding apparatus of the present invention;

FIG. 2 is an enlarged view of the point A of FIG. 1 of the present invention;

fig. 3 is a perspective view of the chip welding apparatus according to the present invention.

In the above drawings: 1. a conveyor belt; 2. a package board; 3. a limiting plate; 4. a welding unit; 5. welding a gun; 6. a carriage; 7. a linear actuator; 71. a drive section; 72. an installation part; 8. fixing the rod; 9. a threaded rod; 10. a first limit rod; 11. a second limiting rod; 12. a first chute; 13. a second chute; 14. a base plate; 15. and (7) supporting the column.

Detailed Description

The invention will be further described with reference to the following drawings and examples:

example 1: a chip bonding apparatus comprising: the packaging device comprises a conveying belt 1 and a packaging plate 2, wherein limiting plates 3 are arranged on two sides of the conveying belt 1, a plurality of packaging areas distributed at equal intervals are arranged on the surface of the packaging plate 2, the packaging plate 2 used for placing QFN chips is arranged between the two limiting plates 3, the bottom of the packaging plate 2 is in contact with the conveying belt 1, and a welding unit 4 is arranged on one side of the conveying belt 1 and above the packaging plate 2;

the welding unit 4 further comprises a welding gun 5, a carriage 6 and a linear driver 7, the output end of the welding gun 5 faces the welding area of the package plate 2, and the linear driver 7 is connected with the welding gun 5;

the linear driver is connected with the welding gun, so that the welding gun moving along the straight line can weld the chips on the same straight line, the operation is simple and convenient, and the processing efficiency is greatly improved.

The sliding frame 6 further comprises a fixed rod 8, a threaded rod 9, a first limiting rod 10 and a second limiting rod 11 which are distributed up and down, the threaded rod 9 is sleeved and connected with the linear driver 7, and the threaded rod 9 is installed between the inner walls of the sliding frame 6;

first gag lever post 10, second gag lever post 11 are located between threaded rod 9 and dead lever 8, just first gag lever post 10 is located second gag lever post 11 top to form a first spout 12 between second gag lever post 11 and dead lever 8, form second spout 13 between first gag lever post 10 and second gag lever post 11, linear actuator 7 moves along first spout 12, second spout 13.

The linear actuator 7 includes a driving portion 71 and a mounting portion 72, the driving portion 71 slidably coupled to the threaded rod 9 along the second slide groove 13, and the mounting portion 72 provided with the welding gun 5 slidably along the first slide groove 12.

The welding units 4 are provided in two; the two welding units 4 are symmetrically arranged.

Example 2: a chip bonding apparatus comprising: the packaging device comprises a conveying belt 1 and a packaging plate 2, wherein limiting plates 3 are arranged on two sides of the conveying belt 1, a plurality of packaging areas distributed at equal intervals are arranged on the surface of the packaging plate 2, the packaging plate 2 used for placing QFN chips is arranged between the two limiting plates 3, the bottom of the packaging plate 2 is in contact with the conveying belt 1, and a welding unit 4 is arranged on one side of the conveying belt 1 and above the packaging plate 2;

the first limiting rod 10 and the second limiting rod 11 are located between the threaded rod 9 and the fixing rod 8, the first limiting rod 10 is located above the second limiting rod 11, a first sliding groove 12 is formed between the second limiting rod 11 and the fixing rod 8, a second sliding groove 13 is formed between the first limiting rod 10 and the second limiting rod 11, and the linear driver 7 moves along the first sliding groove 12 and the second sliding groove 13.

The linear actuator moves along the first horizontal sliding groove and the second vertical sliding groove respectively, the linear actuator is limited in the horizontal direction and the vertical direction, and the moving stability of the linear actuator is greatly improved, so that the welding precision of a welding gun is improved.

The linear actuator 7 includes a driving portion 71 and a mounting portion 72, the driving portion 71 coupled to the threaded rod 9 slidably along the second slide groove 13, and the mounting portion 72 provided with the welding gun 5 slidably along the first slide groove 12.

A bottom plate 14 is arranged below the package plate 2, and a support column 15 is arranged between said bottom plate 14 and the carriage 6.

The welding units 4 are provided in two.

The working principle of the chip welding equipment of the utility model is as follows, the linear driver is connected with the welding gun, so that the welding gun moving along the straight line can weld the chips on the same straight line, the operation is simple and convenient, and the processing efficiency is greatly improved; form a first spout between second gag lever post and dead lever, form the second spout between first gag lever post and second gag lever post, the linear actuator removes along first spout, second spout, and the linear actuator removes along first spout of horizontally, vertical second spout respectively, and is spacing to the linear actuator in level, vertical two directions, has improved the stability that the linear actuator removed greatly to the welding precision of welding rifle has been improved.

When the chip welding equipment is adopted, the welding gun which moves along the straight line can weld and process the chips on the same straight line, the operation is simple and convenient, and the processing efficiency is greatly improved; furthermore, the linear driver is limited in the horizontal direction and the vertical direction, so that the moving stability of the linear driver is greatly improved, and the welding precision of the welding gun is improved.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.

Claims

1. A chip bonding apparatus comprising: conveyer belt (1), encapsulation board (2), its characterized in that: the packaging plate (2) used for placing the QFN chip is positioned between the two limiting plates (3), the bottom of the packaging plate (2) is in contact with the conveying belt (1), and a welding unit (4) is arranged on one side of the conveying belt (1) and above the packaging plate (2);

the welding unit (4) further comprises a welding gun (5), a sliding frame (6) and a linear driver (7), the output end of the welding gun (5) faces the welding area of the packaging plate (2), and the linear driver (7) is connected with the welding gun (5);

the sliding frame (6) further comprises a fixing rod (8), a threaded rod (9), a first limiting rod (10) and a second limiting rod (11), wherein the first limiting rod (10) and the second limiting rod (11) are distributed up and down, the threaded rod (9) is connected with the linear driver (7) in a sleeved mode, the first limiting rod (10) and the second limiting rod (11) are located between the threaded rod (9) and the fixing rod (8), the first limiting rod (10) is located above the second limiting rod (11), a first sliding groove (12) is formed between the second limiting rod (11) and the fixing rod (8), a second sliding groove (13) is formed between the first limiting rod (10) and the second limiting rod (11), and the linear driver (7) moves along the first sliding groove (12) and the second sliding groove (13).

2. The die bonding apparatus of claim 1, wherein: the linear driver (7) comprises a driving part (71) and an installation part (72), the driving part (71) which is connected with the threaded rod (9) in a sleeved mode can slide along the second sliding groove (13), and the installation part (72) provided with the welding gun (5) can slide along the first sliding groove (12).

3. The die bonding apparatus of claim 1, wherein: a bottom plate (14) is arranged below the packaging plate (2), and a support column (15) is arranged between the bottom plate (14) and the sliding frame (6).

4. The die bonding apparatus of claim 1, wherein: the number of the welding units (4) is two.

5. The die bonding apparatus of claim 1, wherein: the two welding units (4) are symmetrically arranged.