CN218649139U

CN218649139U - Integrated heat dissipation mechanism based on servo driver

Info

Publication number: CN218649139U
Application number: CN202222326907.XU
Authority: CN
Inventors: 郭伟伟
Original assignee: Wuxi Xinje Electric Co Ltd
Current assignee: Wuxi Xinje Electric Co Ltd
Priority date: 2022-08-31
Filing date: 2022-08-31
Publication date: 2023-03-17
Anticipated expiration: 2032-08-31

Abstract

The utility model relates to the technical field of servo driving devices, in particular to an integrated heat dissipation mechanism based on a servo driver, which comprises a box body with a cavity, wherein the box body forms a seal for the cavity through a cover plate; the box body includes upper plate, lower plate, left side board, right side board and heating panel, the heating panel includes assembly surface and cooling surface, the assembly surface with the upper plate the lower plate the left side board the right side board constitutes the cavity seted up on the lower plate and accesss to the logical groove of cooling surface, radiator fan is installed in the outside that leads to the groove. The heat dissipation mechanism is simple in structure, and can be used for mounting electronic elements such as a mainboard and the like and also can dissipate heat of electronic components during working.

Description

Integrated heat dissipation mechanism based on servo driver

Technical Field

The utility model relates to a servo drive technical field especially relates to an integral type heat dissipation mechanism based on servo driver.

Background

Servo drivers (servo drivers) also called servo controller and servo amplifier are controllers for controlling servo motors, have the action similar to that of a frequency converter acting on a common alternating current motor, belong to a part of servo systems, are mainly applied to high-precision positioning systems and are suitable for industrial control fields of radars, ships, vehicles, mechanical arms and the like. The servo motor is generally controlled by three modes of position, speed and moment, so that the high-precision positioning of a transmission system is realized, and the servo motor is a high-end product of a transmission technology.

Inside mainly installed various mainboard and electronic component, can produce a large amount of heats in the course of the work, if can not timely effectual carry out the heat dissipation processing, because the high temperature causes electronic components and mainboard to burn very easily, and then influences the life of product, leads to the fact the production safety problem even.

Therefore, a technique for solving this problem is urgently required.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome above-mentioned prior art's problem, provide an integral type heat dissipation mechanism based on servo driver, including a box body that has the cavity, be used for installing electronic components such as mainboard in the cavity, set up a heating panel that has assembly surface and cooling surface on the box body, realize conducting the outside with the cavity is inside through the cooling surface to dispel the heat of cooling surface through radiator fan.

The above purpose is realized by the following technical scheme:

an integrated heat dissipation mechanism based on a servo driver comprises a box body with a cavity, wherein the box body forms a seal for the cavity through a cover plate; the box body includes upper plate, lower plate, left side board, right side board and heating panel, the heating panel includes assembly surface and cooling surface, the assembly surface with the upper plate the lower plate the left side board the right side board constitutes the cavity seted up on the lower plate and accesss to the logical groove of cooling surface, radiator fan is installed in the outside that leads to the groove.

Furthermore, a fin group is arranged on the heat dissipation surface, and the top end of the fin group penetrates through the upper base plate; the two sides of the fin group are limited by the left side plate and the right side plate, and the bottom end of the fin group is limited by the lower bottom plate.

Furthermore, the fin group consists of a plurality of fins with the same specification, and the distances between the adjacent fins are the same.

Further, the upper base plate, the lower base plate, the left side plate, the right side plate and the heat dissipation plate are integrally formed.

Further, the thickness of the mounting face is smaller than the thickness of the fin group.

Furthermore, a wind shield is arranged between the left side plate and the right side plate and positioned on the outer side surface of the fin group, so that the through groove serves as an air inlet of the fin group, and the top of the fin group serves as an air outlet.

Furthermore, right-angle grooves which are symmetrical to each other are formed in the left side plate and the right side plate respectively, and the wind shield is clamped through the right-angle grooves and connected through screws.

Furthermore, a groove with a downward opening is formed in the lower bottom plate, the through groove is formed in the bottom of the groove, and the cooling fan is installed in the groove.

Further, the through groove is circular and coaxial with the heat dissipation fan.

Further, the logical groove has 2, and correspondingly, radiator fan has 2.

Furthermore, the assembling surface is used for installing a mainboard, correspondingly, a plurality of through holes are formed in the left side plate, and slots connected with the mainboard through wiring harnesses are embedded in the through holes.

Advantageous effects

The utility model provides an integral type heat dissipation mechanism based on servo driver, including a box body that has the cavity, be used for installing electronic components such as mainboard in the cavity, set up a heating panel that has assembly surface and cooling surface on the box body, realize the inside conduction of cavity to the outside through the cooling surface to accelerate the radiating efficiency of cooling surface through radiator fan. The heat dissipation mechanism is simple in structure, and can be used for mounting electronic elements such as a mainboard and the like and also can dissipate heat of electronic components during working.

Drawings

Fig. 1 is a schematic view of a first view structure of an integrated heat dissipation mechanism based on a servo driver according to the present invention;

fig. 2 is a schematic structural view of a heat dissipation fan of an integrated heat dissipation mechanism based on a servo driver according to the present invention;

fig. 3 is a second view structural diagram of the integrated heat dissipation mechanism based on the servo driver according to the present invention;

fig. 4 is a schematic diagram of a through groove structure of an integrated heat dissipation mechanism based on a servo driver according to the present invention;

fig. 5 is a schematic structural view of an assembly surface and a heat dissipation surface of an integrated heat dissipation mechanism based on a servo driver.

Graphic notation:

1-box body, 2-cavity, 3-cover plate, 4-upper bottom plate, 5-lower bottom plate, 6-left side plate, 7-right side plate, 8-heat dissipation plate, 9-assembly surface, 10-heat dissipation surface, 11-through groove, 12-heat dissipation fan, 13-fin group, 14-wind shield, 15-right-angle groove, 16-groove, 17-slot, 18-fin and 19-through hole.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. The described embodiments are only some, but not all embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1 and 2, an integrated heat dissipation mechanism based on a servo driver comprises a box body 1 with a cavity 2, wherein the box body 1 forms a seal for the cavity 2 through a cover plate 3; the cavity 2 is used for mounting a control mainboard, electronic components and the like, and the control mainboard, the electronic components and the like in the cavity 2 can be effectively protected through the interaction of the box body 1 and the cover plate 3; as a connection form between the cover plate 3 and the box body 1 in this embodiment, right-angle grooves 15 are respectively formed in the left side plate 6 and the right side plate 7, and the wind shield 14 is clamped by the right-angle grooves 15 and connected by screws.

As shown in fig. 2 and 5, the box body 1 mainly includes an upper bottom plate 4, a lower bottom plate 5, a left side plate 6, a right side plate 7 and a heat dissipation plate 8, wherein the heat dissipation plate 8 includes an assembly surface 9 (facing the surface of the cavity 2) and a heat dissipation surface 10 (facing the external surface), the assembly surface 9 forms the cavity 4 with the upper bottom plate 4, the lower bottom plate 5, the left side plate 6 and the right side plate 7, the lower bottom plate 5 is provided with a through groove 11 leading to the heat dissipation surface 10, and a heat dissipation fan 12 is installed outside the through groove 11.

Specifically, the heat dissipation fan 12 blows air into the through groove 11, and the air flow can directly circulate along the heat dissipation surface 10, so that heat on the heat dissipation surface 10 can be dissipated. The assembling surface 9 is used for installing a main board (namely, controlling the main board, electronic components and the like), correspondingly, a plurality of through holes 19 are formed in the left side plate 6, and slots 17 connected with the main board through wiring harnesses are embedded in the through holes 19.

As an optimization of the heat dissipating surface 10 in this embodiment, a fin group 13 is disposed on the heat dissipating surface 10, the fin group 13 is disposed longitudinally, and two ends of the fin group respectively face the upper base plate 4 and the lower base plate 5; specifically, the top ends of the fin groups 13 penetrate through the upper base plate 4; the two sides of the fin group 13 are limited by the left side plate 6 and the right side plate 7, and the bottom end of the fin group 13 is limited by the lower bottom plate 5.

In this embodiment, the fin group 13 is composed of a plurality of fins 18 with the same specification, and the distances between the adjacent fins 18 are the same. The fin group 13 or the heat dissipation plate 8, or the upper base plate 4, the lower base plate 5, the left side plate 6 and the right side plate 7 can be made of metal aluminum with good heat conducting property; the upper plate 4, the lower plate 5, the left side plate 6, the right side plate 7 and the heating panel 8 are integrally formed, and the processing mode can adopt 3D printing or punch forming, or casting, or injection molding and the like.

In order to optimize the heat dissipation effect, the thickness of the mounting surface 9 is smaller than the thickness of the heat dissipation surface 10 (i.e., the thickness of the fin group 13), and the larger the thickness of the fin group 13 is (the fin group 13 includes a large number of thin fins with the same specification, in this embodiment, the thickness of the fin group corresponds to the width of the fin 18), the better the heat conduction performance is, and more heat can be conducted.

As shown in fig. 3 and 4, as a structural form between the cooling fan 12 and the fin group 13 in the present embodiment, specifically, the following is provided: a wind shield 14 is further arranged between the left side plate 6 and the right side plate 7, and the wind shield 14 is located on the outer side surface of the fin group 13, so that the through groove 11 serves as an air inlet of the fin group 13, and the top of the fin group 13 serves as an air outlet.

Specifically, the fin group 13 is composed of a plurality of fins 18 with the same specification, an air channel capable of allowing air to circulate is formed between the adjacent fins 18 under the action of the wind shield 14, when the cooling fan 12 works, generated air flow can penetrate through the through groove 11, and through air channel circulation between the fins 18, heat on the surfaces of the fins 18 is dissipated, and the cooling time of the fins 18 is shortened.

As an optimization of the installation form of the heat dissipation fan 12 in this embodiment, a groove 16 with a downward opening is formed on the lower bottom plate 5, the through slot 11 is formed at the bottom (also understood as a bottom wall) of the groove 16, and the heat dissipation fan 12 is installed in the groove 16.

In this embodiment, the through groove 11 is circular and coaxial with the heat dissipation fan 12; the number of the through grooves can be 2, correspondingly, the number of the heat radiation fans is 2, and the plurality of heat radiation fans 12 can further promote the circulation of air and accelerate the heat radiation effect of the fins 18.

The above description is only for the purpose of illustrating embodiments of the present invention and should not be taken as limiting the invention, and any modifications, equivalents, improvements and the like made by those skilled in the art within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. An integrated heat dissipation mechanism based on a servo driver is characterized by comprising a box body with a cavity, wherein the box body forms a seal for the cavity through a cover plate; the box body includes upper plate, lower plate, left side board, right side board and heating panel, the heating panel includes assembly surface and cooling surface, the assembly surface with the upper plate the lower plate the left side board the right side board constitutes the cavity seted up on the lower plate and accesss to the logical groove of cooling surface, radiator fan is installed in the outside that leads to the groove.

2. The integrated servo driver-based heat dissipation mechanism as recited in claim 1, wherein a fin set is disposed on the heat dissipation surface, and the top end of the fin set penetrates through the upper base plate; the two sides of the fin group are limited by the left side plate and the right side plate, and the bottom end of the fin group is limited by the lower bottom plate.

3. The integrated heat dissipation mechanism based on the servo driver as claimed in claim 2, wherein the fin set is composed of a plurality of fins with the same specification, and the distance between the adjacent fins is the same.

4. The integrated servo-driver-based heat dissipation mechanism as recited in claim 2, wherein the upper base plate, the lower base plate, the left side plate, the right side plate and the heat dissipation plate are integrally formed.

5. The integrated servo-drive based heat dissipation mechanism of claim 2, wherein the thickness of the mounting face is less than the thickness of the fin set.

6. The integrated heat dissipation mechanism based on the servo driver as claimed in claim 2, wherein a wind deflector is further disposed between the left side plate and the right side plate, the wind deflector is located on an outer side surface of the fin group, so that the through slot serves as an air inlet of the fin group, and a top of the fin group serves as an air outlet.

7. The integrated heat dissipation mechanism based on the servo driver as claimed in claim 6, wherein the left side plate and the right side plate are respectively provided with a right-angle groove which are symmetrical to each other, and the wind deflector is clamped by the right-angle grooves and connected by screws.

8. The integrated heat dissipation mechanism based on the servo driver as claimed in claim 1, wherein a recess with a downward opening is formed on the lower base plate, the through slot is formed at a bottom of the recess, and the heat dissipation fan is installed in the recess.

9. The integrated servo-actuator based heat dissipation mechanism of claim 8, wherein the through slot is circular and coaxial with the heat dissipation fan.

10. The integrated servo driver-based heat dissipation mechanism as recited in claim 9, wherein there are 2 through slots, and correspondingly there are 2 heat dissipation fans.