CN218638849U - Laser slotting equipment - Google Patents

Abstract

The utility model provides a laser slotting device, move including pan feeding mechanism, positioning mechanism, orthoscopic and carry transition mechanism, laser slotting mechanism and discharge mechanism. The positioning mechanism is arranged above the output end of the feeding mechanism and used for photographing and positioning the silicon wafer to be slotted; the feeding mechanism, the linear transfer transition mechanism and the discharging mechanism are arranged along the same straight line, the linear transfer transition mechanism reciprocates between the feeding mechanism and the discharging mechanism, and the laser grooving mechanism is arranged between the feeding mechanism and the discharging mechanism. The linear transfer transition mechanism is used for transferring the silicon wafer to be grooved from the feeding mechanism to the position below the laser grooving mechanism and transferring the grooved silicon wafer to the discharging mechanism. The utility model discloses a laser slotting device, pan feeding mechanism, orthoscopic move and carry transition mechanism and discharge mechanism and lie in same straight line, material loading, fluting and unloading in-process need not snatch and transport the silicon chip implementation to the piece risk has been reduced by a wide margin.

Description

Laser slotting equipment

Technical Field

The utility model belongs to the technical field of battery production and specifically relates to a laser slotting device.

Background

In order to improve the conversion efficiency of the cell, it is necessary to reduce the contact resistance between the silicon wafer and the electrode and increase the ohmic contact between the silicon wafer and the electrode. The current practice is to dope the contact position of the silicon wafer and the electrode with high concentration. Before high-concentration doping, laser grooving needs to be carried out on the silicon wafer.

According to the existing laser grooving equipment, a bearing table is arranged on a rotary platform, and the bearing table is driven by the rotary platform to sequentially rotate to a feeding station, a laser grooving station and a discharging station. When the bearing table rotates to the blanking station, the silicon wafers grabbed by the silicon wafers output from the conveying mechanism are conveyed to the bearing table by the feeding conveying mechanism, and when the bearing table rotates to the blanking station, the silicon wafers slotted on the bearing table are conveyed to the blanking conveying mechanism by the blanking conveying mechanism.

The structure of the existing laser grooving equipment is complex, and the silicon wafer needs to be grabbed and carried for many times, so that the risk of fragments of the silicon wafer is increased.

SUMMERY OF THE UTILITY MODEL

In order to solve the above-mentioned technical problem that current laser slotting device exists, the utility model provides a laser slotting device, it adopts following technical scheme:

the utility model provides a laser slotting device for to silicon chip fluting, laser slotting device includes pan feeding mechanism, positioning mechanism, orthoscopic moves and carries transition mechanism, laser slotting mechanism and discharge mechanism, wherein:

the positioning mechanism is arranged right above the output end of the feeding mechanism and used for photographing and positioning the silicon wafer to be grooved;

the laser grooving mechanism is arranged between the feeding mechanism and the discharging mechanism and is positioned above the motion path of the linear transfer transition mechanism;

the linear transfer transition mechanism is used for transferring the silicon wafer to be grooved from the feeding mechanism to the position below the laser grooving mechanism and transferring the grooved silicon wafer to the discharging mechanism.

The utility model provides a laser slotting device, pan feeding mechanism, orthoscopic moves and carries transition mechanism and discharge mechanism and is located same straight line, orthoscopic moves and carries transition mechanism and can move the silicon chip of treating the fluting from pan feeding mechanism and carry to laser slotting mechanism below to move the silicon chip after slotting to move to discharge mechanism on, promptly, the silicon chip can accomplish the material loading in succession on sharp transport route, fluting and unloading operation, need not implement snatching and carrying the silicon chip in this processing procedure, thereby the piece risk of silicon chip has been reduced by a wide margin.

In some embodiments, the linear transfer transition mechanism comprises a first moving assembly, a second moving assembly and a transition table, wherein the second moving assembly is arranged at the driving end of the first moving assembly, and the transition table is arranged at the driving end of the second moving assembly; the first moving assembly is used for driving the transition table to reciprocate between the feeding mechanism and the discharging mechanism; an avoiding groove is formed in the transition table and used for avoiding the feeding mechanism and the discharging mechanism; the second moving assembly is used for driving the transition table to jack up so as to jack up the silicon wafer to be grooved from the feeding mechanism and transition the silicon wafer to be grooved onto the transition table; the second moving assembly is also used for driving the transition table to descend so as to downwards place the grooved silicon wafer onto the discharging mechanism.

Through the arrangement of the linear transfer transition mechanism and the transition table, the transition table can smoothly acquire the silicon wafer to be grooved from the feeding mechanism and transfer the grooved silicon wafer to the discharging mechanism.

In some embodiments, the linear transfer transition mechanism further comprises a rotating assembly, the rotating assembly is arranged at a driving end of the second moving assembly, the transition table is arranged at a driving end of the rotating assembly, and the rotating assembly is used for driving the transition table to rotate so as to adjust the placing position of the silicon wafer to be grooved.

Through setting up rotating assembly, realized treating the adjustment in advance of slotted silicon chip's locating position for the locating position of silicon chip satisfies predetermined fluting requirement, so, after the silicon chip was moved and is carried to laser fluting mechanism's below, laser fluting mechanism can implement the fluting operation at once, thereby guarantees the beat, improves the fluting effect.

In some embodiments, the laser grooving mechanism is configured to plan the movement path of the grooving laser based on the position information of the silicon wafer to be grooved acquired by the positioning mechanism.

The laser grooving mechanism is configured to plan the movement path of the grooving laser according to the position information of the silicon wafer, so that the action of rotating the transition table to adjust the position of the silicon wafer can be saved, the grooving efficiency is improved, and the equipment cost can be reduced.

In some embodiments, be provided with a plurality of absorption holes on the transition platform, the absorption hole avoids dodging the groove setting.

Through set up the absorption hole at the transition bench, realized fixed to the absorption of silicon chip, prevent that the silicon chip from taking place offset or landing when the transition bench removes, will adsorb the hole and avoid dodging the groove setting, damage the lamellar body when can preventing to adsorb.

In some embodiments, the laser grooving equipment further comprises a silicon wafer pressing mechanism arranged at the output end of the feeding mechanism; silicon chip pushes down mechanism and blows the subassembly including symmetry setting first blowing subassembly and the second of the output both sides of pan feeding mechanism, and first blowing subassembly and second blow the subassembly and all include the installing support and blow the pole, wherein: the mounting bracket is mounted on the feeding mechanism, and the blowing rod is mounted on the mounting bracket and extends along the conveying direction of the feeding mechanism; the first end of the air blowing rod is an air inlet end connected with an external air circuit, the second end of the air blowing rod is closed, a plurality of air blowing holes with downward openings are formed in the air blowing rod, and when the transition table pushes the silicon wafer away from the feeding mechanism, the air blowing holes blow air downwards to press the silicon wafer on the transition table. The plurality of air blowing holes are arranged on the air blowing rod at equal intervals, or the distance between the air blowing holes is gradually reduced from the first end of the air blowing rod to the second end of the air blowing rod; the blow pin is configured to be capable of translating perpendicular to the conveying direction of the feeding mechanism and ascending and descending in the vertical direction.

Through setting up silicon chip pushing mechanism at pan feeding mechanism output to set up silicon chip pushing mechanism as the first subassembly and the second subassembly of blowing that are located the both sides of discharge mechanism's output, when the transition platform was pushing up the silicon chip from pan feeding mechanism, the first subassembly and the second subassembly of blowing blown blows towards the silicon chip from both sides, thereby compresses tightly the silicon chip and fixes on the transition platform, prevents that the silicon chip from inclining or skew or landing from the transition platform in the jacking process.

The blowing assembly is set to be in a blowing rod structure, and the distance between the blowing holes on the blowing assembly is gradually reduced from the first end to the second end, so that the stress uniformity of all parts of the silicon wafer can be improved. In addition, the air blowing rods are arranged to be capable of translating in the direction perpendicular to the conveying direction of the feeding mechanism, so that the distance between the two air blowing rods can be adjusted, and the air blowing rods can be compatible with silicon wafers of different sizes. The distance between the air blowing holes and the silicon wafer can be adjusted by setting the air blowing rods to be liftable, so that the downward pressure of the silicon wafer can be flexibly controlled.

In some embodiments, the mounting bracket comprises a connecting portion and a supporting portion, wherein: the connecting part is provided with a first connecting waist hole extending along the conveying direction vertical to the feeding mechanism, and the connecting part is connected to the feeding mechanism in a translation way through the first connecting waist hole; the lower end of the supporting part is provided with a second connecting waist hole extending along the vertical direction, and the lower end of the supporting part is connected to the connecting part in a lifting way through the second connecting waist hole; the air blowing rod is rotatably connected to the supporting part.

Through setting up the installing support, realized blowing the pole translation and lift adjustment, set the pole of blowing rotatable to, can adjust the angle of blowing according to different operating modes, nimble control is to the lower pressure degree of silicon chip.

In some embodiments, the laser grooving apparatus further comprises an input warping mechanism and/or an output warping mechanism, wherein: the input regulating mechanism is arranged at two sides of the feeding mechanism and is used for regulating the silicon wafers to be grooved input by the feeding mechanism; the output regulating mechanism is arranged on two sides of the discharging mechanism and used for regulating the grooved silicon wafers output by the discharging mechanism.

By arranging the input regulating mechanism, the silicon wafers to be grooved on the feeding mechanism can be regulated, so that the transition table can smoothly acquire the silicon wafers to be grooved from the feeding mechanism. By arranging the output regulating mechanism, the regulation of the slotted silicon wafers positioned on the discharging mechanism is realized.

In some embodiments, the laser grooving equipment further comprises a removing mechanism, and the removing mechanism is used for removing the unqualified silicon wafers after grooving from the discharging mechanism; the rejecting mechanism comprises a jacking assembly arranged on the inner side of the discharging mechanism, and the jacking assembly is used for upwards jacking the unqualified silicon wafers out of the discharging mechanism; or the removing mechanism comprises a carrying assembly arranged at the side of the discharging mechanism, and the carrying assembly is used for picking up unqualified silicon wafers from the discharging mechanism; or the rejecting mechanism comprises a turnover conveying assembly arranged at the discharging end of the discharging mechanism, and the turnover conveying assembly is used for conveying the unqualified silicon wafers to a waste material box below in a turnover mode.

Through setting up the mechanism of rejecting, can remove the unqualified silicon chip after the fluting from ejection of compact mechanism, prevent that unqualified silicon chip from entering into the post-processing station, promote the product percent of pass.

In some embodiments, the laser grooving mechanism comprises a frame, and a laser, a vibrating mirror lifting mechanism and a dust removing mechanism mounted on the frame, wherein: the galvanometer is positioned below the laser, the driving end of the galvanometer lifting mechanism is connected with the galvanometer, the galvanometer lifting mechanism drives the galvanometer to lift, and the laser and the galvanometer are matched to carry out slotting treatment on the silicon wafer; the dust removal mechanism is used for removing impurities generated in the slotting process.

Through the cooperation of the laser and the galvanometer, the laser grooving mechanism realizes the laser grooving of the silicon wafer. And through setting up dust removal mechanism, then realized in time cleaing away the impurity that produces in the grooving process.

In some embodiments, the linear transfer transition mechanism is provided with two transition tables, and the two transition tables alternately acquire silicon wafers to be grooved from the feeding mechanism and transfer the silicon wafers to the lower part of the laser grooving mechanism and transfer the grooved silicon wafers to the discharging mechanism under the driving of the corresponding first moving assembly and second moving assembly.

Two transition platforms will treat grooved silicon chip to move in turn and carry the below to laser grooving mechanism to move the silicon chip after slotting to discharge mechanism, promoted by a wide margin the utility model discloses a grooving efficiency.

Drawings

Fig. 1 is a schematic structural diagram of a laser grooving apparatus according to an embodiment of the present invention;

fig. 2 is a schematic structural view of a silicon wafer pressing mechanism in an embodiment of the present invention;

fig. 3 is a schematic structural diagram of the feeding mechanism, the linear transfer transition mechanism and the discharging mechanism in the embodiment of the present invention;

fig. 4 is a schematic structural view of an overturning conveying assembly in an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a laser grooving apparatus according to another embodiment of the present invention;

fig. 1 to 5 include:

feeding mechanism 1:

a conveyor belt 11;

a positioning mechanism 2;

linear transfer transition mechanism 3:

the first moving assembly 31, the second moving assembly 32, the transition table 33 and the avoidance groove 331;

laser grooving mechanism 4:

a dust removing mechanism 41;

a discharging mechanism 5;

silicon chip pushes down mechanism 6:

the first blowing assembly 61, the second blowing assembly 62, the mounting bracket 63, the blowing rod 64, the connecting part 631, the supporting part 632, the first connecting waist hole 633 and the second connecting waist hole 634;

an input arranging mechanism 7;

an output regulating mechanism 8;

the overturning conveying assembly 9:

a turnover driving mechanism 91, a turnover support 92 and a conveying belt 93.

Detailed Description

The above objects, features and advantages of the present invention can be understood more clearly and will be explained in more detail in conjunction with the drawings and the detailed description of the invention.

The structure of the existing laser grooving equipment is complex, and the silicon wafer needs to be grabbed and carried for many times, so that the risk of fragments of the silicon wafer is increased.

In order to solve the above-mentioned technical problem that current laser slotting device exists, the utility model provides a novel laser slotting device.

As shown in fig. 1, the utility model discloses a laser grooving equipment includes that pan feeding mechanism 1, positioning mechanism 2, orthoscopic move carry transition mechanism 3, laser grooving mechanism 4 and discharge mechanism 5, wherein:

the positioning mechanism 2 is arranged right above the output end of the feeding mechanism 1, and is used for photographing and positioning the silicon wafer to be grooved so as to acquire the position information of the silicon wafer to be grooved.

The feeding mechanism 1, the linear transfer transition mechanism 3 and the discharging mechanism 5 are sequentially arranged along the same straight line, the linear transfer transition mechanism 3 reciprocates between the feeding mechanism 1 and the discharging mechanism 5, and the laser grooving mechanism 4 is arranged between the feeding mechanism 1 and the discharging mechanism 5 and is positioned above the movement path of the linear transfer transition mechanism 3.

The linear transfer transition mechanism 3 is used for transferring the silicon wafer to be grooved from the feeding mechanism 1 to the position below the laser grooving mechanism 4 and transferring the grooved silicon wafer to the discharging mechanism 5.

The utility model discloses a laser slotting device's working process as follows:

the feeding mechanism 1 conveys the silicon wafers to be grooved towards the linear transfer transition mechanism 3.

When the silicon wafer to be grooved is conveyed to the output end of the feeding mechanism 1, the positioning mechanism 2 photographs the silicon wafer to be grooved to implement photographing positioning so as to acquire the position information of the silicon wafer to be grooved.

The linear transfer transition mechanism 3 obtains the silicon wafer to be grooved from the output end of the feeding mechanism 1, and transfers the silicon wafer to be grooved to the lower part of the laser grooving mechanism 4.

The laser grooving mechanism 4 performs grooving processing on the silicon wafer.

The linear transfer transition mechanism 3 transfers the grooved silicon wafer to the discharge mechanism 5, and the discharge mechanism 5 outputs the grooved silicon wafer.

It is visible, the utility model discloses a laser slotting device has realized automatic feeding, automatic fluting and the automatic unloading to the silicon chip. Particularly, the utility model discloses a laser slotting device, pan feeding mechanism 1 wherein, orthoscopic move and carry transition mechanism 3 and discharge mechanism 5 and be located same straight line, and orthoscopic move and carry transition mechanism 3 and can move the silicon chip of treating the fluting from pan feeding mechanism 1 and carry to the below of laser slotting mechanism 4 to move the silicon chip after will slotting to discharge mechanism 5 on.

The silicon wafer continuously finishes the operations of feeding, slotting and blanking on a linear conveying path, and the silicon wafer does not need to be grabbed and carried in the whole treatment process, so that the risk of breaking the silicon wafer is greatly reduced.

As shown in fig. 2, the linear transfer transition mechanism 3 optionally includes a first moving assembly 31, a second moving assembly 32 and a transition table 33, wherein: the second moving assembly 32 is arranged at the driving end of the first moving assembly 31, the transition table 33 is arranged at the driving end of the second moving assembly 32, and the first moving assembly 31 is used for driving the transition table 33 to reciprocate between the feeding mechanism 1 and the discharging mechanism 5. The transition table 33 is provided with an avoiding groove 331 for avoiding the feeding mechanism 1 and the discharging mechanism 5.

The linear transfer transition mechanism 3 works as follows:

when the transition table 33 needs to obtain the silicon wafer to be grooved from the feeding mechanism 1, the second moving assembly 32 first drives the transition table 33 to descend to a low position, and then the first moving assembly 31 drives the transition table 33 to move towards the feeding mechanism 1 until the transition table 33 moves below the output end of the feeding mechanism 1. Then, the second moving assembly 32 drives the transition table 33 to rise to a first predetermined height, in this process, the output end of the feeding mechanism 1 enters the avoidance groove on the transition table 33, and the silicon wafer to be grooved on the output end of the feeding mechanism 1 is jacked up by the transition table 33 so as to be transitioned onto the transition table 33.

After the laser grooving mechanism 4 finishes grooving the silicon wafer, the second moving assembly 32 drives the transition table 33 to descend and return to the original position, so that the avoidance groove on the transition table 33 is at the same height as the input end of the discharging mechanism 5. The first movement assembly 31 then drives the transition table 33 towards the outfeed mechanism 5, during which the input end of the outfeed mechanism 5 is inserted into an escape slot on the transition table 33. Then, the second moving assembly 32 drives the transition table 33 to descend to a second height, in the process, the input end of the discharging mechanism 5 floats upwards to form an avoiding groove, and the grooved silicon wafer on the transition table 33 is downwards overlapped onto the input end of the discharging mechanism 5.

As shown in fig. 2, optionally, two parallel conveyor belts 11 are disposed at the output end of the feeding mechanism 1 and the input end of the discharging mechanism 5, and correspondingly, two avoiding grooves for avoiding the conveyor belts are disposed on the transition table 33. Thus, as described above, when the second moving assembly 32 drives the transition table 33 to ascend to the first predetermined height, the two conveyor belts 11 at the output end of the feeding mechanism 1 enter the two avoiding grooves on the transition table 33, and the silicon wafers to be grooved on the two conveyor belts 11 at the output end of the feeding mechanism 1 transition to the transition table 33. When the transition table 33 descends to the second height, the two conveyor belts 11 at the input end of the discharging mechanism 5 float upwards out of the two avoidance grooves on the transition table 33, and the silicon wafer after grooving on the transition table 33 falls onto the two conveyor belts 11 at the input end of the discharging mechanism 5.

Optionally, a plurality of adsorption holes are further formed in the transition table 33, and the adsorption holes are arranged to avoid the avoiding groove 331. The adsorption hole is used for implementing the adsorption of silicon chip fixedly, prevents that the silicon chip from taking place offset or landing when transition platform 33 removes, avoids avoiding the groove 331 with the adsorption hole and sets up, damages the lamellar body when can preventing adsorbing.

Optionally, in order to further improve the slotting efficiency, the linear transfer transition mechanism 3 is provided with two transition tables 33, the two transition tables 33 are driven by the respective corresponding first moving assembly 31 and second moving assembly 32 to alternately obtain the silicon wafer to be slotted from the feeding mechanism 1, transfer the silicon wafer to the lower side of the laser slotting mechanism 4, and transfer the slotted silicon wafer to the discharging mechanism 5.

Optionally, the utility model provides a straight-line moves and carries transition mechanism 3 still includes rotating assembly, and rotating assembly sets up the drive end at second removal subassembly 32, and transition platform 33 sets up the drive end at rotating assembly. The rotating component drives the transition table 33 to rotate according to the position information of the silicon wafer provided by the positioning mechanism 2 so as to complete the angle adjustment of the silicon wafer to be grooved, so that the placing angle of the silicon wafer meets the preset grooving requirement, and thus, after the silicon wafer is transferred to the position below the laser grooving mechanism 4, the laser grooving mechanism 4 can implement the grooving operation.

Certainly, the rotating assembly may not be provided, and after the silicon wafer to be grooved is moved below the laser grooving mechanism 4, the laser grooving mechanism 4 performs grooving on the silicon wafer according to the position information of the silicon wafer to be grooved, which is obtained by the positioning mechanism 2, that is, the laser grooving mechanism 4 generates a planned path for controlling the laser to move according to the position information of the silicon wafer to be grooved.

As shown in fig. 1, it is optional, the utility model discloses a laser slotting device is still including setting up the silicon chip pushing mechanism 6 at pan feeding mechanism 1's output, and transition platform 33 is pushing up the silicon chip from pan feeding mechanism 1 time, and silicon chip pushing mechanism 6 is used for compressing tightly the silicon chip and fixes at transition platform 33, prevents the silicon chip landing in jacking process.

As shown in fig. 3, optionally, the silicon wafer pressing mechanism 6 includes a first blowing assembly 61 and a second blowing assembly 62 symmetrically disposed at two sides of the output end of the feeding mechanism 1, and each of the first blowing assembly 61 and the second blowing assembly 62 includes a mounting bracket 63 and a blowing rod 64, where the mounting bracket 63 is mounted on the feeding mechanism 1, and the blowing rod 64 is connected to the mounting bracket 63 and extends along the conveying direction of the feeding mechanism 1.

When the transition table 33 pushes the silicon wafer away from the feeding mechanism 1, two air blowing rods 64 blow air towards the silicon wafer from two sides, so that the silicon wafer is tightly pressed and fixed on the transition table 33. The silicon wafer is compressed and fixed in an air blowing mode, so that the risk of pressure loss of the silicon wafer can be reduced. In addition, the blowing rod 64 is used as a pressing part, so that the shielding of the positioning mechanism 2 can be reduced, and the positioning effect of the positioning mechanism 2 on the silicon wafer is ensured.

Optionally, the first end of the blowing rod 64 is an air inlet end connected to an external air path, the second end of the blowing rod 64 is closed, and the blowing rod 64 is provided with a plurality of blowing holes with downward openings. The high pressure air in the external air path enters the blow pin 64 through the first end of the blow pin 64 and is blown out through the blow hole.

The further inside the blow pin 64 from the first end of the blow pin 64, the lower the air pressure. Therefore, in order to ensure the stress uniformity across the silicon wafer, the distance between the blow holes is set to be gradually reduced from the first end of the blow pin 64 to the second end of the blow pin 64 (as shown by the arrow in fig. 3) as an option.

Of course, a plurality of blow holes are also provided on the blow pin 64 at equal intervals in the extending direction of the blow pin 64.

Alternatively, the blow pin 64 is configured to be capable of translating perpendicular to the conveying direction of the feeding mechanism 1, and ascending and descending in the vertical direction. The distance between the two air blowing rods 64 can be adjusted by controlling the air blowing rods 64 to move horizontally in a direction perpendicular to the conveying direction of the feeding mechanism 1, so that silicon wafers of different sizes are compatible, and the distance between the air blowing holes and the silicon wafers can be adjusted by controlling the air blowing rods 64 to ascend and descend, so that the downward pressure of the silicon wafers is flexibly controlled.

With continued reference to fig. 3, optionally, the mounting bracket 63 includes a connecting portion 631 and a support portion 632, wherein: the connecting portion 631 is provided with a first connecting waist hole 633 extending perpendicular to the conveying direction of the feeding mechanism 1, and the connecting portion 631 is connected to the feeding mechanism 1 in a translatable manner through the first connecting waist hole 633. The lower end of the supporting portion 632 is provided with a second connecting waist hole 634 extending in a vertical direction, and the lower end of the supporting portion 632 is liftably connected to the connecting portion 631 via the second connecting waist hole 634.

Optionally, the blowing rod 64 is rotatably connected to the supporting portion 632, and the blowing direction of the blowing hole on the blowing rod 64 can be adjusted by rotating the blowing rod 64, so that the blowing hole can perform blowing compression on the silicon wafer.

As shown in fig. 1, optional, the utility model provides a laser slotting device is still including setting up the regular mechanism 7 of input in pan feeding mechanism 1 both sides, and the regular mechanism 7 of input is used for implementing the regulation to the grooved silicon chip of treating of pan feeding mechanism 1 input for the both sides edge of treating grooved silicon chip is parallel with the direction of delivery of pan feeding mechanism 1, finally guarantees that transition platform 33 can acquire smoothly from pan feeding mechanism 1 and treat grooved silicon chip.

Optionally, the utility model provides a laser slotting device is still including setting up the regular mechanism 8 of output in 5 both sides of discharge mechanism, and the regular mechanism 8 of output is used for implementing the regulation to the silicon chip after the fluting on the discharge mechanism 5 from both sides for the both sides edge of the silicon chip after the fluting is parallel with discharge mechanism 5's direction of delivery.

Optionally, the utility model provides a laser slotting device is still including rejecting the mechanism, rejects the mechanism and is used for removing the unqualified silicon chip after slotting from discharge mechanism 5. Namely, the discharging mechanism 5 only conveys the qualified silicon wafers after being grooved to the post-processing station, and the unqualified silicon wafers after being grooved are removed from the discharging mechanism 5 in advance and cannot flow into the post-processing station.

As shown in fig. 1 and 4, optionally, the removing mechanism is an overturning conveying assembly 9 disposed at the discharging end of the discharging mechanism 5, and the overturning conveying assembly 9 is used for overturning and conveying the unqualified silicon wafers into a waste material box below, so as to implement recycling and storage of the unqualified silicon wafers.

As shown in fig. 4, the turnover conveying assembly 9 includes a turnover driving mechanism 91, a turnover support 92, and a conveying belt 93, wherein the turnover support 92 is connected to a driving end of the turnover driving mechanism 91, and the conveying belt 93 is mounted on the turnover support 92. The turnover driving mechanism 91 drives the turnover support 92 to turn over and switch between a horizontal state and an inclined state, when the turnover support 92 turns over to the horizontal state, the conveying belt 93 is in butt joint with the discharging mechanism 5, and the silicon wafers on the discharging mechanism 5 can smoothly transit to the conveying belt 93 and continue to be conveyed backwards. When the turnover support 92 is turned over to an inclined state, the silicon wafers on the conveyer belt 93 are conveyed downwards into a waste box below.

The rejecting mechanism can also adopt other feasible implementation manners, for example, the rejecting mechanism comprises a jacking assembly arranged on the inner side of the discharging mechanism 5, and the jacking assembly is used for jacking the unqualified silicon wafers out of the discharging mechanism 5. For another example, the removing mechanism comprises a carrying assembly arranged at the side of the discharging mechanism 5, and the carrying assembly is used for picking up unqualified silicon wafers from the discharging mechanism 5 and carrying the unqualified silicon wafers into a waste box.

Optionally, the utility model provides a laser grooving mechanism 4 includes the installing support and installs laser instrument, the mirror that shakes, the mirror elevating system that shakes and dust removal mechanism on the installing support, wherein: the vibrating mirror is located below the laser, the driving end of the vibrating mirror lifting mechanism is connected with the vibrating mirror, the vibrating mirror lifting mechanism drives the vibrating mirror to lift, and the laser and the vibrating mirror are matched to perform slotting processing on the silicon wafer.

As shown in fig. 5, optionally, the laser grooving mechanism 4 further includes a dust removing mechanism 41 disposed on the mounting bracket, and the dust removing mechanism 41 is used for removing impurities generated in the grooving process.

The invention has been described above with a certain degree of particularity sufficient to make a detailed description thereof. It will be understood by those of ordinary skill in the art that the description of the embodiments is merely exemplary and that all changes that may be made without departing from the true spirit and scope of the present invention are intended to be within the scope of the present invention. The scope of the invention is defined by the appended claims rather than by the foregoing description of the embodiments.

Claims (11)

1. The utility model provides a laser slotting device which characterized in that for to the silicon chip fluting, laser slotting device includes pan feeding mechanism, positioning mechanism, orthoscopic moves and carries transition mechanism, laser slotting mechanism and discharge mechanism, wherein:

the positioning mechanism is arranged right above the output end of the feeding mechanism and used for photographing and positioning the silicon wafer to be grooved;

the linear transfer transition mechanism reciprocates between the feeding mechanism and the discharging mechanism, and the laser grooving mechanism is arranged between the feeding mechanism and the discharging mechanism and is positioned above the motion path of the linear transfer transition mechanism;

the linear transfer transition mechanism is used for transferring the silicon wafer to be grooved from the feeding mechanism to the position below the laser grooving mechanism and transferring the grooved silicon wafer to the discharging mechanism.

2. The laser grooving apparatus of claim 1, wherein the linear transfer transition mechanism comprises a first moving assembly, a second moving assembly, and a transition table, the second moving assembly being disposed at a drive end of the first moving assembly, the transition table being disposed at a drive end of the second moving assembly;

the first moving assembly is used for driving the transition table to reciprocate between the feeding mechanism and the discharging mechanism;

an avoidance groove is formed in the transition table and used for avoiding the feeding mechanism and the discharging mechanism;

the second moving assembly is used for driving the transition table to jack up so as to jack up the silicon wafer to be grooved from the feeding mechanism and transition the silicon wafer to be grooved onto the transition table; the second moving assembly is further used for driving the transition table to descend so as to downwards place the grooved silicon wafer onto the discharging mechanism.

3. The laser grooving apparatus of claim 2, wherein the linear transfer transition mechanism further comprises a rotation assembly, the rotation assembly is disposed at a driving end of the second moving assembly, the transition table is disposed at a driving end of the rotation assembly, and the rotation assembly is configured to drive the transition table to rotate so as to adjust a placement position of the silicon wafer to be grooved; or

The laser grooving mechanism is configured to plan a moving path of the grooving laser based on the position information of the silicon wafer to be grooved, which is acquired by the positioning mechanism.

4. The laser grooving apparatus of claim 2, wherein the transition table has a plurality of suction holes disposed thereon, the suction holes avoiding the avoidance slot.

5. The laser grooving apparatus of claim 2, further comprising a silicon wafer hold-down mechanism disposed at an output end of the feed mechanism;

silicon chip pushes down mechanism and is in including the symmetry the first subassembly and the second of blowing of pan feeding mechanism's output both sides blow the subassembly, first blow the subassembly with the second blows the subassembly and all includes installing support and blowing pole, wherein:

the mounting bracket is mounted on the feeding mechanism, the blowing rod is mounted on the mounting bracket and extends along the conveying direction of the feeding mechanism, and the blowing rod is configured to be capable of translating perpendicular to the conveying direction of the feeding mechanism and ascending and descending in the vertical direction;

the first end of the air blowing rod is an air inlet end connected with an external air path, the second end of the air blowing rod is closed, a plurality of air blowing holes with downward openings are formed in the air blowing rod, and the air blowing holes are arranged on the air blowing rod at equal intervals, or the distance between the air blowing holes is gradually reduced from the first end of the air blowing rod to the second end of the air blowing rod;

when the transition table pushes the silicon wafer away from the feeding mechanism, the air blowing holes blow air downwards to press the silicon wafer on the transition table.

6. The laser grooving apparatus of claim 5, wherein the mounting bracket comprises a connecting portion and a support portion, wherein:

the connecting part is provided with a first connecting waist hole extending along the conveying direction vertical to the feeding mechanism, and the connecting part is connected to the feeding mechanism in a translation manner through the first connecting waist hole;

the lower end of the supporting part is provided with a second connecting waist hole extending along the vertical direction, and the lower end of the supporting part is connected to the connecting part in a lifting manner through the second connecting waist hole;

the blow pin is rotatably mounted on the support portion.

7. The laser grooving apparatus of claim 1, wherein the laser grooving apparatus further comprises a detection mechanism, wherein:

the detection mechanism is arranged above the discharging mechanism and used for detecting the slotting quality of the slotted silicon wafer.

8. The laser grooving apparatus of claim 1, further comprising an input warping mechanism and/or an output warping mechanism, wherein:

the input regulating mechanism is arranged at two sides of the feeding mechanism and is used for regulating the silicon wafers to be grooved input by the feeding mechanism;

the output regulating mechanism is arranged on two sides of the discharging mechanism and used for regulating the silicon wafers output by the discharging mechanism after being grooved.

9. The laser grooving apparatus of claim 1, further comprising a reject mechanism for removing the grooved rejected silicon wafers from the outfeed mechanism;

the rejecting mechanism comprises a jacking component arranged on the inner side of the discharging mechanism, and the jacking component is used for upwards jacking the unqualified silicon wafers out of the discharging mechanism; or alternatively

The removing mechanism comprises a carrying assembly arranged on the side of the discharging mechanism, and the carrying assembly is used for picking up the unqualified silicon wafers from the discharging mechanism; or alternatively

The removing mechanism comprises an overturning conveying assembly arranged at the discharging end of the discharging mechanism, and the overturning conveying assembly is used for overturning and conveying the unqualified silicon wafers to a waste material box below the unqualified silicon wafers.

10. The laser grooving apparatus of claim 1, wherein the laser grooving mechanism comprises a frame and a laser, a galvanometer lifting mechanism, and a dust removal mechanism mounted on the frame, wherein:

the galvanometer is positioned below the laser, the driving end of the galvanometer lifting mechanism is connected with the galvanometer, the galvanometer lifting mechanism drives the galvanometer to lift, and the laser and the galvanometer are matched to perform slotting treatment on a silicon wafer;

the dust removal mechanism is used for removing impurities generated in the slotting process.

11. The laser grooving apparatus of claim 2, wherein the linear transfer transition mechanism is provided with two transition tables, and the two transition tables alternately acquire the silicon wafer to be grooved from the feeding mechanism and transfer the silicon wafer to the position below the laser grooving mechanism and transfer the grooved silicon wafer to the discharging mechanism under the driving of the corresponding first moving assembly and the second moving assembly.

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