CN218634670U

CN218634670U - Double-shell type shielding cover

Info

Publication number: CN218634670U
Application number: CN202222383276.5U
Authority: CN
Inventors: 邱硕; 邱丹; 林煜旋; 毛新磊
Original assignee: Suzhou Xiaoyijia Optronics Technology Co ltd
Current assignee: Suzhou Xiaoyijia Optronics Technology Co ltd
Priority date: 2022-09-08
Filing date: 2022-09-08
Publication date: 2023-03-14
Anticipated expiration: 2032-09-08

Abstract

The utility model discloses a double-shell type shield cover, including base plate and open end and the sealed fixed connection's of base plate shield cover, form the encapsulation space that is used for encapsulating electronic device between shield cover and the base plate, its characterized in that, shield cover includes: first compound shell and the compound shell of second that set up along gradually distancing base plate direction interval, first compound shell includes first body and the compound first shielding layer at first body surface, and the compound shell of second includes second body and the compound second shielding layer at second body internal surface, forms between first compound shell and the compound shell of second and has gapped shielding space. The utility model discloses at least, include following advantage: the shielding effect can be greatly enhanced.

Description

Double-shell type shielding cover

Technical Field

The utility model relates to an acoustoelectric field, more specifically say, relate to a double shell formula shield cover.

Background

The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.

With the progress of society and the development of technology, in recent years, the volume of electronic products and sensors is decreasing, and the performance requirements of people on these miniaturized products are also increasing, so that the volume of electronic parts matched with the miniaturized products is also decreasing, and the performance and consistency are also increasing. In recent years, the performance of miniaturized products is optimized, which makes electromagnetic interference between a plurality of electronic devices inside the miniaturized products stronger and stronger, and especially makes the integrated circuit be interfered by radiation signals of the antenna, thereby affecting the normal working performance of the integrated circuit. Therefore, there is a need to improve the packaging of electronic devices, thereby improving the electronic device's resistance to electronic interference and improving its operational reliability.

At present, the encapsulation of the chip of the traditional small sensor is a single-layer metal shell structure, and in practical application, the sensor with the single-layer shell is found to be interfered by electromagnetic field signals due to insufficient shielding capability under the condition of a strong electromagnetic field, so that noise is generated, and the normally output sensing signals are influenced.

It should be noted that the above background description is only for the sake of clarity and complete description of the technical solutions of the present invention, and is set forth for facilitating understanding of those skilled in the art. These solutions are not considered to be known to the person skilled in the art merely because they have been set forth in the background section of the present invention.

Disclosure of Invention

The to-be-solved technical problem of the utility model is to provide a double shell formula shield cover, greatly improved the shielding effect.

In order to solve the technical problem, the utility model provides a double shell formula shield cover, including base plate and open end with the sealed fixed connection's of base plate shield cover, the shield cover with form the encapsulation space that is used for encapsulating electronic device between the base plate, a serial communication port, the shield cover includes: along gradually distancing first compound shell and the compound shell of second that the base plate direction interval set up, first compound shell includes first body and the first shielding layer of compound at first body surface, the compound shell of second includes second body and the second shielding layer of compound at second body internal surface, first compound shell with form between the compound shell of second and have gapped shielding space.

Further, the first composite shell and the second composite shell are respectively connected to the substrate by a connection portion and the first composite shell is not common to the second composite shell.

Further, a first chip and a second chip are further mounted on the substrate, the second chip is used for receiving physical signals, and the first chip is used for receiving signals of the first chip.

Furthermore, an interaction hole is formed in the substrate and used for connecting a physical wire with the second chip so as to transmit signals to the second chip.

Furthermore, the first composite shell and the second composite shell are respectively provided with interaction holes for being connected with the outside, and the two interaction holes are arranged in a staggered manner.

Further, the connecting portion is a pad.

Furthermore, the clearance of the shielding space is less than or equal to 1.5mm.

Furthermore, the thicknesses of the first shielding layer and the second shielding layer are respectively less than or equal to 0.5mm.

Furthermore, the first shielding layer and the second shielding layer are compounded in a mode of electroplating, chemical vapor deposition, physical vapor deposition, spraying, printing or injection molding.

Furthermore, the first shielding layer and the second shielding layer are made of gold, silver, copper, nickel, graphene, conductive cloth or conductive rubber strips.

Borrow by above technical scheme, the beneficial effects of the utility model are as follows:

the utility model discloses a double-shell type shield cover, through the form that sets up two-layer composite shell, can greatly strengthen the shielding effect, and, the first composite shell of this application is the first shielding layer of surface recombination at first body, the composite shell of second is the second shielding layer of internal surface recombination at the second body, the processing of the composite shell of being more convenient for of this kind of mode, the effectual processing degree of difficulty that has reduced the processing cost, the mode that the interactive hole adopted staggered arrangement in this application embodiment 2 can be followed the structure and avoided the dust to fall into the encapsulation space effectively.

Drawings

FIG. 1 is a schematic structural diagram of embodiment 1 of the present invention;

fig. 2 is a schematic structural diagram of embodiment 2 of the present invention.

Wherein:

21. a first composite shell; 20. a second composite shell; 1. a second body; 2. a second shielding layer; 3. a first shielding layer; 4. a first body; 5. a first chip; 6. a second chip; 7. an interaction hole; 8. a substrate; 9. a bonding pad; 10. a bonding pad; 11. packaging the space; 12. shielding the space;

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

It should be noted that, in the description of the present invention, the terms "first", "second", etc. are used for descriptive purposes only and to distinguish similar objects, and there is no order between the two, and no indication or suggestion of relative importance should be understood. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

Example 1

Referring to fig. 1, a dual-shell type shielding can of embodiment 1 includes a substrate and a shielding can with an open end hermetically and fixedly connected to the substrate, where the substrate is a circuit board with conductive traces, and a packaging space for packaging an electronic device is formed between the shielding can and the substrate, in this embodiment, the electronic device mainly includes a first chip and a second chip mounted on the substrate, where the second chip is used for receiving a physical signal, and the first chip is used for receiving a signal of the first chip, and specifically, in order to obtain a more effective shielding effect, the shielding can of the present application includes: along gradually keeping away the first compound shell and the compound shell of second that base plate direction interval set up, first compound shell includes first body and compound first shielding layer at first body surface, the compound shell of second includes second body and the compound second shielding layer at second body internal surface, first compound shell with form between the compound shell of second and have gapped shielding space in order to guarantee not switching on between first compound shell and the compound shell of second, and is concrete, in order to guarantee the shielding effect, the clearance in the shielding space of this application is less than or equal to 1.5mm, first shielding layer with the thickness of second shielding layer is less than or equal to 0.5mm respectively, simultaneously, because the shielding layer of the first compound shell of this application becomes at the surface outward, the shielding of the compound shell of second becomes at the internal surface, consequently need not to compound the shielding layer to compound shell's whole, therefore the processing of the compound shell of this application is more convenient, specifically is: the shielding layer is compounded on the material belt, and then the material belt with the shielding layer is punched to form the required composite shell.

Specifically, the first composite shell and the second composite shell are respectively connected to the substrate through connecting portions, and the connecting portions of the first composite shell and the second composite shell are independently grounded, wherein the connecting portions of the first composite shell and the second composite shell are pads.

Specifically, the substrate is provided with an interaction hole for connecting a physical wire with the second chip so as to transmit signals to the second chip.

The utility model provides a first shielding layer with the compound mode of second shielding layer is for electroplating, chemical vapor deposition, physical vapor deposition, spraying, printing or mould plastics, first shielding layer with the material of second shielding layer is the metal or nonmetal material that has shielding function, and wherein metal material is gold, silver, copper or nickel, and nonmetal material is: graphene, conductive cloth, or conductive rubber strips.

Example 2

The rest is the same as that in embodiment 1, and is different from embodiment 1 in that no interaction hole is formed in the substrate, interaction holes for connecting with the outside are formed in the first composite shell and the second composite shell, and the two interaction holes are preferably arranged in a staggered manner in order to effectively prevent dust from falling into a packaging space.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitution or transformation made by the technical personnel in the technical field on the basis of the utility model is within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.

Claims

1. A double shell formula shield cover, including base plate and open end with the sealed fixed connection's of base plate shield cover, the shield cover with form the encapsulation space that is used for encapsulating electronic device between the base plate, its characterized in that, the shield cover includes: follow gradually far away first compound shell and the compound shell of second that the base plate direction interval set up, first compound shell includes first body and the first shielding layer of compound at first body surface, the compound shell of second includes the second body and the compound second shielding layer at second body internal surface, first compound shell with form between the compound shell of second and have gapped shielding space.

2. The double-shelled shielding cage of claim 1, wherein the first composite shell and the second composite shell are each connected to the base plate by a connection and the first composite shell is not common to the second composite shell.

3. The double-shell shielding cage of claim 1 or 2, wherein the substrate further comprises a first chip and a second chip, the second chip is used for receiving physical signals, and the first chip is used for receiving signals of the first chip.

4. The double-shell shielding case of claim 3, wherein the substrate is provided with an interaction hole for connecting a physical wire with the second chip for signal transmission of the second chip.

5. The double-shell shielding case of claim 3, wherein the first composite shell and the second composite shell are respectively provided with interaction holes for connecting with the outside, and the interaction holes are arranged in a staggered manner.

6. A double shell shielding cage as claimed in claim 2, wherein the connection portions are pads.

7. A double shell shielding cage according to claim 1, wherein the shielding space has a gap of ≤ 1.5mm.

8. The double shell shielding cage of claim 1, wherein the thickness of said first shielding layer and said second shielding layer is ≦ 0.5mm, respectively.

9. The double-shell shielding case of claim 1, wherein the first shielding layer and the second shielding layer are formed by electroplating, chemical vapor deposition, physical vapor deposition, spraying, printing or injection molding.

10. The double-shell shielding case of claim 1, wherein the first shielding layer and the second shielding layer are made of gold, silver, copper, nickel, graphene, conductive cloth or conductive rubber strips.