CN218632033U - Chip packaging structure convenient to identify - Google Patents

Abstract

The application discloses chip packaging structure who conveniently discerns belongs to the packaging technology field. The cover plate mainly comprises a shell and a cover plate, wherein two opposite sides of the bottom of the cover plate are respectively provided with a clamping plate, the two ends of the shell are clamped by the clamping plates, one positioning groove is formed in the lower surface of the cover plate and one positioning groove is formed in the surface of the shell, the other positioning groove is provided with a plurality of positioning piles corresponding to the positioning grooves in position, the positioning grooves and the positioning piles are not arranged with the center of the lower surface of the cover plate or the center of the surface of the shell as the symmetric center and are distributed in a central symmetric mode, a plurality of marks are arranged on the cover plate, the cover plate is sleeved on the upper side of the shell, the positioning grooves are matched with the positioning piles, on one hand, when the installation direction of the cover plate is wrong, the cover plate cannot be attached to the shell, and the user is prompted that the installation direction is wrong; on the other hand fixes a position between apron and the casing, lets the sign mark each stitch, and the convenient to use person discerns the stitch fast. The chip packaging structure convenient to identify achieves the effect of being convenient for identifying the pins.

Description

Chip packaging structure convenient to identify

Technical Field

The application relates to the technical field of chip packaging, in particular to a chip packaging structure convenient to identify.

Background

The chip package is a housing for mounting a semiconductor integrated circuit chip, and plays roles of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, pins at two sides of the housing are connected with contacts on the chip, and the pins are used for connecting the chip to a circuit board and establishing connection with other devices.

The common way of chip packaging is plastic packaging: and placing the chip and the carrier plate after the wire bonding in a mold, injecting epoxy resin, and then baking, hardening, molding and encapsulating.

In order to easily identify the pins in the chip package structure in the subsequent process, pin marks, which are generally recessed structures, are usually formed on the top surface of the chip package structure when the chip package structure is formed. According to the current mold and process, the gate contact is usually located within the range of the pin mark, and the gate contact has a rough surface, so the mark is often not clearly recognized, resulting in slow mark recognition or wrong recognition.

Therefore, it is desirable to provide a chip package structure with easy identification to solve the above problems.

It is noted that the above information disclosed in this background section is only for background purposes in understanding the inventive concept and, therefore, it may contain information that does not constitute prior art.

Disclosure of Invention

Based on the above problems in the prior art, the embodiments of the present application are directed to: the chip packaging structure convenient to identify is provided, and the effect of conveniently identifying the pins is achieved.

The technical scheme adopted by the application for solving the technical problem is as follows: a chip packaging structure convenient to identify comprises a shell, wherein a plurality of pins are respectively fixed on two opposite sides of the shell;

still including the apron, the relative both sides of apron bottom all are provided with splint, splint grasp the both ends that the casing was not provided with the stitch, one side of one in apron lower surface and the housing face is provided with at least one first constant head tank, and another then is provided with the first spud that corresponds with first constant head tank position, the opposite side of one in apron lower surface and the housing face is provided with at least one second constant head tank, and another then is provided with the second spud that corresponds with second constant head tank position, between first constant head tank and second constant head tank or the second spud, do not use apron lower surface center or housing face center as the center of symmetry, become central symmetric distribution, be provided with a plurality of signs that correspond with the stitch position on the apron.

In the process that needs carry out the discernment to the stitch, establish the casing upside with the apron cover, through first spud and second spud respectively with first spud and second constant head tank cooperation, when apron installation direction is wrong, let the apron unable with the casing laminating, suggestion user installation direction mistake, on the other hand will be fixed a position between apron and the casing, ensure that the sign corresponds last stitch respectively, convenient to use person discerns the stitch fast.

Furthermore, the casing is not provided with the both ends of stitch and is protruding, forms the first inclined plane that is close to the casing upside, and is close to the second inclined plane of casing downside, the crossing department of first inclined plane and second inclined plane is established to the intersect line, the splint are close to the lower extreme of casing one side and all are fixed with the lug, the lug is established to the bump apart from the farthest point of splint inner wall, the bump is greater than the distance of intersect line to casing upper surface to the apron for fix the apron on the casing.

Furthermore, the value obtained by subtracting the distance from the intersection line to the upper surface of the shell from the distance from the salient point to the cover plate is smaller than the length of the first positioning pile and the length of the second positioning pile, so that the cover plate is prevented from being installed on the shell in the wrong direction.

Furthermore, the upper side and the lower side of the convex block are both inclined planes.

Further, the intersection line is close to the lower surface of the shell.

Furthermore, the distance from the lower end of the clamping plate to the lower surface of the cover plate is smaller than the thickness of the shell, so that the lower end of the clamping plate is prevented from protruding from the lower surface of the shell.

The beneficial effect of this application is: according to the chip packaging structure convenient to identify, the cover plate additionally installed is utilized to add the identification pin, so that on one hand, the situation that identification is fuzzy in the production process of the shell is avoided, on the other hand, the cover plate can be repeatedly used, the process flow that the cover plate is formed by injection molding and then the identification is formed on the cover plate by processing can be adopted, the cleaning degree of the identification is improved, and the production speed of the chip cannot be influenced; meanwhile, the user can judge the direction of the shell through the distribution of the first positioning piles, the second positioning piles, the first positioning grooves or the second positioning grooves on the shell, so that the direction is accurate when the chip is installed.

In addition to the objects, features and advantages described above, other objects, features and advantages of the present invention are also provided. The present invention will be described in further detail below with reference to the drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are included to illustrate an exemplary embodiment of the invention and not to limit the invention. In the drawings:

FIG. 1 is a general schematic diagram of a chip package structure convenient for identification according to the present application;

FIG. 2 is an exploded view of the chip package structure of FIG. 1 for easy identification;

FIG. 3 is a schematic cross-sectional view of a portion of the chip package structure of FIG. 1 for easy identification;

wherein, in the figures, the various reference numbers:

1. a housing; 11. a stitch; 12. a first inclined plane; 13. a second inclined surface; 14. intersecting lines; 15. a first positioning groove; 16. a second positioning groove;

2. a housing; 21. a cover plate; 22. a splint; 23. a bump; 24. salient points; 25. a first positioning pile; 26. a second spud; 27. and (5) identifying.

Detailed Description

It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

In order to make those skilled in the art better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances for describing embodiments of the invention described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

As shown in fig. 1-3, the present application provides a chip package structure with easy identification, which includes a housing 1 and a case 2 disposed on the housing 1.

A plurality of pins 11 are fixed on two opposite sides of the shell 1, the other two ends of the shell 1 protrude to form a first inclined plane 12 close to the upper side of the shell 1 and a second inclined plane 13 close to the lower side of the shell 1, an intersection line 14 is set at the intersection of the first inclined plane 12 and the second inclined plane 13, the distance from each position on the first inclined plane 12 and the second inclined plane 13 to the intersection line 14 is inversely proportional to the distance from the center of the shell 1, the intersection line 14 is close to the lower side of the shell 1, at least one first positioning groove 15 and at least one second positioning groove 16 are respectively arranged at two ends of the upper side of the shell 1 close to the intersection line 14, the first positioning groove 15 and the second positioning groove 16 are not symmetrical about the center of the upper side of the shell 1, and are symmetrically distributed.

The cover 2 includes the apron 21 with the laminating of casing 1 upside, and apron 21 downside symmetry is provided with two splint 22, and splint 22 are located casing 1 and have both ends outside line 14, and splint 22 is made by elastic material, and in this embodiment, splint 22 is made by elastic plastic. The distance from the lower end of the clamping plate 22 to the lower side of the cover plate 21 is smaller than the thickness of the shell 1, the lower end of the clamping plate 22 close to one side of the shell 1 is fixed with a convex block 23, the farthest point of the convex block 23 from the inner wall of the clamping plate 22 is set as a convex point 24, the distance between the convex points 24 is smaller than the distance between the intersection lines 14, the upper side and the lower side of the convex block 23 are inclined planes, the distance from the convex point 24 to the lower side of the cover plate 21 is greater than the distance from the intersection lines 14 to the upper side of the shell 1, the lower side of the cover plate 21 is also fixed with a first positioning pile 25 and a second positioning pile 26 which correspond to the first positioning groove 15 and the second positioning groove 16 respectively, the heights of the first positioning pile 25 and the second positioning pile 26 are greater than the distance from the convex point 24 to the intersection lines 14 when the upper side of the shell 1 is attached to the cover plate 21, the upper side of the cover plate 21 is provided with a plurality of marks 27 which are the same as the positions of the pins 11, in the present embodiment, the marks 27 are finger lines and numbers.

In this embodiment, install the chip to the product in-process, cover 2 does not install on casing 1, and the direction of chip is judged out to user's accessible first constant head tank 15 and second constant head tank 16, is convenient for judge the chip direction fast, installs.

In the testing process, before the chip is mounted on the test circuit board, the cover case 2 is fitted to the housing 1 from the side of the housing 1 having the first positioning groove 15 and the second positioning groove 16. When the case 2 is fitted, the cover plate 21 is pressed down to bring the cover plate 21 close to the case 1 while the holding plates 22 hold both ends of the case 1 not provided with the pins 11. In the process, the projections 23 follow the first inclined surfaces 12, so that the clamping plates 22 are respectively deformed towards the side far away from the shell 1.

If the user is wrong in the direction of covering the case 2, the first positioning slot 15 will be aligned with the second positioning pin 26, and the second positioning slot 16 is aligned with the first positioning pin 25, because the center of the upper side of the case 1 is not used as the center of symmetry between the first positioning slot 15 and the second positioning slot 16, the two positioning pins are distributed in a central symmetry manner, and the first positioning pin 25 and the second positioning pin 26 correspond to the first positioning slot 15 and the second positioning slot 16, so the first positioning pin 25 and the second positioning pin 26 cannot be inserted into the second positioning slot 16 and the first positioning slot 15, respectively. Since the height of the first pegs 25 and the second pegs 26 is greater than the distance from the protruding point 24 to the intersection line 14 when the upper side of the housing 1 engages the cover plate 21, the protruding point 24 is located on the first inclined surface 12 when the user cannot further press down the casing 2 when the first pegs 25 and the second pegs 26 abut the housing 1. When the user loosened cover shell 2, elasticity through splint 22 can make lug 23 extrude first inclined plane 12, lug 23 and first inclined plane 12 mutually support this moment, make lug 23 produce the trend of moving towards casing 1 upside, lug 23 just can drive splint 22 and apron 21 and move together, thereby let casing 1 and cover shell 2 break away from, remind staff cover shell 2 installation direction mistake, reach the effect of avoiding cover shell 2 installation error, thereby avoid follow-up stitch 11 mistake of discerning.

If the user sets up the direction accuracy of cover case 2, first constant head tank 15 and second constant head tank 16 just can be respectively to last first spud 25 and second spud 26, consequently first spud 25 and second spud 26 can insert first spud 15 and second spud 16 respectively, when making the user press apron 21, last apron 21 can laminate with casing 1, because the distance of bump 24 to apron 21 downside is greater than the distance of intersect 14 to casing 1 upside, lug 23 just can contact with second inclined plane 13 this moment. When the user releases the cover plate 21, the protrusion 23 cooperates with the second inclined surface 13, so that the protrusion 23 drives the clamping plate 22 and the cover plate 21 to tend to move toward the lower side and the housing 1, thereby keeping the cover plate 21 attached to the housing 1 and preventing the housing 2 from being removed from the housing 1.

After the casing 2 is sleeved on the housing 1, the mark 27 is aligned with the stitch 11 through the positioning formed by the first positioning pile 25 and the second positioning pile 26 respectively inserted into the first positioning groove 15 and the second positioning groove 16, so that the mark 27 indicates the number of each stitch 11 respectively.

Because splint 22 lower extreme is less than casing 1's thickness to the distance of apron 21 downside, consequently 2 covers of cover case are established on casing 1 back, and splint 22 lower extreme can not be outstanding from apron 21 downside to when the chip is installed on the test circuit board, avoid splint 22 to lead to in the stitch 11 can not fully insert the stitch hole in the test circuit board, guarantee the normal installation of chip, ensure the accuracy of test.

In the testing process, the user can quickly distinguish the pin 11 through the mark 27, on one hand, after the user judges the pin 11, the respective testing is convenient to carry out, the testing speed is improved, or the pin 11 is prevented from being judged wrongly when the testing is carried out, and the testing accuracy is improved; on the other hand, when the chip goes wrong, the user can conveniently and quickly judge the pin 11 which goes wrong and record, so that the recording speed and the accuracy of the chip which goes wrong are improved.

After the test is finished, the user can pull out the casing 2 from the casing 1, and the casing 2 is conveniently installed on the next casing 1 for testing.

Through letting in advance first constant head tank 15 and second constant head tank 16 on the chip of different grade type set up each part the same of mode, for example the quantity and the position of first constant head tank 15 and second constant head tank 16 on every chip all set up differently, can be when the user selects cover shell 2 by mistake, let first constant head tank 25 and second constant head tank 26 can't insert first constant head tank 15 or second constant head tank 16 equally, thereby let cover shell 2 drop from casing 1, avoid the user to select cover shell 2 by mistake, reach the problem of avoiding user's cover shell 2 to select by mistake, accuracy when ensureing to test.

Through separating sign 27 and casing 1, because the reuse of cover 2, can mould plastics at cover 2 and accomplish the back, add sign 27 to cover 2 processing again, avoid appearing the unclear condition of sign, and because cover 2 produces in addition, can not influence the production of chip.

The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be discussed further in subsequent figures.

For ease of description, spatially relative terms such as "over 8230," "upper surface," "above," and the like may be used herein to describe the spatial positional relationship of one device or feature to other devices or features as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary terms "at 8230; \8230; 'above" may include both orientations "at 8230; \8230;' above 8230; 'at 8230;' below 8230;" above ". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In the description of the present invention, it is to be understood that the directions or positional relationships indicated by the directional terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc., are generally based on the directions or positional relationships shown in the drawings, and are for convenience of description and simplicity of description only, and in the case of not making a reverse description, these directional terms do not indicate and imply that the device or element referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. The utility model provides a chip package structure who conveniently discerns, includes casing (1), be fixed with a plurality of stitches (11) on the relative both sides of casing (1) respectively, its characterized in that:

still including apron (21), the relative both sides of apron (21) bottom all are provided with splint (22), splint (22) are held casing (1) both ends that are not provided with stitch (11), one side of one in apron (21) lower surface and casing (1) surface is provided with at least one first constant head tank (15), and another then is provided with first pilot pile (25) that correspond with first constant head tank (15) position, the opposite side of one in apron (21) lower surface and casing (1) surface is provided with at least one second constant head tank (16), and another then is provided with second pilot pile (26) that correspond with second constant head tank (16) position, between first constant head tank (15) and second constant head tank (16) or second pilot pile (26), do not use apron (21) lower surface center or casing (1) surface center as the symmetry center, become central symmetric distribution, be provided with a plurality of marks (27) that correspond with stitch (11) position on apron (21).

2. The chip package structure convenient for identification according to claim 1, wherein: casing (1) do not be provided with the both ends of stitch (11) protrudingly, form first inclined plane (12) near casing (1) upside and be close to second inclined plane (13) of casing (1) downside, the crossing department of first inclined plane (12) and second inclined plane (13) is established to intersect line (14), splint (22) are close to the lower extreme of casing (1) one side and all are fixed with lug (23), lug (23) are established to bump (24) apart from splint (22) inner wall one farthest point, bump (24) are greater than the distance of intersect line (14) to casing (1) upper surface to the distance of apron (21) for fix apron (21) on casing (1).

3. The chip package structure convenient for identification as claimed in claim 2, wherein: the value obtained by subtracting the distance from the intersection line (14) to the upper surface of the shell (1) from the distance from the salient point (24) to the cover plate (21) is smaller than the lengths of the first positioning pile (25) and the second positioning pile (26), and the value is used for preventing the cover plate (21) from being installed on the shell (1) in the wrong direction.

4. An identification facilitating chip package structure according to claim 2, wherein: the upper side and the lower side of the convex block (23) are both inclined planes.

5. An identification facilitating chip package structure according to claim 2, wherein: the intersection line (14) is close to the lower surface of the shell (1).

6. The chip package structure convenient for identification according to claim 1, wherein: the distance from the lower end of the clamping plate (22) to the lower surface of the cover plate (21) is smaller than the thickness of the shell (1), and the lower end of the clamping plate (22) is prevented from protruding from the lower surface of the shell (1).

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