CN218631971U - PIN needle inserting system - Google Patents

PIN needle inserting system Download PDF

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Publication number
CN218631971U
CN218631971U CN202223123609.7U CN202223123609U CN218631971U CN 218631971 U CN218631971 U CN 218631971U CN 202223123609 U CN202223123609 U CN 202223123609U CN 218631971 U CN218631971 U CN 218631971U
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China
Prior art keywords
pin
workpiece
workpiece carrier
holder
air pressure
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CN202223123609.7U
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Chinese (zh)
Inventor
王泽铠
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Jiguang Semiconductor Shaoxing Co ltd
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Jiguang Semiconductor Shaoxing Co ltd
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Priority to CN202223123609.7U priority Critical patent/CN218631971U/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

The utility model relates to a PIN needle insertion system. Comprises a workpiece carrier configured to load a workpiece; the PIN needle inserting device comprises a holder for holding a PIN needle to be inserted into the workpiece; the gripper is movable over the workpiece carrier to insert the PIN into the workpiece by releasing the PIN; the number and the positions of the PIN needles on the holder are adapted to the number and the positions of the PIN needles to be inserted into the workpiece. The utility model provides a PIN needle inserts establishes system has efficient, the high characteristics of qualification rate.

Description

PIN needle inserting system
Technical Field
The utility model relates to a chip package technical field especially relates to a PIN needle insertion system.
Background
In module packaging, PIN Bonding is required to be performed on a Copper-clad ceramic substrate (DBC), including PIN insertion and Bonding. In the prior art, the inserting of the Pin needle on the DBC is manual operation step by step, the efficiency is low, and the product percent of pass is influenced.
SUMMERY OF THE UTILITY MODEL
In view of this, the embodiments of the present application provide a PIN inserting system to solve at least one problem in the background art.
In order to achieve the purpose, the technical scheme of the application is realized as follows:
the embodiment of the application provides a system is established in inserting of PIN needle, includes:
a workpiece carrier configured to load a workpiece;
the PIN needle inserting device comprises a holder for holding a PIN needle to be inserted into the workpiece; the gripper is movable over the workpiece carrier to insert the PIN into the workpiece by releasing the PIN; the number and the positions of the PIN needles on the holder are adapted to the number and the positions of the PIN needles to be inserted into the workpiece.
Optionally, the holder comprises:
a first vacuum chuck configured to suck the PIN by generating a negative pressure to position the PIN.
Optionally, the first vacuum chuck includes a plurality of air pressure control components for controlling the adsorption air pressure and adsorption areas corresponding to the air pressure control components, and the plurality of air pressure control components can independently control the air pressure of the corresponding adsorption areas.
Optionally, the gripper further comprises a second vacuum chuck configured to suck the first vacuum chuck by generating a negative pressure to turn the first vacuum chuck upside down so that the end of the PIN inserted into the workpiece faces downward.
Optionally, the PIN inserting system further includes:
a workpiece carrier track configured for movement of the workpiece carrier such that the workpiece carrier moves sequentially at each station; the PIN needle inserting device is arranged on one side of the workpiece carrier track.
Optionally, the PIN inserting system further includes:
an appearance inspection device configured to inspect an appearance of the workpiece; each air pressure control component controls the air pressure of the corresponding adsorption area according to the inspection result of the appearance inspection device; the appearance inspection device is arranged on one side of the workpiece carrier track and is arranged at an interval with the PIN needle insertion device; the visual inspection device comprises a camera.
Optionally, the PIN insertion system further includes:
a curing agent laying device configured to lay curing agent on the workpiece, wherein the laying position of the curing agent is adapted to the position of the PIN needle where the workpiece needs to be inserted: the curing agent laying device is arranged on one side of the workpiece carrier track and is arranged between the appearance inspection device and the PIN needle inserting device.
Optionally, the PIN inserting device further includes:
a drive component configured to drive movement of the holder.
Optionally, the PIN inserting system further includes:
a PIN feed tray configured to align the PIN PINs and sequentially feed them to the holder.
Optionally, the PIN inserting system further includes:
a heating furnace configured to heat the curing agent laid on the workpiece so that the curing agent is uniformly laid between the workpiece and the PIN needles; the heating furnace is arranged on the workpiece carrier track and is arranged at intervals with the PIN needle inserting device.
The PIN inserting system comprises a workpiece carrier and a PIN inserting device, wherein the workpiece carrier is configured to load a workpiece; the PIN needle inserting device comprises a holder for holding a PIN needle to be inserted into the workpiece; the gripper is movable over the workpiece carrier to insert the PIN into the workpiece by releasing the PIN; the number and the positions of the PIN needles on the holder are adapted to the number and the positions of the PIN needles to be inserted into the workpiece. The PIN needle inserting device moves above the workpiece carrier and is used for inserting the PIN needle into the workpiece by releasing the PIN needle, and compared with manual operation in steps, the PIN needle inserting device is high in efficiency and qualified rate. Therefore, the PIN inserting system provided by the embodiment of the application has the characteristics of high efficiency and high qualification rate.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic diagram of a PIN inserting system according to an embodiment of the present application.
Description of the reference numerals:
10. a workpiece carrier; 20. a workpiece; 30. a PIN insertion device; 31. a holder; 311. a first vacuum chuck; 312. a second vacuum chuck; 40. a PIN needle; 50. a workpiece carrier track; 60. an appearance inspection device; 70. a curing agent applicator 70; 80. a PIN needle feeding tray; 90. a heating furnace.
Detailed Description
Exemplary embodiments disclosed in the present application will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present application. It will be apparent, however, to one skilled in the art, that the present application may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the present application; that is, not all features of an actual embodiment are described herein, and well-known functions and structures are not described in detail.
In the drawings, the size of layers, regions, elements, and relative sizes may be exaggerated for clarity. Like reference numerals refer to like elements throughout.
It will be understood that when an element or layer is referred to as being "on," "8230;" \8230 "", "adjacent to," "connected to," or "coupled to" other elements or layers, it can be directly on, adjacent to, connected to, or coupled to the other elements or layers, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," 8230; \8230 ";," "directly adjacent," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application. And the discussion of a second element, component, region, layer or section does not imply that a first element, component, region, layer or section is necessarily present in the application.
Spatial relational terms such as "in 8230," "below," "in 8230," "below," "8230," "above," "above," and the like may be used herein for convenience of description to describe the relationship of one element or feature to another element or feature illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, then elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "at 8230; \8230below" and "at 8230; \8230, below" may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial descriptors used herein interpreted accordingly.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.
In order to provide a thorough understanding of the present application, detailed procedures and detailed structures will be set forth in the following description so as to explain the technical aspects of the present application. The following detailed description of the preferred embodiments of the present application, however, can be practiced otherwise than as specifically described.
To solve the technical problem in the prior art, an embodiment of the present application provides a PIN inserting system, as shown in fig. 1, the PIN inserting system includes:
a workpiece carrier 10 configured to load a workpiece 20;
a PIN inserting device 30 including a holder 31 holding a PIN 40 to be inserted into the workpiece 20; the gripper 31 is movable above the workpiece carrier 10, inserting the PIN 40 into the workpiece 20 by releasing the PIN 40; the number and positions of the PINs 40 on the holder 31 are adapted to the number and positions of the PINs 40 that the workpiece 20 needs to be inserted.
The workpiece 20 may illustratively be a DBC to which PIN PINs 40 are to be inserted, and the workpiece carrier 10 is used to carry and transport the workpiece 20 during production, e.g., moving from one station to another on a production line. For example, during the moving process, the workpiece carrier 10 also serves to temporarily fix the DBC and prevent the DBC from moving relative to the workpiece carrier 10, so that the workpiece carrier 10 has some positioning and temporary fixing structures, which may be some general positioning and fixing structures for the DBC, and will not be described in detail.
Illustratively, the holder 31 is configured to hold the PIN 40 and insert the PIN 40 into the workpiece 20 by releasing the PIN 40. Thus, in addition to holding the PINs 40, the holder 31 also needs to position the PINs 40. Illustratively, the grip and release of the holder 31 are quick to improve production efficiency, but quick grip and release is premised on the inability to cause injury to the PIN 40.
In some embodiments, the holder 31 may include:
a first vacuum chuck 311 configured to suck the PIN 40 by generating a negative pressure to position the PIN 40.
Illustratively, the first vacuum chuck 311 is used for sucking the PIN 40 by generating negative pressure, so that the PIN 40 can be held and released quickly without damaging the PIN 40. For example, the suction force of the first vacuum chuck 311 may be adjusted by adjusting the magnitude of the negative pressure.
In some embodiments, the first vacuum chuck 311 may include a plurality of air pressure control members for controlling a suction air pressure and suction areas corresponding to the air pressure control members, and the plurality of air pressure control members may independently control an air pressure of the corresponding suction areas.
For example, since the number of PIN PINs 40 to be sucked by the first vacuum chuck 311 is relatively large and the number of corresponding workpieces 20 is different, the first vacuum chuck 311 is divided into a plurality of mutually independent suction areas, and each suction area is controlled by an independent air pressure control unit. Thus, the suction of the PIN PINs 40 in each region can be controlled according to the qualification conditions of different workpieces 20 and each region of the same workpiece 20, namely, some regions suck the PIN PINs 40, and some regions do not suck the PIN PINs 40. Alternatively, the release of the PIN 40 may be controlled according to the situation, the PIN 40 in the partial area is released, and the PIN 40 in the partial area is not released. Illustratively, each individual pneumatic control component may be: separate vacuum generators are configured to form separate suction zones. Alternatively, a single vacuum generator may be used, and different adsorption lines and valves may be provided to form separate adsorption regions.
In some embodiments, the holder 31 may further include a second vacuum chuck 312 configured to suck the first vacuum chuck 311 by generating a negative pressure to turn the first vacuum chuck 311 upside down so that the end of the PIN 40 inserted into the workpiece 20 faces downward.
Illustratively, since PIN 40 is loaded into the first vacuum chuck 311, the PIN 40 is generally pointed upward, i.e., the end of PIN 40 that is inserted into the workpiece 20 is pointed upward. When inserting the PIN 40 into the workpiece 20, the PIN 40 is required to be inserted into the workpiece 20 by dropping down the PIN. Therefore, the holder 31 is provided with the second vacuum chuck 312, and the second vacuum chuck 312 sucks the first vacuum chuck 311 by generating negative pressure, so as to turn the first vacuum chuck over. Thus, the structure of the holder 31 is simple, and the vacuum generator for generating negative pressure can be used many times without providing additional other power parts.
In some embodiments, the PIN insertion system may further include:
a workpiece carrier track 50 configured for movement of the workpiece carrier 10 such that the workpiece carrier 10 moves sequentially at each station; the PIN inserting device 30 is disposed on one side of the workpiece carrier rail 50.
Illustratively, the workpiece carrier track 50 is a track for movement of the workpiece carrier 10. The principle of movement of the workpiece carrier 10 on the workpiece carrier track 50 may be sliding friction or rolling friction. The rollers, if rolling friction, may be on the workpiece carrier 10 or on the workpiece carrier track 50. For example, after the workpiece carrier 10 moves to the corresponding station, the workpiece carrier rail 50 is provided with a movable fixing device to fix the workpiece carrier 10, and after the process of the station is completed, the movable fixing device is released, and the workpiece carrier 10 enters the next station. For example, the movement of the workpiece carrier to the corresponding station may be recognized by a travel switch or a position sensor, etc. The PIN inserting device 30 is disposed at one side of the workpiece carrier track 50, and can insert the PINs 40 into the workpieces 20 on the workpiece carrier 10, and the PIN feeding tray 80 can supply the PINs 40 to the PIN inserting device 30.
In some embodiments, the PIN insertion system may further include:
an appearance inspection device 60 configured to inspect the appearance of the workpiece 20; each of the air pressure control means controls the air pressure of the corresponding suction area based on the inspection result of the appearance inspection device 60; the appearance inspection device 60 is arranged on one side of the workpiece carrier track 50 and is arranged at a distance from the PIN insertion device 30; the visual inspection device 60 includes a camera.
Illustratively, the workpiece 20, i.e., the DBC, generally has a plurality of regions and corresponding components, each region corresponding to an absorption region. During incoming material inspection, partial areas are inspected to be unqualified, and the unqualified areas are marked with corresponding unqualified marks (Mark). The appearance inspection device 60 may inspect the unqualified marks, and the air pressure control unit controls the air pressure of the corresponding adsorption area according to the inspection result of the appearance inspection device 60 so that the PIN 40 is adsorbed without generating adsorption force, or the PIN 40 is not released when the PIN is inserted. Therefore, the PIN needle 40 is not inserted into the unqualified area on the DBC, the use of the PIN needle 40 is saved, and the cost is reduced. The visual inspection device 60 is disposed at one side of the workpiece carrier rail 50 and spaced apart from the PIN inserting device 30, and specifically, the visual inspection device 60 performs an inspection process and then performs a PIN inserting process at a station in front of the PIN inserting device 30. In some embodiments, the visual inspection device 60 may employ machine vision, such as by capturing an image of the surface of the workpiece 20 with a camera and then recognizing the image with image recognition software. In particular, since the pattern of the defective mark is set in advance, it is relatively simple, and therefore the image recognition software is easily recognized, and is not easily subjected to errors.
In some embodiments, the PIN insertion system may further include:
a firming agent laying device configured to lay firming agent on the workpiece 20, wherein the laying position of the firming agent is adapted to the position of the PIN 40 which needs to be inserted into the workpiece 20: the curing agent applying device is disposed on one side of the work carrier rail 50 between the visual inspection device 60 and the PIN inserting device 30.
Illustratively, the curing agent is used to cure the PIN 40 to the DBC, and generally needs to be applied to the DBC prior to the PIN 40 being inserted into the PIN 40. Therefore, the curing agent applying device is disposed on one side of the work carrier rail 50 between the visual inspection device 60 and the PIN inserting device 30. In some embodiments, the curing agent may be a solder paste and the curing agent applicator may be a solder paste dispensing device.
In some embodiments, the PIN inserting apparatus 30 may further include:
a driving part configured to drive the movement of the holder 31.
Illustratively, the gripper 31 needs to be moved above the workpiece carrier 10, and thus needs to be driven by a driving means. Moreover, in some embodiments, the holder 31 further needs to turn over the first vacuum chuck 311, and also needs to be driven by a driving unit. In some embodiments, the drive member may be a robotic arm capable of performing multiple motions.
In some embodiments, the PIN insertion system may further include:
a PIN feed tray 80 configured to arrange the PIN PINs 40 and sequentially feed them to the holder 31.
Illustratively, the PIN feed tray 80 is configured to feed the PIN PINs 40 to the holder 31. The PIN feed tray 80 can align the PIN PINs 40 and sequentially feed them to the holder 31. In this way, the PIN 40 can be automatically and continuously fed to the holder 31 by means of the PIN feed tray 80. In some embodiments, the PIN feeding tray 80 may be a vibrating tray, which may automatically arrange the PINs 40 in a row, and sequentially feed the PINs to the holder 31, and the PIN 40 may be replenished after the holder 31 inserts the PINs 40 to the DBC.
In some embodiments, the PIN insertion system may further include:
a heating furnace 90 configured to heat the solidifying agent laid on the workpiece 20 so that the solidifying agent is uniformly laid between the workpiece 20 and the PIN needles 40; the heating furnace 90 is disposed on the workpiece carrier rail 50 and spaced apart from the PIN insertion device 30.
Illustratively, the oven 90 may be a relatively closed oven except for an inlet and an outlet so that the temperature within the oven 90 can be maintained so that the curing agent is continuously heated and uniformly applied between the workpiece 20 and the PIN 40. Illustratively, the heating furnace 90 may be disposed at a station where the PIN PINs 40 are inserted, so that the curing agent is uniformly applied between the workpiece 20 and the PIN PINs 40. Illustratively, the curing agent may be a solder paste that is in a solid or semi-solid state prior to heating and is not uniformly distributed between the workpiece 20 and the PIN 40, and thus requires heating to melt the solder paste into a fluid state.
It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations encompassed by the claims. Various modifications and changes may also be made on the above embodiments without departing from the scope of the present disclosure. Likewise, various features of the above embodiments may be combined in any combination to form additional embodiments of the invention that may not be explicitly described. Therefore, the above embodiments only express several embodiments of the present invention, and do not limit the protection scope of the present invention.

Claims (10)

1. A PIN insertion system, comprising:
a workpiece carrier configured to load a workpiece;
the PIN needle inserting device comprises a holder for holding a PIN needle to be inserted into the workpiece; the gripper is movable over the workpiece carrier to insert the PIN into the workpiece by releasing the PIN; the number and the positions of the PIN needles on the holder are adapted to the number and the positions of the PIN needles to be inserted into the workpiece.
2. The PIN insertion system of claim 1, wherein the holder comprises:
a first vacuum chuck configured to suck the PIN by generating a negative pressure to position the PIN.
3. The PIN inserting system according to claim 2, wherein the first vacuum chuck includes a plurality of air pressure control members that control suction air pressure and suction areas corresponding to the air pressure control members, and the plurality of air pressure control members can independently control air pressure of the corresponding suction areas.
4. The PIN insertion system according to claim 2, wherein the holder further comprises a second vacuum chuck configured to suck the first vacuum chuck by generating a negative pressure to turn the first vacuum chuck upside down so that the PIN is inserted with one end thereof inserted into the workpiece facing downward.
5. The PIN inserting system according to claim 1, further comprising:
a workpiece carrier track configured for movement of the workpiece carrier such that the workpiece carrier moves sequentially at each station; the PIN needle inserting device is arranged on one side of the workpiece carrier track.
6. The PIN insertion system according to claim 3, wherein the PIN insertion system further comprises:
an appearance inspection device configured to inspect an appearance of the workpiece; each air pressure control component controls the air pressure of the corresponding adsorption area according to the inspection result of the appearance inspection device; the appearance inspection device is arranged on one side of the workpiece carrier track and is arranged at intervals with the PIN needle inserting device; the appearance inspection device comprises a camera.
7. The PIN insertion system according to claim 6, wherein the PIN insertion system further comprises:
a curing agent laying device configured to lay curing agent on the workpiece, wherein the laying position of the curing agent is adapted to the position of the PIN needle where the workpiece needs to be inserted: the curing agent laying device is arranged on one side of the workpiece carrier track and is arranged between the appearance inspection device and the PIN needle inserting device.
8. The PIN inserting system according to any one of claims 1 to 7, wherein the PIN inserting device further comprises:
a drive component configured to drive movement of the holder.
9. The PIN inserting system according to any one of claims 1 to 7, further comprising:
a PIN feed tray configured to align the PIN PINs and sequentially feed them to the holder.
10. The PIN insertion system according to claim 7, wherein the PIN insertion system further comprises:
a heating furnace configured to heat the solidifying agent laid on the workpiece so that the solidifying agent is uniformly laid between the workpiece and the PIN needle; the heating furnace is arranged on the workpiece carrier track and is arranged at intervals with the PIN needle inserting device.
CN202223123609.7U 2022-11-23 2022-11-23 PIN needle inserting system Active CN218631971U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223123609.7U CN218631971U (en) 2022-11-23 2022-11-23 PIN needle inserting system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223123609.7U CN218631971U (en) 2022-11-23 2022-11-23 PIN needle inserting system

Publications (1)

Publication Number Publication Date
CN218631971U true CN218631971U (en) 2023-03-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223123609.7U Active CN218631971U (en) 2022-11-23 2022-11-23 PIN needle inserting system

Country Status (1)

Country Link
CN (1) CN218631971U (en)

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