CN218603846U

CN218603846U - Electronic equipment and heat radiation structure thereof

Info

Publication number: CN218603846U
Application number: CN202222375388.6U
Authority: CN
Inventors: 邢欢
Original assignee: Bosch Automotive Products Suzhou Co Ltd
Current assignee: Bosch Automotive Products Suzhou Co Ltd
Priority date: 2022-09-07
Filing date: 2022-09-07
Publication date: 2023-03-10
Anticipated expiration: 2032-09-07

Abstract

The application discloses electronic equipment and heat radiation structure thereof. The heat dissipating structure includes a graphene polymer-based body; a PCB board assembly having a heat source; a spacer layer made of a thermal interface material, one surface of the spacer layer being connected to the heat source; wherein the graphene polymer substrate body is disposed with at least a portion thereof connecting the opposite other surface of the spacing layer such that heat from the heat source is transferred to the graphene polymer substrate body via the spacing layer. The heat conducting material has excellent heat conducting performance and light weight.

Description

Electronic equipment and heat radiation structure thereof

Technical Field

The present application relates to heat dissipation of electronic components accommodated by a housing, and particularly relates to a heat dissipation structure.

The application also relates to an electronic device comprising the heat dissipation structure.

Background

With the development of new energy automobiles, electronic equipment in automobiles plays an increasingly important role. Electronic devices with high heating power, such as electronic devices integrated with a PCB board, require a matching heat dissipation capability due to the heat generated by the highly demanding computing work.

Conventional electronic devices employ a metal material as a case, such as an iron-based case or an aluminum alloy case, to accommodate the PCB board and provide functions of dust prevention, protection, electromagnetic shielding, and the like.

Graphene has been found to be a two-dimensionally arranged monolayer of carbon atoms, which is considered a "future material" due to its excellent electrical conductivity, impressive thermal conductivity and good mechanical properties. In the aspect of thermal performance, the thermal conductivity of the graphene is 5200W/mK, which is far higher than that of traditional metal materials such as copper (about 400W/mK) and aluminum (about 200W/mK).

SUMMERY OF THE UTILITY MODEL

One aspect of the present application is to provide a heat dissipation structure having better heat dissipation capability.

A heat dissipation structure for an electronic device, comprising: a graphene polymer-based material body; a PCB board assembly having a heat source; a spacer layer made of a thermal interface material, one surface of the spacer layer being connected to the heat source; wherein the graphene polymer substrate body is disposed with at least a portion thereof connecting the opposite other surface of the spacing layer such that heat from the heat source is transferred to the graphene polymer substrate body via the spacing layer.

Heat generated by the PCB assembly is transferred to the graphene polymer substrate body through the spacing layer. The graphene polymer matrix body has high thermal conductivity, so that heat reaches the graphene polymer matrix body more quickly and is dissipated. The graphene polymer substrate material is adopted instead of a metal material, so that the graphene polymer substrate material has excellent performance in the aspect of heat conduction, and is lighter in weight than metal.

The graphene polymer matrix body may be a variety of structures based on design, which may be a portion of a casing of an electronic device that establishes a heat transfer path with the spacer layer to transfer heat from the PCB board assembly. The graphene polymer substrate body can be further connected with a heat dissipation device, and heat conduction is promoted. The graphene polymer material may also be an integral part of the housing of the electronic device, which has a better performance in terms of heat radiation.

In an embodiment of a heat dissipation structure, the electronic device of the PCB assembly and/or an area portion of the PCB assembly is the heat source.

In an embodiment of the heat dissipation structure, the chip is the heat source.

The heat source of the PCB assembly is the place where the highest heat is generated in the assembly, and may be one heat source location or a plurality of heat source locations. The heat source of the PCB assembly may be a specific electronic device or devices, or the heat source may be an electronic device-free area or areas on the PCB, or a combination of electronic device-free areas and electronic devices. Typically, the electronic device is a chip.

In an embodiment of a heat dissipation structure, the graphene polymer base material body includes a lid and a branch portion extending from the lid toward the heat source, and the spacer layer is filled between the branch portion and the heat source.

The arrangement of the branches depends on the position and number of the heat sources. The graphene polymer base material body extends beyond the graphene polymer-based branch portion and sufficiently close to the heat source at a position corresponding to the heat source, and air in a gap between the graphene polymer-based branch portion and the heat source is filled with the spacer layer, whereby heat reaches the cover from the heat source via the spacer layer and the branch portion. The heat dissipation area is enlarged when the heat reaches the cover, and the heat dissipation is accelerated.

The cap and the branch portion may be made of the same graphene polymer-based material or made of different graphene polymer-based materials.

Another aspect of the present application is to provide an electronic device having better heat dissipation capability.

An electronic device, comprising: a housing, at least a portion of the housing having a graphene polymer matrix body and the housing defining an interior space; a PCB board assembly in the interior space, the PCB board assembly having a heat source; a spacer layer made of a thermal interface material, one surface of the spacer layer being connected to the heat source; wherein the graphene polymer substrate body is disposed to connect the opposite other surface of the spacer layer such that heat from the heat source is transferred to the graphene polymer substrate body via the spacer layer.

In the electronic device of the present application, heat generated by the PCB board assembly is transferred to at least a portion of the graphene polymer-based housing through the spacer layer. Heat may also be transferred through the spacer layer to the entire graphene polymer-based sheath. The graphene polymer-based housing has excellent heat dissipation capability because of its high thermal conductivity. The graphene polymer-based shell is adopted to replace a metal shell, so that the graphene polymer-based shell has excellent performance in the aspect of heat conduction, and the graphene polymer-based shell is lighter in weight than the metal shell, so that lighter electronic equipment can be obtained. As for the in-vehicle electronic device, hundreds of electronic devices are to be arranged on the vehicle, and the reduction in mass of the in-vehicle electronic device is advantageous to the weight reduction of the vehicle.

In an embodiment of the electronic device, the electronic component of the PCB assembly and/or an area part of the PCB assembly is the heat source.

In an embodiment of the electronic device, the chip is said heat source.

In an embodiment of the electronic device, the graphene polymer matrix material body includes a lid and a branch portion extending from the lid toward the heat source, and the spacer layer is filled between the branch portion and the heat source. The cap and the branch portion may be made of the same graphene polymer-based material or made of different graphene polymer-based materials.

In one embodiment of the electronic device, the electronic device is a vehicle electronic control unit or a sensor.

In an embodiment of the Electronic device, the Electronic device is a Domain Control Unit DCU (Domain Control Unit), a Vehicle Control Unit VCU (Vehicle Control Unit), or an Electronic Battery Sensor EBS (Electronic Battery Sensor).

The Electronic device may be any Electronic device having a housing and a PCB assembly inside the housing, and particularly for an on-vehicle Electronic device, the Electronic device with large heat dissipation power includes, but is not limited to, any Electronic Control Unit ECU (Electronic Control Unit), or an on-vehicle sensor with a PCB inside.

Other aspects and features of the present application will become apparent from the following detailed description, which proceeds with reference to the accompanying drawings. It is to be understood, however, that the drawings are designed solely for purposes of illustration and not as a definition of the limits of the application, for which reference should be made to the appended claims. It should be further understood that the drawings are merely intended to conceptually illustrate the structures and procedures described herein, and that, unless otherwise indicated, the drawings are not necessarily drawn to scale.

Drawings

The present application will be more fully understood from the detailed description given below with reference to the accompanying drawings, in which like reference numerals refer to like elements throughout the views. Wherein:

FIG. 1 is a partial internal view of one embodiment of an electronic device to which the present application relates;

FIG. 2 is a partial internal view of another embodiment of an electronic device to which the present application relates.

Detailed Description

To assist those skilled in the art in understanding the subject matter claimed herein, specific embodiments thereof are described below in detail with reference to the accompanying drawings.

FIG. 1 illustrates a partial internal view of an embodiment of an electronic device to which the present application relates. The electronic device includes a housing 10, the housing 10 defining an internal space 20, and a PCB board assembly 30 disposed in the internal space 20. The PCB assembly 30 is shown schematically, and typically, the PCB assembly 30 is comprised of a PCB 31, various electronic devices 35, and preformed traces on the PCB 31 connecting the electronic devices 35. In operation, PCB board assembly 30 generates heat source 32, which heat source 32 may be one or more. In the illustrated embodiment, the heat source 32 is located at a position of the PCB board 31 where the electronic device 35 is located, and the electronic device 35 is a chip 36.

The housing 10 is a graphene polymer-based material body 12. The Graphene Polymer matrix material 12 is made of Graphene Polymer Alloy (GPA) materialThe material is made by adding graphene and other additives to a polymer alloy. The polymer alloy is a polymer material of a polymer system formed by blending two or more than two multicomponent polymers with different structures. The thermal conductivity of the graphene polymer alloy is higher than 10W/mK, the value is the same as that of cast aluminum, and the density of the graphene polymer alloy is 1.8g/cm ³ About 40% of aluminum. Replacing the current metal housing (e.g., aluminum or iron-based housing) with a graphene polymer-based housing can increase the thermal conductivity and decrease the density of the housing.

A spacer layer 40 is disposed between the body of graphene polymeric substrate 12 and the heat source 32. The spacer layer 40 is made of a thermal interface material. One surface of the spacer layer 40 is connected to a heat source and the opposite surface is connected to the graphene polymer substrate body 12. In the illustrated embodiment, the graphene polymer-based housing 10 includes a lid 14 and a branch 16 extending from the lid 14 at a position corresponding to the heat source 32, the branch 16 being closer to the heat source 32, the spacer layer 40 filling a gap between the branch 16 and the heat source 32. Spacer layer 40 may be made of a thermally conductive material, such as silicone. The distance layer 40 is in the form of a shim in the illustrated embodiment. Spacer layer 40 may replace air between heat source 32 and branch 16. The surfaces of both the heat source 32 and the branch 16 are rough, air is trapped in the matte surfaces, which is detrimental to heat transfer, the filling of the thermal interface material can exclude this air, and it establishes a heat transfer path with the branch 16. Heat exits the heat source 32 along the spacer layer 40 and the branch 16 and eventually reaches the cover 14, which has a larger heat dissipation area. In the illustrated embodiment, both the cover 14 and the branch 16 are made of a graphene polymer alloy material. The lid 14 and the branches 16 may be made of different graphene polymer alloy materials. The cover 14 may additionally be provided with an electromagnetic shielding layer. The lid 14 and the branches 16 may also be made of the same graphene polymer alloy material. The lid 14 may also be made of other thermally conductive materials than graphene polymer alloy material, while the branches 16 are made of graphene polymer alloy material. In embodiments where no branches 16 are provided, the lid 14 is made of a graphene polymer alloy material, and the spacer layer 40 is filled between the graphene polymer alloy material and the heat source 32.

The housing 10 of the electronic device may include a body 12 of graphene polymer alloy material and a backplane (not shown). The graphene polymer alloy material body 12, the PCB assembly 30 and the bottom plate are manufactured separately. The body of graphene polymer alloy material 12 is pre-coated with a spacer layer 40 corresponding to the location of the heat source 32 and the pcb board assembly 30 is mounted on the base plate. After the body of graphene polymer alloy material 12 and the base plate are closed, the spacer layer 40 is connected to the heat source 32.

The electronic device may also include two bodies of graphene alloy material 12 as the upper and lower halves of the housing 10, respectively. When the PCB assembly 30 includes a double-sided PCB, the PCB board 31 has heat sources 32 on both front and rear sides thereof, respectively, and thus two heat dissipation structures are required. One of the graphene polymer alloy materials 12 establishes a heat transfer path on the front side of the PCB 31 and the other graphene polymer alloy material 12 establishes a heat transfer path on the back side of the PCB 31.

Here, the feature "cover" may be one surface of the housing 10 substantially parallel to the PCB board 31. The "cover" may also be a surface of the housing 10 that is not parallel to the PCB board 31, such as the cover 14 is perpendicular to the PCB board 31, and the branch 16 has a bending angle. Normally, a shorter heat transfer path is selected to provide the branch portion 16, but depending on other factors, such as the arrangement of the electronic device, the surface of the casing 10 which is not parallel to the PCB 31 has a better heat dissipation condition than other surfaces, and then the branch portion 16 is designed to guide heat to the cover 14 which is not parallel to the PCB 31.

The electronic equipment comprises a vehicle-mounted electronic control unit ECU, including but not limited to a domain controller DCU, a vehicle control unit VCU and the like.

The electronic device of the present application further comprises a sensor with a PCB built in, including but not limited to an electronic battery sensor EBS and the like.

FIG. 2 illustrates a partial internal view of another embodiment of an electronic device to which the present application relates. In the illustrated embodiment, the same reference numerals as in fig. 1 denote the same structures and/or features as in fig. 1, except for the heat source. Here, the heat source 32 is a region 34 on the PCB board 31 of the PCB board assembly 30 where no electronic devices are located. Heat from this region 34 is transferred to the cover 14 via the spacer layer 40 and the branches 16. Graphene polymer alloy material is used for both the branch portion 16 and the lid 14.

While specific embodiments of the present application have been shown and described in detail to illustrate the principles of the application, it will be understood that the application may be embodied otherwise without departing from such principles.

Claims

1. A heat dissipation structure for an electronic device, comprising:

a graphene polymer-based material body (12);

a PCB board assembly (30), the PCB board assembly (30) having a heat source (32);

a spacer layer (40), said spacer layer (40) being made of a thermal interface material, one surface of said spacer layer being connected to said heat source (32);

wherein the body of graphene polymer base material (12) is arranged with at least a portion thereof connecting the opposite other surface of the spacer layer (40) such that heat from the heat source (32) is transferred to the body of graphene polymer base material (12) via the spacer layer (40).

2. The heat dissipation structure as set forth in claim 1, wherein: an electronic device (35) of the PCB board assembly (30) and/or an area portion of the PCB board (31) of the PCB board assembly (30) is the heat source (32).

3. The heat dissipation structure as set forth in claim 2, wherein: a chip (36) is the heat source (32).

4. The heat dissipation structure as set forth in any one of claims 1 to 3, wherein: the graphene polymer base material body (12) includes a lid (14) and a branch portion (16) extending from the lid (14) toward the heat source (32), and the spacer layer (40) is filled between the branch portion (16) and the heat source (32).

5. An electronic device, comprising:

a housing (10), at least a portion of the housing (10) having a graphene polymer matrix body (12) and the housing (10) defining an interior space (20);

a PCB board assembly (30) in the interior space (20), the PCB board assembly (30) having a heat source (32);

a spacer layer (40), said spacer layer (40) being made of a thermal interface material, one surface of said spacer layer (40) being connected to said heat source (32);

wherein the housing (10) is arranged such that the body of graphene polymer matrix material (12) is connected to the opposite surface of the spacer layer (40) such that heat from the heat source (32) is transferred to the body of graphene polymer matrix material (12) via the spacer layer (40).

6. The electronic device of claim 5, wherein: an electronic device (35) of the PCB board assembly (30) and/or an area portion of the PCB board (31) of the PCB board assembly (30) is the heat source (32).

7. The electronic device of claim 6, wherein: a chip (36) is the heat source (32).

8. The electronic device of claim 5, wherein: the graphene polymer-based material body (12) includes a lid (14) and a branch portion (16) extending from the lid (14) toward the heat source (32), and the spacer layer (40) is filled between the branch portion (16) and the heat source (32).

9. The electronic device of any one of claims 5-8, wherein: the electronic equipment is a vehicle electronic control unit or a sensor.

10. The electronic device of any of claims 5-8, wherein: the electronic equipment is a domain controller, a whole vehicle control unit or an electronic battery sensor.