CN218596546U - A electrically conductive clamp and coating machine for coating machine - Google Patents
A electrically conductive clamp and coating machine for coating machine Download PDFInfo
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- CN218596546U CN218596546U CN202221814123.5U CN202221814123U CN218596546U CN 218596546 U CN218596546 U CN 218596546U CN 202221814123 U CN202221814123 U CN 202221814123U CN 218596546 U CN218596546 U CN 218596546U
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Abstract
The utility model discloses a conductive clamp for a film plating machine and a film plating machine, wherein the conductive clamp comprises a first clamping arm and a second clamping arm, and the first clamping arm comprises a first clamping surface; the second clamping arm comprises a second clamping surface, and the first clamping surface and the second clamping surface are arranged oppositely and are conductive surfaces; and the first clamping arm and the second clamping arm can move relatively to enable the conductive clamp to be in a clamping state or an opening state, when the conductive clamp is in the clamping state and clamps the conductive base film to be plated in the plating solution between the first clamping surface and the second clamping surface, the first clamping arm and the second clamping arm are immersed in the plating solution, and a first anti-sticking liquid layer is coated on at least part of the surface except the first clamping surface and the second clamping surface. The conductive clamp can effectively reduce the amount of plating solution attached to the surface of the conductive clamp, reduce the waste of the plating solution and simultaneously reduce the cleaning difficulty of the conductive clamp.
Description
Technical Field
The application relates to the field of electroplating, in particular to a conductive clamp for a film plating machine and the film plating machine.
Background
The film plating machine is a device for plating the surface of a conductive basal film. When a film coating machine is used for coating, the conductive base film can be clamped by a conductive clamp so as to be immersed into the plating solution for electroplating.
However, the conductive clip is frequently moved out of and into the plating solution during the electroplating process, and the plating solution is usually attached to the surface of the conductive clip when the conductive clip is moved out of the plating solution, and the plating solution is carried out of the plating solution tank, which not only wastes the plating solution, but also increases the cleaning difficulty of the conductive clip and increases the plating cost.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned not enough among the prior art, the utility model provides a lead electrical clamp and coating machine for coating machine can effectively reduce the volume of the attached plating bath in surface that leads electrical clamp to the waste to the plating bath has been reduced.
In order to achieve the above object, in a first aspect, the present invention discloses a conductive clip for a film plating machine, comprising:
a first clamp arm including a first clamp face;
the second clamping arm comprises a second clamping surface, and the first clamping surface and the second clamping surface are oppositely arranged and are conductive surfaces;
the first clamping arm and the second clamping arm can move relatively to enable the conductive clamp to be in a clamping state or an opening state, when the conductive clamp is in the clamping state and clamps the conductive base film between the first clamping surface and the second clamping surface to be plated in plating solution, a first anti-sticking liquid layer is coated on at least part of the surface, except the first clamping surface and the second clamping surface, of the first clamping arm and the second clamping arm, which are immersed in the plating solution.
In this embodiment, the first clamping surface in the first clamping arm and the second clamping surface in the second clamping arm are opposite and are conductive surfaces, and the first clamping arm and the second clamping arm can move relatively, so that the conductive clamp can be in a clamping state or an opening state. From this, when electrically conductive clamp is in the centre gripping state, first centre gripping arm and second centre gripping arm can the centre gripping electrically conductive base film get into the plating solution in, and electrically conductive base film is by the centre gripping between first clamping face and second clamping face to can contact between first clamping face, second clamping face and the electrically conductive base film and switch on.
When coating, the conductive clip can clamp the conductive base film, immerse the conductive base film into the plating solution and move for coating, after the conductive clip clamps the conductive base film and finishes coating, the conductive clip can move out of the plating solution and move to the outer side of the plating solution tank, and the conductive clip inevitably carries part of the plating solution when moving out of the plating solution and carries the carried plating solution out of the plating solution tank, thus easily causing waste of the plating solution.
Based on the structure, when the conductive clamp is immersed in the plating solution for plating by clamping the conductive base film, at least part of the surface of the first clamping arm and the second clamping arm immersed in the plating solution except the first clamping surface and the second clamping surface is coated with a first anti-sticking liquid layer. Therefore, the first anti-sticking liquid layer can form a liquid repellent surface on at least part of the surface of the first clamping arm and the second clamping arm which can be immersed in the plating solution, so that the plating solution is not easy to hang on the surfaces of the first clamping arm and the second clamping arm, the amount of the plating solution attached to the surface of the conductive clamp when the plating solution is removed can be reduced, the waste of the plating solution is reduced, the plating solution attached to the surface of the conductive clamp is reduced, and the cleaning of the conductive clamp is facilitated.
In a possible implementation manner of the first aspect, the first liquid-repellent layer includes an acrylic coating layer and a polytetrafluoroethylene coating layer, and the acrylic coating layer is located on the outer side of the polytetrafluoroethylene coating layer.
Therefore, the first anti-sticking liquid layer can form a hydrophobic surface on the surface of the conductive clip, and has better anti-sticking liquid property. And can also make antiseized liquid layer have better corrosion resistance for the first antiseized liquid layer on Tu Sheyu first centre gripping arm and the second centre gripping arm has longer life, and in addition, acrylic acid coating and polytetrafluoroethylene coating are the more common waterproof coating in the market, and the cost is lower.
In a possible implementation manner of the first aspect, the first liquid release layer has a thickness t 1 ，0.1mm≤t 1 Less than or equal to 0.4mm. Therefore, the first anti-sticking liquid layer with the thickness range has a good anti-sticking liquid effect on the part of the conductive clip immersed in the plating solution during plating, and can prevent the conductive clip from being coated with the first anti-sticking liquid layer, so that the cost is greatly increased.
In a possible implementation manner of the first aspect, a second anti-sticking liquid layer is coated on the surfaces of the first clamping surface and the second clamping surface, and the second anti-sticking liquid layer is an electrically conductive anti-sticking layer.
Therefore, plating solution can be hardly attached to the first clamping surface and the second clamping surface, the amount of the plating solution attached to the conductive clamp when the plating solution is removed is further reduced, and the conductivity of the first clamping surface and the second clamping surface is not easily affected.
In a possible implementation manner of the first aspect, the second anti-sticking liquid layer is a nano anti-sticking liquid layer. Therefore, the nano anti-sticking liquid layer is mature in process and easy to realize.
In a possible implementation manner of the first aspect, the second liquid release layer has a thickness t 2 ，0.1nm≤t 2 Less than or equal to 1000nm. Therefore, the first clamping surface and the second clamping surface can have better conductivity while plating solution is not easy to adhere to the first clamping surface and the second clamping surface.
In a possible implementation manner of the first aspect, the surfaces of the first and second clamp arms are configured to: except for the first clamping surface and the second clamping surface, the rest surfaces which can be immersed in plating solution during film plating are insulating surfaces, and the first anti-sticking liquid layer is coated on the surface of the insulating surfaces.
From this, when the coating film, first centre gripping arm and second centre gripping arm all the other surfaces except first clamping surface and second clamping surface are the insulating surface, can prevent in first centre gripping arm and the second centre gripping arm that other parts except first clamping surface and second clamping surface are direct to switch on with the plating bath, again, scribble on the surface of insulating surface and establish first antiseized liquid layer, can effectively reduce electrically conductive clamp when shifting out the plating bath, the volume of plating bath adhesion on the insulating layer, the waste to the plating bath has been reduced, and can make the surface of electrically conductive clamp more easily wash.
In a possible implementation manner of the first aspect, the first clamping arm includes a first clamping portion and a first connecting rod, the first clamping portion is connected to one end of the first connecting rod, the first clamping surface is located on the first clamping portion, except for the first clamping surface, one end of the first connecting rod close to the first clamping portion and the outer surface of the first clamping portion are insulating surfaces, and a distance between an edge of the insulating surface of the first connecting rod far away from the first clamping surface and the first clamping surface is L 1 ，10cm≤L 1 Less than or equal to 15cm; and/or the presence of a gas in the gas,
the second centre gripping arm includes second clamping part and second connecting rod, the second clamping part with the one end of second connecting rod is connected, the second clamping face is located on the second clamping part, except that the second clamping face is outer, the second connecting rod is close to the one end of second clamping part with be on the surface of second clamping part insulating face, on the second connecting rod keep away from in the insulating face the limit of second clamping face with the distance of second clamping face is L 2 ，10cm≤L 2 ≤15cm。
From this, can be so that first connecting rod and second connecting rod dip in the plating bath part and be the insulating surface, and, in the first clamping part except that the part of first clamping surface and second clamping part except that the second clamping surface is the insulating surface, still can not make all surfaces of first connecting rod and second connecting rod all be the insulating surface, save material, so, only need scribble on the insulating surface of first connecting rod, first clamping part, second connecting rod and second clamping part establish first antiseized liquid layer can, the cost is saved.
In a possible implementation manner of the first aspect, the insulating surface of the first connecting rod is an arc surface, and/or the insulating surface of the first clamping portion is an arc surface.
Therefore, the attachment surfaces of the plating solution on the part of the first connecting rod immersed in the plating solution and the second clamping part are smaller, so that the plating solution is not easy to attach when the first connecting rod and the second clamping part are moved out of the plating solution during plating.
In a second aspect, the present invention further provides a coating machine, comprising the conductive clip of the first aspect.
The plating machine provided by this embodiment adopts the conductive clip in the first embodiment, so that after the conductive clip is used for clamping the conductive base film, when the conductive clip is moved out of the plating solution, only a small amount of plating solution can be attached, and even no plating solution is attached to the surface of the conductive clip, thereby reducing the waste of the plating solution caused by the movement of the conductive clip out of the plating solution, and making the cleaning of the conductive clip easier.
In a possible implementation manner of the second aspect, the coater includes:
the plating solution tank comprises a first side wall and a second side wall which extend along a first horizontal direction and are oppositely arranged;
the first conveying mechanism comprises a first conveying belt and a plurality of first conductive clips, wherein the first conveying belt is arranged close to the first side wall and extends along the first horizontal direction, the plurality of first conductive clips are arranged on the first conveying belt, and the plurality of first conductive clips are arranged along the first horizontal direction;
the second conveying mechanism comprises a second conveying belt which is arranged close to the second side wall and extends along the first horizontal direction, and a plurality of second conductive clamps which are arranged on the second conveying belt and are arranged along the first horizontal direction;
the first conductive clip and the second conductive clip are respectively used for clamping two opposite side edges of a horizontally placed conductive base film, and the first conductive clip and the second conductive clip are conductive clips in the first aspect.
Therefore, during operation, the first conductive clamps are driven by the first conveyor belt to move along the first horizontal direction, the second conductive clamps are driven by the conveyor belt to move along the first horizontal direction, namely when the first conductive clamps and the second conductive clamps move to preset positions, the first conductive clamps and the second conductive clamps clamp the conductive base film from two sides respectively and drive the conductive base film to move forwards, and meanwhile, the conductive base film is electrified to be electroplated. And when the first conductive clamp and the second conductive clamp are moved out of the plating solution, less plating solution is attached to the surfaces of the first conductive clamp and the second conductive clamp, so that waste of the plating solution is reduced.
Compared with the prior art, the application has the following beneficial effects: in this embodiment, the first clamping surface in the first clamping arm and the second clamping surface in the second clamping arm are opposite and are conductive surfaces, and the first clamping arm and the second clamping arm can move relatively, so that the conductive clamp can be in a clamping state or an opening state. From this, when electrically conductive clamp is in the centre gripping state, first centre gripping arm and second centre gripping arm can the centre gripping electrically conductive base film get into the plating solution in, and electrically conductive base film is by the centre gripping between first clamping face and second clamping face to can contact between first clamping face, second clamping face and the electrically conductive base film and switch on.
When coating, the conductive clip can clamp the conductive base film, immerse the conductive base film into the plating solution, move and coat the film, after the conductive clip clamps the conductive base film and coats the film, the conductive clip can move out of the plating solution and move to the outer side of the plating solution tank, and the conductive clip can inevitably carry part of the plating solution when moving out of the plating solution and can carry the carried plating solution out of the plating solution tank, thus easily causing waste of the plating solution.
Based on the structure, when the conductive clamp is immersed in the plating solution for plating by clamping the conductive base film, the anti-sticking liquid layer is coated on at least part of the surface of the first clamping arm and the second clamping arm immersed in the plating solution except the first clamping surface and the second clamping surface. Therefore, the anti-sticking liquid layer can form a liquid repellent surface on at least part of the surface of the first clamping arm and the second clamping arm which can be immersed in the plating solution, so that the plating solution is not easy to hang on the surfaces of the first clamping arm and the second clamping arm, the amount of the plating solution attached to the surface of the conductive clamp when the plating solution is removed can be reduced, the waste of the plating solution is reduced, the plating solution attached to the surface of the conductive clamp is reduced, and the cleaning of the conductive clamp is facilitated.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a conductive clip according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of a portion of the first clamping arm immersed in the plating solution and coated with an anti-sticking liquid layer according to an embodiment of the present invention;
fig. 3 is a schematic structural view of an anti-sticking liquid layer coated on an insulating surface according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a nano anti-sticking liquid layer coated on an insulating surface according to an embodiment of the present invention;
fig. 5 is a schematic structural view illustrating a conductive anti-sticking layer coated on a first clamping surface according to an embodiment of the present invention;
fig. 6 is a second cross-sectional view of the first clamping arm immersed in the plating solution and coated with an anti-sticking liquid layer according to the embodiment of the present invention;
fig. 7 is a third cross-sectional view of a portion of the first clamping arm immersed in the plating solution and coated with an anti-sticking liquid layer according to the embodiment of the present invention;
fig. 8 is a top view of a film coating machine according to an embodiment of the present invention.
Description of reference numerals:
1-a conductive clip; 11-a first gripper arm; 111-a first clamping portion; 1111-a first clamping surface; 1112-an electrically conductive release layer; 112-a first link; 12-a second gripper arm; 121-a second clamping part; 1211-a second clamping surface; 122-a second link; 13-an insulating sleeve; 131-an insulating surface; 14-a first anti-adhesive liquid layer; 141-acrylic acid coating layer; 142-a polytetrafluoroethylene coating layer; 143-nanometer anti-sticking liquid layer; 100-plating bath; 1001-first side wall; 1002-a second sidewall; 200-a first transport mechanism; 2001-a first conveyor belt; 2002-a first conductive clip; 300-a second transport mechanism; 3001-a second conveyor belt; 3002-a second conductive clip; 400-conductive base film.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the invention and its embodiments, and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in the present invention can be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.
Electroplating is the process of plating a layer of other metal or alloy on the surface of some plated parts by using the principle of electrolysis. Specifically, a plating metal or other insoluble materials is used as an anode, a workpiece to be plated is used as a cathode, and a liquid containing plating metal ions is used as a plating solution. As in the electroplating process of the conductive base film, the conductive base film serves as a cathode. Before electroplating, the anode and the cathode are electrified, the current forms a loop among the anode, the plating solution and the cathode, and cations of plating metal are reduced on the surface of a workpiece to be plated to form a plating layer in the electroplating process.
In a process of manufacturing a current collector of a lithium ion battery, a thick metal plating layer is generally formed on a conductive base film using an electroplating process to manufacture the current collector. The electroplating process can be specifically completed by using a film coating machine. The film coating machine is a device for coating the surface of a conductive base film.
The film plating machine comprises a plating solution tank and a conductive base film conveying device, wherein plating solution is filled in the plating solution tank, and the conductive base film conveying device is used for conveying the conductive base film into the plating solution tank. Specifically, electrically conductive base film conveyer includes that conveyer belt and electrically conductive clamp, and electrically conductive clamp is used for the electrically conductive base film of centre gripping and to the electrically conductive base film circular telegram, and the conveyer belt is used for driving electrically conductive clamp and removes to make electrically conductive base film dip in the plating bath groove and electroplate.
However, the conductive clip is frequently moved out of and into the plating solution during the electroplating process, and the plating solution is usually attached to the surface of the conductive clip when the conductive clip is moved out of the plating solution, and the plating solution is carried out of the plating solution tank, which not only wastes the plating solution, but also increases the cleaning difficulty of the conductive clip and increases the plating cost.
In view of this, the embodiment of the utility model provides a lead electrical clamp and coating machine for coating machine can effectively reduce the volume of the attached plating bath in surface that leads electrical clamp, has reduced the waste of plating bath, can also reduce the washing degree of difficulty that leads electrical clamp simultaneously.
The conductive clip and coater are described in detail below with specific examples:
example one
The embodiment of the application provides a conductive clamp for a coating machine, which comprises a first clamping arm 11 and a second clamping arm 12 as shown in figures 1 and 2. Wherein the first clamping arm 11 comprises a first clamping surface 1111; the second clamping arm 12 includes a second clamping surface 1211, and the first clamping surface 1111 and the second clamping surface 1211 are disposed opposite to each other and are conductive surfaces; and the first clamping arm 11 and the second clamping arm 12 can move relatively to make the conductive clamp 1 in a clamping state or an opening state, when the conductive clamp 1 is in the clamping state and clamps the conductive base film to be plated in the plating solution between the first clamping surface 1111 and the second clamping surface 1211, at least part of the surface of the first clamping arm 11 and the second clamping arm 12, which is immersed in the plating solution, except the first clamping surface 1111 and the second clamping surface 1211 is coated with a first anti-sticking liquid layer 14.
In this embodiment, the first clamping surface 1111 of the first clamping arm 11 and the second clamping surface 1211 of the second clamping arm 12 are oppositely disposed and are conductive surfaces, and the first clamping arm 11 and the second clamping arm 12 can move relatively, so that the conductive clip 1 can be in a clamping state or an opening state. Thus, when the conductive clip 1 is in the clipping state, the first clipping arm 11 and the second clipping arm 12 can clip the conductive base film into the plating solution, and the conductive base film is clipped between the first clipping surface 1111 and the second clipping surface 1211, so that the first clipping surface 1111, the second clipping surface 1211 and the conductive base film can be contacted and conducted.
It should be noted that, when the conductive base film is electroplated by the film plating machine, the conductive clip 1 is connected to the negative electrode of the power supply, so that the conductive base film can become an electroplating cathode, and the anode plate in the film plating machine is connected to the positive electrode of the power supply, so that the anode plate can become an electroplating anode, so that the conductive clip 1, the conductive base film, the plating solution and the anode plate can form a passage, so that the metal ions to be plated in the plating solution can be dissociated to the vicinity of the conductive base film and precipitated on the surface of the conductive base film, thereby achieving the purpose of plating the conductive base film.
In addition, the conveyer belt among the coating machine can set up to oval structure, electrically conductive clamp 1 can set up on the conveyer belt, with this, the conveyer belt of oval structure can drive electrically conductive clamp 1 and make the removal of oval, so that electrically conductive clamp 1 can the centre gripping electrically conductive base film and dip in the plating bath and move, and when moving to preset position, can move out the plating bath under the drive of conveyer belt, then move to the conveyer belt and deviate from one side of plating bath 100, and move to electrically conductive base film department along the direction opposite with the moving direction of electrically conductive base film, centre gripping electrically conductive base film again moves, so reciprocating, make electrically conductive clamp 1 can frequently pass in and out the plating bath and the centre gripping electrically conductive base film move in the plating bath. However, when the conductive clip 1 is removed from the plating solution, a part of the plating solution is inevitably carried, and the carried plating solution is carried out of the plating solution tank 100, which is likely to cause waste of the plating solution.
In this regard, when the conductive clip 1 is immersed in a plating solution with the conductive base film interposed therebetween to perform plating, at least a part of the surface of the first and second holding arms 11 and 12 immersed in the plating solution excluding the first and second holding surfaces 1111 and 1211 is coated with a first anti-sticking liquid layer 14. Therefore, the first anti-sticking liquid layer 14 can form a liquid repellent surface on at least part of the surface of the first clamping arm 11 and the second clamping arm 12 which can be immersed in the plating solution, so that the plating solution is not easy to hang on the surface of the first clamping arm 11 and the second clamping arm 12, the amount of the plating solution attached to the surface of the conductive clip 1 when the plating solution is removed can be reduced, the waste of the plating solution is reduced, the plating solution attached to the surface of the conductive clip 1 is reduced, and the cleaning of the conductive clip 1 is facilitated.
It should be noted that, since the main components of the plating solution are water and the metal ions to be plated, and the metal ions to be plated are dissociated in the water, the purpose of reducing the plating solution attached to the conductive clip 1 can be achieved by reducing the water attached to the surface of the conductive clip 1 when the conductive clip 1 is removed from the plating solution. Therefore, the first anti-adhesive layer 14 may be a water-repellent layer capable of forming the surfaces of the first and second holding arms 11 and 12 to be water-repellent.
As described above, when plating is performed in the plating solution, the first anti-sticking liquid layer 14 is coated on at least a part of the surface of the first clamping arm 11 and the second clamping arm 12 immersed in the plating solution except the first clamping surface 1111 and the second clamping surface 1211, the first anti-sticking liquid layer 14 may be coated on both the part of the first clamping arm 11 and the part of the second clamping arm 12 immersed in the plating solution except the first clamping surface 1111 and the second clamping surface 1211, the first anti-sticking liquid layer 14 may be coated on only the part of the surface of the first clamping arm 11 immersed in the plating solution except the first clamping surface 1111, or the first anti-sticking liquid layer 14 may be coated on only the part of the surface of the second clamping arm 12 immersed in the plating solution except the second clamping surface 1211, which is not limited herein.
Of course, the first anti-adhesive liquid layer 14 may be coated on the surfaces of the remaining portions of the first holding arm 11 and the second holding arm 12 except for the first holding surface 1111 and the second holding surface 1211, which is not limited herein, and thus, it is not necessary to mark the positions on the first holding arm 11 and the second holding arm 12 where the first anti-adhesive liquid layer 14 needs to be coated, which simplifies the process.
In addition, there are various implementations of forming a water-repellent waterproof layer on the surfaces of the first and second holding arms 11 and 12. In one possible implementation, the surfaces of the first and second gripper arms 11, 12 are configured to: except for the first holding surface 1111 and the second holding surface 1211, the remaining surfaces that can be immersed in the plating solution during plating are the insulating surfaces 131, and the first anti-sticking liquid layer 14 is coated on the surfaces of the insulating surfaces 131.
Therefore, when the film is plated, the rest surfaces except the first clamping surface 1111 and the second clamping surface 1211 are the insulating surfaces 131, so that the rest parts except the first clamping surface 1111 and the second clamping surface 1211 in the first clamping arm 11 and the second clamping arm 12 can be prevented from being directly conducted with the plating solution, the reduction of the current flowing through the conductive base film caused by the conduction of the rest parts except the first clamping surface 1111 and the second clamping surface 1211 in the first clamping arm 11 and the second clamping arm 12 with the plating solution can be avoided, and the condition that the plating efficiency of the conductive base film is reduced due to the reduction of the current flowing through the conductive base film can be prevented. In addition, the first anti-sticking liquid layer 14 is coated on the surface of the insulating surface 131, so that the amount of the plating solution adhered to the insulating layer when the conductive clip 1 is moved out of the plating solution can be effectively reduced, the waste of the plating solution is reduced, and the surface of the conductive clip 1 can be easily cleaned. The first anti-adhesive liquid layer 14 is coated only on the insulating layer, and the conductive clip 1 is prevented from affecting the conductive properties of the first clamping surface 1111 and the second clamping surface 1211 due to the coating of the first anti-adhesive liquid layer 14.
Alternatively, as shown in fig. 1, in the conductive clip 1, the first clip arm 11 includes a first clip portion 111 and a first link 112, the first clip portion 111 is connected to one end of the first link 112, the second clip arm 12 includes a second clip portion 121 and a second link 122, the second clip portion 121 is connected to one end of the second link 122, the first clip portion 111 and the second clip portion 121 are oppositely disposed, the first clip surface 1111 is located on a side of the first clip portion 111 facing the second clip portion 121, the second clip surface 1211 is located on a side of the second clip portion 121 facing the first clip portion 111, and the first clip portion 111 and the second clip portion 121 are relatively movable to enable the conductive clip 1 to be closed or opened, and when the conductive clip 1 is closed, the first clip portion 111 and the second clip portion 121 are close to each other to enable the first clip surface 1111 and the second clip surface 1211 to be attached to each other, or, the conductive clip is sandwiched between the first clip surface 1111 and the second clip surface 112.
Optionally, except for the first clamping surface 1111, both an end of the first connecting rod 112 close to the first clamping portion 111 and an outer surface of the first clamping portion 111 are insulating surfaces 131, and a distance between an edge of the insulating surface 131 of the first connecting rod 112 far from the first clamping surface 1111 and the first clamping surface 1111 is L 1 (see L in FIG. 1) 1 Shown in (b) 10cm < L 1 Less than or equal to 15cm; and/or, except for the second clamping surface 1211, both the end of the second connecting rod 122 close to the first clamping part 111 and the outer surface of the first clamping part 111 are insulating surfaces 131, and the distance between the edge of the insulating surface 131 far away from the second clamping surface 1211 and the second clamping surface 1211 in the insulating surface 131 on the second connecting rod 122 is L 2 (see L in FIG. 1) 2 Shown) 10cm < L 2 ≤15cm。
When L is 1 Less than 10cm, the conductive clip 1 is used for clamping the conductive base film 400 and immersing the first connecting rod 112 in the plating solutionSome parts in the plating solution are not insulated, so that the uninsulated parts of the first connecting rod 112 can be directly conducted with the plating solution, and some parts of the current flowing through the conductive clip 1 are led into the plating solution through the first connecting rod 112, thereby reducing the current flowing to the conductive base film 400 and lowering the plating efficiency. When L is 1 When the thickness is larger than 15cm, when the conductive clip 1 is used for clamping the conductive base film 400 to be dipped into the plating film in the plating solution, although the parts of the first connecting rod 112 dipped into the plating solution are all insulated, the parts of the surface of the first connecting rod 112, which are the insulating surfaces 131, are too many, so that the insulating material for manufacturing the insulating surfaces 131 on the first connecting rod 112 is used more, and the cost is increased. In the same way, when L 2 When the thickness is less than 10cm, the uninsulated part of the second connecting rod 122 can be directly communicated with the plating solution, so that the plating efficiency is reduced; when L is 2 More material for the insulating surface 131 of the second link 122 is required above 15cm, which increases the cost.
Therefore, the parts of the first connecting rod 112 and the second connecting rod 122 immersed in the plating solution are all the insulating surfaces 131, and the parts of the first clamping part 111 except the first clamping surface 1111 and the second clamping surface 1211 of the first clamping part 111 are all the insulating surfaces 131, and simultaneously, all the surfaces of the first connecting rod 112 and the second connecting rod 122 are not all the insulating surfaces 131, so that the material is saved, and thus, only the first anti-sticking liquid layer 14 needs to be coated on the first connecting rod 112, the first clamping part 111, the second connecting rod 122 and the insulating surfaces 131 of the first clamping part 111, and the cost is saved.
In some embodiments, as shown in fig. 3, the first liquid release layer 14 may include an acrylic coating layer 141 and a polytetrafluoroethylene coating layer 142, the acrylic coating layer 141 being located outside the polytetrafluoroethylene coating layer 142. Because the acrylic coating has the characteristics of low temperature resistance, environmental protection, no pollution, high elongation, good crack resistance, good weather resistance, good waterproofness and the like, and the polytetrafluoroethylene coating 142 has the characteristics of high temperature resistance, low temperature resistance, corrosion resistance, waterproofness, strong adhesive force and the like, the waterproof layer can form a hydrophobic surface on the surface of the conductive clamp 1, and the waterproof layer has good anti-sticking performance, so that the first clamping arm 11 and the second clamping arm 12 have good anti-sticking performance. And can also be that first antiseized liquid layer 14 has better corrosion resistance for Tu Sheyu first centre gripping arm 11 and the first antiseized liquid layer 14 on the second centre gripping arm 12 have longer life, and in addition, acrylic acid coating and polytetrafluoroethylene coating are the more common waterproof coating in the market, and the cost is lower.
The thickness of the first anti-sticking liquid layer 14 may be t 1 ，0.1mm≤t 1 Less than or equal to 0.4mm. In addition, since the first anti-sticking liquid layer 14 needs a certain thickness, a relatively dense waterproof layer can be formed on the surface of the conductive clip 1, and a good waterproof effect is achieved, so that the thickness t of the first anti-sticking liquid layer 14 is larger 1 If the thickness is less than 0.1mm, the effect of preventing the conductive clip 1 from sticking to the plating solution is not good when the conductive clip is immersed in the plating solution during plating. When the thickness t of the first release liquid layer 14 1 If the thickness is more than 0.4mm, a dense waterproof layer can be formed on the surface of the conductive clip 1, but if the thickness of the first anti-sticking liquid layer 14 is too large, a large amount of waterproof coating material is used, which increases the cost. Thus, the first anti-adhesive liquid layer 14 has a thickness t of 0.1mm ≦ t 1 Is less than or equal to 0.4mm, and can prevent the conductive clip 1 from being coated with the first anti-sticking liquid layer 14 to increase more cost while ensuring that the part of the conductive clip 1 immersed in the plating solution has better anti-sticking liquid effect during film coating.
In another possible implementation, as shown in fig. 4, first anti-stiction liquid layer 14 may be a nano anti-stiction liquid layer 143. Because the nanometer anti-sticking liquid layer 143 can form a layer of transparent hydrophobic coating on the first clamping arm 11 and the second clamping arm 12, water is not easily hung on the surface of the part of the conductive clip 1 entering the plating solution during plating, so that the plating solution is not easily attached to the surface of the conductive clip 1 when the conductive clip 1 is moved out of the plating solution, waste of the plating solution is reduced, and the conductive clip 1 is easy to clean.
It should be noted that the nano anti-sticking liquid layer 143 may be a nano waterproof layer, and the nano waterproof layer is a relatively advanced nano coating technology, and the thickness of the nano anti-sticking liquid layer can be a nano-level thickness (such as 200 nm), and a water drop on the surface of an object can have a relatively large contact angle, so that the water drop on the surface of the object rolls down just like on a lotus leaf, that is, the nano waterproof layer has relatively strong super-hydrophobic property.
Specifically, when the nano waterproof layer liquid is smeared on the surface of a metal product or a plastic product and the like, the nano waterproof layer liquid can quickly form an extremely thin and very soft high-performance transparent coating on the surface, namely the nano waterproof layer, and the process is mature and easy to realize. And the transparent coating has extremely low surface tension, is easy to coat and can cover the surfaces of all parts. And the water on the surface of the object can have higher surface tension, so that the water forms water drops with larger contact angles, and at the moment, the water drops can slide off by slightly inclining the object, so that the surface of the object has better hydrophobicity.
Moreover, the nano waterproof layer liquid can be a fluorine compound solution which takes a fluorine-containing solvent as a solvent and has waterproof and oil-proof properties, and a thin and transparent protective film can be quickly formed on the surface of an object, so that a good anti-mucus effect is achieved. In this way, the prepared nano waterproof layer liquid may be soaked or sprayed on the first holding arm 11 and the second holding arm 12 to form the nano anti-sticking liquid layer 143 on the first holding arm 11 and the second holding arm 12. Before the nano waterproof layer liquid is soaked or sprayed, the first clamping surface 1111 of the first clamping arm 11 and the second clamping surface 1211 of the second clamping arm 12 can be subjected to sealing protection treatment, so that the nano waterproof layer liquid is prevented from being coated on the first clamping surface 1111 and the second clamping surface 1211, and the electric conductivity is prevented from being influenced due to the fact that the nano waterproof layer liquid is coated on the first clamping surface 1111 and the second clamping surface 1211.
In some embodiments, as shown in fig. 1 and 5, a second anti-adhesive layer is coated on the surfaces of the first clamping surface 1111 and the second clamping surface 1211, and the second anti-adhesive layer is an electrically conductive anti-adhesive layer 1112, in this case, the surfaces of the first clamping arm 11 and the second clamping arm 12 are configured to: except for the first clamping surface 1111 and the second clamping surface 1211, the rest surfaces which can be immersed in the plating solution during plating are all insulating surfaces 131, and the first anti-sticking liquid layer 14 is coated on the surfaces of the insulating surfaces 131. Therefore, the plating solution is not easily attached to the insulating surface 131 of the conductive clip 1, and the plating solution is not easily attached to the first clamping surface 1111 and the second clamping surface 1211, so that the amount of the plating solution attached to the conductive clip 1 when the plating solution is removed is further reduced, and the conductivity of the first clamping surface 1111 and the second clamping surface 1211 is not easily affected.
Specifically, the antiseized liquid layer of second can be the antiseized liquid layer 143 of nanometer 143, can electrically conduct antiseized layer 1112 can be the antiseized liquid layer 143 of nanometer, from this, can make the antiseized liquid layer of second when having electric conductivity, the antiseized liquid effect that still has, and the antiseized liquid layer technology of nanometer is ripe, easily realizes.
In some embodiments, the second release liquid layer has a thickness t 2 ，0.1nm≤t 2 Less than or equal to 1000nm. Therefore, the first clamping surface 1111 and the second clamping surface 1211 can not be easily attached with the plating solution, and have better conductivity.
And, when the thickness t of the second anti-sticking liquid layer 2 When the thickness of the second anti-sticking liquid layer is less than 0.1nm, the coating of the second anti-sticking liquid layer is usually realized through a soaking or coating process (for example, the coating of the nano anti-sticking liquid layer 143), so that the coating of the second anti-sticking liquid layer with a smaller thickness can make the process of the second anti-sticking liquid layer have higher difficulty and difficult realization. When the thickness t of the second anti-sticking liquid layer 2 Greater than 1000nm, although the thicker second anti-sticking liquid layer can make the anti-sticking liquid performance of the first clamping surface 1111 and the second clamping surface 1211 better, the thicker second anti-sticking liquid layer may have a certain influence on the electric conductivity of the first clamping surface 1111 and the second clamping surface 1211, so that the current flowing to the conductive base film through the conductive clip 1 is reduced, and the electroplating efficiency of the conductive base film may be affected. Therefore, when the thickness of the second anti-sticking liquid layer is 0.1nm ≦ t 2 When the thickness is less than or equal to 1000nm, the first clamping surface 1111 and the second clamping surface 1211 can have good liquid-proof performance, and the electric conductivity of the first clamping surface 1111 and the second clamping surface 1211 cannot be influenced.
In addition, when the second anti-sticking liquid layer is the nano anti-sticking liquid layer 143, the thickness of the nano anti-sticking liquid layer 143 may be between 0.1nm and 1000nm. The nano anti-sticking liquid layer 143 coated on the first clamping surface 1111 and the second clamping surface 1211 can be formed by coating the same nano waterproof layer liquid as the nano anti-sticking liquid layer 143 coated on the insulating surface 131, so that when the nano anti-sticking liquid layer 143 is coated on the insulating surface 131, the first clamping surface 1111 and the second clamping surface 1211 can be coated at the same time, and the process of coating the first anti-sticking liquid layer 14 and the conductive anti-sticking layer 1112 can be effectively simplified.
In some embodiments, as shown in fig. 6 and 7, except for the first clamping surface 1111 and the second clamping surface 1211, the outer surfaces of the first clamping arm 11 and the second clamping arm 12, which are immersed in the plating solution during plating, are cambered surfaces. Therefore, during plating, the plating solution can be less attached to the portions of the first and second holding arms 11 and 12 that are immersed in the plating solution, so that the plating solution is less likely to adhere to the first and second holding arms 11 and 12 when the plating solution is removed.
Optionally, the insulating surface 131 of the first connecting rod 112 is an arc surface, and/or the insulating surface 131 of the first clamping portion 111 is an arc surface. Therefore, the plating solution has a smaller adhesion surface on the part of the first connecting rod 112 immersed in the plating solution and the part of the first clamping part 111 except the first clamping surface 1111, so that the plating solution is not easy to adhere to the first connecting rod 112 and the first clamping part 111 when the plating solution is removed. Similarly, the insulating surface 131 of the second connecting rod 122 may be an arc surface, and/or the insulating surface 131 of the second clamping portion 121 may be an arc surface. The insulating surface 131 of the first link 112 and the insulating surface 131 of the second link 122 have already been described above, and are not described again here.
Besides, the outer surfaces of the first clamping arm 11 and the second clamping arm 12 entering the plating solution during plating may be smooth curved surfaces, such as elliptical cross sections of the portions of the first connecting rod 112 and the second connecting rod 122 entering the plating solution, the surface of the first clamping portion 111 on the side away from the first clamping surface 1111 may be gradually transited from the circular arc surface to the first clamping surface 1111, and the surface of the second clamping portion 121 on the side away from the second clamping surface 1211 may be gradually transited from the circular arc surface to the second clamping surface 1211. Of course, the cross section of the portion of the first connecting rod 112 and the second connecting rod 122 entering the plating solution may also be a circle, or a special arc shape formed by connecting several arc lines with different curvatures in a smooth transition manner, which is not limited herein.
The first clamping surface 1111 and the second clamping surface 1211 may be both flat surfaces, or the first clamping surface 1111 may be a convex arc surface, and the second clamping surface 1211 may be a concave arc surface matching with the first clamping surface 1111, which is not limited herein.
In the present embodiment, the first and second gripper arms 11 and 12 are configured to: except for the first clamping surface 1111 and the second clamping surface 1211, the rest surfaces which can be immersed into the plating solution during plating are designed as insulating surfaces 131. The surface insulation of the first clamping arm 11 and the second clamping arm 12 can be achieved in various ways, for example, the first clamping arm 11 and the second clamping arm 12 can be integrally made of an insulating material, only the first clamping surface 1111 and the second clamping surface 1211 are provided with conducting strips, and then the conducting strips are connected to the negative electrode of the power supply through wires.
It is also possible to integrally form the first and second grip arms 11 and 12 from a conductive metal material, and then coat the surfaces of the first and second grip arms 11 and 12 with an insulating sheath 13, and arrange the insulating sheath 13 so as to avoid the first and second grip surfaces 1111 and 1211. With this arrangement, the entire interiors of the first and second holding arms 11 and 12 are both electrically conductive, and thus the first and second holding surfaces 1111 and 1211 can be electrically connected from the interiors of the first and second holding arms 11 and 12. For example, a portion of the conductive surface may be exposed at the top of the first clamping arm 11 and/or the second clamping arm 12, or a conductive hole may be formed at the top for connecting with the negative electrode of the power source, thereby avoiding the need for a conductive wire and making the structure of the conductive clip 1 simpler. Besides the first clamping surface 1111 and the second clamping surface 1211, the other surfaces of the first clamping arm 11 and the second clamping arm 12, which can be immersed in the plating solution during plating, are coated with the insulating sleeve 13.
From this, when electrically conductive clamp 1 of centre gripping electrically conductive base film got into the plating bath, the part that first centre gripping arm 11 and second centre gripping arm 12 got into the plating bath all can be insulated, has prevented first centre gripping arm 11 and second centre gripping arm 12 direct and plating bath contact, has avoided directly forming the current path between first centre gripping arm 11 and second centre gripping arm 12 and the plating bath to can prevent to reduce through the electric current of electrically conductive base film, avoid the influence to electroplating efficiency.
Example two
The application also provides a film coating machine which comprises the conductive clamp 1 in any one of the first embodiment.
In the coating machine provided by this embodiment, because the conductive clip 1 in the first embodiment is adopted, when the conductive clip 1 is moved out of the plating solution after the conductive base film is clamped by the conductive clip 1, only a small amount of plating solution can be attached, and even the plating solution is not attached to the surface of the conductive clip 1, so that waste of the plating solution caused by moving the conductive clip 1 out of the plating solution can be reduced, and the conductive clip 1 can be relatively easily cleaned.
Specifically, as shown in fig. 8, the coater may be a horizontal-film-moving coater, the coater includes a plating solution tank 100, a first conveying mechanism 200 and a second conveying mechanism 300, wherein the plating solution tank 100 includes a first side wall 1001 and a second side wall 1002 extending along a first horizontal direction (a direction indicated by Y in fig. 8) and disposed opposite to each other, and an anode member and a plating solution (not shown in the figure) are disposed in the plating solution tank 100; the first transfer mechanism 200 includes a first transfer belt 2001 provided adjacent to the first side wall 1001 and extending in the Y direction, the first transfer belt 2001 being provided with a plurality of first conductive clips 2002, and the plurality of first conductive clips 2002 being arranged in the Y direction; the second conveying mechanism 300 includes a second conveying belt 3001 disposed adjacent to the second side wall 1002 and extending in the Y direction, the second conveying belt 3001 is provided with a plurality of second conductive clips 3002, and the plurality of second conductive clips 3002 are arranged in the Y direction; the first conductive clip 2002 and the second conductive clip 3002 are respectively used for clamping two opposite sides of the conductive base film 400 horizontally placed, and the first conductive clip 2002 and the second conductive clip 3002 can use the conductive clip 1 of the first embodiment.
Therefore, in operation, the plurality of first conductive clips 2002 are driven by the first conveyor belt 2001 to move in the Y direction, and the plurality of second conductive clips 3002 are driven by the conveyor belt to move in the Y direction, that is, when the first conductive clips 2002 and the second conductive clips 3002 move to a predetermined position, the first conductive clips 2002 and the second conductive clips 3002 respectively clip the conductive base film 400 from two sides and drive the conductive base film 400 to move forward, and meanwhile, the conductive base film 400 is electrified to be electroplated. Moreover, when the first conductive clip 2002 and the second conductive clip 3002 are removed from the plating solution, less plating solution adheres to the surfaces of the first conductive clip 2002 and the second conductive clip 3002, thereby reducing waste of the plating solution.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (11)
1. The utility model provides a conductive clamp for coating machine which characterized in that includes:
a first clamp arm including a first clamp face;
the second clamping arm comprises a second clamping surface, and the first clamping surface and the second clamping surface are oppositely arranged and are conductive surfaces;
the first clamping arm and the second clamping arm can move relatively to enable the conductive clamp to be in a clamping state or an opening state, when the conductive clamp is in the clamping state and clamps the conductive base film between the first clamping surface and the second clamping surface to be plated in plating solution, a first anti-sticking liquid layer is coated on at least part of the surface, except the first clamping surface and the second clamping surface, of the first clamping arm and the second clamping arm, which are immersed in the plating solution.
2. The conductive clip for coating machine as claimed in claim 1, wherein the first liquid-proof layer comprises an acrylic paint layer and a teflon paint layer, and the acrylic paint layer is located outside the teflon paint layer.
3. The conductive clip for coating machine of claim 2 wherein said clip is made of a metal materialThe first anti-sticking liquid layer has a thickness t 1 ，0.1mm≤t 1 ≤0.4mm。
4. The conductive clip for coating machine as claimed in claim 1, wherein a second anti-sticking liquid layer is coated on the surface of the first clamping surface and the second clamping surface, and the second anti-sticking liquid layer is a conductive anti-sticking layer.
5. The conductive clip for coating machine as claimed in claim 4, wherein the second anti-adhesive layer is a nano anti-adhesive layer.
6. The conductive clip for coater of claim 4 wherein the second release liquid layer has a thickness t 2 ，0.1nm≤t 2 ≤1000nm。
7. The conductive clip for coating machines of any one of claims 1-6 wherein the surfaces of the first clamping arm and the second clamping arm are configured to: except the first clamping surface and the second clamping surface, the rest surfaces which can be immersed in plating solution during plating are insulating surfaces, and the first anti-sticking liquid layer is coated on the surface of the insulating surfaces.
8. The conductive clip for coating machine as claimed in claim 7, wherein the first clipping arm comprises a first clipping portion and a first connecting rod, the first clipping portion is connected with one end of the first connecting rod, the first clipping surface is located on the first clipping portion, except the first clipping surface, the end of the first connecting rod close to the first clipping portion and the outer surface of the first clipping portion are both the insulating surface, and the distance between the edge of the insulating surface of the first connecting rod far away from the first clipping surface and the first clipping surface is L 1 ，10cm≤L 1 Less than or equal to 15cm; and/or the presence of a gas in the atmosphere,
the second clamping arm comprises a second clamping part and a second connecting rod, and the second clamping part and the second connecting rodIs located on the second clamping part, except for the second clamping surface, the second connecting rod is close to one end of the second clamping part and is equal to the insulating surface on the outer surface of the second clamping part, the second connecting rod is far away from the edge of the second clamping surface and the distance between the second clamping surface and the insulating surface is L 2 ，10cm≤L 2 ≤15cm。
9. The conductive clip for coating machine as claimed in claim 8, wherein the insulating surface of the first connecting rod is a cambered surface, and/or the insulating surface of the first clamping part is a cambered surface.
10. A coater comprising the conductive clip of any one of claims 1-9.
11. A coater as defined in claim 10 wherein said coater includes:
the plating solution tank comprises a first side wall and a second side wall which extend along a first horizontal direction and are oppositely arranged;
the first conveying mechanism comprises a first conveying belt and a plurality of first conductive clips, wherein the first conveying belt is arranged close to the first side wall and extends along the first horizontal direction, the plurality of first conductive clips are arranged on the first conveying belt, and the plurality of first conductive clips are arranged along the first horizontal direction;
the second conveying mechanism comprises a second conveying belt which is arranged close to the second side wall and extends along the first horizontal direction, and a plurality of second conductive clamps which are arranged on the second conveying belt and are arranged along the first horizontal direction;
the first conductive clip and the second conductive clip are respectively used for clamping two opposite side edges of a horizontally placed conductive base film, and the first conductive clip and the second conductive clip are the conductive clips in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221814123.5U CN218596546U (en) | 2022-07-13 | 2022-07-13 | A electrically conductive clamp and coating machine for coating machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221814123.5U CN218596546U (en) | 2022-07-13 | 2022-07-13 | A electrically conductive clamp and coating machine for coating machine |
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| Publication Number | Publication Date |
|---|---|
| CN218596546U true CN218596546U (en) | 2023-03-10 |
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| CN202221814123.5U Active CN218596546U (en) | 2022-07-13 | 2022-07-13 | A electrically conductive clamp and coating machine for coating machine |
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| Country | Link |
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| CN (1) | CN218596546U (en) |
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