CN218587501U - High heat radiation structure of lead interconnection packaging hardware - Google Patents
High heat radiation structure of lead interconnection packaging hardware Download PDFInfo
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- CN218587501U CN218587501U CN202221211775.XU CN202221211775U CN218587501U CN 218587501 U CN218587501 U CN 218587501U CN 202221211775 U CN202221211775 U CN 202221211775U CN 218587501 U CN218587501 U CN 218587501U
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Abstract
The utility model discloses a lead wire interconnection packaging hardware's high heat radiation structure, including the control box, install the controller body in the control box, the control box is separated for control room and radiating chamber by a baffle, the controller body is installed in the control room, install bellows in the radiating chamber, install first fan assembly in the bellows, one side of bellows is equipped with the air intake, the opposite side of bellows is equipped with the air outlet, first fan assembly's negative pressure face is towards the air intake, first fan assembly's air-out face is towards the air outlet, install a plurality of cold air pipes towards the controller body on the baffle, a plurality of cold air pipes are connected with the air outlet through a blast pipe respectively, a plurality of air vents have on the lateral wall of control room, the air inlet has on the lateral wall of radiating chamber, the air inlet passes through induced duct and air intake connection, install a semiconductor refrigerator on the induced duct, a plurality of thermovents have on the lateral wall of radiating chamber, through the utility model discloses a high heat radiation structure, can play rapid cooling's efficiency, the radiating efficiency is high.
Description
Technical Field
The utility model relates to a semiconductor package technical field, concretely relates to lead wire interconnection packaging hardware's high heat radiation structure.
Background
The semiconductor packaging process is used for providing a packaging structure to protect the semiconductor chip, so that the problems of external force collision, dust pollution, moisture or oxidation and the like can be avoided when the semiconductor chip is powered on, and the packaging structure is used for improving the use reliability of the semiconductor and prolonging the service life of the semiconductor. In the conventional semiconductor packaging process, a semiconductor wafer is generally manufactured and tested, then the semiconductor wafer passing the test is cut into a plurality of semiconductor chips, and then each semiconductor chip is fixed to a lead frame or a package substrate to perform a lead interconnection process.
Generally, the requirement of a lead interconnection process is high, and the device is required to have very high accuracy, so that a controller of the device has relatively high power, a complex operation program and relatively high operation speed, so that the heating speed and the heat quantity of the controller are high, and the controller of the lead interconnection device in the prior art adopts natural heat dissipation and air cooling heat dissipation, but the efficiency of the heat dissipation mode is low, and the heat quantity of the controller cannot be reduced quickly.
Disclosure of Invention
In order to solve the deficiencies in the prior art, the utility model provides a lead wire interconnection packaging hardware's high heat radiation structure.
In order to realize the technical effect, the utility model discloses a following scheme:
the utility model provides a lead wire interconnection packaging hardware's high heat radiation structure, includes the control box, install the controller body in the control box, the control box is separated for control room and radiating chamber by a baffle, the controller body is installed in the control room, install bellows through first support mounting in the radiating chamber, install first fan assembly in the bellows, one side of bellows is equipped with the air intake, the opposite side of bellows is equipped with the air outlet, first fan assembly's negative pressure face is towards the air intake, first fan assembly's air-out face is towards the air outlet, install a plurality of cold air pipes towards the controller body on the baffle, a plurality of cold air pipes are connected with the air outlet through a blast pipe respectively, a plurality of air vents have on the lateral wall of control room, the air inlet has on the lateral wall of radiating chamber, the air inlet passes through induced duct and air intake connection, install a semiconductor refrigerator on the induced duct, a plurality of thermovents have on the lateral wall of radiating chamber.
The semiconductor refrigerator comprises a refrigeration box, the refrigeration box is installed in a heat dissipation chamber through a second support, a first connecting port is arranged at one end of the refrigeration box, the first connecting port is connected with one section of an air inlet through an air guiding pipe, a second connecting port is arranged at the other end, corresponding to the first connecting port, of the refrigeration box, the second connecting port is connected with the other section of the air inlet through the air guiding pipe, a semiconductor refrigeration plate is installed on the side wall of the refrigeration box, the refrigeration surface of the semiconductor refrigeration plate is located in the refrigeration box, the heating surface of the semiconductor refrigeration plate is located outside the refrigeration box, a plurality of heat conducting rods are arranged in the refrigeration box, one end of each heat conducting rod is perpendicular to the refrigeration surface of the semiconductor refrigeration plate and fixedly connected with the semiconductor refrigeration plate, and the heat conducting rods are perpendicular to the connecting line direction of the first connecting port and the second connecting port.
According to the preferable technical scheme, a second fan assembly is arranged in the heat dissipation chamber, and the air outlet surface of the second fan assembly is close to and faces towards the plurality of heat dissipation ports.
According to the preferable technical scheme, the heating surface of the semiconductor refrigeration plate is arranged close to the negative pressure surface of the second fan assembly.
According to the preferable technical scheme, a dust removal filter screen is installed at the air inlet.
Compared with the prior art, beneficial effect does:
the utility model discloses simple structure, convenient to use will refrigerate through the air of induced duct through the semiconductor refrigerator, then blow to the controller body through a plurality of cold air pipes by first fan assembly, cool down the controller body, through the utility model discloses a high heat radiation structure can play rapid cooling's efficiency, and the radiating efficiency is high.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Reference numerals: 1. a control box; 2. a controller body; 3. a control room; 4. a heat dissipation chamber; 5. a partition plate; 6. a vent hole; 7. an air box; 8. a first fan assembly; 9. an air outlet; 10. an air inlet; 11. a cold air pipe; 12. an exhaust duct; 13. a refrigeration case; 14. a semiconductor refrigeration plate; 15. a heat conducting rod; 16. an induced draft pipe; 17. an air inlet; 18. a dust removal filter screen; 19. a second fan assembly; 20. and a heat dissipation port.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
The utility model provides a lead wire interconnection packaging hardware's high heat radiation structure, includes control box 1, install controller body 2 in the control box 1, controller body 2 is the controller of lead wire interconnection device, control box 1 is separated for control room 3 and heat dissipation room 4 by a baffle 5, controller body 2 installs in control room 3, there is bellows 7 through first support mounting in the heat dissipation room 4, install first fan assembly 8 in the bellows 7, one side of bellows 7 is equipped with air intake 10, the opposite side of bellows 7 is equipped with air outlet 9, the negative pressure face of first fan assembly 8 is towards air intake 10, the air-out face of first fan assembly 8 is towards air outlet 9, install a plurality of cold-blast main 11 towards controller body 2 on the baffle 5, a plurality of cold-blast main 11 are connected with air outlet 9 through one row of tuber pipe 12 respectively, a plurality of air vents 6 have on the lateral wall of control room 3, air inlet 17 has on the lateral wall of heat dissipation room 4, air inlet 17 passes through induced duct 16 and air intake 10 is connected, install a semiconductor refrigerator on the induced duct 16, heat dissipation room 4 has on the lateral wall 20.
First fan unit 8 starts, attracts the air to get into induced air pipe 16 from air inlet 17, and the air cools down when passing through semiconductor cooler and refrigerates, then the cold air passes through air intake 10 and gets into bellows 7, under first fan unit 8's power effect, and is defeated to blow off towards controller body 2 towards a plurality of cold blast pipes 11 through air outlet 9 and a plurality of exhaust pipe 12 again, cools down the heat dissipation for controller body 2.
The semiconductor refrigerator comprises a refrigeration box 13, the refrigeration box 13 is installed in a heat dissipation chamber 4 through a second support, one end of the refrigeration box 13 is provided with a first connecting port, the first connecting port is connected with one section of an air inlet 17 through an air guiding pipe 16, the other end of the refrigeration box 13 corresponding to the first connecting port is provided with a second connecting port, the second connecting port is connected with the other section of the air inlet 10 through the air guiding pipe 16, a semiconductor refrigeration plate 14 is installed on the side wall of the refrigeration box 13, the refrigeration surface of the semiconductor refrigeration plate 14 is located in the refrigeration box 13, the heating surface of the semiconductor refrigeration plate 14 is located outside the refrigeration box 13, a plurality of heat conducting rods 15 are arranged in the refrigeration box 13, one end of each heat conducting rod 15 is perpendicular to the refrigeration surface of the semiconductor refrigeration plate 14 and fixedly connected with the semiconductor refrigeration plate 14, and the heat conducting rods 15 are perpendicular to the connecting line direction of the first connecting port and the second connecting port.
The semiconductor refrigeration plate 14 works, the refrigeration surface produces cold low temperature and transmits the cold low temperature to the heat conducting rod 15, the heat conducting rod 15 is a rod body used for transmitting temperature, the heat conducting rod is mainly made of metal materials, the temperature is controlled and cooled in the refrigeration box 13, air enters the refrigeration box 13 through one section of the air guide pipe 16, and the cooled air enters the air box 7 through the other section of the air guide pipe 16.
In a preferred technical scheme, a second fan assembly 19 is arranged in the heat dissipation chamber 4, and an air outlet surface of the second fan assembly 19 is close to and faces the plurality of heat dissipation ports 20.
The heating surface of the semiconductor refrigeration plate 14 will radiate heat into the heat dissipation box, and the heat in the heat dissipation box is quickly blown out from the heat dissipation port 20 by the second fan assembly 19.
In a preferred technical solution, the heating surface of the semiconductor refrigeration plate 14 is disposed close to the negative pressure surface of the second fan assembly 19.
It is possible to reduce the heat dissipation from the heating surface of the semiconductor chilling plate 14 into the heat-dissipating box.
In a preferred technical scheme, a dust removal filter screen 18 is arranged at the air inlet 17.
The air entering the air inlet 17 is dedusted, and dust accumulation inside the heat dissipation box and the first fan assembly 8 is avoided.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like refer to the orientation or position relationship shown in the drawings, or the orientation or position relationship that the product of the present invention is usually placed when in use, or the orientation or position relationship that one skilled in the art conventionally understands, and are only for convenience of describing the present invention and simplifying the description, but do not refer to or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Claims (5)
1. The utility model provides a lead wire interconnection packaging hardware's high heat radiation structure, includes the control box, install the controller body in the control box, its characterized in that, the control box is separated for control room and heat dissipation room by a baffle, the controller body is installed in the control room, install bellows through first support mounting in the heat dissipation room, install first fan assembly in the bellows, one side of bellows is equipped with the air intake, the opposite side of bellows is equipped with the air outlet, first fan assembly's negative pressure face is towards the air intake, first fan assembly's air-out face is towards the air outlet, install a plurality of cold air pipes towards the controller body on the baffle, a plurality of cold air pipes are connected with the air outlet through a blast pipe respectively, a plurality of air vents have on the lateral wall of control room, the air inlet has on the lateral wall of heat dissipation room, the air inlet is through induced duct and air intake connection, install a semiconductor on the induced duct, a plurality of thermovents have on the lateral wall of heat dissipation room.
2. The high heat dissipation structure of the lead interconnection packaging device according to claim 1, wherein the semiconductor refrigerator comprises a refrigeration box, the refrigeration box is mounted in the heat dissipation chamber through a second bracket, one end of the refrigeration box is provided with a first connector, the first connector is connected with the air inlet through one section of the induced draft tube, the other end of the refrigeration box corresponding to the first connector is provided with a second connector, the second connector is connected with the air inlet through the other section of the induced draft tube, a semiconductor refrigeration plate is mounted on a side wall of the refrigeration box, a refrigeration surface of the semiconductor refrigeration plate is located in the refrigeration box, a heating surface of the semiconductor refrigeration plate is located outside the refrigeration box, a plurality of heat conduction rods are arranged in the refrigeration box, one ends of the heat conduction rods are perpendicular to the refrigeration surface of the semiconductor refrigeration plate and are fixedly connected with the semiconductor refrigeration plate, and the heat conduction rods are perpendicular to a connection line direction of the first connector and the second connector.
3. The high heat dissipation structure of a leaded package device as defined in claim 2, wherein, a second fan assembly is arranged in the heat dissipation chamber, and the air outlet surface of the second fan assembly is arranged near and towards a plurality of heat dissipation ports.
4. The high heat dissipation structure of a lead interconnect package device of claim 3, wherein the heating surface of the semiconductor chilling plate is disposed proximate to the negative pressure surface of the second fan assembly.
5. The high heat dissipation structure of a lead interconnect package device according to claim 1, wherein a dust-removing filter is installed at the air inlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221211775.XU CN218587501U (en) | 2022-05-18 | 2022-05-18 | High heat radiation structure of lead interconnection packaging hardware |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221211775.XU CN218587501U (en) | 2022-05-18 | 2022-05-18 | High heat radiation structure of lead interconnection packaging hardware |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218587501U true CN218587501U (en) | 2023-03-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221211775.XU Active CN218587501U (en) | 2022-05-18 | 2022-05-18 | High heat radiation structure of lead interconnection packaging hardware |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218587501U (en) |
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2022
- 2022-05-18 CN CN202221211775.XU patent/CN218587501U/en active Active
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