CN111351270A - Semiconductor refrigerating system and smoke exhaust ventilator using same - Google Patents
Semiconductor refrigerating system and smoke exhaust ventilator using same Download PDFInfo
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- CN111351270A CN111351270A CN202010271760.1A CN202010271760A CN111351270A CN 111351270 A CN111351270 A CN 111351270A CN 202010271760 A CN202010271760 A CN 202010271760A CN 111351270 A CN111351270 A CN 111351270A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
- F24C15/00—Details
- F24C15/20—Removing cooking fumes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/30—Arrangement or mounting of heat-exchangers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0096—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater combined with domestic apparatus
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F2221/00—Details or features not otherwise provided for
- F24F2221/18—Details or features not otherwise provided for combined with domestic apparatus
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a semiconductor refrigeration system, comprising: the semiconductor refrigeration module comprises a cold end heat exchanger and a hot end heat exchanger; the refrigerating device is internally provided with a cold end cavity, the cold end cavity is divided into a refrigerating cavity and an air supply cavity by a dividing part, the cold end heat exchanger is arranged in the refrigerating cavity, and a fan is arranged in the air supply cavity; and the heat radiator is provided with a second air inlet and a first hot air outlet, and a hot end heat exchanger and an air cooling device are arranged in the heat radiator. Because the refrigerating cavity and the air supply cavity are separated by the separating part, air can fully exchange heat with the cold end heat exchanger in the refrigerating cavity and then enters the air supply cavity, and the refrigerating effect created by the invention is effectively improved; in addition, hot gas generated by the hot end heat exchanger can be blown out of the first hot air outlet through the air cooling device, and the first hot air outlet is communicated with an external exhaust pipeline, so that the hot gas is prevented from flowing back to the working environment.
Description
Technical Field
The invention relates to the technical field of heat exchange, in particular to a semiconductor refrigeration system and a range hood applying the same.
Background
At present, partial domestic appliance adopts semiconductor refrigerating system to cool down operational environment, smoke ventilator for example, current semiconductor refrigerating system is most directly the air inlet from operational environment, then directly blows to the user behind its heat exchanger, because the air can not carry out the heat transfer with the heat exchanger fully, consequently its refrigeration effect is relatively poor and the air that blows out is neglected cold easily and is neglected hot. In addition, the heat dissipation effect of the hot end of the conventional semiconductor refrigeration system is poor, and most of the heat is returned to the working environment, so that the refrigeration effect of the semiconductor refrigeration system is further reduced.
Disclosure of Invention
The present invention is designed to solve at least one of the problems of the prior art, and therefore, the present invention provides a semiconductor refrigeration system.
The invention also provides a range hood with the semiconductor refrigeration system.
According to the invention, the semiconductor refrigeration system comprises:
the semiconductor refrigeration module comprises a cold end heat exchange assembly and a hot end heat exchange assembly, a heat insulation plate is arranged between each cold end heat exchange assembly and the corresponding hot end heat exchange assembly, each cold end heat exchange assembly comprises a cold end heat exchanger, and each hot end heat exchange assembly comprises a hot end heat exchanger;
the refrigerating device is provided with a first air inlet and a first cold air outlet, a cold end cavity is arranged in the refrigerating device, a partition part is arranged in the cold end cavity, the cold end cavity is partitioned into a refrigerating cavity and a air supply cavity through the partition part, an air guide opening is formed in the partition part, and the refrigerating cavity is communicated with the air supply cavity through the air guide opening; an air inlet channel is arranged in the refrigeration cavity, the first air inlet is directly communicated with the air inlet channel, the first cold air outlet is directly communicated with the air supply cavity, and the air inlet channel is not directly communicated with the air supply cavity; all the cold end heat exchangers are arranged in the refrigerating cavity, and a fan is arranged in the air supply cavity;
and the heat-end heat exchanger and the air cooling device used for cooling the heat-end heat exchanger are arranged in each heat radiator.
The semiconductor refrigeration system according to the embodiment of the invention has at least the following beneficial effects: because the refrigeration cavity and the air supply cavity are separated by the separating part, and the air inlet channel is not directly communicated with the air supply cavity, air can fully exchange heat with the cold end heat exchanger in the refrigeration cavity and then enters the air supply cavity, and the refrigeration effect created by the invention is effectively improved; in addition, hot air generated by the hot-end heat exchanger can be blown out of the first hot air outlet through the air cooling device, and the first hot air outlet is communicated with an external exhaust pipeline, so that the hot air is prevented from flowing back to a working environment, and the refrigeration effect created by the invention is further improved.
According to some embodiments of the invention, the flow area of the air inlet channel is gradually increased along the air inlet direction.
According to some embodiments of the invention, the number of the semiconductor refrigeration modules and the number of the heat dissipation devices are two, and the cold-end cavity is located between the two heat insulation plates.
According to some embodiments of the invention, the partition comprises a first vertical plate, a horizontal plate and a second vertical plate in sequence, and the first vertical plate and the second vertical plate are both connected to the top of the refrigeration device.
According to some embodiments of the invention, the first air inlet is arranged at the top of the refrigeration device, the first vertical plate is close to the first air inlet, the second vertical plate is far away from the first air inlet, the second vertical plate is inclined outwards from bottom to top, and the air guiding opening is arranged on the second vertical plate.
According to some embodiments of the invention, a flow guide plate is arranged at the bottom of the cold end cavity, and a drain outlet is arranged on the flow guide plate.
According to some embodiments of the invention, a water cooling device for cooling the hot-end heat exchanger is further installed in the heat dissipation device.
According to the second aspect of the invention, the range hood comprises a smoke exhaust assembly, a smoke exhaust assembly and the semiconductor refrigeration system, wherein the heat dissipation device is connected with the smoke exhaust assembly, the smoke exhaust assembly is provided with at least one second hot air outlet, and the second hot air outlets are arranged in one-to-one correspondence with the first hot air outlets.
According to some embodiments of the invention, an air outlet pipe is communicated between each second hot air outlet and the corresponding first hot air outlet, and a check valve is arranged in each air outlet pipe and is opened by the air cooling device.
According to some embodiments of the invention, the range hood further comprises a decorative shell, the decorative shell is arranged around the periphery of the semiconductor refrigeration system, the decorative shell is provided with a second cold air outlet, the second cold air outlet is arranged corresponding to the first cold air outlet, and the second cold air outlet is provided with a rotatable air guide grid.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic perspective view of a semiconductor refrigeration system according to an embodiment of the present invention;
fig. 2 is a schematic view of the internal structure of a refrigerating apparatus according to an embodiment of the present invention;
fig. 3 is a schematic view of the internal structure of a heat dissipation device according to an embodiment of the present invention;
fig. 4 is a schematic perspective view of a range hood according to an embodiment of the present invention, when the range hood is not provided with a semiconductor refrigeration system;
fig. 5 is a top view of a hood according to an embodiment of the present invention;
fig. 6 is a front view of a decorative cover according to an embodiment of the invention.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of illustrating the invention and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as up, down, front, rear, left, right, etc., is the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of the description of the present invention, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the invention, the meaning of a plurality of the terms is one or more, the meaning of a plurality of the terms is two or more, and the terms larger, smaller, larger, etc. are understood to include no essential numbers, and the terms larger, smaller, etc. are understood to include essential numbers. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly defined, terms such as setup, installation, connection, and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the terms in the present invention in combination with the detailed contents of the technical solutions.
As shown in fig. 1 to 3, the semiconductor refrigeration system according to the first embodiment of the present invention includes a refrigeration device 100 having a first air inlet 110 and a first cold air outlet 120, and two heat dissipation devices 200 having a second air inlet 210 and a first hot air outlet 220, wherein the two heat dissipation devices 200 are respectively located behind two sides of the refrigeration device 100, such that the two heat dissipation devices 200 and the refrigeration device 100 form a "u" -shaped structure; each heat dissipation device 200 and the refrigeration device 100 exchange heat through a semiconductor refrigeration module, and each semiconductor refrigeration module comprises a cold-end heat exchange assembly 300, a hot-end heat exchange assembly 400 and a semiconductor refrigeration piece 500.
Specifically, each cold end heat exchange assembly 300 comprises a cold guiding plate 310, a plurality of cold guiding U-shaped tubes 320 and a plurality of cooling fins 330, the first ends and the last ends of the plurality of cold guiding U-shaped tubes 320 are welded to the cold guiding plate 310, a refrigerant is arranged in all the cold guiding U-shaped tubes 320, the plurality of cooling fins 330 are distributed among the plurality of cold guiding U-shaped tubes 320, and all the cold guiding U-shaped tubes 320 and the cooling fins 330 jointly form the cold end heat exchanger 301; each hot-end heat exchange assembly 400 comprises a heat conducting plate 410, a heat conducting long pipe 420 and a plurality of heat radiating fins 430, the head end and the tail end of the heat conducting long pipe 420 are welded on the heat conducting plate 410, a refrigerant is arranged in the heat conducting long pipe 420, the middle part of the heat conducting long pipe 420 is bent in a U shape, the plurality of heat radiating fins 430 are distributed in the middle part of the heat conducting long pipe 420, and the middle part of the heat conducting long pipe 420 and the plurality of heat radiating fins 430 jointly form a hot-end heat exchanger 401; every all be equipped with heat insulating board 510 between cold junction heat exchange assemblies 300 and the hot junction heat exchange assemblies 400 that correspond, every all inlayed in the heat insulating board 510 semiconductor refrigeration piece 500, every semiconductor refrigeration piece 500 all includes cold junction terminal surface and hot junction terminal surface, every the cold junction terminal surface all leads cold plate 310 butt with corresponding, makes lead the temperature of cold plate 310 to reduce, every the hot junction terminal surface all with the heat-conducting plate 410 butt that corresponds, make the temperature of heat-conducting plate 410 risees. Since the semiconductor cooling plate 500 is a prior art, the present invention does not describe the structure and the cooling principle thereof in detail. All the cold-end heat exchange assemblies 300, the heat insulation plates 510 and the heat conduction plates 410 are installed in the refrigeration device 100, each hot-end heat exchanger 401 is installed in the corresponding heat dissipation device 200, wherein each heat dissipation device 200 is connected with the refrigeration device 100 through the heat conduction long pipe 420, so that the two heat dissipation devices 200 can dissipate heat of the refrigeration device 100. It is understood that the number of the heat dissipation devices 200 is the same as the number of the semiconductor refrigeration modules, and the number of the heat dissipation devices 200 and the semiconductor refrigeration modules may also be one, three, etc., without being limited thereto, but in order to improve the refrigeration effect and control the cost, the number of the heat dissipation devices 200 and the semiconductor refrigeration modules is preferably two.
As shown in fig. 2, a cold end cavity is arranged in the refrigeration apparatus 100, the cold end cavity is located between two of the heat insulation plates 510, that is, the two heat insulation plates 510 respectively form two side walls of the cold end cavity, a partition 600 is arranged in the cold end cavity, the cold end cavity is partitioned into a refrigeration cavity 140 and a blowing cavity 150 by the partition 600, an air guide opening 631 is formed in the partition 600, and the refrigeration cavity 140 is communicated with the blowing cavity 150 by the air guide opening 631; an air inlet channel 131 is arranged in the refrigeration cavity 140, the first air inlet 110 is directly communicated with the air inlet channel 131, and the first cold air outlet 120 is directly communicated with the air supply cavity 150. The two cold-end heat exchange assemblies 300 are installed in the refrigeration cavity 140, the cold-end heat exchange assemblies 300 are used for refrigerating air entering from the first air inlet 110, a fan 151 is installed in the air supply cavity 150, the fan 151 is specifically a cross-flow fan, an air outlet of the fan 151 is right opposite to the first cold air outlet 120, the fan 151 provides negative pressure to suck air in the external environment into the refrigeration cavity 140, and then the refrigerated air is discharged to the external environment through the first cold air outlet 120, so that circulation of the air is realized.
Specifically, the first air inlet 110 is arranged at the top of the refrigeration device 100, the partition 600 is bent or welded to sequentially form a first vertical plate 610, a horizontal plate 620 and a second vertical plate 630, the first vertical plate 610 and the second vertical plate 630 are both connected to the top of the refrigeration device, the first vertical plate 610 is close to the first air inlet 110, the second vertical plate 630 is far away from the first air inlet 110, the air guiding opening 631 is arranged on the second vertical plate 630, and an air inlet of the fan 151 is opposite to the air guiding opening 631; an air inlet channel 131 of the refrigeration cavity 140 is formed between the first vertical plate 610 and the corresponding heat insulation plate 510, and an air outlet channel 132 of the refrigeration cavity 140 is formed between the second vertical plate 630 and the corresponding heat insulation plate 510. In order to improve the refrigeration effect of the semiconductor refrigeration system, the two heat insulation plates 510 are arranged in an inclined manner from bottom to top, and the first vertical plate 610 is vertically arranged, so that the flow area of the air inlet channel 131 is gradually increased along the air inlet direction; meanwhile, the second vertical plate 630 is disposed to be inclined outward from bottom to top, so that the flow area of the air outlet channel 132 is gradually narrowed along the air outlet direction. Through the arrangement, the airflow channel is increased, the flow channels are distributed along the partition 600 in a shape like a Chinese character 'kou', the air inlet channel 131 is narrow and wide, the airflow speed is changed from fast to slow, the air and the cold end heat exchanger 301 can fully exchange heat, the refrigerated air enters the air supply cavity 150 through the air guide opening 631, and the air outlet channel 132 is changed from wide to narrow, the airflow speed is changed from slow to fast, and the cold air can be rapidly discharged. It is understood that the same technical effect can be achieved if only the heat insulation plates 510 adjacent to the second vertical plate 630 are inclined, and it is not necessary that two heat insulation plates 510 are inclined at the same time.
In some embodiments of the present invention, the semiconductor refrigeration system may be in a damp and hot external environment, after the damp and hot air is subjected to sufficient heat exchange at the lower portion of the refrigeration cavity 140, water droplets and particulate pollutants in the air are primarily separated from the air, and under the negative pressure of the fan 151, dry and clean air enters the air supply cavity 150 upward, and the water droplets and particulate pollutants remain on the lower bottom surface of the refrigeration cavity 140. In order to discharge the dirt, a guide plate 141 is arranged at the bottom of the refrigeration cavity 140, the guide plate 141 is arranged in an inclined manner, a dirt discharge outlet 142 is arranged at the downstream of the guide plate 141, a dirt storage tank (not shown in the drawing) is arranged below the dirt discharge outlet 142, and the dirt storage tank is detachably mounted at the outer bottom of the refrigeration device 100, so that a user can clean the dirt storage tank conveniently. If the air quality of the cold air needs to be further improved, the first filter screen can be arranged on the air guide port 631, so that the cold air with impurities is prevented from being directly blown to a user.
As shown in fig. 3, based on the refrigeration principle of the semiconductor refrigeration sheet 500, since the temperature difference between the cold end surface and the hot end surface of the semiconductor refrigeration sheet 500 is within a fixed range, the cold end surface can provide a better refrigeration effect as long as the heat of the hot end surface can be timely dissipated. Therefore, an air cooling device 700 and a water cooling device 800 for cooling the hot-side heat exchanger 401 are installed in the heat dissipation device 200, the air cooling device 700 mainly includes a heat dissipation fan 710, the heat dissipation fan 710 is installed near the second air inlet 210, the heat dissipation fan 710 enters air from the second air inlet 210 and blows air flow to the hot-side heat exchanger 401, and finally hot air is discharged through the first hot air outlet 220. In order to filter impurities such as dust and the like to keep the interior of the heat dissipation apparatus 200 clean, a second filter screen 211 is disposed on the second air inlet 210. It should be noted that, the number of the second air inlets 210 and the number of the first hot air outlets 220 are kept the same, in order to improve the heat dissipation effect, the number of the second air inlets 210 and the number of the first hot air outlets 220 are preferably two, and the position of each second air inlet 210 corresponds to the position of the corresponding first hot air outlet 220.
In addition, the water cooling device 800 includes a water tank 810, a liquid cooling pipe 820 and a water pump 830, the water tank 810 is disposed at the bottom of the heat dissipation device 200, the first end and the last end of the liquid cooling pipe 820 are both connected with the water tank 810, so that the liquid cooling pipe 820 is communicated with the water tank 810, the middle of the liquid cooling pipe 820 is bent in a U shape, the plurality of heat dissipation fins 430 are distributed at the middle of the liquid cooling pipe 820, the water pump 830 is mounted on the liquid cooling pipe 820, and the water pump 830 is used for circulating cooling water in the liquid cooling pipe 820. The arrangement of the water cooling device 800 enables a user to further dissipate heat of the hot-side heat exchanger 401, and the water cooling device 800 and the air cooling device 700 are independent from each other and do not interfere with each other. However, the air cooling device 700 is used as a basic heat dissipation means, and should reside in the semiconductor refrigeration system to prevent hot air from flowing back to the working environment, and if the user needs to enhance the cooling effect, the water cooling device 800 can be additionally activated.
As shown in fig. 4 and 5, the range hood according to the embodiment of the second aspect of the present invention includes the semiconductor refrigeration system according to the embodiment of the first aspect of the present invention, and further includes a smoke exhaust assembly 10 and a smoke exhaust assembly 20, the cross section of the smoke exhaust assembly 20 is specifically rectangular, the smoke exhaust assembly 20 and the semiconductor refrigeration system are both installed on the top of the smoke exhaust assembly 10, an exhaust fan 11 is installed in the smoke exhaust assembly 10, and the exhaust fan 11 is used for exhausting smoke from bottom to top into the smoke exhaust assembly 20. Two heat abstractor 200 is located respectively the both sides of assembly 20 of discharging fume, refrigerating plant 100 is located the front side of assembly 20 of discharging fume, assembly 20 of discharging fume is equipped with two sets of second hot air outlet 21, second hot air outlet 21 with first hot air outlet 220 one-to-one sets up, every the intercommunication has out tuber pipe 230 between second hot air outlet 21 and the first hot air outlet 220 that corresponds, makes steam in the heat abstractor 200 can be discharged in the assembly 20 of discharging fume, avoid steam to flow back to operational environment in the middle of. As shown in fig. 1, when the semiconductor refrigeration system is stopped, in order to prevent the smoke exhaust assembly 20 from discharging smoke into the heat dissipation device 200, a check valve 231 is disposed in each of the air outlet pipes 230, where the check valve 231 is a check valve commonly used in the air pipe field, and only when the air cooling device 700 is started, the check valve 231 can be opened, and as long as the air cooling device 700 is not started, the check valve 231 unidirectionally closes the first hot air outlet 220.
As shown in fig. 5 and 6, in some embodiments of the present invention, in order to shield and protect the semiconductor refrigeration system, the range hood further includes a decorative shell 30, the decorative shell 30 is disposed around the periphery of the semiconductor refrigeration system, i.e. the decorative shell 30 also has a "u" shape structure; specifically, the refrigeration device 100 is tightly attached to the decorative shell 30, and the two heat dissipation devices 200 are arranged at intervals with the decorative shell 30, so that the outside air can enter the heat dissipation devices 200 conveniently. In order to adjust the air outlet angle of the cold air, a second cold air outlet 31 is formed in the front side surface of the decorative shell 30, the second cold air outlet 31 is arranged corresponding to the first cold air outlet 120, and the second cold air outlet 31 is provided with a rotatable air guide grid 32.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (10)
1. A semiconductor refrigeration system, comprising:
the semiconductor refrigeration module comprises a cold end heat exchange assembly and a hot end heat exchange assembly, a heat insulation plate is arranged between each cold end heat exchange assembly and the corresponding hot end heat exchange assembly, each cold end heat exchange assembly comprises a cold end heat exchanger, and each hot end heat exchange assembly comprises a hot end heat exchanger;
the refrigerating device is provided with a first air inlet and a first cold air outlet, a cold end cavity is arranged in the refrigerating device, a partition part is arranged in the cold end cavity, the cold end cavity is partitioned into a refrigerating cavity and a air supply cavity through the partition part, an air guide opening is formed in the partition part, and the refrigerating cavity is communicated with the air supply cavity through the air guide opening; an air inlet channel is arranged in the refrigeration cavity, the first air inlet is directly communicated with the air inlet channel, the first cold air outlet is directly communicated with the air supply cavity, and the air inlet channel is not directly communicated with the air supply cavity; all the cold end heat exchangers are arranged in the refrigerating cavity, and a fan is arranged in the air supply cavity;
and the heat-end heat exchanger and the air cooling device used for cooling the heat-end heat exchanger are arranged in each heat radiator.
2. The semiconductor refrigeration system of claim 1, wherein: the flow area of the air inlet channel is gradually increased along the air inlet direction.
3. The semiconductor refrigeration system of claim 1, wherein: the number of the semiconductor refrigeration modules and the number of the heat dissipation devices are two, and the cold end cavity is located between the two heat insulation plates.
4. The semiconductor refrigeration system according to claim 1 or 3, characterized in that: the partition part sequentially comprises a first vertical plate, a transverse plate and a second vertical plate, and the first vertical plate and the second vertical plate are connected to the top of the refrigerating device.
5. The semiconductor refrigeration system of claim 4, wherein: the first air inlet is formed in the top of the refrigerating device, the first vertical plate is close to the first air inlet, the second vertical plate is far away from the first air inlet, the second vertical plate is arranged in an inclined mode from bottom to top, and the air guide opening is formed in the second vertical plate.
6. The semiconductor refrigeration system of claim 1, wherein: the bottom of cold junction cavity is equipped with the guide plate, be equipped with the drain on the guide plate.
7. The semiconductor refrigeration system of claim 1, wherein: and a water cooling device for cooling the hot-end heat exchanger is also arranged in the heat dissipation device.
8. A range hood comprising the semiconductor refrigeration system of any one of claims 1 to 7, further comprising: the heat dissipation device is connected with the smoke exhaust assembly, the smoke exhaust assembly is provided with at least one second hot air outlet, and the second hot air outlet and the first hot air outlet are arranged in a one-to-one correspondence mode.
9. The range hood of claim 8, wherein: every the intercommunication has a tuber pipe between second hot air exitus and the first hot air exitus that corresponds, every all be equipped with the check valve in the tuber pipe, the check valve passes through air cooling device opens.
10. The range hood of claim 8, wherein: the semiconductor refrigeration system is characterized by further comprising a decorative shell, the decorative shell is arranged around the periphery of the semiconductor refrigeration system in a surrounding mode, the decorative shell is provided with a second cold air outlet, the second cold air outlet corresponds to the first cold air outlet, and the second cold air outlet is provided with a rotatable air guide grid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010271760.1A CN111351270A (en) | 2020-04-08 | 2020-04-08 | Semiconductor refrigerating system and smoke exhaust ventilator using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010271760.1A CN111351270A (en) | 2020-04-08 | 2020-04-08 | Semiconductor refrigerating system and smoke exhaust ventilator using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111351270A true CN111351270A (en) | 2020-06-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010271760.1A Pending CN111351270A (en) | 2020-04-08 | 2020-04-08 | Semiconductor refrigerating system and smoke exhaust ventilator using same |
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|---|---|
| CN (1) | CN111351270A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112546394A (en) * | 2020-12-15 | 2021-03-26 | 珠海格力电器股份有限公司 | Environment management device |
-
2020
- 2020-04-08 CN CN202010271760.1A patent/CN111351270A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112546394A (en) * | 2020-12-15 | 2021-03-26 | 珠海格力电器股份有限公司 | Environment management device |
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