CN218585973U - Chip packaging structure and electronic equipment - Google Patents

Abstract

The application discloses a chip packaging structure and electronic equipment, which comprise a packaging substrate, a bare chip and a packaging cover shell; the bare chip is positioned on one side of the packaging substrate and is electrically connected with the packaging substrate; the packaging cover shell is positioned on one side of the bare chip, which is far away from the packaging substrate, and the packaging cover shell and the packaging substrate enclose a closed space, and the bare chip is positioned in the closed space; the package cover shell comprises a first part and a second part; the second part is located on the periphery of the first part, the thickness of the first part is larger than that of the second part, the bare chip is fixed between the first part and the packaging substrate, the warping of the chip packaging structure is resisted through the first part with larger thickness and heavier weight, the bare chip is protected from being damaged, the weight of the whole packaging cover shell is reduced through the second part with smaller thickness and lighter weight, the risk of process problems such as welding spot collapse, bridging and the like of the chip packaging structure caused by overlarge weight of the packaging cover shell is reduced, and the packaging yield of the chip packaging structure is improved.

Description

Chip packaging structure and electronic equipment

Technical Field

The application relates to the technical field of chip packaging, in particular to a chip packaging structure and electronic equipment.

Background

With the increasing size of the chip packaging structure, the packaging cover shell in the chip packaging structure is also thicker and thicker to resist the increasing warping generated by the chip packaging structure after undergoing a heating process, and to protect key components of the chip packaging structure from being damaged.

SUMMERY OF THE UTILITY MODEL

The application discloses a chip packaging structure and electronic equipment, which are used for reducing risks of problems such as welding spot collapse and bridging in the chip packaging structure.

In a first aspect, the present application discloses a chip package structure, including a package substrate, a die, and a package lid shell; the bare chip is positioned on one side of the packaging substrate and is electrically connected with the packaging substrate; the packaging cover shell is positioned on one side of the bare chip, which is far away from the packaging substrate, and the packaging cover shell and the packaging substrate enclose a closed space, and the bare chip is positioned in the closed space; the package cover shell comprises a first part and a second part; the second portion is located on the periphery of the first portion, the thickness of the first portion is larger than that of the second portion, the bare chip is fixed between the first portion and the packaging substrate, so that warping of the chip packaging structure is resisted through the first portion with larger thickness and heavier weight, the bare chip is protected from being damaged, the weight of the whole packaging cover shell is reduced through the second portion with smaller thickness and lighter weight, risks of process problems such as welding spot collapse and bridging and the like of the chip packaging structure caused by overlarge weight of the packaging cover shell are reduced, and the packaging yield of the chip packaging structure is improved.

In some optional examples, the first portion is located in a middle area of the package cover shell, and the second portion is located at a peripheral edge of the first portion, so that the first portion is uniformly cooled by the second portion located at a periphery of the first portion.

In some optional examples, the first portion includes first and second oppositely disposed surfaces, the first surface has an area greater than or equal to an area of the die, and the first surface is fixedly connected to the die; the second part comprises a third surface and a fourth surface which are oppositely arranged, the second surface and the fourth surface are positioned on the same plane, and the distance between the first surface and the plane is greater than the distance between the third surface and the plane, so that the height of the closed space is increased, and the heat dissipation capacity of the closed space to the bare chip is improved.

In some optional examples, the first portion further comprises a fifth surface, the fifth surface being located between the first surface and the second surface; the fifth surface comprises a plane, and an included angle between the fifth surface and the first surface is an acute angle or an obtuse angle; or the fifth surface is an arc surface, and the arc surface protrudes towards a direction far away from the first part, so that the problem of stress concentration at the edge of the bare chip is relieved through the fifth surface, the risk of cracking of the bare chip is reduced, and the reliability of the bare chip is improved.

In some optional examples, the first portion includes a first surface for fixed connection with the die; the first surface is provided with a plurality of micro grooves, and the micro grooves are used for accommodating connecting materials between the first surface and the bare chip so as to avoid excessive flowing of the connecting materials caused by the larger weight of the packaging cover shell and further avoid influence on the connecting effect of the packaging cover shell and the bare chip caused by excessive flowing of the connecting materials.

In some optional examples, the first portion includes a micro channel, the micro channel is at least partially located inside the first portion, and the micro channel is used for dissipating heat of the package cover shell and the bare chip through a coolant flowing in the micro channel, so as to improve the heat dissipation capability of the package cover shell and prolong the service life of the chip package structure.

In some alternative examples, the micro flow channel includes a plurality of first flow channels and a plurality of second flow channels; the first flow channel extends along a first direction, the second flow channel extends along a second direction, and the first direction is intersected with the second direction; the plurality of first flow channels are sequentially arranged along the second direction, and the second flow channel is positioned between two adjacent first flow channels, so that the two adjacent first flow channels are connected end to end, the bare chip is uniformly covered by the micro flow channels, and uniform heat dissipation of the bare chip is realized.

In some alternative examples, the packaging cover shell is provided with a packaging retaining wall at the periphery; the packaging retaining wall is fixedly connected with the packaging substrate, so that the packaging cover shell and the packaging substrate enclose a closed space for containing the bare chip; the surface of one side of the packaging retaining wall facing the packaging substrate is provided with reinforcing ribs or fins so as to resist the warping of the packaging substrate caused by overlarge size.

In some optional examples, the second portion has a vent for communicating the enclosed space with the outside to remove volatile gases generated by flux when the die is soldered to the package substrate.

In a second aspect, the application discloses an electronic device, including any one of the above chip package structures, the warpage of the chip package structure can be resisted through the first portion with larger thickness and heavier weight, the bare chip is protected from being damaged, the weight of the whole package cover shell is reduced through the second portion with smaller thickness and lighter weight, the risk of process problems such as solder joint collapse and bridging of the chip package structure caused by the overlarge weight of the package cover shell is reduced, and the package yield of the chip package structure is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present application, the drawings required to be used in the embodiments or the background art of the present application will be described below.

Fig. 1 is a schematic cross-sectional view illustrating a chip package structure disclosed in the present application;

fig. 2 is a schematic top view of a chip package structure according to an embodiment of the present disclosure;

FIG. 3 is a schematic cross-sectional view of the chip package structure shown in FIG. 2 along a cutting line AA';

fig. 4 is a schematic bottom view of a package cover shell in a chip package structure according to an embodiment of the disclosure;

fig. 5 is a schematic cross-sectional view illustrating another chip package structure disclosed in the embodiment of the present application;

fig. 6 is a schematic cross-sectional view illustrating another chip package structure disclosed in the embodiment of the present application;

fig. 7 is a schematic cross-sectional view of another chip package structure disclosed in the embodiment of the present application;

fig. 8 is a schematic bottom view of a package cover shell in another chip package structure disclosed in this embodiment of the application;

fig. 9 is a schematic cross-sectional view of another chip package structure disclosed in the embodiment of the present application;

fig. 10 is a schematic bottom view of a package cover shell in another chip package structure disclosed in this embodiment of the application;

fig. 11 is a schematic cross-sectional view illustrating another chip package structure disclosed in the embodiment of the present application;

fig. 12 is a schematic top view of another chip package structure disclosed in the embodiments of the present application;

fig. 13 is a schematic cross-sectional view of the chip package structure shown in fig. 12 along a cutting line BB';

FIG. 14 is a schematic structural view of a micro flow channel according to an embodiment of the present invention;

fig. 15 is a schematic top view of another chip package structure disclosed in the embodiments of the present application;

FIG. 16 is a schematic cross-sectional view of the chip package structure shown in FIG. 15 along a cutting line CC';

fig. 17 is a schematic cross-sectional view of another chip package structure disclosed in the embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

Most of the current Chip package structures are Flip Chip (Flip Chip) structures, which are non-leaded structures, as shown in fig. 1, and fig. 1 is a schematic cross-sectional structure diagram of a Chip package structure disclosed in the present application, where the Chip package structure includes a bare Chip 22, a package substrate 21, and a package cover shell 20. Wherein, the die 22 is fixed between the package substrate 21 and the package cover 20, and the die 22 can be electrically connected to the package substrate 21 through the solder balls 220.

As shown in fig. 1, the package cover 20 and the package substrate 21 enclose an enclosed space for accommodating the die 22 to provide a certain mechanical protection for the die 22. As the size of the chip package structure is larger and larger, the package cover 20 is thicker and thicker to resist the larger and larger warpage of the chip package structure after the chip package structure is subjected to the heating process, and to protect the key components of the chip package structure, such as the die 22, from being damaged, however, the thicker the package cover 20, the heavier the package cover 20 is, and the heavier the package cover 20 may cause the chip package structure to have problems such as the collapse of the solder joints where the solder balls 210 are located and the bridging between adjacent solder joints.

Based on this, the application discloses a chip packaging structure, so that the thickness of the part, corresponding to the bare chip, of the packaging cover shell is larger than that of the peripheral part, the weight of the packaging cover shell is reduced, and the risk of problems such as welding spot collapse and bridging and the like of the chip packaging structure is reduced.

As an optional implementation of the disclosure, an embodiment of the present application discloses a chip package structure, which may also be referred to as a chip, where the chip includes a processor chip, a server chip, and the like. Fig. 2 is a schematic top view of a chip package structure disclosed in an embodiment of the present invention, and fig. 3 is a schematic cross-sectional structure of the chip package structure shown in fig. 2 along a cutting line AA', where the chip package structure includes a package substrate 21, a die 22, and a package cover 20.

The bare chip 22 is located on one side of the package substrate 21, the bare chip 22 is electrically connected to the package substrate 21, the package cover 20 is located on one side of the bare chip 22 away from the package substrate 21, the package cover 20 and the package substrate 21 enclose an enclosed space, and the bare chip 22 is located in the enclosed space.

The encapsulating cover 20 comprises a first portion 201 and a second portion 202, the second portion 202 being located at the periphery of the first portion 201. Also, the thickness of the first portion 201 is greater than the thickness of the second portion 202. Wherein the die 22 is fixed between the first portion 201 and the package substrate 21.

During the process of packaging the die 22, the die 22 is heated to electrically connect the die 22 and the package substrate 21, but the chip package structure is warped due to the mismatch of the thermal expansion coefficients between the package substrate 21 and the die 22. By making the thickness of the first portion 201 greater than the thickness of the second portion 202, the first portion 201 with a greater thickness and a heavier weight can resist warpage of the chip package structure, protect the die 22 from damage, reduce the probability of failure of the chip package structure, and the second portion 202 with a smaller thickness and a lighter weight can reduce the weight of the entire package cover 20, thereby reducing the risk of process problems such as solder joint collapse and bridging between solder joints caused by an excessive weight of the package cover 20 during packaging.

In some embodiments of the present application, as shown in fig. 2, the first portion 201 is located in a middle region of the cover casing 20, and the second portion 202 is located in a peripheral edge region of the cover casing 20, so that the first portion 201 is uniformly cooled by the second portion 202 located around the first portion 201. Of course, the present application is not limited thereto, and in other embodiments, the first portion 201 may be located at an edge region of the package cover 20, but it should be understood that the location of the first portion 201 corresponds to the location of the die 22, or the location of the first portion 201 is determined by the location of the die 22.

In some embodiments of the present application, as shown in fig. 3, the package cover 20 has a package wall 203 around the package cover 20, and the package wall 203 is used for being fixedly connected to the package substrate 21, so that the package cover 20 and the package substrate 21 enclose an enclosed space for accommodating the die 22. Of course, the present application is not limited thereto, and in other embodiments, the package cover 20 may also have a flat plate structure, and the space between the package cover and the package substrate 21 may be sealed by a package adhesive to form a sealed space for accommodating the die 22.

In some embodiments of the present application, as shown in fig. 3 and fig. 4, fig. 4 is a schematic bottom view of a package lid shell in a chip package structure disclosed in the embodiment of the present application, a first portion 201 includes a first surface S1 and a second surface S2 that are opposite to each other, an area of the first surface S1 is greater than or equal to an area of a die 22, and the first surface S1 is fixedly connected to the die 22, a second portion 202 includes a third surface S3 and a fourth surface S4 that are opposite to each other, the second surface S2 and the fourth surface S4 are located in a same plane, and a distance D1 between the first surface S1 and the plane is greater than a distance D2 between the third surface S3 and the plane.

That is, the side surfaces of the first portion 201 and the second portion 202 facing away from the die 22 are coplanar, and the side surfaces of the first portion 201 and the second portion 202 near the die 22 are different in height, so that the thickness of the first portion 201 is greater than that of the second portion 202. It is understood that the thickness of the retaining wall 203 is greater than or equal to the thickness of the first portion 201, for example, D3 is greater than D1, so that the retaining wall 203 and the package substrate 21 can enclose an enclosed space for accommodating the die 22.

Certainly, the present application is not limited to this, in other embodiments, as shown in fig. 5, fig. 5 is a schematic cross-sectional structure diagram of another chip package structure disclosed in the embodiments of the present application, where the first surface S1 and the third surface S3 are located on the same plane, and a distance D4 between the second surface S2 and the plane is greater than a distance D5 between the fourth surface S4 and the plane.

That is, the side surfaces of the first portion 201 and the second portion 202 close to the die 22 are coplanar, and the side surfaces of the first portion 201 and the second portion 202 facing away from the die 22 are different in height, so that the thickness of the first portion 201 is greater than that of the second portion 202.

In some embodiments of the present application, as shown in fig. 3, the first portion 201 further includes a fifth surface S5, the fifth surface S5 is located between the first surface S1 and the second surface S2, the fifth surface S5 includes a plane, and an included angle α between the fifth surface S5 and the first surface S1 is an obtuse angle. Alternatively, as shown in fig. 5, the included angle α between the fifth surface S5 and the first surface S1 is an acute angle.

Certainly, the present application is not limited to this, in other embodiments, as shown in fig. 6, fig. 6 is a schematic cross-sectional structure of another chip package structure disclosed in the embodiments of the present application, and an included angle α between the fifth surface S5 and the first surface S1 may also be a right angle. In other embodiments, as shown in fig. 7, fig. 7 is a schematic cross-sectional structure view of another chip packaging structure disclosed in the embodiment of the present application, and the fifth surface S5 is an arc surface, and the arc surface protrudes toward a direction away from the first portion 201.

In some embodiments of the present application, as shown in fig. 8 and fig. 9, fig. 8 is a schematic bottom view of a package cover shell in another chip package structure disclosed in the embodiment of the present application, and fig. 9 is a schematic cross-sectional view of another chip package structure disclosed in the embodiment of the present application, where the first portion 201 includes a first surface S1, and the first surface S1 is used for being fixedly connected to the die 22, or the first surface S1 is a surface fixedly connected to the die 22. The first surface S1 has a plurality of micro grooves 200, and the micro grooves 200 are used for accommodating the connection material 23 between the first surface S1 and the die 22.

Based on this, while the first portion 201 with a larger thickness resists the warpage of the die and the second portion 202 with a smaller thickness reduces the weight of the package cover 20, by providing the plurality of micro grooves 200 on the first surface S1, not only the contact area between the connection material 23 and the first surface S1 and the die 22 can be increased, but also the connection material 23 can be prevented from flowing excessively, and the connection effect between the die 22 and the package cover 20 can be enhanced.

In some embodiments, as shown in fig. 8, the micro grooves 200 are strip-shaped grooves, and the micro grooves 200 are arranged in parallel, although the present disclosure is not limited thereto, in other embodiments, the micro grooves 200 may also be square or circular grooves arranged in an array, and the details are not repeated herein.

In some embodiments of the present application, as shown in fig. 9, the die 22 is electrically connected to the package substrate 21 through solder balls 220, and the first portion 201 is fixedly connected to the die 22 through a connection material 23. An encapsulant 221 is further disposed between the die 22 and the package substrate 21, so that the solder balls 220 are protected by the encapsulant 221.

In addition, the bottom of the package substrate 21 also has a plurality of solder balls 210 electrically connected to a Printed Circuit Board (PCB), and in some embodiments, the solder balls 210 are arranged in a Grid-like pattern, so the package structure is also called a BGA (Ball Grid Array) package structure.

In some embodiments of the present application, the package cover 20 comprises a metal cover, and the connection material 23 comprises a metal solder material, wherein the metal solder material comprises indium metal. In other embodiments, the connecting material 23 may further include a silicone material, etc., which will not be described herein. Based on this, a heat dissipation channel between the die 22 and the first portion 201 can be established through a metal solder material with better thermal conductivity, so as to better realize heat dissipation of the die 22.

In some embodiments, the material of the metal lid shell comprises copper or a copper alloy to further inhibit warpage of die 22 by the metal lid shell. In addition, the surface of the metal cover shell can be plated with nickel or gold so as to realize good infiltration of metal welding materials such as indium and achieve reliable welding effect.

In some embodiments, as shown in fig. 10 and fig. 11, fig. 10 is a schematic bottom view of a package cover shell in another chip package structure disclosed in this embodiment of the present application, and fig. 11 is a schematic cross-sectional view of another chip package structure disclosed in this embodiment of the present application, a side surface of the package retaining wall 203 facing the package substrate 21 has a stiffener 205, and the stiffener 205 may also be referred to as a rib. The stiffener 205 is fixedly connected to the package substrate 21 to resist the warpage of the package substrate 21 caused by an over-size. The package wall 203 is fixedly connected to the package substrate 21 through an adhesive 204, and the stiffener 205 may also be fixedly connected to the package substrate 21 through the adhesive 204.

In some embodiments, as shown in fig. 10, the stiffener 205 extends along the long side direction of the package cover 20, and two stiffeners 205 are respectively located on two sides of the first portion 201 to support the second portion 202 with smaller thickness against the warpage of the package substrate 21 caused by over-sizing. Of course, the present application is not limited thereto, and in other embodiments, the stiffener 205 may also extend along a short side direction or a diagonal line of the package cover 20, which is not described herein again.

In some embodiments of the present application, as shown in fig. 12 and 13, fig. 12 is a schematic top view of another chip package structure disclosed in the embodiments of the present application, and fig. 13 is a schematic cross-sectional view of the chip package structure shown in fig. 12 along a cutting line BB', the first portion 201 includes a micro channel 206, the micro channel 206 is at least partially located inside the first portion 201, and the micro channel 206 is used for dissipating heat of the package lid 20 and the die 22 through a coolant flowing inside the micro channel 206. The coolant may include liquid such as water or alcohol, and may also include gas such as ammonia gas or sulfur dioxide. Gases such as ammonia gas and sulfur dioxide are generally used as refrigerants for refrigeration equipment such as air conditioners.

In the embodiment of the present application, the inside of the package cover 20 may include one micro channel 206, or may include a plurality of micro channels 206. The embodiment and the drawings of the present application are only described with reference to one micro flow channel 206 as an example, and are not limited thereto. In some embodiments, the plurality of micro channels 206 may be arranged in parallel or in a cross arrangement according to actual requirements, which is not described herein.

As shown in fig. 13, the micro channels 206 are connected to the outside of the package cover 20 through the inlet 210 and the outlet 211, so as to package components such as a motor and a mechanical pump outside the cover 20, and the coolant is injected into the micro channels 206 through the inlet 210, so that the coolant flows in the micro channels 206 and takes away heat from the package cover 20 and the dies 22, etc., and then flows out of the micro channels 206 through the outlet 211, thereby dissipating heat from the package cover 20 and the dies 22, etc. In addition, since the thickness of the first portion 201 is large, the flow channel aperture of the micro flow channel 206 inside the first portion 201 can be large or the flow channel length can be large, and the heat dissipation capability of the micro flow channel 206 can be further improved.

In some embodiments, the micro channels 206 are arranged in a predetermined pattern such that the micro channels 206 uniformly cover the die 22 to achieve uniform heat dissipation from the die 22. As shown in fig. 14, fig. 14 is a schematic structural diagram of a micro flow channel disclosed in an embodiment of the present invention, the micro flow channel 206 includes a plurality of first flow channels 212 and a plurality of second flow channels 213, the first flow channels 212 extend along a first direction Y, the second flow channels 213 extend along a second direction X, the first direction Y intersects with the second direction X, and the plurality of first flow channels 212 are sequentially arranged along the second direction X, and the second flow channels 212 are located between two adjacent first flow channels 212, such that the two adjacent first flow channels 212 are connected end to form a zigzag micro flow channel.

Of course, the present application is not limited thereto, and in other embodiments, the plurality of first flow channels 212 and the plurality of second flow channels 213 form a zigzag micro-channel. In other embodiments, the micro flow channel 21 may be a micro flow channel with other shapes, which will not be described herein.

In some embodiments of the present application, as shown in fig. 15 and 16, fig. 15 is a schematic top view of another chip package structure disclosed in the embodiments of the present application, fig. 16 is a schematic cross-sectional view of the chip package structure shown in fig. 15 along a cutting line CC', the second portion 202 has a vent 207, and the vent 207 is used for communicating an enclosed space where the die 22 is located with the outside so as to remove volatile gas and the like generated by a flux when the die 22 is soldered to the package substrate 21.

In some embodiments, as shown in fig. 17, fig. 17 is a schematic cross-sectional structure diagram of another chip package structure disclosed in the embodiments of the present application, and the package substrate 21 is further provided with a passive device 24, where the passive device 24 includes a decoupling capacitor, and the decoupling capacitor is used to reduce noise influence on the die 22 from other devices in the circuit.

As another alternative implementation of the disclosure, an embodiment of the present application discloses an electronic device, which includes a chip package structure disclosed in any of the above embodiments. The electronic device can be a smart phone, a tablet computer, a digital camera, a server and the like.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only express several embodiments of the present specification, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present description, which shall fall within the protection scope of the present description. Therefore, the protection scope of the patent in the specification shall be subject to the appended claims.

Claims (10)

1. A chip packaging structure is characterized by comprising a packaging substrate, a bare chip and a packaging cover shell;

the bare chip is positioned on one side of the packaging substrate and is electrically connected with the packaging substrate;

the packaging cover shell is positioned on one side of the bare chip, which is far away from the packaging substrate, and the packaging cover shell and the packaging substrate enclose an enclosed space, and the bare chip is positioned in the enclosed space;

the package cover shell comprises a first part and a second part; the second portion is located at the periphery of the first portion, the thickness of the first portion is greater than that of the second portion, and the die is fixed between the first portion and the package substrate.

2. The chip package structure according to claim 1, wherein the first portion is located in a middle region of the package cover shell, and the second portion is located at a peripheral edge of the first portion.

3. The chip package structure according to claim 1, wherein the first portion includes a first surface and a second surface disposed opposite to each other, an area of the first surface is greater than or equal to an area of the die, and the first surface is fixedly connected to the die;

the second part comprises a third surface and a fourth surface which are oppositely arranged, the second surface and the fourth surface are positioned on the same plane, and the distance between the first surface and the plane is larger than the distance between the third surface and the plane.

4. The chip package structure according to claim 3, wherein the first portion further comprises a fifth surface, the fifth surface being located between the first surface and the second surface;

the fifth surface comprises a plane, and an included angle between the fifth surface and the first surface is an acute angle or an obtuse angle; or, the fifth surface is an arc surface, and the arc surface protrudes towards a direction away from the first portion.

5. The chip package structure according to claim 1, wherein the first portion includes a first surface for fixed connection with the die;

the first surface has a plurality of micro-grooves for receiving a connecting material between the first surface and the die.

6. The chip package structure of claim 1, wherein the first portion includes a fluidic channel at least partially located within the first portion, the fluidic channel configured to dissipate heat from the package lid and the die via a coolant flowing therein.

7. The chip package structure according to claim 6, wherein the micro flow channels comprise a plurality of first flow channels and a plurality of second flow channels;

the first flow channel extends along a first direction, the second flow channel extends along a second direction, and the first direction and the second direction are intersected; the plurality of first flow channels are sequentially arranged along the second direction, and the second flow channels are positioned between two adjacent first flow channels, so that the two adjacent first flow channels are connected end to end.

8. The chip package structure according to claim 1, wherein the package cover shell has a package dam around it; the packaging retaining wall is fixedly connected with the packaging substrate, so that the packaging cover shell and the packaging substrate enclose a closed space for containing the bare chip;

and the surface of one side of the packaging retaining wall facing the packaging substrate is provided with reinforcing ribs or fins.

9. The chip package structure according to claim 1, wherein the second portion has a vent for communicating the closed space with the outside.

10. An electronic device comprising the chip packaging structure according to any one of claims 1 to 9.

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