CN218585286U

CN218585286U - Heat dissipation type notebook computer

Info

Publication number: CN218585286U
Application number: CN202222074645.2U
Authority: CN
Inventors: 李锦富
Original assignee: Guangdong Tianyi Electronic Technology Co ltd
Current assignee: Guangdong Tianyi Electronic Technology Co ltd
Priority date: 2022-08-08
Filing date: 2022-08-08
Publication date: 2023-03-07
Anticipated expiration: 2032-08-08

Abstract

The utility model discloses a heat dissipation type notebook computer, including computer main part, button, operation panel, display screen and internal components and parts, internal components and parts connect in the inside of computer main part, still include: the internal heat dissipation mechanism is connected to the inside of the computer main body and used for dissipating heat of internal components, the internal heat dissipation mechanism comprises a heat dissipation copper pipe, heat dissipation fins, a water cooling tank, a liquid pump, a control assembly and a cooling mechanism, the heat dissipation copper pipe is communicated with the inside of the water cooling tank through the liquid pump, the heat dissipation copper pipe is a coiled pipe, and the heat dissipation fins are inserted between every two heat dissipation copper pipes; accelerate in heat transfer to the heat dissipation copper pipe through radiating fin, take away the inside heat of device through the inside coolant liquid of heat dissipation copper pipe, the radiating efficiency is high, takes away the inside heat of water-cooling box through radiator fan and semiconductor fin, further improves cooling efficiency.

Description

Heat dissipation type notebook computer

Technical Field

The utility model belongs to the technical field of the notebook computer, especially, relate to a heat dissipation type notebook computer.

Background

The notebook computer is called notebook, also called portable computer, hand-held computer, palm computer or laptop computer, and features small size. Compared with a desktop computer, the portable notebook computer is a small-sized and portable personal computer, and the notebook computer has small volume and more mounted parts, so that high temperature can be generated in long-time work, the high temperature seriously influences the service life of each part of the notebook computer, and the high temperature needs to be discharged.

Patent publication "CN216286549U" describes "a heat dissipation type notebook computer, including computer main part and intelligent display, the intelligent display is installed on the top of computer main part, the top of computer main part is equipped with the radiating groove,", and the device exists following shortcoming: firstly, derive inside heat through the heat conduction strip, the coverage rate of heat conduction strip is low, leads to heat derivation efficiency lower, and the radiating effect is not good, secondly through carrying out the effluvium on the heat dissipation tooth with the heat concentration, heat radiating area is less, leads to the radiating efficiency low.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a heat dissipation type notebook computer has solved above-mentioned problem.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a heat dissipation type notebook computer, includes computer main part, button, operation panel, display screen and inside components and parts, inside components and parts are connected in the inside of computer main part, display screen swing joint is at the top of computer main part, the button all is connected in the top of computer main part with the operation panel, still includes:

the internal heat dissipation mechanism is connected to the inside of the computer main body and used for dissipating heat of internal components, the internal heat dissipation mechanism comprises heat dissipation copper pipes, heat dissipation fins, a water cooling tank, a liquid pump, a control assembly and a cooling mechanism, the heat dissipation copper pipes are communicated with the inside of the water cooling tank through the liquid pump, the heat dissipation copper pipes are coiled pipes, and the heat dissipation fins are inserted between every two heat dissipation copper pipes;

cooling body includes semiconductor fin, heat dissipation fan, exhaust vent, grid and dust removal subassembly, semiconductor fin fixed connection is inside the lateral wall of water-cooling tank, the heat dissipation fan passes through the motor and drives, the exhaust vent is seted up at the lateral wall of computer main part, grid fixed connection is inside the exhaust vent.

On the basis of the technical scheme, the utility model discloses still provide following optional technical scheme:

the further technical scheme is as follows: the two sides of the semiconductor radiating fin are respectively connected with the inner side and the outer side of the water cooling box, the radiating fan is located on the side face of the semiconductor radiating fin, and the radiating fan corresponds to the air outlet hole.

The further technical scheme is as follows: the internal heat dissipation mechanism is matched with the cooling mechanism for use, and three pairs of internal heat dissipation mechanisms and three pairs of cooling mechanisms are arranged.

The further technical scheme is as follows: the control assembly comprises a first temperature sensor, a second temperature sensor and a controller, and the controller is electrically connected with the first temperature sensor and the second temperature sensor.

The further technical scheme is as follows: the first temperature sensor and the second temperature sensor are respectively positioned at an inlet and an outlet of the joint of the heat dissipation copper pipe and the water cooling tank, and the controller is electrically connected with the liquid pump.

The further technical scheme is as follows: the dust removal component comprises an external baffle, insertion blocks, limiting balls and air inlet holes, the insertion blocks are inserted into the side wall of the computer main body in an inserted mode, the dust removal component is mounted on the left side and the right side of the computer main body, and the two insertion blocks are located between the heat dissipation fan and the semiconductor cooling fins.

The further technical scheme is as follows: the air inlet hole penetrates through the external baffle and the inserting block, the diameter of the external baffle is larger than that of the inserting block, and the external baffle is positioned on the outer side of the computer main body.

The further technical scheme is as follows: the limiting ball is elastically connected to the side face of the inserting block, the limiting ball is elastically connected to the groove in the side face of the inserting block, and one half of the limiting ball is located on the outer side of the inserting block.

Advantageous effects

The utility model provides a heat dissipation type notebook computer. Compared with the prior art, the method has the following beneficial effects:

1. the heat transfer into the heat dissipation copper pipe is accelerated through the heat dissipation fins, the heat in the device is taken away through the cooling liquid in the heat dissipation copper pipe, the heat dissipation efficiency is high, and the heat in the water cooling tank is taken away through the heat dissipation fan and the semiconductor heat dissipation fins, so that the cooling efficiency is further improved;

2. when can guarantee through the inlet port that the heat dissipation fan rotates, guarantee the normal circulation of air, guarantee to dispel the heat and normally work in the fan, and can completely cut off the dust through the inlet port, realize the dust removal subassembly through spacing ball and freely dismantle to be convenient for clear up the dust of adhesion on the dust removal subassembly.

Drawings

Fig. 1 is a perspective view of the external structure of the present invention.

Fig. 2 is a perspective view of the internal structure of the present invention.

Fig. 3 is a schematic view of the internal structure of the present invention.

Fig. 4 is a schematic structural view of the dust removal assembly of the present invention.

Notations for reference numerals: 1. a computer main body; 2. pressing a key; 3. an operation panel; 4. a display screen; 5. a dust removal assembly; 6. an internal component; 7. a heat dissipation copper pipe; 8. a heat dissipating fin; 9. a water cooling tank; 10. a first temperature sensor; 11. a second temperature sensor; 12. a semiconductor heat sink; 13. an air outlet; 14. a heat dissipation fan; 15. a grid; 16. inserting a block; 17. an outer baffle; 18. an air inlet; 19. a limiting ball; 20. a liquid pump; 21. and a controller.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The following detailed description is provided for the specific embodiments of the present invention.

Please refer to fig. 1-4, for an embodiment of the present invention provides a heat dissipation type notebook computer, including computer main body 1, button 2, operation panel 3, display screen 4 and internal components 6, the internal components 6 are connected in the inside of the computer main body 1, the display screen 4 is movably connected at the top of the computer main body 1, the button 2 and the operation panel 3 are both connected above the computer main body 1, further including:

the computer comprises a computer main body 1, an internal heat dissipation mechanism, a heat dissipation copper pipe 7, heat dissipation fins 8, a water cooling tank 9, a liquid pump 20, a control assembly and a cooling mechanism, wherein the internal heat dissipation mechanism is connected inside the computer main body 1 and used for dissipating heat of internal components 6;

cooling body includes semiconductor fin 12, heat dissipation fan 14, exhaust vent 13, grid 15 and dust removal component 5, and semiconductor fin 12 fixed connection is inside the lateral wall of water-cooling tank 9, and heat dissipation fan 14 passes through the motor and drives, and exhaust vent 13 is seted up at the lateral wall of computer main part 1, and grid 15 fixed connection is inside exhaust vent 13.

Preferably, both sides of the semiconductor heat sink 12 are connected to the inside and outside of the water cooling box 9, the heat dissipation fan 14 is located on the side surface of the semiconductor heat sink 12, and the heat dissipation fan 14 corresponds to the air outlet 13. The purpose of this arrangement is to remove the heat inside the water cooling tank 9 through the semiconductor heat sink 12, the heat dissipation fan 14, and the air outlet 13.

Preferably, the internal heat dissipation mechanism is matched with the cooling mechanism for use, and the internal heat dissipation mechanism and the cooling mechanism are provided with three pairs. The purpose of this kind of setting is, prevent heat concentration through the independent device of multiunit and accelerate the radiating efficiency.

Preferably, the control assembly includes a first temperature sensor 10, a second temperature sensor 11 and a controller 21, and the controller 21 is electrically connected to both the first temperature sensor 10 and the second temperature sensor 11.

Preferably, the first temperature sensor 10 and the second temperature sensor 11 are respectively located at the inlet and the outlet of the connection between the heat dissipation copper pipe 7 and the water cooling tank 9, and the controller 21 is electrically connected to the liquid pump 20. The purpose of this arrangement is to control the power of the liquid pump 20 by sensing the temperature of the coolant entering and exiting the water-cooled tank 9, thereby conserving energy.

The embodiment of the utility model provides an in, accelerate heat transfer to heat dissipation copper pipe 7 through radiating fin 8 in, take away the inside heat of device through the inside coolant liquid of heat dissipation copper pipe 7, the radiating efficiency is high, takes away the inside heat of water-cooling box 9 through heat dissipation fan 14 and semiconductor cooling fin 12, further improves cooling efficiency.

Referring to fig. 4, as an embodiment of the present invention, the dust removing assembly 5 includes an external baffle 17, an insertion block 16, a limiting ball 19 and an air inlet 18, the insertion block 16 is inserted into the sidewall of the computer main body 1, the dust removing assembly 5 is installed on both sides of the computer main body 1, and the two insertion blocks 16 are located between the heat dissipating fan 14 and the semiconductor heat dissipating fin 12.

Preferably, the air inlet hole 18 penetrates through the outer shield 17 and the insertion block 16, the outer shield 17 has a larger diameter than the insertion block 16, and the outer shield 17 is located outside the computer main body 1.

Preferably, the stop ball 19 is elastically coupled to a side of the insertion block 16, the stop ball 19 is elastically coupled to a groove formed in a side of the insertion block 16, and a half of the stop ball 19 is located outside the insertion block 16.

The embodiment of the utility model provides an in, can guarantee through inlet port 18 when heat dissipation fan 14 rotates, guarantee the normal circulation of air, guarantee to dispel the heat and normally work in the fan 14, and can completely cut off the dust through inlet port 18, realize the free dismantlement of dust removal subassembly 5 through spacing ball 19 to be convenient for clear up the dust of adhesion on the dust removal subassembly 5.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a heat dissipation type notebook computer, includes computer main body (1), button (2), operation panel (3), display screen (4) and internal components and parts (6), the inside at computer main body (1) is connected in internal components and parts (6), display screen (4) swing joint is at the top of computer main body (1), button (2) and operation panel (3) all are connected in the top of computer main body (1), its characterized in that still includes:

the computer comprises a computer main body (1), an internal heat dissipation mechanism, a liquid pump (20), a control assembly and a cooling mechanism, wherein the internal heat dissipation mechanism is connected inside the computer main body (1) and used for dissipating heat of an internal component (6), the internal heat dissipation mechanism comprises heat dissipation copper pipes (7), heat dissipation fins (8), a water cooling box (9), the liquid pump (20), the control assembly and the cooling mechanism, the heat dissipation copper pipes (7) are communicated with the inside of the water cooling box (9) through the liquid pump (20), the heat dissipation copper pipes (7) are coiled pipes, and the heat dissipation fins (8) are inserted between the heat dissipation copper pipes (7);

cooling body includes semiconductor fin (12), heat dissipation fan (14), exhaust vent (13), grid (15) and dust removal subassembly (5), semiconductor fin (12) fixed connection is inside the lateral wall of water-cooling tank (9), heat dissipation fan (14) pass through the motor and drive, the lateral wall at computer main part (1) is seted up in exhaust vent (13), grid (15) fixed connection is inside exhaust vent (13).

2. The heat dissipation type notebook computer of claim 1, wherein two sides of the semiconductor heat sink (12) are connected to the inside and the outside of the water cooling box (9), respectively, the heat dissipation fan (14) is located at the side of the semiconductor heat sink (12), and the heat dissipation fan (14) and the air outlet (13) correspond to each other.

3. The heat dissipation type notebook computer according to claim 1, wherein the internal heat dissipation mechanism and the cooling mechanism are used in cooperation, and three pairs of the internal heat dissipation mechanism and the cooling mechanism are arranged.

4. The heat dissipation type notebook computer according to claim 1, wherein the control assembly comprises a first temperature sensor (10), a second temperature sensor (11) and a controller (21), and the controller (21) is electrically connected to the first temperature sensor (10) and the second temperature sensor (11).

5. The heat dissipation type notebook computer of claim 4, wherein the first temperature sensor (10) and the second temperature sensor (11) are respectively located at an inlet and an outlet of a connection part of the heat dissipation copper pipe (7) and the water cooling tank (9), and the controller (21) is electrically connected with the liquid pump (20).

6. The heat dissipation type notebook computer of claim 1, wherein the dust removing assembly (5) comprises an external baffle (17), an insertion block (16), a limiting ball (19) and an air inlet hole (18), the insertion block (16) is inserted into the side wall of the computer main body (1), the dust removing assembly (5) is installed on the left side and the right side of the computer main body (1), and the two insertion blocks (16) are located between the heat dissipation fan (14) and the semiconductor heat dissipation fin (12).

7. The heat dissipation type notebook computer of claim 6, wherein the air inlet hole (18) penetrates through the external baffle (17) and the insertion block (16), the external baffle (17) is larger in diameter than the insertion block (16), and the external baffle (17) is positioned outside the computer main body (1).

8. The heat dissipation type notebook computer according to claim 6, wherein the limiting ball (19) is elastically connected to the side of the insertion block (16), the limiting ball (19) is elastically connected to the groove of the side of the insertion block (16), and half of the limiting ball (19) is located outside the insertion block (16).