CN218580114U

CN218580114U - Magnetic attraction type silicon wafer clamp with elastic clamping head

Info

Publication number: CN218580114U
Application number: CN202222351489.XU
Authority: CN
Inventors: 王落军; 张三洋; 温旭军; 陶俊
Original assignee: Wuxi Kunsheng Intelligent Equipment Co ltd
Current assignee: Wuxi Kunsheng Intelligent Equipment Co ltd
Priority date: 2022-09-05
Filing date: 2022-09-05
Publication date: 2023-03-07
Anticipated expiration: 2032-09-05

Abstract

The utility model provides a magnetic silicon wafer clamp with an elastic clamping head, which comprises a bottom plate and a pressing plate, wherein the bottom plate is provided with a first hollow area, the pressing plate is provided with a corresponding second hollow area, the periphery of each first hollow area on the bottom plate is provided with a first fixing part, the end part of the bottom plate is connected with the first elastic clamping head, the periphery of each second hollow area on the pressing plate is provided with a second fixing part, and the end part of the pressing plate is connected with the second elastic clamping head; the bottom plate and the pressing plate are buckled relatively, a magnetic material is arranged in the attached part, a silicon wafer is accommodated between the corresponding first hollow-out area and the corresponding second hollow-out area, and the silicon wafer is limited and fixed through the first elastic clamping heads and the second elastic clamping heads on the two sides. The utility model provides a formula silicon chip anchor clamps are inhaled to magnetism with flexible clamping head utilizes flexible clamping head and silicon chip contact, reduces the piece rate when guaranteeing effective clamping, and bottom plate and clamp plate adopt magnetic adsorption, easy dismounting, weak point consuming time have improved production efficiency.

Description

Magnetic silicon wafer clamp with elastic clamping head

Technical Field

The utility model relates to an anchor clamps especially relate to a formula silicon chip anchor clamps are inhaled to magnetism with flexible clamping head.

Background

The preparation of the solar cell electrode mostly adopts the electroplating of metal electrodes such as nickel copper, and a silicon wafer needs to be put into electroplating liquid during electroplating, and in the process, the silicon wafer needs to take a clamp as a carrier. The clamp used at present adopts a flat plate type clamp, a silicon wafer is clamped between two sides, the surface of the silicon wafer is clamped by a hard clamping head, the clamping force is high, and the fragment rate is high. In addition, the clamp is locked by the locking device, so that the disassembly and assembly are long, and the production efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming current defect, providing a formula silicon chip anchor clamps are inhaled to magnetism with flexible clamping head, solve present silicon chip anchor clamps piece rate height, dismouting long problem that lead to production efficiency low consuming time.

In order to solve the technical problem, the utility model provides a following technical scheme:

a magnetic type silicon wafer clamp with elastic clamping heads comprises a bottom plate and a pressing plate, wherein a plurality of first hollowed-out areas are arranged on the bottom plate, second hollowed-out areas corresponding to the first hollowed-out areas are arranged on the pressing plate, a plurality of first fixing pieces are arranged on the periphery of each first hollowed-out area on the bottom plate, the end portions of the first fixing pieces extend to the outer side face of the space of the first hollowed-out area and are connected with the first elastic clamping heads, a plurality of second fixing pieces are arranged on the periphery of each second hollowed-out area on the pressing plate, and the end portions of the second fixing pieces extend to the outer side face of the space of the second hollowed-out area and are connected with the second elastic clamping heads; the bottom plate and the pressing plate are oppositely buckled according to the corresponding relation of the first hollow area and the second hollow area, a magnetic material is arranged in a part where the bottom plate and the pressing plate are jointed, the corresponding first hollow area and the second hollow area are pairwise combined, a silicon wafer is accommodated between the first hollow area and the second hollow area in each group, and the silicon wafer is limited and fixed through the first elastic clamping heads and the second elastic clamping heads on the two sides; the bottom plate upper end is connected with the conduction board, the conduction board is provided with negative pole butt joint contact, conduction board and bottom plate built-in have electrically conductive route to be connected to every first mounting.

Furthermore, at least two positioning columns are arranged on the bottom plate, and positioning holes corresponding to the positioning columns are formed in the pressing plate.

Furthermore, the number of the positioning columns is four, and the four positioning columns are respectively arranged at four corners of the inner end face of the bottom plate.

Furthermore, the outer edge of the inner end face of the bottom plate is provided with a limiting frame, and the pressing plate is located in the limiting frame when the bottom plate is buckled with the pressing plate.

Furthermore, the limiting frame consists of four limiting strips.

Furthermore, the first elastic clamping head and the second elastic clamping head adopt a U-shaped elastic sheet structure or a spring contact structure.

Furthermore, a contact end of the U-shaped elastic sheet structure is provided with a contact salient point.

Furthermore, the spring contact structure comprises a first fixed seat, a connecting column is arranged on the first fixed seat, and the connecting column is connected with a solid contact through a first spring.

Furthermore, the spring contact structure comprises a second fixing seat, a fixing column is arranged on the second fixing seat, a hollow contact is sleeved at the end part of the fixing column, and the hollow contact is connected with the second fixing seat through a second spring.

The utility model relates to a formula silicon chip anchor clamps are inhaled to magnetism with flexible clamping head utilizes flexible clamping head and silicon chip contact, reduces the piece rate when guaranteeing effective clamping, and bottom plate and clamp plate adopt magnetic adsorption, easy dismounting, weak point consuming time have improved production efficiency.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the principles of the invention. In the drawings:

FIG. 1 is a schematic view of the present invention;

FIG. 2 is a schematic view of the U-shaped spring plate with contact bumps of the present invention;

fig. 3 is a schematic view of a first spring contact structure of the present invention;

fig. 4 is a schematic diagram of a second spring contact structure according to the present invention.

Detailed Description

The preferred embodiments of the present invention will be described hereinafter with reference to the accompanying drawings, and it should be understood that the preferred embodiments described herein are merely for purposes of illustration and explanation, and are not intended to limit the present invention.

As shown in fig. 1-4, a magnetic silicon wafer clamp with an elastic clamping head includes a bottom plate 1 and a pressing plate 2, nine first hollow areas are arranged on the bottom plate 1, a second hollow area 3 corresponding to the first hollow area is arranged on the pressing plate 2, six first fixing members (corresponding to the second fixing member and shielded by a silicon wafer a in the drawing) are arranged on the bottom plate 1 at the periphery of each first hollow area, the end of each first fixing member extends to the outer side of the space of the first hollow area and is connected with the first elastic clamping head, six second fixing members 4 are arranged on the pressing plate 2 at the periphery of each second hollow area, and the end of each second fixing member 4 extends to the outer side of the space of the second hollow area 3 and is connected with a second elastic clamping head (not shown in the drawing); the bottom plate 1 and the pressing plate 2 are oppositely buckled according to the corresponding relation of the first hollow area and the second hollow area 3, a magnetic material is arranged in a part, attached to the bottom plate 1 and the pressing plate 2, of the bottom plate, the first hollow area and the second hollow area 3 are correspondingly arranged in a group, a silicon wafer A is accommodated between each group of the first hollow area and the second hollow area 3, and the silicon wafer A is limited and fixed through the first elastic clamping heads and the second elastic clamping heads on the two sides; the upper end of the bottom plate 1 is connected with a conduction plate 5, the conduction plate 5 is provided with a cathode butt contact (connected with a cathode rod of equipment), and the conduction plate 5 and the bottom plate 1 are internally provided with a conductive path connected to each first fixing piece.

The working principle is as follows:

when the silicon chip clamp is used, the silicon chip is placed in the second hollow area of the bottom plate, the second elastic clamping head supports the silicon chip, the pressing plate covers the bottom plate, the silicon chip and the pressing plate are attached and fixed under the action of magnetic force, the silicon chip is clamped and fixed by the first elastic clamping head and the second elastic clamping head, and the silicon chip is conducted with the cathode rod through the first elastic clamping head, the first fixing piece, the conductive path and the conducting plate.

Four positioning columns 6 are arranged on the bottom plate 1 and are respectively arranged at four corners of the inner end face of the bottom plate 1, and positioning holes 7 corresponding to the positioning columns 6 are arranged on the pressing plate 2. When the pressing plate is buckled with the bottom plate, the positioning columns are inserted into the corresponding positioning holes, and the buckling accuracy is improved when the buckling is convenient.

The inner end face outer edge of the bottom plate 1 is provided with a limiting frame 8, the pressing plate 2 is located in the limiting frame 8 when the bottom plate 1 and the pressing plate 2 are buckled, and the limiting frame 8 is composed of four limiting strips. After the pressing plate is buckled with the bottom plate, relative sliding cannot occur between the pressing plate and the bottom plate.

The first elastic clamping head and the second elastic clamping head adopt a U-shaped elastic sheet structure or a spring contact structure.

The contact end of the U-shaped elastic sheet structure is provided with the contact salient point 9, so that the contact area with the silicon wafer is reduced, and the probability of electroplating pinch point printing on the surface of the silicon wafer is reduced.

The first spring contact structure comprises a first fixed seat 10, a connecting column 11 is arranged on the first fixed seat 10, and the connecting column 11 is connected with a solid contact 13 through a first spring 12. And a gap exists between the connecting column and the solid contact, so that the sufficient compression space of the spring is ensured.

The second spring contact structure comprises a second fixed seat 14, a fixed column 15 is arranged on the second fixed seat 14, a hollow contact 16 is sleeved at the end part of the fixed column 15, and the hollow contact 16 is connected with the second fixed seat 14 through a second spring 17. The hollow contact can slide along the fixed column, and the elasticity is guaranteed to be over against the silicon chip.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a formula silicon chip anchor clamps are inhaled to magnetism with flexible clamping head which characterized in that: the clamping device comprises a bottom plate and a pressing plate, wherein a plurality of first hollowed-out areas are arranged on the bottom plate, a second hollowed-out area corresponding to the first hollowed-out areas is arranged on the pressing plate, a plurality of first fixing pieces are arranged on the periphery of each first hollowed-out area on the bottom plate, the end parts of the first fixing pieces extend to the outer side surface of the space of the first hollowed-out area and are connected with first elastic clamping heads, a plurality of second fixing pieces are arranged on the periphery of each second hollowed-out area on the pressing plate, and the end parts of the second fixing pieces extend to the outer side surface of the space of the second hollowed-out area and are connected with second elastic clamping heads;

the bottom plate and the pressing plate are oppositely buckled according to the corresponding relation of the first hollow area and the second hollow area, a magnetic material is arranged in a part, attached to the bottom plate and the pressing plate, of the bottom plate, the first hollow area and the second hollow area are correspondingly arranged in a group, a silicon wafer is contained between the first hollow area and the second hollow area in each group, and the silicon wafer is limited and fixed through the first elastic clamping heads and the second elastic clamping heads on the two sides;

the bottom plate upper end is connected with the conduction board, the conduction board is provided with negative pole butt joint contact, conduction board and bottom plate built-in have electrically conductive route to be connected to every first mounting.

2. The magnetic silicon wafer chuck with elastic clamping head as claimed in claim 1, wherein: the bottom plate is provided with at least two positioning columns, and the pressing plate is provided with positioning holes corresponding to the positioning columns.

3. The magnetic silicon wafer chuck with elastic clamping head as claimed in claim 2, wherein: the number of the positioning columns is four, and the four positioning columns are arranged on four corners of the inner end face of the bottom plate respectively.

4. The magnetic silicon wafer chuck with elastic clamping head as claimed in claim 1, wherein: the outer edge of the inner end face of the bottom plate is provided with a limiting frame, and the pressing plate is located in the limiting frame when the bottom plate is buckled with the pressing plate.

5. The magnetic silicon wafer chuck with elastic clamping head as claimed in claim 4, wherein: the limiting frame is composed of four limiting strips.

6. The magnetic silicon wafer chuck with elastic clamping head as claimed in claim 1, wherein: the first elastic clamping head and the second elastic clamping head are of U-shaped elastic sheet structures or spring contact structures.

7. The magnetic silicon wafer chuck with elastic clamping head as claimed in claim 6, wherein: and a contact end of the U-shaped elastic sheet structure is provided with a contact salient point.

8. The magnetically-attractable wafer chuck as claimed in claim 6, wherein the magnetically-attractable wafer chuck comprises: the spring contact structure comprises a first fixed seat, wherein a connecting column is arranged on the first fixed seat, and the connecting column is connected with a solid contact through a first spring.

9. The magnetic silicon wafer chuck with elastic clamping head as claimed in claim 6, wherein: the spring contact structure comprises a second fixing seat, a fixing column is arranged on the second fixing seat, a hollow contact is sleeved at the end part of the fixing column, and the hollow contact is connected with the second fixing seat through a second spring.