CN218576630U - Cutting device for processing semiconductor material - Google Patents

Abstract

The utility model discloses a cutting device for semiconductor material processing, including base and sliding plate, the fixed plate is installed to the one end of base, and the top of fixed plate installs the roof, the fixed plate is close to the top of base one end and installs third slip subassembly, and the one end slidable mounting that the fixed plate was kept away from to third slip subassembly has the lifter plate, third electric pneumatic cylinder is installed at the top of roof. The utility model discloses install chi strip, gear, first pivot and servo motor, during the use, servo motor drives the gear through first pivot and rotates, and the gear passes through the chi strip and drives the sliding plate and remove, can remove the cutting teeth piece to appointed cutting position department, and in the accommodation process, servo motor's rotational speed is even for the cutting teeth piece can uniform velocity move, is favorable to carrying out the accurate regulation to the position of cutting teeth piece, thereby can effectively improve the cutting accuracy of device.

Description

Cutting device for processing semiconductor material

Technical Field

The utility model relates to a semiconductor material processing equipment technical field specifically is a cutting device for semiconductor material processing.

Background

Semiconductor materials are a class of electronic materials having semiconductor properties that can be used to fabricate semiconductor devices and integrated circuits, and are widely used in the manufacture of electronic devices, and when processing semiconductor materials, a cutting apparatus is used to cut the semiconductor materials so as to process the semiconductor materials into a desired size and shape.

When the existing cutting device for processing the semiconductor material is used, the cutting toothed sheet is mostly pushed to move through the cylinder, the length of the output end of the cylinder is fixed, the cylinder pushes the cutting toothed sheet to move, when the cutting position is adjusted, the moving speed of the cutting toothed sheet is uneven, the cutting toothed sheet is not easy to move to a specified position to be cut, and an error is easily generated in the cutting process, so that the cutting precision of the device is greatly reduced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a cutting device for semiconductor material processing to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a cutting device for semiconductor material processing, includes base and sliding plate, the fixed plate is installed to the one end of base, and the top of fixed plate installs the roof, the fixed plate is close to the top of base one end and installs third slip subassembly, and the third slip subassembly keeps away from the one end slidable mounting of fixed plate and has the lifter plate, the third electric pneumatic cylinder is installed at the top of roof, the one end of keeping away from the fixed plate in the lifter plate bottom installs first slip subassembly, and the bottom slidable mounting of first slip subassembly has the sliding plate, driving motor is installed to the bottom of sliding plate, and the sliding plate is close to the one end of fixed plate and installs the chi strip, servo motor is installed to the one end that the lifter plate top is close to the fixed plate, and servo motor's output installs first pivot, first pivot is passed through the lifter plate, and the bottom of first pivot is installed with chi strip meshing gear, first clamping piece is installed to the bottom of lifter plate, and the one end that the lifter plate bottom is close to the fixed plate installs second electric pneumatic cylinder, the second slip subassembly is installed at the top of base, and the top slidable mounting of second slip subassembly has the top of fixed plate, the one end of first electric pneumatic cylinder and the electric pneumatic cylinder is connected with the output of electric control panel, the electric control panel of motor control panel, the output of servo motor, the output of base and the third electric control panel.

Preferably, a second rotating shaft is installed at the output end of the driving motor, and a cutting tooth piece is installed at one end, far away from the driving motor, of the second rotating shaft.

Preferably, the second clamping piece is installed to the output of second electric pneumatic cylinder, and the one end that driving motor was kept away from to the second clamping piece is installed anti-skidding rubber pad.

Preferably, the second splint are installed to the one end that the layer board top is close to the fixed plate, and the layer board top is kept away from the one end of fixed plate and is installed fixed solenoid, the internal thread of fixed solenoid installs clamping screw, and clamping screw is close to the one end of second splint and installs first splint.

Preferably, the output end of the third electric pneumatic cylinder penetrates through the top plate, and the output end of the third electric pneumatic cylinder is connected with the lifting plate.

Preferably, the reinforcing plate is installed to the base top near the one end of fixed plate, and the reinforcing plate is kept away from the one end of base and is connected with the fixed plate.

Preferably, the handle is installed to the one end that set screw kept away from the second splint, and the sponge cover is installed to the outside of handle.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the cutting device for processing the semiconductor material is provided with the ruler strip, the gear, the first rotating shaft and the servo motor, when the cutting device is used, the servo motor drives the gear to rotate through the first rotating shaft, the gear drives the sliding plate to move through the ruler strip, the cutting tooth piece can be moved to a specified cutting position, and in the adjusting process, the rotating speed of the servo motor is uniform, so that the cutting tooth piece can move at a uniform speed, the position of the cutting tooth piece can be accurately adjusted, and the cutting precision of the cutting device can be effectively improved;

2. the cutting device for processing the semiconductor material is provided with the second electric pneumatic cylinder, the first clamping piece, the anti-skidding rubber pad and the second clamping piece, after the cutting tooth piece is moved to a specified position, the second electric pneumatic cylinder pushes the second sliding assembly to move, so that the anti-skidding rubber pad is tightly attached to the outer side of the first rotating shaft, the first rotating shaft is clamped by the first clamping piece and the second clamping piece, the friction force is increased by the anti-skidding rubber pad, the first rotating shaft can be prevented from continuously rotating, and due to the fact that the ruler strip is meshed with the gear, when the gear stops rotating, the gear and the sliding plate can be prevented from continuously moving in the cutting process, the cutting tooth piece can be prevented from continuously moving, and the stability of the device is improved;

3. this a cutting device for semiconductor material processing installs first electric pneumatic cylinder, layer board and second slip subassembly, during the use, first electric pneumatic cylinder can promote the layer board and remove, can promote semiconductor material to cutting teeth below cutting, and after the use, first electric pneumatic cylinder pulling layer board removes, can follow cutting teeth below with semiconductor material and remove to the staff of being convenient for takes off the semiconductor material after will cutting from the layer board.

Drawings

FIG. 1 is a schematic sectional view of the front view of the present invention;

fig. 2 is a schematic side view of the lift plate of the present invention;

FIG. 3 is a schematic view of a partial structure of the present invention;

fig. 4 is a schematic side view of the sliding plate of the present invention;

fig. 5 is a schematic front sectional view of the pallet of the present invention.

In the figure: 1. a base; 2. a first electric pneumatic cylinder; 3. fixing the screw rod; 4. fixing the solenoid; 5. cutting the tooth sheet; 6. a sliding plate; 7. a lifting plate; 8. a first sliding assembly; 9. a ruler strip; 10. a gear; 11. a first rotating shaft; 12. a servo motor; 13. a second electric pneumatic cylinder; 14. a first splint; 15. a support plate; 16. a second splint; 17. a second slide assembly; 18. a third electric pneumatic cylinder; 19. a top plate; 20. a third sliding assembly; 21. a fixing plate; 22. a control panel; 23. a drive motor; 24. a second rotating shaft; 25. a first clip piece; 26. an anti-skid rubber pad; 27. a second clip.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides an embodiment: a cutting device for semiconductor material processing, including base 1 and sliding plate 6, fixed plate 21 is installed at one end of base 1, and top plate 19 is installed at the top of fixed plate 21, fixed plate 21 is installed near the top of base 1 one end with third sliding assembly 20, and the end of third sliding assembly 20 far away from fixed plate 21 is installed with lifting plate 7, top plate 19 is installed with third electric pneumatic cylinder 18, here the model of third electric pneumatic cylinder 18 can be J64RT2 VER, lifting plate 7 bottom is installed with first sliding assembly 8, and the bottom sliding installation of first sliding assembly 8 has sliding plate 6, bottom of sliding plate 6 is installed with driving motor 23, here the model of driving motor 23 can be Y90S-2, ruler strip 9 is installed at the end of lifting plate 6 near fixed plate 21, servo motor 12 is installed at the end of lifting plate 7 top near fixed plate 21, here the model of servo motor 12 can be EDSMT-2T, and the output end of servo motor 12 is installed with first rotating shaft 11, first rotating shaft 11 passes through lifting plate 7, and gear wheel 10 is installed at the bottom of first rotating shaft 11, and gear wheel 10 is installed at the bottom of lifting plate 21, and the end of lifting plate 21 is installed with lifting plate 13, and the top of second electric pneumatic cylinder 17 is installed at the top of lifting plate 21, and the top is installed with lifting plate 13, the top of lifting plate 13, and the top is installed with electric pneumatic cylinder 13, the top of lifting plate 21 is installed with lifting plate 13, the top of lifting plate 13, and the top is installed with lifting plate 13, the output end of the control panel 22 is electrically connected to the input ends of the first electric pneumatic cylinder 2, the servo motor 12, the second electric pneumatic cylinder 13, the third electric pneumatic cylinder 18 and the driving motor 23 through wires.

In this implementation:

further, a second rotating shaft 24 is installed at the output end of the driving motor 23, the cutting tooth piece 5 is installed at one end, far away from the driving motor 23, of the second rotating shaft 24, the driving motor 23 drives the cutting tooth piece 5 to rotate through the second rotating shaft 24, and therefore the semiconductor material can be cut through the cutting tooth piece 5.

Further, second clamping piece 27 is installed to the output of second electric pneumatic cylinder 13, and the one end that driving motor 23 was kept away from to second clamping piece 27 installs anti-skidding rubber pad 26, second electric pneumatic cylinder 13 promotes the removal of second slip subassembly 17, make anti-skidding rubber pad 26 closely laminate with the outside of first pivot 11, grasp first pivot 11 through first clamping piece 25 and second clamping piece 27, and increase frictional force through anti-skidding rubber pad 26, can prevent that first pivot 11 from continuing to rotate, because mesh between chi strip 9 and the gear 10, when gear 10 stall, can prevent that gear 10 and sliding plate 6 from continuing to move at the cutting process, thereby can prevent that cutting teeth 5 from continuing to move, be favorable to improving the stability of device.

Further, second splint 16 are installed to the one end that layer board 15 top is close to fixed plate 21, and the one end that fixed plate 21 was kept away from at layer board 15 top is installed fixed solenoid 4, clamping screw 3 is installed to the internal thread of fixed solenoid 4, and clamping screw 3 is close to the one end of second splint 16 and installs first splint 14, the staff can place the semiconductor material that needs the cutting in the top of layer board 15, then rotate clamping screw 3, make clamping screw 3 pass through the screw thread and remove, clamping screw 3 drives first splint 14 and removes together, make first splint 14 closely laminate with the semiconductor material, can be firm with the semiconductor material centre gripping through first splint 14 and second splint 16.

Further, the output end of the third electric pneumatic cylinder 18 passes through the top plate 19, and the output end of the third electric pneumatic cylinder 18 is connected to the lifting plate 7, so that the lifting plate 7 is pushed by the third electric pneumatic cylinder 18 to move downward, and the dicing blade 5 can be brought into contact with the semiconductor material.

Furthermore, a reinforcing plate is installed at one end of the top of the base 1 close to the fixing plate 21, and one end of the reinforcing plate far away from the base 1 is connected with the fixing plate 21, so that the base 1 and the fixing plate 21 can be installed firmly in front.

Further, the handle is installed to the one end that second splint 16 were kept away from to clamping screw 3, and the sponge cover is installed in the outside of handle, and the staff of being convenient for rotates clamping screw 3.

The working principle is as follows:

when the device is used, the device is powered on, a worker can place a semiconductor material to be cut on the top of the supporting plate 15, then the fixing screw 3 is rotated, the fixing screw 3 moves through threads, the fixing screw 3 drives the first clamping plate 14 to move together, the first clamping plate 14 is tightly attached to the semiconductor material, and the semiconductor material can be firmly clamped through the first clamping plate 14 and the second clamping plate 16;

then, the worker can start the first electric pneumatic cylinder 2 through the control panel 22, so that the first electric pneumatic cylinder 2 pushes the supporting plate 15 to move, and the semiconductor material can be pushed to the position below the cutting tooth piece 5 for cutting;

before cutting, a worker can start the servo motor 12 through the control panel 22, the servo motor 12 drives the gear 10 to rotate through the first rotating shaft 11, the gear 10 drives the sliding plate 6 to move through the ruler strip 9, and then the cutting tooth piece 5 can be moved to a specified cutting position;

after the cutting tooth piece 5 is moved to a specified position, a worker can start the second electric pneumatic cylinder 13 through the control panel 22, the second electric pneumatic cylinder 13 pushes the second sliding assembly 17 to move, so that the anti-skid rubber pad 26 is tightly attached to the outer side of the first rotating shaft 11, the first rotating shaft 11 is clamped through the first clamping piece 25 and the second clamping piece 27, the friction force is increased through the anti-skid rubber pad 26, the first rotating shaft 11 can be prevented from continuously rotating, and due to the meshing between the ruler strip 9 and the gear 10, when the gear 10 stops rotating, the gear 10 and the sliding plate 6 can be prevented from continuously moving in the cutting process, so that the cutting tooth piece 5 can be prevented from continuously moving, and the stability of the device is improved;

during cutting, a worker can start the third electric pneumatic cylinder 18 through the control panel 22, so that the third electric pneumatic cylinder 18 pushes the lifting plate 7 to move downwards, and the cutting tooth piece 5 can be in contact with the semiconductor material;

then, the worker can start the driving motor 23 through the control panel 22, and the driving motor 23 drives the cutting blade 5 to rotate through the second rotating shaft 24, so that the semiconductor material can be cut through the cutting blade 5.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

Claims (7)

1. A cutting device for semiconductor material processing, includes base (1) and sliding plate (6), its characterized in that: the automatic lifting device is characterized in that a fixed plate (21) is installed at one end of the base (1), a top plate (19) is installed at the top of the fixed plate (21), a third sliding assembly (20) is installed at the top of the fixed plate (21) close to one end of the base (1), a lifting plate (7) is installed at one end, far away from the fixed plate (21), of the third sliding assembly (20), a third electric pneumatic cylinder (18) is installed at the top of the top plate (19), a first sliding assembly (8) is installed at one end, far away from the fixed plate (21), of the bottom of the lifting plate (7), a sliding plate (6) is installed at the bottom of the first sliding assembly (8), a driving motor (23) is installed at the bottom of the sliding plate (6), a ruler strip (9) is installed at one end, close to the fixed plate (21), of the top of the lifting plate (7), a servo motor (12) is installed at one end, close to the fixed plate (21), a first rotating shaft (11) is installed at the output end of the servo motor (12), the first rotating shaft (11) penetrates through the lifting plate (7), a gear (10) meshed with the ruler strip (9) is installed at the bottom of the first rotating shaft (11), a second lifting plate (13) is installed at one end, a second lifting plate (7) close to the bottom of the lifting plate (7) is installed at the bottom of the lifting plate (21), second slip subassembly (17) is installed at the top of base (1), and the top slidable mounting of second slip subassembly (17) has layer board (15), base (1) top is kept away from the one end of fixed plate (21) and is installed first electric pneumatic cylinder (2), and the output of first electric pneumatic cylinder (2) is connected with layer board (15), fixed plate (21) are kept away from the bottom of base (1) one end and are installed control panel (22), the output of control panel (22) passes through the wire respectively with the input electric connection of first electric pneumatic cylinder (2), servo motor (12), second electric pneumatic cylinder (13), third electric pneumatic cylinder (18) and driving motor (23).

2. The cutting device for semiconductor material processing according to claim 1, wherein: second pivot (24) are installed to the output of driving motor (23), and cutting pick (5) are installed to the one end that driving motor (23) were kept away from in second pivot (24).

3. The cutting device for semiconductor material processing according to claim 1, wherein: second clamping piece (27) are installed to the output of second electric pneumatic cylinder (13), and anti-skidding rubber pad (26) are installed to the one end that driving motor (23) were kept away from in second clamping piece (27).

4. The cutting device for semiconductor material processing according to claim 1, wherein: second splint (16) are installed to the one end that layer board (15) top is close to fixed plate (21), and the one end that fixed plate (21) were kept away from at layer board (15) top installs fixed solenoid (4), set screw (3) are installed to the internal thread of fixed solenoid (4), and set screw (3) are close to the one end of second splint (16) and install first splint (14).

5. The cutting device for semiconductor material processing according to claim 1, wherein: the output end of the third electric pneumatic cylinder (18) penetrates through the top plate (19), and the output end of the third electric pneumatic cylinder (18) is connected with the lifting plate (7).

6. The cutting device for semiconductor material processing according to claim 1, wherein: the reinforcing plate is installed to the one end that base (1) top is close to fixed plate (21), and the reinforcing plate is kept away from the one end of base (1) and is connected with fixed plate (21).

7. The cutting device for semiconductor material processing according to claim 4, wherein: the handle is installed to the one end that second splint (16) were kept away from in clamping screw (3), and the sponge cover is installed in the outside of handle.

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