CN218570572U - Rubber plate substrate laminating device for processing circuit board - Google Patents
Rubber plate substrate laminating device for processing circuit board Download PDFInfo
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- CN218570572U CN218570572U CN202222397878.6U CN202222397878U CN218570572U CN 218570572 U CN218570572 U CN 218570572U CN 202222397878 U CN202222397878 U CN 202222397878U CN 218570572 U CN218570572 U CN 218570572U
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- frame
- base plate
- wall
- circuit board
- electric telescopic
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Abstract
The utility model discloses a circuit board processing is with offset plate base plate laminating device, which comprises a mounting bas, the upper surface of mount pad is fixedly connected with respectively links up frame, benchmark frame and connection box, and the inner wall that links up the frame rotates through the connecting axle and is connected with the installing frame, and the inner wall sliding connection of installing frame has the locating frame with base plate looks adaptation, and the inner wall of locating frame is provided with the sucking disc, and the left surface of installing frame is provided with an electric telescopic handle. This offset plate base plate laminating device is used in circuit board processing puts into the offset plate in the benchmark frame, puts into the posting with the base plate again in, utilizes the sucking disc to adsorb the base plate in the posting, driving motor drives the installing frame and rotates to parallel with the benchmark frame after that, later drives a electric telescopic handle, because the inner wall size of benchmark frame and posting and the size looks adaptation of offset plate and base plate to can make the quick laminating of base plate on the posting on the offset plate, and then improved the laminating efficiency of base plate and offset plate.
Description
Technical Field
The utility model relates to a circuit board processing technology field specifically is a plywood base plate laminating device is used in circuit board processing.
Background
When the circuit board is produced, the base plate and the rubber plate need to be attached, the base plate is manually placed on the operating table in the traditional attaching mode, then the rubber plate is placed in the operating table for attaching, but the attaching mode easily causes dislocation during attaching of the rubber plate, the efficiency is low, and therefore the efficient circuit board base plate and rubber plate attaching device is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a plywood base plate laminating device is used in circuit board processing to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a circuit board processing is with offset base plate laminating device, includes the mount pad, the upper surface of mount pad is fixedly connected with respectively links up frame, benchmark frame and connection frame, the inner wall that links up the frame rotates through the connecting axle and is connected with the mount frame, the inner wall sliding connection of mount frame have with the locating frame of base plate looks adaptation, the inner wall of locating frame is provided with the sucking disc, the left surface of mount frame is provided with first electric telescopic handle, first electric telescopic handle's flexible end extends to the inside of mount frame to with the left surface fixed connection of locating frame, the upper surface of mount pad is provided with the propelling movement subassembly.
Preferably, the front surface of the connecting frame is fixedly connected with a motor, and the output end of the motor is fixedly connected with the front surface of the connecting shaft.
Preferably, the surface of locating frame is provided with the sliding block, and the sliding tray with sliding block looks adaptation is seted up to the inner wall of installing frame.
Preferably, the upper surface of mount pad is seted up flutedly, and the inner wall of recess and the interior roof of connecting frame all are provided with the compression roller.
Preferably, the propelling movement subassembly includes fixed mounting at mount pad upper surface second electric telescopic handle, and the flexible end connection of second electric telescopic handle has the push pedal, and the track groove that supplies the push pedal to pass through is seted up to the interior left side wall of benchmark frame.
Preferably, the sucking disc is connected with outside air pump, and the inner wall size and the size looks adaptation of plywood of benchmark frame.
Advantageous effects
The utility model provides a plywood base plate laminating device is used in circuit board processing possesses following beneficial effect:
1. this offset plate base plate laminating device is used in circuit board processing, put into the benchmark frame with the offset plate in, put into the locating frame with the base plate again, utilize the sucking disc to adsorb the base plate in the locating frame, driving motor drives the installing frame and rotates to being parallel with the benchmark frame after that, later drive first electric telescopic handle, because the inner wall size and offset plate and the size looks adaptation of base plate of benchmark frame and locating frame, thereby can make the quick laminating of base plate on the locating frame on the offset plate, dislocation when having avoided base plate and offset plate laminating, and then the laminating efficiency of base plate and offset plate has been improved.
2. This offset plate base plate laminating device is used in circuit board processing finishes the back when offset plate and base plate laminating, and drive second electric telescopic handle can order about the push pedal and remove the base plate and the offset plate that the laminating was accomplished to between two compression rollers to usable two compression rollers exert pressure to base plate and offset plate, make offset plate and base plate laminating inseparabler.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of a front cross-section structure of the mounting base of the present invention;
FIG. 3 is a schematic view of the front cross-section structure of the mounting frame of the present invention;
fig. 4 is a schematic side view structure diagram of the positioning frame of the present invention.
In the figure: the device comprises a mounting seat 1, a connecting frame 2, a reference frame 3, a connecting frame 4, a mounting frame 5, a positioning frame 6, a sucking disc 7, a first electric telescopic rod 8, a motor 9, a sliding block 10, a pressing roller 11, a second electric telescopic rod 12 and a push plate 13.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a circuit board processing is with offset base plate laminating device, includes mount pad 1, and the upper surface of mount pad 1 is fixedly connected with respectively links up frame 2, benchmark frame 3 and connecting frame 4, and the upper surface of mount pad 1 is seted up flutedly, and the inner wall of recess and the interior roof of connecting frame 4 all are provided with compression roller 11, and the inner wall size and the size looks adaptation of offset of benchmark frame 3 to can carry on spacingly to the offset.
The inner wall of the connection frame 2 is rotatably connected with an installation frame 5 through a connecting shaft, the front of the connection frame 2 is fixedly connected with a motor 9, the output end of the motor 9 is fixedly connected with the front of the connecting shaft, the driving motor 9 can drive the installation frame 5 to rotate, the inner wall of the installation frame 5 is slidably connected with a positioning frame 6 matched with a substrate, the inner wall of the positioning frame 6 is provided with a sucker 7, the sucker 7 is connected with an external air pump, the substrate is placed into the positioning frame 6, the lower surface of the substrate is in lap joint with the inner bottom wall of the positioning frame 6, and the substrate can be adsorbed in the positioning frame 6 by utilizing the negative pressure generated by the sucker 7.
The surface of locating frame 6 is provided with sliding block 10, the sliding tray with sliding block 10 looks adaptation is seted up to the inner wall of installing frame 5, can restrict the removal orbit of locating frame 6 through setting up sliding block 10, the left surface of installing frame 5 is provided with first electric telescopic handle 8, first electric telescopic handle 8's flexible end extends to the inside of installing frame 5, and with the left surface fixed connection of locating frame 6, drive first electric telescopic handle 8 can drive the orbit removal of locating frame 6 along the sliding tray.
Put into benchmark frame 3 with the offset plate in, put into locating frame 6 with the base plate again, utilize sucking disc 7 to adsorb the base plate in locating frame 6, driving motor 9 drives installing frame 5 and rotates to being parallel with benchmark frame 3 after that, first electric telescopic handle 8 of drive to can make the quick laminating of base plate on the locating frame 6 on the offset plate, and then improved the laminating efficiency of base plate and offset plate.
The upper surface of mount pad 1 is provided with the propelling movement subassembly, and the propelling movement subassembly includes fixed mounting at 1 upper surface second electric telescopic handle 12 of mount pad, and the flexible end fixedly connected with push pedal 13 of second electric telescopic handle 12, the track groove that supplies push pedal 13 to pass through is seted up to the interior left side wall of benchmark frame 3.
After the offset plate finishes laminating with the base plate, drive second electric telescopic handle 12, can order about push pedal 13 and remove the base plate and the offset plate that the laminating was accomplished to between two compression rollers 11 to usable two compression rollers 11 exert pressure to base plate and offset plate, make offset plate and base plate laminating inseparabler.
The working principle is as follows: when the glue board substrate laminating device for processing the circuit board is used, firstly, a glue board is placed into the reference frame 3, the left side face of the glue board is in lap joint with the inner left side wall of the reference frame 3, then the substrate is placed into the positioning frame 6, the lower surface of the substrate is in lap joint with the inner bottom wall of the positioning frame 6, the substrate can be adsorbed in the positioning frame 6 by utilizing negative pressure generated by the sucker 7, then the driving motor 9 drives the installation frame 5 to rotate to be parallel to the reference frame 3, then the first electric telescopic rod 8 is driven to extend, the positioning frame 6 is driven to move along the track of the sliding groove, the substrate on the positioning frame 6 is quickly laminated on the glue board, after the glue board is completely laminated with the substrate, the motor 9 is reversely rotated, the installation frame 5 is reset, the second electric telescopic rod 12 is driven, the push plate 13 is driven to move the laminated substrate and glue board between the two press rollers 11, and therefore, the two press rollers 11 can be utilized to apply pressure to the substrate and the glue board, and the glue board is more tightly laminated.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a circuit board processing is with offset plate base plate laminating device, includes mount pad (1), its characterized in that: the upper surface of mount pad (1) is fixedly connected with respectively links up frame (2), benchmark frame (3) and connection frame (4), the inner wall that links up frame (2) rotates through the connecting axle and is connected with installing frame (5), the inner wall sliding connection of installing frame (5) has location frame (6) with base plate looks adaptation, the inner wall of location frame (6) is provided with sucking disc (7), the left surface of installing frame (5) is provided with first electric telescopic handle (8), the flexible end of first electric telescopic handle (8) extends to the inside of installing frame (5), and with the left surface fixed connection of location frame (6), the upper surface of mount pad (1) is provided with the propelling movement subassembly.
2. The bonding device for the circuit board processing rubber plate substrate according to claim 1, characterized in that: the front face of the connecting frame (2) is fixedly connected with a motor (9), and the output end of the motor (9) is fixedly connected with the front face of the connecting shaft.
3. The bonding device for the circuit board processing rubber plate substrate according to claim 1, characterized in that: the surface of the positioning frame (6) is provided with a sliding block (10), and the inner wall of the mounting frame (5) is provided with a sliding groove matched with the sliding block (10).
4. The bonding device for the circuit board processing rubber plate substrate according to claim 1, characterized in that: the upper surface of the mounting seat (1) is provided with a groove, and the inner wall of the groove and the inner top wall of the connecting frame (4) are both provided with a compression roller (11).
5. The bonding device for the circuit board processing rubber plate substrate according to claim 1, characterized in that: the propelling movement subassembly includes fixed mounting at mount pad (1) upper surface second electric telescopic handle (12), and the flexible end connection of second electric telescopic handle (12) has push pedal (13), and the track groove that supplies push pedal (13) to pass through is seted up to the interior left side wall of benchmark frame (3).
6. The bonding device for the circuit board processing rubber plate substrate according to claim 1, characterized in that: sucking disc (7) are connected with outside air pump, the inner wall size and the size looks adaptation of plywood of benchmark frame (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222397878.6U CN218570572U (en) | 2022-09-09 | 2022-09-09 | Rubber plate substrate laminating device for processing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222397878.6U CN218570572U (en) | 2022-09-09 | 2022-09-09 | Rubber plate substrate laminating device for processing circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218570572U true CN218570572U (en) | 2023-03-03 |
Family
ID=85310469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222397878.6U Active CN218570572U (en) | 2022-09-09 | 2022-09-09 | Rubber plate substrate laminating device for processing circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218570572U (en) |
-
2022
- 2022-09-09 CN CN202222397878.6U patent/CN218570572U/en active Active
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