CN218570199U - LTCC-based non-reflection high-pass filter - Google Patents
LTCC-based non-reflection high-pass filter Download PDFInfo
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Abstract
The utility model discloses a no reflection high pass filter based on LTCC comprises three inductance, three electric capacity and two built-in resistance. The microwave device based on the LTCC has good high temperature resistance and can bear larger current, dozens of layers of substrates can be manufactured by the LTCC process, the passive device is embedded, the integration level is improved, and meanwhile, the interference of other assembled elements is reduced; an inductor and a resistor are respectively connected to an input port and an output port to form circuit branches so as to absorb a low-pass frequency band reflection signal, and capacitors are connected to the input port and the output port to transmit high-frequency signals; on the premise that both the pass band and the stop band have extremely low reflection loss, the characteristics of small volume, simple structure, good stability, high reliability, high temperature resistance and good material consistency of the element are realized.
Description
Technical Field
The utility model relates to a microwave technology field, concretely relates to no reflection high pass filter based on LTCC.
Background
The filter has a function of filtering fixed frequency signals, and is widely applied to communication and radio frequency systems. According to the processing method of the stop band signal of the filter, the filter can be divided into a reflective filter and a non-reflective filter, wherein the stop band signal of the reflective filter is reflected back to the signal input end, and the non-reflective filter absorbs and consumes the reflected signal through a certain circuit structure. Compared with the mature research and design of the traditional reflection type filter, the research of the reflection-free filter is still few, and related research and design are lacked in China.
In many practical applications, for example, the mixer is very sensitive to signal variations at the outer ends of all bands; the stability of the high gain amplifier is affected by the out-of-band signal feedback in the packaging environment; the reliability and stability of high power transmitters is limited by the out-of-band reflected signal. Therefore, there is a need to design a LTCC-based non-reflective high pass filter. LTCC, a low temperature co-fired ceramic, is a thick film process with high stability, high quality factor and high integration. Compared with other materials, the ceramic material has high stability and large variation range of dielectric constant, and is suitable for manufacturing microwave devices.
Existing reflectionless filter designs are of two types: one is that a single-terminal prototype filter is used as an absorption load, and different filters with complementary admittance curves are formed in the working mode of a duplexer or a multiplexer to realize the matching of a pass band and a stop band; the other is to use a reflection filter in combination with two 3dB directional couplers to cancel out the stopband reflection energy. These two types of filters employ a large number of components, a complicated design process, and a large volume of components.
The existing non-reflective design scheme has the following disadvantages: (1) The design of a reflection-free high-pass filter by adopting a duplexer or a multiplexer structure requires the dual high-pass and low-pass paths and complementary phase frequency curves. The design and debugging difficulty is high, and the element volume is large; (2) A reflection-free high-pass filter is designed by adopting a reflection filter and two 3dB directional couplers, so that the filter has the advantages of more elements, large volume and large insertion loss; (3) And the symmetrical circuit design based on the IPD process is adopted, so that the stability and the heat dissipation are low.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned technical problem that exists among the prior art, the utility model provides a no reflection high pass filter based on LTCC.
The utility model discloses a there is not reflection high pass filter based on LTCC, including first isolation resistance R1, second isolation resistance R2, first electric capacity C1, second electric capacity C2, third electric capacity C3, first inductance L1, second inductance L2 and third inductance L3, first electric capacity C1 one end is connected with input port P1, the other end is connected with one end electricity of first isolation resistance R1, second isolation resistance R2, third inductance L3 and second electric capacity C2 respectively; the other end of the first isolation resistor R1 is electrically connected with the first inductor L1 and the third capacitor C3 respectively; the first inductor L1 is connected with the input port P1; the other end of the third capacitor C3 is respectively connected with the other end of the second isolation resistor R2 and the second inductor L2; the second inductor L2 and the second capacitor C2 are respectively connected with the output port P3; the third inductor L3 is connected to the middle of the shielding layer SH; both ends of the shield layer SH are connected to the first ground port P2 and the second ground port P4, respectively.
Preferably, the first inductor L1 and the second inductor L2 are arranged in a left-right symmetrical manner, the first capacitor C1 and the second capacitor C2 are arranged in a left-right symmetrical manner, the first isolation resistor R1 and the second isolation resistor R2 are arranged in a left-right symmetrical manner, and the third inductor L3 and the third capacitor C3 are located in the middle.
Preferably, the symmetrical arrangement has a common symmetry plane, and the third inductor L3 and the third capacitor C3 are symmetrically arranged on the symmetry plane on the left side and the right side.
Preferably, the input port P1 and the output port P3 are distributed left and right, and the first ground port P2 and the second ground port P4 are distributed front and back;
the first inductor L1 is arranged on the upper side of the first capacitor C1, and the second inductor L2 is arranged on the upper side of the second capacitor C2;
the lower sides of the first isolation resistor R1 and the second isolation resistor R2 are provided with a third inductor L3, and the upper sides are provided with a third capacitor C3;
the third inductor L3 is disposed on the upper side of the shielding layer SH to constitute a stacked structure.
Preferably, the first inductor is a first spiral inductor, and the second inductor is a second spiral inductor;
the first spiral inductor comprises six layers, the layers are connected through a through hole connecting column, the first layer is connected with the input port P1, and the sixth layer is connected with the first connecting line Li n 1;
the second spiral inductor comprises six layers, the layers are connected through a through hole connecting column, the first layer is connected with the output port P3, and the sixth layer is connected with a fifth connecting line Li n 5;
the third spiral inductor has three layers, the layers are connected through a through hole connecting column, the first layer is connected with a second transmission line T2, and the third layer is connected with the upper end of a fifth connecting column H5;
the first capacitor C1 comprises three layers, the first layer and the third layer are respectively connected with the input port P1, and the second layer is connected with the first transmission line T1;
the second capacitor C2 has three layers, the first layer and the third layer are respectively connected with the output port P3, and the second layer is connected with the third transmission line T3;
the third capacitor C3 has two layers; the first layer is connected with a second connecting line Li n2, and the second layer is connected with a sixth connecting line Li n 6;
one end of the first isolation resistor R1 is connected with the first connecting line L i n1, and the other end of the first isolation resistor R1 is connected with the third connecting line Li n 3;
one end of the second isolation resistor R2 is connected with a fifth connecting line L i n5, and the other end of the second isolation resistor R2 is connected with a seventh connecting line Li n 7;
one end of the shielding layer SH is connected to the first ground port P2, and the other end is connected to the second ground port P4;
the first connecting line Li n1 is connected with the second connecting line Li n2 through a first connecting column H1, the third connecting line Li n3 is connected with the fourth connecting line Li n4 through a second connecting column H2, the fifth connecting line Li n5 is connected with the sixth connecting line Li n6 through a third connecting column H3, and the seventh connecting line Li n7 is connected with the eighth connecting line Li n8 through a fourth connecting column H4; the second layer of the first capacitor C1 is connected with one end of a first transmission line T1, the other end of the first transmission line T1 is connected with one end of a fourth connecting line Li n4, the other end of the fourth connecting line Li n4 is connected with one end of a second transmission line T2, the other end of the second transmission line T2 is connected with an eighth connecting line Li n8, and the other end of the eighth connecting line Li n8 is connected with the second layer of the second capacitor C2; the middle point of the second transmission line T2 is connected with the first layer of the third spiral inductor, the third layer of the third spiral inductor is connected with the upper end of a fifth connecting post H5, and the lower end of the fifth connecting post H5 is connected with the middle part of the shielding layer SH.
Preferably, the second layer of the third capacitor C3 is electrically connected to the first connection post H1; a first through hole is formed in the first layer of the third capacitor C3, and the first connecting column H1 penetrates through the first through hole and is electrically connected with the third connecting line Li n 3.
Preferably, the input port P1 and the output port P3 are both 50 ohm impedance ports.
Preferably, the input port P1, the first ground port P2, the output port P3, and the second ground port P4 are external package pins.
Preferably, the first isolation resistor R1 and the second isolation resistor R2 are of an embedded structure, and the impedance of the first isolation resistor R1 and the second isolation resistor R2 is 50 ohms.
Preferably, the non-reflection high-pass filter is a low-temperature co-fired ceramic piece.
Compared with the prior art, the beneficial effects of the utility model are that: the microwave device based on the LTCC has good high temperature resistance and can bear larger current, dozens of layers of substrates can be manufactured by the LTCC process, the passive device is embedded, the integration level is improved, and meanwhile, the interference of other assembled elements is reduced; an inductor and a resistor are respectively connected to an input port and an output port to form circuit branches so as to absorb a low-pass frequency band reflection signal, and capacitors are connected to the input port and the output port to transmit high-frequency signals; on the premise that both the pass band and the stop band have extremely low reflection loss, the characteristics of small volume, simple structure, good stability, high reliability, high temperature resistance and good material consistency of the element are realized.
Drawings
Fig. 1 is a schematic structural diagram of the LTCC-based non-reflective high pass filter of the present invention;
FIG. 2 is a top view of a reflection-free high pass filter;
fig. 3 is a side view of the present invention;
FIG. 4 is a graph of insertion loss and return loss for performance testing;
FIG. 5 is a graph of standing wave coefficients for performance testing.
The symbols in the figure illustrate:
an input port P1, a first grounding port P2, an output port P3 and a second grounding port P4;
the shielding structure comprises a first transmission line T1, a second transmission line T2, a third transmission line T3, a first connection line Li n1, a second connection line Li n2, a third connection line Li n3, a fourth connection line Li n4, a fifth connection line Li n5, a sixth connection line Li n6, a seventh connection line Li n7, an eighth connection line Li n8, a first connection column H1, a second connection column H2, a third connection column H3, a fourth connection column H4, a fifth connection column H5 and a shielding layer SH;
the inductor comprises a first inductor L1, a second inductor L2, a third inductor L3, a first capacitor C1, a second capacitor C2, a third capacitor C3, a first isolation resistor R1 and a second isolation resistor R2.
Detailed Description
To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and obviously, the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The invention is described in further detail below with reference to the accompanying drawings:
an LTCC-based non-reflective high-pass filter is shown in figures 1-3 and comprises a first isolation resistor R1, a second isolation resistor R2, a first capacitor C1, a second capacitor C2, a third capacitor C3, a first inductor L1, a second inductor L2 and a third inductor L3, wherein one end of the first capacitor C1 is connected with an input port P1, and the other end of the first capacitor C1 is respectively and electrically connected with one end of the first isolation resistor R1, one end of the second isolation resistor R2, one end of the third inductor L3 and one end of the second capacitor C2; the other end of the first isolation resistor R1 is electrically connected with the first inductor L1 and the third capacitor C3 respectively; the first inductor L1 is connected to the input port P1; the other end of the third capacitor C3 is respectively connected with the other end of the second isolation resistor R2 and the second inductor L2; the second inductor L2 and the second capacitor C2 are respectively connected with the output port P3; the third inductor L3 is connected to the middle of the shielding layer SH; both ends of the shield layer SH are connected to the first ground port P2 and the second ground port P4, respectively.
The microwave device based on the LTCC has good high temperature resistance and can bear larger current, dozens of layers of substrates can be manufactured by the LTCC process, the passive device is embedded, the integration level is improved, and meanwhile, the interference of other assembled elements is reduced; an inductor and a resistor are respectively connected to an input port and an output port to form circuit branches so as to absorb a low-pass frequency band reflection signal, and capacitors are connected to the input port and the output port to transmit high-frequency signals; on the premise that the pass band and the stop band have extremely low reflection loss, the characteristics of small volume, simple structure, good stability, high reliability, high temperature resistance and good material consistency of the element are realized; the circuit structure is simple, and the non-reflection filter with any frequency and stop band requirements can be realized by adjusting the combination of the inductor and the capacitor.
The utility model discloses a no reflection high pass filter can wide application in satellite communication such as the 5G mobile communication of microwave band, phased array radar, big dipper navigation, and to electrical property, material uniformity, thermomechanical nature, temperature stability, manufacturability and high requirement's such as interference immunity system and equipment.
The first inductor L1 and the second inductor L2 are arranged in a bilateral symmetry mode, the first capacitor C1 and the second capacitor C2 are arranged in a bilateral symmetry mode, the first isolation resistor R1 and the second isolation resistor R2 are arranged in a bilateral symmetry mode, and the third inductor L3 and the third capacitor C3 are located in the middle. The symmetrical arrangement has a common symmetrical plane, and the third inductor L3 and the third capacitor C3 are symmetrically arranged on the left side and the right side of the symmetrical plane. And the symmetrical design is adopted, the circuit structure is simple and symmetrical, and the design and development are convenient.
The input port P1 and the output port P3 are distributed left and right, and the first grounding port P2 and the second grounding port P4 are distributed front and back; the first inductor L1 is arranged on the upper side of the first capacitor C1, and the second inductor L2 is arranged on the upper side of the second capacitor C2; the lower sides of the first isolation resistor R1 and the second isolation resistor R2 are provided with a third inductor L3, and the upper sides are provided with a third capacitor C3; the third inductor L3 is disposed on the upper side of the shielding layer SH to constitute a stacked structure.
The first inductor may be a first spiral inductor, and the second inductor may be a second spiral inductor.
The connecting lines of the various components can also be optimized: the first spiral inductor comprises six layers, the layers are connected through a through hole connecting column, the first layer is connected with the input port P1, and the sixth layer is connected with a first connecting line Li n 1;
the number of the second spiral inductors is six, the layers are connected through-hole connecting columns, the first layer is connected with the output port P3, and the sixth layer is connected with a fifth connecting wire Li n 5;
the third spiral inductor comprises three layers, the layers are connected through a through hole connecting column, the first layer of the third spiral inductor is connected with a second transmission line T2, and the third layer of the third spiral inductor is connected with the upper end of a fifth connecting column H5;
the first capacitor C1 comprises three layers, the first layer and the third layer are respectively connected with the input port P1, and the second layer is connected with the first transmission line T1;
the second capacitor C2 has three layers, the first layer and the third layer are respectively connected with the output port P3, and the second layer is connected with the third transmission line T3;
the third capacitor C3 has two layers; the first layer is connected with a second connecting line Li n2, and the second layer is connected with a sixth connecting line Li n 6;
one end of the first isolation resistor R1 is connected with the first connecting line L i n1, and the other end of the first isolation resistor R1 is connected with the third connecting line Li n 3;
one end of the second isolation resistor R2 is connected with a fifth connecting line L i n5, and the other end of the second isolation resistor R2 is connected with a seventh connecting line Li n 7;
one end of the shielding layer SH is connected to the first ground port P2, and the other end is connected to the second ground port P4;
the first connecting line Li n1 is connected with the second connecting line Li n2 through a first connecting column H1, the third connecting line Li n3 is connected with the fourth connecting line Li n4 through a second connecting column H2, the fifth connecting line Li n5 is connected with the sixth connecting line Li n6 through a third connecting column H3, and the seventh connecting line Li n7 is connected with the eighth connecting line Li n8 through a fourth connecting column H4; the second layer of the first capacitor C1 is connected with one end of a first transmission line T1, the other end of the first transmission line T1 is connected with one end of a fourth connecting line Li n4, the other end of the fourth connecting line Li n4 is connected with one end of a second transmission line T2, the other end of the second transmission line T2 is connected with an eighth connecting line Li n8, and the other end of the eighth connecting line Li n8 is connected with the second layer of the second capacitor C2; the middle point of the second transmission line T2 is connected with the first layer of the third spiral inductor, the third layer of the third spiral inductor is connected with the upper end of a fifth connecting post H5, and the lower end of the fifth connecting post H5 is connected with the middle part of the shielding layer SH.
The connecting column realizes connection among different layers and is realized by punching, and the connecting column, the connecting line and the transmission line have different realization processes; the transmission line realizes the connection of different elements in the same layer; the connecting line is used for reliably connecting the connecting column and the transmission line.
As shown in fig. 3, the second layer of the third capacitor C3 is electrically connected to the first connection post H1; a first through hole is formed in the first layer of the third capacitor C3, and the first connection post H1 penetrates through the first through hole to be electrically connected with the third connection line Li n 3.
In a specific embodiment, the input port P1 and the output port P3 are both 50 ohm impedance ports, and the input port P1, the first ground port P2, the output port P3 and the second ground port P4 are external package pins; the first isolation resistor R1 and the second isolation resistor R2 are of an embedded structure, the impedance of the first isolation resistor R1 and the impedance of the second isolation resistor R2 are 50 ohms, the reflection-free high-pass filter is a low temperature co-fired ceramic (LTCC) piece, namely, the reflection-free high-pass filter with the size of 2.5mm multiplied by 1.25mm multiplied by 0.94mm is manufactured by adopting an LTCC process, and detection is carried out, wherein the detection is as shown in fig. 4 and 5. In fig. 4, the abscissa is frequency and the ordinate is decibel ratio; in fig. 5, the abscissa represents frequency, and the ordinate represents standing wave ratio. From the test data and the figures, it follows: the passband distribution is 2.5 GHz-9 GHz, the insertion loss in the frequency range is better than-2 dB, and the attenuation of the stopband range DC-1.9 GHz is less than-16 dB; in the frequency range of DC-9 GHz, the return loss of the incident port is less than-10 dB, and the standing-wave ratio is better than 2.
The utility model discloses three inductance, three electric capacity and two built-in resistance by the symmetry formula constitute, through adjusting two series capacitance's connecting wire, optimized the position of built-in resistance and parallelly connected inductance to obtain the superior miniaturized high pass filter of performance. The design principle of the utility model is that: the high-pass filter with no reflection characteristic is realized by adopting an RLC single-terminal high-pass prototype filter and a dual filter thereof and replacing and simplifying passive elements of a split point (a disconnection point) and a grounding point (a short-circuit point).
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An LTCC-based non-reflective high-pass filter is characterized by comprising a first isolation resistor (R1), a second isolation resistor (R2), a first capacitor (C1), a second capacitor (C2), a third capacitor (C3), a first inductor (L1), a second inductor (L2) and a third inductor (L3),
one end of the first capacitor (C1) is connected with the input port (P1), and the other end of the first capacitor (C1) is respectively and electrically connected with the first isolation resistor (R1), the second isolation resistor (R2), the third inductor (L3) and one end of the second capacitor (C2);
the other end of the first isolation resistor (R1) is electrically connected with the first inductor (L1) and the third capacitor (C3) respectively;
a first inductance (L1) is connected to the input port (P1);
the other end of the third capacitor (C3) is respectively connected with the other end of the second isolation resistor (R2) and the second inductor (L2);
the second inductor (L2) and the second capacitor (C2) are respectively connected with the output port (P3);
the third inductor (L3) is connected with the middle part of the shielding layer (SH); both ends of the shield layer (SH) are connected to the first ground port (P2) and the second ground port (P4), respectively.
2. The reflectionless high-pass filter according to claim 1, characterized in that the first inductance (L1) and the second inductance (L2) are arranged in a left-right symmetry, the first capacitance (C1) and the second capacitance (C2) are arranged in a left-right symmetry, the first isolation resistance (R1) and the second isolation resistance (R2) are arranged in a left-right symmetry, and the third inductance (L3) and the third capacitance (C3) are located in a middle position.
3. The reflectionless high-pass filter according to claim 2, characterized in that the symmetrical arrangement has a common plane of symmetry in which the third inductance (L3) and the third capacitance (C3) are arranged symmetrically to the left and right.
4. The reflectionless high-pass filter according to claim 2, characterized in that the input port (P1) and the output port (P3) are distributed left and right, and the first ground port (P2) and the second ground port (P4) are distributed back and forth;
the first inductor (L1) is arranged on the upper side of the first capacitor (C1), and the second inductor (L2) is arranged on the upper side of the second capacitor (C2);
the lower sides of the first isolation resistor (R1) and the second isolation resistor (R2) are provided with a third inductor (L3), and the upper sides are provided with a third capacitor (C3);
the third inductor (L3) is arranged on the upper side of the shielding layer (SH); a laminated structure is composed.
5. The reflectionless high-pass filter of any of claims 1-4, wherein the first inductor is a first spiral inductor and the second inductor is a second spiral inductor;
the first spiral inductor comprises six layers, the layers are connected through a through hole connecting column, the first layer is connected with the input port (P1), and the sixth layer is connected with the first connecting line (Lin 1);
the second spiral inductor comprises six layers, the layers are connected through hole connecting columns, the first layer is connected with the output port (P3), and the sixth layer is connected with a fifth connecting line (Lin 5);
the third spiral inductor comprises three layers, the layers are connected through a through hole connecting column, the first layer is connected with a second transmission line (T2), and the third layer is connected with the upper end of a fifth connecting column (H5);
the first capacitor (C1) has three layers, the first layer and the third layer are respectively connected with the input port (P1), and the second layer is connected with the first transmission line (T1);
the second capacitor (C2) has three layers, the first layer and the third layer are respectively connected with the output port (P3), and the second layer is connected with the third transmission line (T3);
the third capacitor (C3) has two layers; the first layer is connected with a second connecting line (Lin 2), and the second layer is connected with a sixth connecting line (Lin 6);
one end of the first isolation resistor (R1) is connected with the first connecting line (Lin 1), and the other end of the first isolation resistor (R1) is connected with the third connecting line (Lin 3);
one end of the second isolation resistor (R2) is connected with the fifth connecting line (Lin 5), and the other end of the second isolation resistor (R2) is connected with the seventh connecting line (Lin 7);
one end of the shielding layer (SH) is connected with the first grounding port (P2), and the other end of the shielding layer (SH) is connected with the second grounding port (P4);
the first connecting line (Lin 1) is connected with the second connecting line (Lin 2) through a first connecting column (H1), the third connecting line (Lin 3) is connected with the fourth connecting line (Lin 4) through a second connecting column (H2), the fifth connecting line (Lin 5) is connected with the sixth connecting line (Lin 6) through a third connecting column (H3), and the seventh connecting line (Lin 7) is connected with the eighth connecting line (Lin 8) through a fourth connecting column (H4); the second layer of the first capacitor (C1) is connected with one end of a first transmission line (T1), the other end of the first transmission line (T1) is connected with one end of a fourth connecting line (Lin 4), the other end of the fourth connecting line (Lin 4) is connected with one end of a second transmission line (T2), the other end of the second transmission line (T2) is connected with an eighth connecting line (Lin 8), and the other end of the eighth connecting line (Lin 8) is connected with the second layer of the second capacitor (C2); the middle point of the second transmission line (T2) is connected with the first layer of the third spiral inductor, the third layer of the third spiral inductor is connected with the upper end of a fifth connecting post (H5), and the lower end of the fifth connecting post (H5) is connected with the middle part of the shielding layer (SH).
6. The reflectionless high-pass filter according to claim 5, characterized in that the second layer of the third capacitor (C3) is electrically connected to the first connection stud (H1); a first through hole is formed in the first layer of the third capacitor (C3), and the first connecting column (H1) penetrates through the first through hole and is electrically connected with the third connecting line (Lin 3).
7. The reflectionless high-pass filter according to claim 5, characterized in that the input port (P1) and the output port (P3) are both 50 ohm impedance ports.
8. The reflectionless high-pass filter of claim 5,
the input port (P1), the first ground port (P2), the output port (P3), and the second ground port (P4) are external package pins.
9. The reflectionless high-pass filter according to claim 5,
the first isolation resistor (R1) and the second isolation resistor (R2) are of an embedded structure, and the impedance of the first isolation resistor (R1) and the impedance of the second isolation resistor (R2) are 50 ohms.
10. The reflectionless high-pass filter according to claim 5,
the non-reflection high-pass filter is a low-temperature co-fired ceramic piece.
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| CN202220085182.7U CN218570199U (en) | 2022-01-13 | 2022-01-13 | LTCC-based non-reflection high-pass filter |
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