CN218550400U - Novel integrative communication of ship bank device - Google Patents
Novel integrative communication of ship bank device Download PDFInfo
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- CN218550400U CN218550400U CN202222745198.9U CN202222745198U CN218550400U CN 218550400 U CN218550400 U CN 218550400U CN 202222745198 U CN202222745198 U CN 202222745198U CN 218550400 U CN218550400 U CN 218550400U
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- radiator
- semiconductor refrigeration
- cover plate
- shell
- refrigeration piece
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Abstract
The utility model provides a novel integrative communication of ship bank device, it includes shell, equipment body, semiconductor refrigeration piece and radiator, the inside sealed inner chamber that is used for the erection equipment body that is equipped with of shell, inside semiconductor refrigeration piece and radiator all located the shell, the cold junction of semiconductor refrigeration piece and sealed inner chamber's chamber wall laminating, the hot junction and the radiator laminating of semiconductor refrigeration piece, two relative conch walls of shell are equipped with air inlet grid and air-out grid respectively, the radiator is located the convection current region between air inlet grid and the air-out grid. Protect communication equipment through setting up shell body and sealed inner chamber, avoid it to receive corruption such as sea wind, sea water to set up the semiconductor refrigeration piece and carry out effectual cooling heat dissipation to communication equipment, greatly prolonged communication equipment's life.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a ship bank communications facilities field especially relates to a novel integrative communication of ship bank device.
[ background of the invention ]
The mainstream transportation in the world at present during waterway transportation has the advantages of large loading capacity, low transportation cost and the like, waterway transportation is also generally adopted in import and export trade, but the maritime weather information is changed, certain safety risk exists in the waterway transportation, so that more communication devices can be arranged on the ship to realize communication on the ship and the safety condition on the ship can be monitored in real time by the communication devices.
However, sea wind and rain with salt can affect the communication device, which is prone to cause the communication device to be affected by damp and corrosion, resulting in shortened service life of the communication device, and therefore, further improvement is needed.
[ Utility model ] A method for manufacturing a semiconductor device
The utility model aims at overcoming above-mentioned problem, we provide a novel integrative communication device of ship bank, and this communication device can resist corruption such as sea water, prolongs its life.
In order to realize the above-mentioned purpose, the utility model provides a novel integrative communication of ship bank device, it includes shell, equipment body, semiconductor refrigeration piece and radiator, the inside sealed inner chamber that is used for the erection equipment body that is equipped with of shell, inside semiconductor refrigeration piece and radiator all located the shell, the cold junction of semiconductor refrigeration piece and sealed inner chamber's chamber wall laminating, the hot junction and the radiator laminating of semiconductor refrigeration piece, the conch wall that the shell is two relative is equipped with air-inlet grille and air-out grille respectively, the radiator is located the convection current region between air-inlet grille and the air-out grille.
In one or more embodiments, the inner bottom of the housing is provided with an upward extending surrounding wall, the top of the surrounding wall is provided with a cover plate for sealing, the cover plate is detachably connected with the surrounding wall, and the surrounding wall, the cover plate and the inner bottom of the housing enclose the sealed inner cavity.
In one or more embodiments, the cover plate is connected with the surrounding wall through bolts, and a sealing ring is arranged between the cover plate and the surrounding wall.
In one or more embodiments, the cover plate is a heat-conducting cover plate, and the cold end of the semiconductor refrigeration piece is attached to the cover plate.
In one or more embodiments, the top of the cover plate is provided with an inward concave embedded cavity, and the semiconductor refrigeration piece is embedded in the embedded cavity.
In one or more embodiments, the heat sink is a copper heat sink, and the heat sink is fixed to the cover plate by screws.
In one or more embodiments, a temperature sensor is disposed inside the sealed inner cavity, and the semiconductor chilling plate operates according to the real-time temperature detected by the temperature sensor.
Compared with the prior art, the utility model the effect that exists is: protect communication equipment through setting up shell body and sealed inner chamber, avoid it to receive sea wind, sea water etc. and corrode to set up the semiconductor refrigeration piece and carry out effectual cooling heat dissipation to communication equipment, greatly prolonged communication equipment's life.
[ description of the drawings ]
Fig. 1 is a schematic structural view of an integrated communication device of a ship and a shore according to the present invention.
[ detailed description ] embodiments
In order to deepen the understanding of the present invention, the present invention will be further described in detail with reference to the following embodiments and the attached drawings, and the embodiments are only used for explaining the present invention, and do not constitute the limitation to the protection scope of the present invention.
Referring to fig. 1, the embodiment provides a novel ship-shore integrated communication device, which includes a housing 1, an apparatus body 2, a semiconductor refrigeration sheet 3 and a radiator 4, the apparatus body is a ship-shore integrated communication device, a sealed inner cavity for installing the apparatus body 2 is arranged inside the housing 1, the sealed inner cavity can isolate internal and external air and moisture, the semiconductor refrigeration sheet 3 and the radiator 4 are both arranged inside the housing 1, the cold end of the semiconductor refrigeration sheet 3 is attached to the cavity wall of the sealed inner cavity, the hot end of the semiconductor refrigeration sheet 3 is attached to the radiator 4, two opposite shell walls of the housing 1 are respectively provided with an air inlet grille 5 and an air outlet grille 6, the radiator 4 is located in a convection area between the air inlet grille 5 and the air outlet grille 6, when the semiconductor refrigeration sheet works, the semiconductor refrigeration sheet refrigerates and transfers temperature to the cavity wall of the sealed inner cavity, the refrigeration and the heat dissipation is performed inside the sealed inner cavity by virtue of the cavity wall, the heat of the semiconductor refrigeration sheet is transferred to the air inlet grille, the radiator, the heat dissipation speed of the radiator is accelerated by virtue of the radiator, a heat conduction glue can be arranged between the radiator and the semiconductor refrigeration sheet, the air circulation of the hot end of the air in the radiator is enhanced, and the air in the housing, and the radiator is taken away by the radiator.
The interior bottom of shell 1 is equipped with the leg 7 that upwards extends, and the top of leg 7 is equipped with the apron 8 that is used for the closing cap, and apron 8 can dismantle with leg 7 and be connected, the interior bottom of leg 7, apron 8 and shell 1 encloses into sealed inner chamber, leg and shell structure as an organic whole can adopt corrosion-resistant metal material to make, like the stainless steel.
Apron 8 is connected with leg 7 through bolt 9, is provided with sealing washer 10 between apron 8 and the leg 7, and is fixed through bolted connection, has the advantage of easy installation dismantlement, and convenient regular communication equipment is overhauld or is maintained, and the gas tightness of being connected between apron and the leg can be strengthened to sealed rubber ring, avoids outside aqueous vapor to enter into inside.
Optionally, apron 8 is heat conduction apron, and semiconductor refrigeration piece 3's cold junction and 8 laminatings of apron can strengthen the semiconductor refrigeration piece and refrigerate the heat dissipation to sealed inner chamber inside for heat transfer, apron 8's top is equipped with the chamber of inlaying of indent, and semiconductor refrigeration piece 8 inlays and adorns in should inlaying the chamber, conveniently fixes the semiconductor refrigeration piece to can make semiconductor refrigeration piece and apron laminating transmission temperature more.
The inside temperature sensor 11 that is provided with of sealed inner chamber, semiconductor refrigeration piece 3 detects real-time temperature and work according to temperature sensor 11, and for example temperature sensor has preset temperature, and when the temperature was higher than preset temperature, semiconductor refrigeration piece began work refrigeration and is cooled down sealed inner chamber, and when the temperature was less than preset temperature, semiconductor refrigeration piece was then in the state of stop work.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiment, but all equivalent modifications or changes made by those skilled in the art according to the present invention should be included in the protection scope of the claims.
Claims (7)
1. The utility model provides a novel integrative communication of ship bank device which characterized in that: including shell (1), equipment body (2), semiconductor refrigeration piece (3) and radiator (4), the inside sealed inner chamber that is used for installing equipment body (2) that is equipped with of shell (1), inside shell (1) was all located in semiconductor refrigeration piece (3) and radiator (4), the cold junction of semiconductor refrigeration piece (3) and the chamber wall laminating of sealed inner chamber, the hot junction and the radiator (4) laminating of semiconductor refrigeration piece (3), two relative conch walls of shell (1) are equipped with air-inlet grille (5) and air-out grille (6) respectively, radiator (4) are located the convection current between air-inlet grille (5) and air-out grille (6) and are regional.
2. The novel ship-shore integrated communication device of claim 1, wherein: the inner bottom of the shell (1) is provided with an upward extending surrounding wall (7), the top of the surrounding wall (7) is provided with a cover plate (8) used for sealing, the cover plate (8) is detachably connected with the surrounding wall (7), and the inner bottom of the surrounding wall (7), the cover plate (8) and the shell (1) is surrounded into the sealing inner cavity.
3. The novel ship-shore integrated communication device of claim 2, wherein: the cover plate (8) is connected with the surrounding wall (7) through a bolt (9), and a sealing ring (10) is arranged between the cover plate (8) and the surrounding wall (7).
4. The novel ship-shore integrated communication device of claim 2, wherein: the cover plate (8) is a heat conduction cover plate, and the cold end of the semiconductor refrigeration piece (3) is attached to the cover plate (8).
5. The novel ship-shore integrated communication device of claim 4, wherein: the top of the cover plate (8) is provided with an inwards concave embedded cavity, and the semiconductor refrigeration sheet (3) is embedded in the embedded cavity.
6. The novel ship-shore integrated communication device of claim 4, wherein: the radiator (4) is made of copper, and the radiator (4) is fixed on the cover plate (8) through screws.
7. A novel ship-shore integrated communication device according to any one of claims 1-6, characterized in that: a temperature sensor (11) is arranged in the sealed inner cavity, and the semiconductor refrigerating sheet (3) works according to the real-time temperature detected by the temperature sensor (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222745198.9U CN218550400U (en) | 2022-10-18 | 2022-10-18 | Novel integrative communication of ship bank device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222745198.9U CN218550400U (en) | 2022-10-18 | 2022-10-18 | Novel integrative communication of ship bank device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218550400U true CN218550400U (en) | 2023-02-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222745198.9U Active CN218550400U (en) | 2022-10-18 | 2022-10-18 | Novel integrative communication of ship bank device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218550400U (en) |
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2022
- 2022-10-18 CN CN202222745198.9U patent/CN218550400U/en active Active
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