CN219976396U - Boiler overheat cooling device for power plant - Google Patents
Boiler overheat cooling device for power plant Download PDFInfo
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- CN219976396U CN219976396U CN202320356383.0U CN202320356383U CN219976396U CN 219976396 U CN219976396 U CN 219976396U CN 202320356383 U CN202320356383 U CN 202320356383U CN 219976396 U CN219976396 U CN 219976396U
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- cooling
- furnace body
- radiating
- power plant
- cover
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- 238000001816 cooling Methods 0.000 title claims abstract description 103
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 21
- 230000001681 protective effect Effects 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 6
- 235000019362 perlite Nutrition 0.000 claims description 6
- 239000010451 perlite Substances 0.000 claims description 6
- 238000009423 ventilation Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000005057 refrigeration Methods 0.000 description 8
- 239000002699 waste material Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000036760 body temperature Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Abstract
The utility model discloses a boiler overheat cooling device for a power plant, which relates to the technical field of related equipment of the power plant and solves the technical problem of low cooling speed of the existing cooling equipment, and the boiler overheat cooling device comprises a furnace body and a bracket welded with four corners of the bottom of the furnace body, wherein a cooling cover is arranged on the outer wall of the furnace body; the cooling device comprises a semiconductor refrigerating sheet, a first radiating fan, a second radiating sheet and a second radiating fan; according to the utility model, the temperature of the cold end of the semiconductor refrigerating sheet drops very fast to enable the temperature of surrounding air to drop suddenly, the second cooling fan sends cold air of the cold end into the cooling cavity fast, and the cold air in the cooling cavity exchanges heat with the outer wall of the furnace body to enable the temperature of the furnace body to drop fast to achieve the effect of heat dissipation.
Description
Technical Field
The utility model relates to the technical field of power plant related equipment, in particular to a boiler overheat cooling device for a power plant.
Background
The utility boiler is also called a "power plant boiler" and refers to a medium-sized and large-sized boiler in a power plant that provides a specified amount and quality of steam to a steam turbine. In the use process of the boiler in the current market, the overheating condition of the boiler body can occur, and the service lives of the boiler body and the equipment inside the boiler body can be seriously influenced, so that economic loss is caused.
At present, water cooling equipment is adopted in the market, and the cooling speed is low when the water cooling equipment is used.
Disclosure of Invention
The utility model aims at: the utility model provides a cooling device for solving the technical problem that the cooling speed of the existing cooling device is low.
The utility model adopts the following technical scheme for realizing the purposes:
the utility model provides a boiler overheat cooling device for power plant, includes furnace body and with the support of furnace body bottom four corners welded, the furnace body outer wall is equipped with the cooling cover, be equipped with the cooling chamber between cooling cover and the furnace body, cooling chamber top left side is equipped with the air intake, and air intake department top is equipped with cooling device, and cooling chamber top right side is equipped with the air outlet, and furnace body top inner wall rigid coupling has first temperature sensor, and the furnace body top is equipped with the PLC controller;
the cooling device comprises a semiconductor refrigerating sheet, a first radiating fan, a second radiating sheet and a second radiating fan, wherein the first radiating sheet is connected with the hot end of the semiconductor refrigerating sheet in a fitting mode, the first radiating fan is connected with the top of the first radiating sheet, the second radiating sheet is connected with the cold end of the semiconductor refrigerating sheet in a fitting mode, the second radiating fan is connected with the bottom of the second radiating sheet, and the second radiating fan is opposite to the air inlet. The semiconductor refrigerating sheet, the first cooling fan, the second cooling fan and the first temperature sensor are respectively and electrically connected with the PLC.
The working process is described as follows: the first temperature sensor carries out real-time supervision and gives the PLC controller with signal transmission to the temperature in the furnace body, when the temperature that first temperature sensor monitored reaches the threshold value of predetermineeing, the work of semiconductor refrigeration piece is controlled to the controller, the cold junction temperature decline of semiconductor refrigeration piece very fast makes surrounding air temperature suddenly drop, the cooling intracavity is sent into fast with the cold wind of cold junction to the second radiator fan, the cold wind in cooling intracavity and furnace body outer wall heat exchange make furnace body temperature decline fast reach radiating effect, cold wind becomes hot-blast last hot-blast discharge through the air outlet, compare prior art, the setting of semiconductor refrigeration piece makes furnace body temperature decline quicker, the radiating effect is better.
The outer wall of the cooling cover is provided with a three-way pipe, the top of the outer wall on the right side of the cooling cover is communicated with the first end of the three-way pipe, the second end and the third end of the three-way pipe are respectively provided with a second electromagnetic valve and a third electromagnetic valve, the first end of the three-way pipe is provided with a second temperature sensor, and the third end of the three-way pipe is communicated with the cooling cover through a return pipe. The second temperature sensor is arranged near the air outlet, the temperature of hot air discharged by the air outlet is monitored in real time, if the temperature of the hot air discharged by the air outlet is too high, the second electromagnetic valve is opened, the third electromagnetic valve is closed, the hot air with the too high temperature is rapidly discharged through the second electromagnetic valve, if the hot air discharged by the air outlet does not exceed a preset temperature value, the second electromagnetic valve is closed, the third electromagnetic valve is opened, so that the hot air flows back into the cooling cavity for continuous recycling, waste is avoided, and waste is avoided due to the arrangement of the three-way pipe, the second temperature sensor, the second electromagnetic valve and the third electromagnetic valve.
The bottom of the cooling cover is provided with a water outlet, the water outlet is provided with a water drain valve, and a transparent observation window is arranged on the outer wall of the cooling cover, close to the bottom. The semiconductor refrigerating sheet during operation can produce the comdenstion water owing to the too big difference in temperature, and the comdenstion water can pile up cooling cover bottom, observes the water level condition through transparent observation window, in time discharges the comdenstion water through the drain valve and avoids the comdenstion water to plug up the cooling chamber.
The cooling cover is internally coated with a perlite heat insulation layer. The perlite heat-insulating layer has good heat insulation and fire resistance, so that the cooling cavity keeps temperature and has good cooling effect.
The periphery of the semiconductor refrigerating sheet is provided with a fixing assembly, and the fixing assembly comprises a fixing frame and a rubber ring which is connected with the inner wall of the fixing frame in a fitting manner and is used for placing the semiconductor refrigerating sheet; screw holes are respectively formed in the left side and the right side of the fixing frame, and the second radiating fins are connected with the first radiating fins through screw holes in a screwed mode. The setting of fixed frame is used for together fixed the again of first fin, second fin and semiconductor refrigeration piece, specifically, the screw on the second fin passes screw and first fin screwed connection and accomplishes fixedly, and the setting of rubber circle is convenient for smear heat conduction silicone grease and installation semiconductor refrigeration piece.
The cooling device is characterized in that a protective cover is arranged on the upper portion of the cooling device, the protective cover is welded with the top of the cooling cover, and a vent is arranged on the top of the protective cover. The setting of safety cover protects the cooling cover from being destroyed, and the setting of vent is convenient for first radiator fan to exhaust heat dissipation.
The beneficial effects of the utility model are as follows:
1. according to the utility model, the temperature of the cold end of the semiconductor refrigerating sheet is reduced very fast, so that the temperature of surrounding air is suddenly reduced, the cold air of the cold end is quickly fed into the cooling cavity by the second cooling fan, the cold air in the cooling cavity is exchanged with the heat of the outer wall of the furnace body, so that the temperature of the furnace body is reduced fast, the heat dissipation effect is achieved, the temperature of the furnace body is reduced faster by the arrangement of the semiconductor refrigerating sheet, and the heat dissipation effect is better.
2. According to the utility model, the perlite heat-insulating layer has good heat insulation and fire resistance, so that the cooling cavity keeps temperature and has good cooling effect.
3. According to the utility model, the cooling cover is protected from damage by the arrangement of the protective cover, and the first cooling fan is conveniently used for exhausting and radiating air by the arrangement of the vent.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
fig. 2 is a schematic view of a fixing assembly structure.
Reference numerals: 1. a furnace body; 2. a bracket; 3. a cooling cover; 4. a cooling chamber; 5. an air inlet; 6. an air outlet; 7. a first temperature sensor; 8. a PLC controller; 9. a semiconductor refrigeration sheet; 10. a first heat sink; 11. a first heat radiation fan; 12. a second heat sink; 13. a second heat radiation fan; 14. a three-way pipe; 15. a second electromagnetic valve; 16. a third electromagnetic valve; 17. a second temperature sensor; 18. a return pipe; 19. a water outlet; 20. a drain valve; 21. a transparent viewing window; 22. a fixed frame; 23. a rubber ring; 24. a screw hole; 25. and a protective cover.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1
As shown in fig. 1, the embodiment provides a boiler overheat cooling device for a power plant, which comprises a furnace body 1 and a bracket 2 welded with four corners of the bottom of the furnace body 1, wherein a cooling cover 3 is arranged on the outer wall of the furnace body 1, a cooling cavity 4 is arranged between the cooling cover 3 and the furnace body 1, an air inlet 5 is arranged on the left side of the top of the cooling cavity 4, a cooling device is arranged on the top of the air inlet 5, an air outlet 6 is arranged on the right side of the top of the cooling cavity 4, a first temperature sensor 7 is fixedly connected on the inner wall of the top of the furnace body 1, and a PLC controller 8 is arranged on the top of the furnace body 1;
the cooling device comprises a semiconductor refrigerating sheet 9, a first radiating fin 10, a first radiating fan 11, a second radiating fin 12 and a second radiating fan 13, wherein the first radiating fin 10 is connected with the hot end of the semiconductor refrigerating sheet 9 in a fitting mode, the first radiating fan 11 is connected with the top of the first radiating fin 10, the second radiating fin 12 is connected with the cold end of the semiconductor refrigerating sheet 9 in a fitting mode, the second radiating fan 13 is connected with the bottom of the second radiating fin 12, and the second radiating fan 13 is opposite to the air inlet 5. The semiconductor cooling fin 9, the first cooling fan 11, the second cooling fan 13, and the first temperature sensor 7 are electrically connected to the PLC controller 8, respectively.
The working process is described as follows: the temperature in the furnace body 1 is monitored in real time by the first temperature sensor 7 and signals are transmitted to the PLC 8, when the temperature monitored by the first temperature sensor 7 reaches a preset threshold value, the controller controls the semiconductor refrigerating sheet 9 to work, the temperature of the cold end of the semiconductor refrigerating sheet 9 drops very fast to enable the temperature of surrounding air to drop suddenly, the second cooling fan 13 rapidly sends cold air of the cold end into the cooling cavity 4, the cold air in the cooling cavity 4 exchanges heat with the outer wall of the furnace body 1 to enable the temperature of the furnace body 1 to drop fast to achieve the heat dissipation effect, and finally hot air is discharged through the air outlet 6 after the cold air changes into hot air.
Example 2
As shown in fig. 1 and 2, on the basis of embodiment 1, the outer wall of the cooling cover 3 is provided with a three-way pipe 14, the top of the outer wall on the right side of the cooling cover 3 is communicated with the first end of the three-way pipe 14, the second end and the third end of the three-way pipe 14 are respectively provided with a second electromagnetic valve 15 and a third electromagnetic valve 16, the first end of the three-way pipe 14 is provided with a second temperature sensor 17, and the third end of the three-way pipe 14 is communicated with the cooling cover 3 through a return pipe 18. The second temperature sensor 17 is arranged near the air outlet 6, the temperature of hot air discharged by the air outlet 6 is monitored in real time, if the temperature of the hot air discharged is too high, the second electromagnetic valve 15 is opened, the third electromagnetic valve 16 is closed, the hot air with too high temperature is rapidly discharged through the second electromagnetic valve 15, if the hot air discharged does not exceed a preset temperature value, the second electromagnetic valve 15 is closed, the third electromagnetic valve 16 is opened, so that the hot air flows back into the cooling cavity 4 for continuous recycling, waste is avoided, and the waste is avoided due to the arrangement of the three-way pipe 14, the second temperature sensor 17, the second electromagnetic valve 15 and the third electromagnetic valve 16.
The bottom of the cooling cover 3 is provided with a water outlet 19, the water outlet 19 is provided with a water outlet valve 20, and a transparent observation window 21 is arranged on the outer wall of the cooling cover 3 near the bottom. The semiconductor refrigerating sheet 9 can produce the comdenstion water because the too big temperature difference during operation, and the comdenstion water can pile up cooling cover 3 bottom, observes the water level condition through transparent observation window 21, in time discharges the comdenstion water through drain valve 20 and avoids the comdenstion water to plug up cooling chamber 4.
The cooling cover 3 is internally coated with a perlite heat insulation layer. The perlite heat-insulating layer has good heat insulation and fire resistance, so that the cooling cavity 4 has good cooling effect in keeping the temperature.
The periphery of the semiconductor refrigeration piece 9 is provided with a fixing assembly, and the fixing assembly comprises a fixing frame 22 and a rubber ring 23 which is connected with the inner wall of the fixing frame 22 in a fitting manner and is used for placing the semiconductor refrigeration piece 9; screw holes 24 are respectively formed in the left side and the right side of the fixed frame 22, and the second cooling fin 12 is in screw connection with the first cooling fin 10 through the screw holes 24. The fixing frame 22 is used for fixing the first radiating fin 10, the second radiating fin 12 and the semiconductor refrigerating fin 9 together, specifically, screws on the second radiating fin 12 pass through screw holes 24 and are connected with the first radiating fin 10 by screws to complete fixing, and the rubber ring 23 is convenient for smearing heat-conducting silicone grease and installing the semiconductor refrigerating fin 9.
The upper portion of the cooling device is provided with a protective cover 25, the protective cover 25 is welded with the top of the cooling cover 3, and the top of the protective cover 25 is provided with a ventilation opening. The protection cover 25 protects the cooling cover 3 from damage, and the ventilation opening is convenient for the first cooling fan 11 to exhaust and dissipate heat.
Claims (6)
1. The utility model provides a boiler overheat cooling device for power plant, includes furnace body and with the support of furnace body bottom four corners welded, its characterized in that, the furnace body outer wall is equipped with the cooling cover, be equipped with the cooling chamber between cooling cover and the furnace body, cooling chamber top left side is equipped with the air intake, air intake department top is equipped with cooling device, cooling chamber top right side is equipped with the air outlet, furnace body top inner wall rigid coupling has first temperature sensor, the furnace body top is equipped with the PLC controller;
the cooling device comprises a semiconductor refrigerating sheet, a first radiating fan, a second radiating sheet and a second radiating fan, wherein the first radiating sheet is connected with the hot end of the semiconductor refrigerating sheet in a fitting mode, the first radiating fan is connected with the top of the first radiating sheet, the second radiating sheet is connected with the cold end of the semiconductor refrigerating sheet in a fitting mode, the second radiating fan is connected with the bottom of the second radiating sheet, and the second radiating fan is opposite to the air inlet.
2. The boiler overheat cooling device for the power plant of claim 1, wherein the outer wall of the cooling cover is provided with a three-way pipe, the top of the outer wall on the right side of the cooling cover is communicated with the first end of the three-way pipe, the second end and the third end of the three-way pipe are respectively provided with a second electromagnetic valve and a third electromagnetic valve, the first end of the three-way pipe is provided with a second temperature sensor, and the third end of the three-way pipe is communicated with the cooling cover through a return pipe.
3. The boiler overheat cooling device for the power plant of claim 1, wherein a water outlet is arranged at the bottom of the cooling cover, a drain valve is arranged on the water outlet, and a transparent observation window is arranged on the outer wall of the cooling cover close to the bottom.
4. The boiler desuperheater for power plant of claim 1, wherein the cooling cover is internally covered with a perlite insulation layer.
5. The boiler overheat cooling device for the power plant of claim 1, wherein the periphery of the semiconductor refrigerating piece is provided with a fixing component, and the fixing component comprises a fixing frame and a rubber ring which is connected with the inner wall of the fixing frame in a fitting way and is used for placing the semiconductor refrigerating piece; screw holes are respectively formed in the left side and the right side of the fixing frame, and the second radiating fins are connected with the first radiating fins through screw holes in a screwed mode.
6. The boiler desuperheater for power plant of claim 1, wherein the upper part of the cooler is provided with a protective cover, the protective cover is welded with the top of the cooling cover, and the top of the protective cover is provided with a ventilation opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320356383.0U CN219976396U (en) | 2023-03-01 | 2023-03-01 | Boiler overheat cooling device for power plant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320356383.0U CN219976396U (en) | 2023-03-01 | 2023-03-01 | Boiler overheat cooling device for power plant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219976396U true CN219976396U (en) | 2023-11-07 |
Family
ID=88578685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320356383.0U Active CN219976396U (en) | 2023-03-01 | 2023-03-01 | Boiler overheat cooling device for power plant |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219976396U (en) |
-
2023
- 2023-03-01 CN CN202320356383.0U patent/CN219976396U/en active Active
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