CN218547680U

CN218547680U - Semiconductor heat dissipation's high-efficient industry remote controller

Info

Publication number: CN218547680U
Application number: CN202221536015.6U
Authority: CN
Inventors: 徐平
Original assignee: Nanjing Xiading Electronic Technology Co ltd
Current assignee: Nanjing Xiading Electronic Technology Co ltd
Priority date: 2022-06-20
Filing date: 2022-06-20
Publication date: 2023-02-28
Anticipated expiration: 2032-06-20

Abstract

The utility model discloses a semiconductor heat dissipation's high-efficient industrial remote controller belongs to remote controller technical field, a semiconductor heat dissipation's high-efficient industrial remote controller, including remote controller main part and circuit board main part, the inside of remote controller main part has seted up the inner chamber, and the circuit board main part is installed on the inner chamber upper wall, and the below of circuit board main part is equipped with semiconductor refrigeration piece and water storage plate; this scheme absorbs the heat that produces in the circuit board main part through the semiconductor refrigeration piece cold junction, the heat in semiconductor refrigeration piece hot junction can absorb through the water storage plate of its below simultaneously, its heat conducts again to in the water or the coolant liquid in the water storage plate, then can reach the processing of circulation heat dissipation cooling to the semiconductor refrigeration piece through circulation mechanism, can guarantee the normal function of components and parts in the circuit board main part, the condition that has greatly reduced its high temperature damage takes place, the life who is showing and is improving the remote controller main part.

Description

Semiconductor heat dissipation's high-efficient industry remote controller

Technical Field

The utility model relates to a remote controller technical field, more specifically say, relate to a radiating high-efficient industrial remote controller of semiconductor.

Background

The remote controller is a wireless transmitting device, the key information is coded by a modern digital coding technology, a light wave is transmitted by an infrared diode, the light wave converts a received infrared signal into an electric signal by an infrared receiver of a receiver, and a processor decodes and demodulates a corresponding instruction to achieve the requirement of controlling terminal equipment to complete. Industrial remote controllers are a concept distinguished from domestic remote controllers, which are devices for remote operation control or remote control of industrial machinery using radio transmission.

The industrial remote controller is bigger for ordinary remote controller volume, present industrial remote controller generally lacks effectual heat dissipation, it dispels the heat to open some louvres on the remote controller usually, the radiating effect is not good, operating time is longer and ambient temperature is higher, the inside temperature of industrial remote controller can continuously increase, can influence its inside circuit components and parts, still can lead to damaging when serious, still reduced its life when influencing the performance effect of remote controller.

Therefore, it is necessary to provide a semiconductor heat dissipation industrial remote controller with high efficiency to solve the above technical problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a radiating high-efficient industry remote controller of semiconductor is in order to solve above-mentioned technical problem.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a radiating high-efficient industry remote controller of semiconductor, includes remote controller main part and circuit board main part, the inner chamber has been seted up to the inside of remote controller main part, the circuit board main part is installed in the inner chamber upper wall, the below of circuit board main part is equipped with semiconductor refrigeration piece and water storage plate, the cold junction and the hot junction of semiconductor refrigeration piece are connected with circuit board main part and water storage plate respectively, the right-hand member of water storage plate communicates respectively has outlet pipe and inlet tube, the inside of inner chamber is equipped with the circulation mechanism with outlet pipe and inlet tube intercommunication, venthole and the first inlet port that is linked together with the inner chamber are seted up respectively to the lateral wall around the remote controller main part.

Further, the circulation mechanism is including the installing frame of fixed connection between the upper and lower walls of inner chamber, the inside fixed mounting of installing frame has the heat dissipation return bend, inner chamber bottom fixed mounting has miniature pump, miniature pump's input and outlet pipe are linked together, the one end of heat dissipation return bend is linked together with miniature pump's output, the other end and the inlet tube of heat dissipation return bend are linked together.

Furthermore, a cold conducting plate is arranged between the circuit board main body and the semiconductor refrigeration plate, and a heat radiation plate is arranged between the semiconductor refrigeration plate and the water storage plate.

Furthermore, two montants of fixedly connected with between the lower wall on the inner chamber, both sides respectively fixed mounting has exhaust fan and first blower on the montant, the circuit board main part is located between exhaust fan and the first blower.

Furthermore, the lower wall fixedly connected with multiunit support of inner chamber, every group fixedly connected with horizontal pole on the support, fixed mounting has the second extraction fan on the horizontal pole, a plurality of bottom openings have been seted up to the bottom of remote controller main part.

Furthermore, filter screens are arranged in the bottom hole, the air outlet hole and the first air inlet hole.

Furthermore, a plurality of metal sheets are fixedly arranged on the lower wall of the inner cavity, and a conducting rod is fixedly arranged between the metal sheets and the bottom of the water storage plate.

Compared with the prior art, the utility model has the advantages of:

this scheme absorbs the heat that produces in the circuit board main part through semiconductor refrigeration piece cold junction, then conducts the hot junction, and then has effectively realized the heat dissipation cooling effect to the circuit board main part. Meanwhile, the heat of the hot end (lower end) of the semiconductor refrigerating piece can be absorbed through the water storage plate below the semiconductor refrigerating piece, the heat is conducted to water or cooling liquid in the water storage plate, then the semiconductor refrigerating piece can be subjected to circulating heat dissipation and cooling through the circulating mechanism, the heat dissipation and cooling effects are good, normal operation of components on the circuit board main body can be guaranteed, the high-temperature damage of the components is greatly reduced, and the service life of the remote controller main body is remarkably prolonged.

This scheme can blow the heat dissipation to the heat dissipation return bend through first blower, can improve the heat dissipation cooling effect of heat dissipation return bend internal water, and then improves the thermal conduction effect of semiconductor refrigeration piece, also directly blows the heat dissipation to the circuit board main part simultaneously, and the cooling is effectual. Simultaneously the exhaust fan can be discharged the inside high-temperature gas of remote controller main part through the venthole, has greatly promoted the inside circulation of air speed of remote controller main part, and further improvement heat dissipation cooling effect has effectively improved the life of circuit board main part.

Drawings

Fig. 1 is a schematic external perspective structure of the present invention;

fig. 2 is a schematic side view of the internal structure of the remote controller of the present invention;

FIG. 3 is an enlarged view of the structure at A in FIG. 2;

fig. 4 is a schematic view of the three-dimensional structure of the mounting frame of the present invention;

fig. 5 is a schematic view of the view angle structure under the main body of the remote controller of the present invention.

The reference numbers in the figures illustrate:

1. a remote controller main body; 2. a circuit board main body; 3. an inner cavity; 4. a semiconductor refrigeration sheet; 5. A water storage plate; 6. a water outlet pipe; 7. a water inlet pipe; 8. a circulating mechanism; 801. installing a frame; 802. A heat dissipation bent pipe; 803. a micro water pump; 9. an air outlet; 10. a first air intake hole; 11. a cold conducting plate; 12. a heat dissipation plate; 13. a vertical rod; 14. an exhaust fan; 15. a first blowing fan; 16. a support; 17. a cross bar; 18. a second suction fan; 19. a bottom hole; 20. a filter screen; 21. a metal sheet; 22. a conductive rod.

Detailed Description

The first embodiment is as follows:

referring to fig. 1-3, a semiconductor heat-dissipating high-efficiency industrial remote controller comprises a remote controller main body 1 and a circuit board main body 2, an inner cavity 3 is formed in the remote controller main body 1, the circuit board main body 2 is installed on the upper wall of the inner cavity 3, a semiconductor refrigerating sheet 4 and a water storage plate 5 are arranged below the circuit board main body 2, the cold end and the hot end of the semiconductor refrigerating sheet 4 are respectively connected with the circuit board main body 2 and the water storage plate 5, the right end of the water storage plate 5 is respectively communicated with a water outlet pipe 6 and a water inlet pipe 7, a circulating mechanism 8 communicated with the water outlet pipe 6 and the water inlet pipe 7 is arranged in the inner cavity 3, and an air outlet 9 and a first air inlet 10 communicated with the inner cavity 3 are respectively formed in the front side wall and the rear side wall of the remote controller main body 1. During the use, the inside semiconductor refrigeration piece 4 of remote controller main part 1 is the instrument of a heat transfer, when the galvanic couple that the direct current was established ties through two kinds of different semiconductor materials wherein, the both ends of semiconductor refrigeration piece 4 can produce the heat transfer, the heat can be followed the cold junction and is passed to the hot junction, the cold junction of semiconductor refrigeration piece 4 can absorb the heat promptly, and the hot junction then can emit the heat, thereby absorb the heat that produces on circuit board main part 2 through the 4 cold junctions of semiconductor refrigeration piece, then conduct the hot junction, and then effectively realized the heat dissipation cooling effect to circuit board main part 2. Meanwhile, the heat of the hot end (lower end) of the semiconductor refrigerating piece 4 can be absorbed through the water storage plate 5 below the semiconductor refrigerating piece, the heat is conducted to water or cooling liquid in the water storage plate 5 again, then the semiconductor refrigerating piece 4 can be subjected to circulating heat dissipation and cooling treatment through the circulating mechanism 8, the heat dissipation and cooling effects of the semiconductor refrigerating piece 4 on the circuit board main body 2 are greatly improved, the normal operation of components on the circuit board main body 2 can be guaranteed, the high-temperature damage of the components is greatly reduced, the use performance of the remote controller main body 1 is remarkably improved, and the service life of the remote controller main body is prolonged. Be provided with between circuit board main part 2 and the semiconductor refrigeration piece 4 and lead cold drawing 11, lead cold drawing 11 and can improve the conduction effect of the 4 cold junctions of semiconductor refrigeration piece, be provided with heating panel 12 between semiconductor refrigeration piece 4 and the water storage plate 5, have heating panel 12 can improve the heat transfer speed and the effect of the 4 hot junctions of semiconductor refrigeration piece.

Referring to fig. 2 and 4, the circulating mechanism 8 includes a mounting frame 801 fixedly connected between the upper and lower walls of the inner cavity 3, a heat dissipating bent pipe 802 is fixedly installed inside the mounting frame 801, a micro water pump 803 is fixedly installed at the bottom of the inner cavity 3, an input end of the micro water pump 803 is communicated with the water outlet pipe 6, one end of the heat dissipating bent pipe 802 is communicated with an output end of the micro water pump 803, and the other end of the heat dissipating bent pipe 802 is communicated with the water inlet pipe 7. The micro water pump 803 pumps away the water in the water storage plate 5 through the water outlet pipe 6, and then discharges the water into the heat dissipation elbow 802 of the mounting frame 801, the water which just absorbs heat flows through the heat dissipation elbow 802, the water inside the heat dissipation elbow 802 is gradually dissipated to the outside through the multi-bending shape of the heat dissipation elbow 802, the purpose effect of heat dissipation is achieved, the water after heat dissipation enters the water storage plate 5 from the water inlet pipe 7, and the treatment of circulating heat dissipation and cooling can be achieved.

Referring to fig. 2, two vertical rods 13 are fixedly connected between the upper wall and the lower wall of the inner cavity 3, an exhaust fan 14 and a first blowing fan 15 are respectively and fixedly installed on the vertical rods 13 at the two sides, and the circuit board main body 2 is located between the exhaust fan 14 and the first blowing fan 15. Start first blower 15 and exhaust fan 14 on two montants 13 simultaneously, first blower 15 can blow the heat dissipation to heat dissipation return bend 802 on the installing frame 801, can improve the heat dissipation cooling effect of the interior water of heat dissipation return bend 802, and then improve the thermal conduction effect of semiconductor refrigeration piece 4, also directly blow the heat dissipation to circuit board main part 2 simultaneously, and the cooling is effectual. Simultaneously exhaust fan 14 can pass through venthole 9 with the inside high-temperature gas of remote controller main part 1 and discharge, has greatly avoided high-temperature gas to stop inside the remote controller main part 1 and influence circuit board main part 2, has greatly promoted the inside circulation of air speed of remote controller main part 1 in addition, and further improvement heat dissipation cooling effect has effectively improved the life of circuit board main part 2 and remote controller main part 1.

Example two:

referring to fig. 2 and 5, on the basis of the first embodiment, a plurality of sets of brackets 16 are fixedly connected to the lower wall of the inner cavity 3, a cross bar 17 is fixedly connected to each set of brackets 16, a second suction fan 18 is fixedly installed on the cross bar 17, and a plurality of bottom holes 19 are formed in the bottom of the remote controller main body 1. Not only can directly blow the water storage plate 5 to dissipate heat by starting the second exhaust fan 18, improve the heat dissipation effect of the water storage plate 5 and the circuit board main body 2, but also improve the inside air circulation speed of the remote controller main body 1, so that the inside high-temperature gas can be rapidly discharged, and the heat dissipation effect is good. The filter screen 20 is arranged in the bottom hole 19, the air outlet hole 9 and the first air inlet hole 10. The filter screen 20 can greatly prevent external dust, impurities and the like from entering the remote controller main body 1 to influence the circuit board main body 2, so that the working effect and the service life of the circuit board main body 2 are improved.

Example three:

referring to fig. 2, on the basis of the first embodiment, a plurality of metal sheets 21 are fixedly disposed on the lower wall of the inner cavity 3, and a conductive rod 22 is fixedly disposed between the metal sheets 21 and the bottom of the water storage plate 5. After the water in the water storage plate 5 absorbs the heat at the hot end of the semiconductor refrigeration sheet 4, part of the heat can be conducted to the metal sheet 21 through the conduction rod 22, and then the heat is conducted out by the metal sheet 21, so that the heat dissipation and cooling effects of the water storage plate 5 and the circuit board main body 2 are improved in an auxiliary manner.

The working principle is as follows: when using, when remote controller main part 1 during operation, its inside semiconductor refrigeration piece 4 also can the circular telegram, its principle is that semiconductor refrigeration piece 4 is the instrument of a heat transfer, when the galvanic couple that the direct current was established ties into through two kinds of different semiconductor materials wherein, the both ends of semiconductor refrigeration piece 4 can produce the heat transfer, the heat can be passed to the hot junction from the cold junction, produce the difference in temperature and form cold and hot junction, the cold junction of semiconductor refrigeration piece 4 can absorb the heat promptly, and the hot junction then can give off the heat, thereby realize the refrigeration, thereby absorb the heat that produces on circuit board main part 2 through 4 cold junctions of semiconductor refrigeration piece, then conduct the hot junction, and then effectively realized the heat dissipation cooling effect to circuit board main part 2. Meanwhile, the heat of the hot end (lower end) of the semiconductor refrigerating sheet 4 can be absorbed through the water storage plate 5 below the semiconductor refrigerating sheet, the heat is conducted to the water or cooling liquid in the water storage plate 5, then the micro water pump 803 pumps the water in the water storage plate 5 through the water outlet pipe 6, the water is discharged into the heat dissipation elbow pipe 802 of the mounting frame 801, the water which just absorbs the heat can flow through the heat dissipation elbow pipe 802, the heat can be gradually dissipated to the outside through the bending form of the heat dissipation elbow pipe 802, the purpose effect of heat dissipation is achieved, the water after heat dissipation can enter the water storage plate 5 from the water inlet pipe 7, the semiconductor refrigerating sheet 4 is subjected to heat absorption again, and the treatment of circular heat dissipation and cooling can be achieved.

Start first blower 15 and exhaust fan 14 on two montants 13 simultaneously during the use, first blower 15 can blow the heat dissipation to heat dissipation return bend 802 on the installing frame 801, can improve the heat dissipation cooling effect of the interior water of heat dissipation return bend 802, and then improve the thermal conduction effect of semiconductor refrigeration piece 4, also directly blow the heat dissipation to circuit board main part 2 simultaneously, and the cooling is effectual. Meanwhile, the exhaust fan 14 will exhaust the high temperature gas inside the remote controller main body 1 through the air outlet 9.

Claims

1. The utility model provides a radiating high-efficient industry remote controller of semiconductor, includes remote controller main part (1) and circuit board main part (2), its characterized in that: inner chamber (3) have been seted up to the inside of remote controller main part (1), install in inner chamber (3) upper wall circuit board main part (2), the below of circuit board main part (2) is equipped with semi-conductor refrigeration piece (4) and water storage plate (5), the cold junction and the hot junction of semi-conductor refrigeration piece (4) are connected with circuit board main part (2) and water storage plate (5) respectively, the right-hand member of water storage plate (5) communicates respectively has outlet pipe (6) and inlet tube (7), the inside of inner chamber (3) is equipped with circulation mechanism (8) with outlet pipe (6) and inlet tube (7) intercommunication, venthole (9) and first inlet port (10) that are linked together with inner chamber (3) are seted up respectively to the lateral wall around remote controller main part (1).

2. The semiconductor heat-dissipating high-efficiency industrial remote controller according to claim 1, characterized in that: circulation mechanism (8) are including installing frame (801) between the wall about fixed connection in inner chamber (3), the inside fixed mounting of installing frame (801) has heat dissipation return bend (802), inner chamber (3) bottom fixed mounting has micro-water pump (803), the input and outlet pipe (6) of micro-water pump (803) are linked together, the one end of heat dissipation return bend (802) is linked together with the output of micro-water pump (803), the other end and inlet tube (7) of heat dissipation return bend (802) are linked together.

3. The high-efficiency industrial remote controller with semiconductor heat dissipation function as recited in claim 2, wherein: a cold guide plate (11) is arranged between the circuit board main body (2) and the semiconductor refrigeration sheet (4), and a heat dissipation plate (12) is arranged between the semiconductor refrigeration sheet (4) and the water storage plate (5).

4. The high-efficiency industrial remote controller with semiconductor heat dissipation function as recited in claim 1, wherein: two montants (13) of fixedly connected with between the wall about inner chamber (3), both sides respectively fixed mounting has exhaust fan (14) and first blowing fan (15) on montant (13), circuit board main part (2) are located between exhaust fan (14) and first blowing fan (15).

5. The semiconductor heat-dissipating high-efficiency industrial remote controller according to claim 3, wherein: the lower wall fixedly connected with multiunit support (16) of inner chamber (3), every group fixedly connected with horizontal pole (17) on support (16), fixed mounting has second extraction fan (18) on horizontal pole (17), a plurality of bottom outlets (19) have been seted up to the bottom of remote controller main part (1).

6. The semiconductor heat-dissipating high-efficiency industrial remote controller according to claim 5, wherein: and filter screens (20) are respectively arranged in the bottom hole (19), the air outlet hole (9) and the first air inlet hole (10).

7. The semiconductor heat-dissipating high-efficiency industrial remote controller according to claim 1, characterized in that: the lower wall of the inner cavity (3) is fixedly provided with a plurality of metal sheets (21), and a conduction rod (22) is fixedly arranged between the metal sheets (21) and the bottom of the water storage plate (5).