CN218547214U

CN218547214U - Industry camera with heat radiation structure

Info

Publication number: CN218547214U
Application number: CN202222845784.0U
Authority: CN
Inventors: 饶城云; 丁晟; 吴剑海
Original assignee: Fujian Newland Auto ID Technology Co Ltd
Current assignee: Fujian Newland Auto ID Technology Co Ltd
Priority date: 2022-10-26
Filing date: 2022-10-26
Publication date: 2023-02-28
Anticipated expiration: 2032-10-26

Abstract

The utility model relates to an industry camera with heat radiation structure. The method comprises the following steps: the lens assembly, the mainboard assembly and the heat dissipation unit; the lens assembly is electrically connected with the mainboard assembly, and the heat dissipation unit is arranged on the other surface of the mainboard assembly; the heat dissipation unit comprises at least two liquid cooling radiating fins which are of fin-shaped structures. The mainboard subassembly includes: the mainboard comprises a front mainboard shell, an interface board, a mainboard and a rear mainboard cover, wherein the front mainboard shell is detachably connected with the rear mainboard cover, and a heat conducting pad is arranged between the mainboard and the rear mainboard cover. Through can dismantling and set up the liquid cooling fin, increase the area of industrial camera and air contact, have the advantage of heat conduction fast, do not condense. Cover behind mainboard and the mainboard through the heat conduction pad connection, cover behind the heat of on the mainboard fully conducts the mainboard, be favorable to the inside heat transfer of mainboard subassembly to dispel the heat to the casing.

Description

Industrial camera with heat radiation structure

Technical Field

The utility model relates to an industrial camera technical field, more specifically say, the utility model relates to an industrial camera with heat radiation structure.

Background

Along with the development of industry, the requirement on an industrial camera is higher and higher, the functions are increased, the performance is improved, the performance requirement on hardware is more and more strict, the power consumption of the whole machine is greatly increased before, and the heat productivity is continuously improved.

In order to cope with the complex situation in the industrial scene, the volume requirement of the industrial camera is more and more strict, the small-sized device can better adapt to different application scenes, and the miniaturization of the device, the structural area which can be used for heat dissipation becomes smaller, resulting in the increase of the heat quantity of the device.

The development process of industrial cameras faces the situation of higher and higher heat, the heat dissipation technology is to be improved urgently, and the current scheme is to seek balance in power consumption control and volume increase. Controlling power consumption results in performance constraints on industrial cameras and the inability to perform full technological levels. The volume is increased, and the heat dissipation area is increased, so that the volume of the equipment is overlarge, and the equipment becomes heavier. In order to solve the problem, a proposal such as the invention patent proposal of application number 202111176473.3 is to increase the heat convection coefficient of the surface of the shell by externally connecting a fan, but the proposal needs to increase the volume of the equipment by adding the fan, and the exposed fan is easy to fail under the severe environment. And the utility model discloses a scheme of application number 2021201699375.6 in addition, with the heat source connection radiator, inside the equipment was arranged in to the radiator, the gas pocket was seted up to the both sides that the radiating fin passageway corresponds, increased the flow of air current, and this kind of mode leads to equipment can not do dustproof and waterproof. Like the utility model of application No. 202021363168.6, the utility model discloses a scheme uses the semiconductor refrigeration piece, provides refrigeration and reduces equipment temperature, though can effectual lowering temperature, the phenomenon of dewfall appears easily in refrigerated one end, can cause fatal damage to electronic device such as mainboard. And because the semiconductor refrigeration piece needs the accurate management and control to the temperature, need a set of independent temperature control system, for example, temperature sensor, temperature control algorithm etc. for the industry camera structure becomes more complicated, and the cost increases by a large amount.

SUMMERY OF THE UTILITY MODEL

Therefore, the to-be-solved technical problem of the utility model is that the industrial camera to above-mentioned current heat radiation structure is bulky, and easy hydrops provides an industrial camera with heat radiation structure because of punching uses the not enough of technologies such as scene is limited.

For solving the technical problem, the utility model discloses the technical scheme who adopts:

an industrial camera having a heat dissipation structure, comprising:

the lens assembly, the mainboard assembly and the heat dissipation unit;

the lens assembly is fixedly connected with one surface of the mainboard assembly, and the heat dissipation unit is arranged on the other surface of the mainboard assembly;

the heat dissipation unit comprises at least two unconnected liquid cooling radiating fins, the liquid cooling radiating fins are of fin-shaped structures, pipelines are arranged on the liquid cooling radiating fins, the pipelines are of vacuum cavity structures, and partial liquid is contained in the pipelines.

Further, the main board assembly includes:

the main board front shell, the interface board and the main board; wherein

The interface board is arranged in the front shell of the main board; the main board is in communication connection with the interface board and is detachably connected with the main board rear cover; the mainboard front shell is detachably connected with the mainboard rear cover.

Furthermore, a heat conducting pad is arranged between the main board and the main board rear cover.

Further, the lens assembly includes:

the front part of the lens front shell is provided with a lens;

the lamp panel assembly is arranged inside the lens front shell;

the lens is arranged on the lamp panel assembly and is detachably connected with the lens rear cover;

the lens front shell is fixedly connected with the lens rear cover, the lens rear cover is fixedly connected with the mainboard front shell, and the lamp panel assembly is electrically connected with the interface board.

Further, the thickness of the liquid cooling heat sink is less than 2 mm, and the general thickness range is 1-2 mm.

Furthermore, a preset distance is reserved between the liquid cooling radiating fins and is uniformly distributed on the mainboard assembly.

Further, the mainboard is provided with: a central processing unit and a memory.

Further, an image sensor is arranged on the interface board, and the image sensor is in the range of incident light of the lens assembly.

The invention has the following beneficial effects:

1. the utility model provides a pair of industry camera with heat radiation structure, heat convection does not need extra external fan, perhaps the action such as punch, has not only reduced the whole volume of industry camera, moreover can be waterproof dustproof. The liquid cooling radiating fin with the fin-shaped structure is arranged, so that the contact area of the industrial camera and the air is increased; in the vacuum pipeline, liquid as a working medium is vaporized at the heat source position of the main board assembly to absorb heat and is liquefied at the area outside the heat source to release the heat, so that the heat dissipation is realized, and the heat dissipation pipeline has the advantages of quick heat conduction and no condensation; and the liquid cooling heat sink is made into a fin-shaped structure which can be processed independently.

2. The utility model provides a pair of industry camera with heat radiation structure covers behind mainboard and the mainboard is connected through the heat conduction pad, covers behind the heat on the mainboard fully conducts the mainboard for the inside heat transfer of mainboard subassembly dispels the heat to the casing.

3. The utility model provides an industrial camera with heat radiation structure, it is below 2 millimeters to process into the liquid cooling fin of finned structure thickness scope, wholly more frivolous to thickness reduces the radiating effect and improves.

4. The utility model provides a pair of industry camera with heat radiation structure concentrates on the mainboard with the great central processing unit of consumption and memory, is favorable to heat transmission to and reduce the volume of industry camera.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is an exploded view of the present invention.

Fig. 3 is a schematic view of the structure of the heat dissipation unit of the present invention.

Fig. 4 is a schematic structural view of the front and the side of the liquid cooling fin of the present invention.

The reference signs are: 10-a lens assembly; 11-lens front shell; 12-a lamp panel assembly; 13-a lens; 14-lens rear cover; 20-a motherboard assembly; 21-main board front shell; 22-an interface board; 23-a main board; 24-main board rear cover; 25-a thermally conductive pad; 30-a heat dissipation unit; 31-liquid-cooled heat sinks; 311-pipeline.

Detailed Description

The invention is described in detail below with reference to the figures and the specific embodiments.

The fixed connection in the utility model can be detachable connection or integrated; mechanical connection, or electrical connection; directly connected, or indirectly connected through intervening media, the communication between the two elements, or the interaction between the two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

An industrial camera having a heat dissipation structure, as shown in fig. 1 to 4, includes:

the lens assembly 10, the main board assembly 20 and the heat dissipation unit 30.

The lens assembly 10 is fixedly connected with one surface of the main board assembly 20, and the heat dissipation unit 30 is detachably arranged on the other surface of the main board assembly 20 far away from the lens assembly 10.

The heat dissipation unit 30 comprises at least two unconnected liquid cooling fins 31, a space is reserved between the liquid cooling fins 31, the liquid cooling fins 31 are not connected in pairs and are independently arranged on the main board assembly 20, the liquid cooling fins 31 are of fin-shaped structures, the liquid cooling fins are provided with pipelines 311 which are two-sided outer drums, and the pipelines 311 are of vacuum cavity structures and contain partial liquid. The width of the tube 311 is larger than the width of the fin, and the tube 311 has a serpentine shape, but may have a planar shape instead of the serpentine shape, and the upper and lower portions may be equally distributed.

The utility model discloses the convection heat transfer does not need extra external fan, perhaps acts such as punch, has not only reduced the whole volume of industrial camera, moreover can be waterproof dustproof. The area of contact between the industrial camera and air is increased by detachably arranging the liquid cooling radiating fins 31 of the fin structures, and in the pipeline 311 in a vacuum state, liquid serving as a working medium is vaporized at the heat source position of the main board assembly 20 to absorb heat and is liquefied in the region outside the heat source to release the heat, so that the heat dissipation is realized, and the heat-conducting liquid cooling radiator has the advantages of high heat conduction speed and no condensation; the number of the liquid cooling fins 31 can be set according to specific requirements, and the liquid cooling fins 31 can be made into fin structures which can be processed independently;

the main board assembly 20 further includes:

a front main board shell 21, an interface board 22 and a main board 23. Wherein

The interface board 22 is arranged inside the main board front shell 21; the main board 23 is in communication connection with the interface board 22 and is detachably connected with the main board rear cover 24; the main board front case 21 is detachably connected to the main board rear cover 24.

A heat conducting pad 25 is arranged between the main board 23 and the main board rear cover 24. Cover 24 behind mainboard 23 and the mainboard is connected through heat conduction pad 25, cover 24 behind the heat of on 23 with the mainboard of fully conducting of mainboard for the inside heat transfer of mainboard subassembly 20 dispels the heat to the casing.

The lens assembly 10 includes:

the lens front shell 11, the front sets up the lens.

And the lamp panel assembly 12 is arranged inside the lens front shell 11.

And the lens 13 is arranged on the lamp panel assembly 12 and detachably connected with the lens rear cover 14.

The lens front housing 11 is fixedly connected with the lens rear cover 14, the lens rear cover 14 is fixedly connected with the mainboard front housing 21, and the lamp panel assembly 12 is electrically connected with the interface board 22.

The lens assembly 10 is a cube, the lens front shell 11 has a partial saw-toothed structure, and the lens rear cover 14 has a reinforcing rib, a screw column and an off-line structure arranged therein; mainboard subassembly 20 is the cuboid, and casing 21 part has heat dissipation sawtooth structure before the mainboard, and lid 24 inside has the screw post behind the mainboard to and the boss of heat conduction pad 25 contact.

Lamp plate subassembly 12 is last evenly distributed lamp pearl to it is fixed with lid 14 installation behind the camera lens through back backup pad.

The thickness of the liquid cooling fin 31 is less than 2 mm, and the general thickness range is 1-2 mm. The liquid cooling fins 31 of the fin-shaped structure are processed to have a thickness of less than 2 mm, so that the whole structure is lighter and thinner, and the heat dissipation effect is improved due to the reduction of the thickness.

A preset distance is reserved between the liquid cooling radiating fins 31, and the liquid cooling radiating fins are uniformly distributed on the main board assembly 20, so that heat is evacuated.

The main board 23 is provided with: a central processing unit and a memory. The central processing unit and the memory with larger power consumption are centralized on the mainboard 23, which is beneficial to the collective transmission of heat and the reduction of the volume of the industrial camera.

An image sensor is disposed on the interface board 22 and is within the range of light incident on the lens assembly 10.

The above embodiments are merely illustrative and not restrictive, and all equivalent changes and modifications made by the methods described in the claims are intended to be included within the scope of the present invention.

Claims

1. An industrial camera with a heat dissipation structure, comprising:

the lens assembly (10), the main board assembly (20) and the heat dissipation unit (30);

the lens assembly (10) is fixedly connected with one surface of the main board assembly (20), and the heat dissipation unit (30) is arranged on the other surface of the main board assembly (20);

the heat dissipation unit (30) comprises at least two unconnected liquid cooling radiating fins (31), the liquid cooling radiating fins (31) are of fin-shaped structures, the liquid cooling radiating fins (31) are provided with pipelines (311), and the pipelines (311) are of vacuum cavity structures and contain partial liquid.

2. The industrial camera with a heat dissipation structure as recited in claim 1, wherein the main board assembly (20) further comprises:

the main board front shell (21), the interface board (22) and the main board; wherein

The interface board (22) is arranged inside the mainboard front shell (21); the main board (23) is in communication connection with the interface board (22) and is detachably connected with the main board rear cover (24); the mainboard front shell (21) is detachably connected with the mainboard rear cover (24).

3. The industrial camera with the heat dissipation structure is characterized in that a heat conducting pad (25) is arranged between the main board (23) and the main board rear cover (24).

4. The industrial camera with a heat dissipation structure according to any one of claims 1 or 2, wherein the lens assembly (10) comprises:

a lens front case (11) with a lens arranged in front;

the lamp panel assembly (12) is arranged inside the lens front shell (11);

the lens (13) is arranged on the lamp panel component (12) and is detachably connected with the lens rear cover (14);

wherein, preceding shell of camera lens (11) and behind the camera lens lid (14) fixed connection, behind the camera lens lid (14) and mainboard preceding shell (21) fixed connection, lamp plate subassembly (12) are connected with interface board (22) electricity.

5. The industrial camera with the heat dissipation structure as claimed in claim 1, wherein the liquid-cooled heat sink (31) has a thickness in a range of 1-2 mm.

6. The industrial camera with the heat dissipation structure as claimed in any one of claims 1, 2 or 5, wherein the liquid-cooled heat sinks (31) are uniformly distributed on the motherboard assembly (20) with a predetermined distance therebetween.

7. The industrial camera with the heat dissipation structure as claimed in any one of claims 2 or 3, wherein the main board (23) is provided with: a central processing unit and a memory.

8. The industrial camera with the heat dissipation structure as recited in claim 4, wherein the interface board (22) is provided with an image sensor, and the image sensor is in a range of light incident on the lens assembly (10).