CN218525599U

CN218525599U - Novel ultraviolet LED packaging structure

Info

Publication number: CN218525599U
Application number: CN202220987519.3U
Authority: CN
Inventors: 邱心雨
Original assignee: Shenzhen Youweixin Electronic Technology Co ltd
Current assignee: Shenzhen Youweixin Electronic Technology Co ltd
Priority date: 2022-04-26
Filing date: 2022-04-26
Publication date: 2023-02-24
Anticipated expiration: 2032-04-26

Abstract

The utility model relates to a novel ultraviolet LED packaging structure, which comprises an ultraviolet LED chip, a substrate and a reflecting cup arranged on the substrate, wherein the ultraviolet LED chip is arranged on the substrate and is positioned at the center of the bottom of the reflecting cup; the reflecting cup is formed by stacking a plurality of layers of silicon reflecting plates, a through hole is formed in the middle of each silicon reflecting plate, the opening of the through hole at the top is larger than that of the through hole at the bottom, and the inner wall of each silicon reflecting plate is in an inverted trapezoid shape; the inner wall of the reflecting cup stacked by the silicon reflecting plates is smooth and continuous, and the shape, the size and the dimension of the through hole opening at the bottom of the silicon reflecting plate on the adjacent upper layer are consistent with the shape, the size and the dimension of the through hole opening at the top of the silicon reflecting plate on the lower layer. The utility model has the advantages that the reflecting cup is formed by arranging the multilayer silicon reflecting plates and stacking the silicon reflecting plates, so that the height of the reflecting cup is increased, and better light gathering effect is effectively realized; and through the inner wall coating at reflection of light cup has high ultraviolet reflectivity material, effectively increases ultraviolet reflectivity, effectively solves the problem that present ultraviolet LED lamp ultraviolet reflectivity is low.

Description

Novel ultraviolet LED packaging structure

Technical Field

The utility model relates to an ultraviolet LED lighting technology field, in particular to novel ultraviolet LED packaging structure.

Background

At present, the preventive disinfection of living work environments and objects is an important safeguard. The chlorine-containing disinfectant is sprayed to disinfect large area of environment, and contains hypochlorous acid as effective broad-spectrum bactericidal component for killing bacteria, viruses, fungi and spores. However, the chlorine-containing disinfectant has its limitations because hypochlorous acid is corrosive and its disinfection by-product contains carcinogenic chlorine-containing organic substances such as trihalomethane, and the chlorine-containing disinfectant is not suitable for preventive disinfection of articles such as clothes, personal belongings, foods (fruits, vegetables, tattoos), tableware, toys, and the like. The ultraviolet scheme is a good choice for the preventive disinfection of the above articles, and because no residue is generated and no disinfection by-product is generated, the problem of secondary pollution caused by residue during the disinfection of the disinfectant is solved, and the secondary cleaning after the disinfection is finished is saved.

Ultraviolet rays with the wavelength less than 280nm can destroy the molecular structure of DNA (deoxyribonucleic acid) or RNA (ribonucleic acid) in microorganisms, so that the microorganisms cannot reproduce, and the effects of sterilization and disinfection are achieved. The conventional ultraviolet light source is a mercury arc lamp (i.e., a so-called ultraviolet lamp or mercury lamp), and since mercury is contained in the mercury lamp and is a harmful heavy metal, it poses a significant risk to the natural environment and human health. Therefore, a news bulletin was issued at a fifth meeting by a council of government councils between government councils about mercury problems held by the environmental protection agency of the united nations on day 19/1 in 2013, and detailed regulations on the specific emission limits were made by the international convention water guarantee convention aimed at controlling and reducing mercury emissions globally, to reduce the damage of mercury to the environment and human health. China formally becomes one of the contracting nations of Water good convention in 2016. According to the announcements jointly issued by more than ten departments of the ministry of environmental protection, the ministry of outreach, the development and reform committee and the like in China, new primary mercury ore mining is prohibited from being mined from 8, 16 and 8 months in 2017, and national resource governing departments in various regions stop issuing new mercury ore exploration licenses and mining licenses. And 5, from 8 to 16 in 2032, the exploitation of primary mercury ores is completely prohibited. In this large context, low-pressure mercury lamps are being phased out.

Ultraviolet light emitting diodes (UVC LEDs) have become a great trend as the next generation of uv light sources to replace low-pressure mercury lamps. First, UVC LEDs have environmental advantages because UVC LED devices do not contain mercury. Secondly, the UVC LED has adjustable wavelength and short half-wave width, and compared with a low-pressure mercury lamp with fixed wavelength, the UVC LED can realize high-efficiency killing of the wavelength of 265nm, and the mercury lamp can only be 254nm. Compared with the defect that a mercury lamp is easy to explode, the UVC LED is the third-generation semiconductor technology, explosion concerns do not exist, and the safety risk of mercury vapor leakage does not exist. Another disadvantage of mercury lamps is that the radiation efficiency fluctuates greatly with ambient temperature, whereas UVC LEDs are much more stable. In addition, mercury lamps cannot operate at low temperatures, whereas UVC LEDs can operate stably at low temperatures. In view of the above advantages, UVC LEDs have been rapidly developed in recent years.

However, the UVC LED has low radiation power due to low photoelectric conversion efficiency of the chip, which is also a bottleneck that currently limits rapid development of the UVC LED. From the packaging point of view, both the fully inorganic package and the semi-inorganic package are not favorable for increasing the radiation power, because the ultraviolet ray is seriously absorbed due to the very low ultraviolet reflectivity of the inner wall of the bowl of the substrate, which is because the material (gold, aluminum oxide, aluminum nitride) of the inner wall of the bowl has very strong absorption to the ultraviolet section.

SUMMERY OF THE UTILITY MODEL

The utility model provides a novel ultraviolet LED packaging structure, this structure have the better effect of gathering together ultraviolet light, realize promoting the effect of unit area irradiance degree.

The technical scheme of the utility model a novel ultraviolet LED packaging structure, it includes: the LED lamp comprises an ultraviolet LED chip, a substrate and a reflecting cup arranged on the substrate, wherein the ultraviolet LED chip is arranged on the substrate and is positioned in the center of the bottom of the reflecting cup;

the reflecting cup is formed by stacking a plurality of layers of silicon reflecting plates, a through hole is formed in the middle of each silicon reflecting plate, the opening of the through hole at the top is larger than that of the through hole at the bottom, and the inner wall of each silicon reflecting plate is in an inverted trapezoid shape;

the inner wall of the reflecting cup stacked by the silicon reflecting plates is smooth and continuous, and the shape and the size of the through hole opening at the bottom of the silicon reflecting plate on the adjacent upper layer are consistent with those of the through hole opening at the top of the silicon reflecting plate on the lower layer.

Furthermore, the included angle between the inner wall of the adjacent silicon reflector and the bottom thereof is consistent, and the included angle between the inner wall of the stacked reflector and the bottom thereof is consistent with the included angle between the inner wall of the silicon reflector and the bottom thereof.

Furthermore, the included angle between the inner wall of the silicon reflector and the bottom is 0-90 degrees.

Furthermore, the included angle between the inner wall of the silicon reflector and the bottom is 54.7 degrees.

Further, the reflecting cup is formed by stacking at least two or more layers of silicon reflecting plates.

Further, the via opening shape of the silicon light reflecting plate includes any one of polygons.

Further, the inner wall of the reflection cup is provided with a high ultraviolet reflecting layer, the high ultraviolet reflecting layer comprises a high ultraviolet reflecting material coated on the inner wall of the reflection cup, and the high ultraviolet emitting material comprises any one of aluminum, silver, barium sulfate, magnesium chloride and calcium carbonate.

Further, the reflection cup is bonded with the substrate through glue, and the glue comprises one or more of ultraviolet-resistant glue and high-temperature-resistant glue.

Further, the substrate includes any one of an alumina ceramic substrate, an aluminum nitride ceramic substrate, a silicon substrate, and a silicon carbide substrate.

Furthermore, high ultraviolet transmittance glass covers the upper portion of the reflecting cup, and the high ultraviolet transmittance glass comprises any one of quartz glass, ultraviolet glass and nano-calcium glass.

The beneficial effects of the utility model are as follows:

the utility model has the advantages that the reflecting cup is formed by arranging the multilayer silicon reflecting plates and stacking the silicon reflecting plates, so that the height of the reflecting cup is increased, and better light gathering effect is effectively realized; and through the inner wall coating at reflection of light cup has high ultraviolet reflectivity material, effectively increases the ultraviolet reflectivity to effectively solve the problem that present ultraviolet LED lamp ultraviolet reflectivity is low.

Drawings

Fig. 1 is a schematic structural diagram of the present invention;

fig. 2 is a schematic cross-sectional view of the present invention;

FIG. 3 is a schematic structural diagram of another embodiment of the present invention;

FIGS. 4a and 4b are a prior art optical simulation block diagram and a ray bunching effect diagram, respectively;

fig. 5a and 5b are the optical simulation structure diagram and the light gathering effect diagram of the present invention, respectively.

The LED light source comprises an ultraviolet LED chip 1, a substrate 2, a reflecting cup 3, a silicon reflecting plate 4 and high ultraviolet transmissivity glass 5.

Detailed Description

The conception, specific structure and resulting technical effects of the present invention will be made clear and fully described with reference to the accompanying drawings and examples, so as to fully understand the objects, aspects and effects of the present invention. It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict.

It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature or indirectly fixed or connected to the other feature. Furthermore, the description of the upper, lower, left, right, top, bottom, etc. used in the present invention is only relative to the mutual position relationship of the components of the present invention in the drawings.

Furthermore, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any combination of one or more of the associated listed items.

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element of the same type from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure.

Referring to fig. 1, in this embodiment, the novel ultraviolet LED package structure provided by the present invention includes an ultraviolet LED chip 1, a substrate 2, and a reflective cup 3 disposed on the substrate 2, where the ultraviolet LED chip 1 is disposed on the substrate 2 and located at the bottom center of the reflective cup 3;

the reflecting cup 3 is formed by stacking a plurality of layers of silicon reflecting plates 4, a through hole is formed in the middle of each silicon reflecting plate 4, the opening of the through hole at the top is larger than that of the through hole at the bottom, and the inner wall of each silicon reflecting plate 4 is in an inverted trapezoid shape;

the inner wall of the reflecting cup 3 stacked by the silicon reflecting plate 4 is smooth and continuous, and the shape and the size of the through hole opening at the bottom of the silicon reflecting plate 4 on the adjacent upper layer are consistent with the shape and the size of the through hole opening at the top of the silicon reflecting plate 4 on the lower layer.

The utility model has the advantages that the reflecting cup 3 is formed by arranging the multilayer silicon reflecting plates 4 and stacking the silicon reflecting plates, so that the height of the reflecting cup 3 is increased, and a better light gathering effect is effectively realized; and through the high ultraviolet reflectivity material of coating at the inner wall of reflection of light cup 3, effectively increase the reflectivity of ultraviolet ray to effectively solve the problem that present ultraviolet ray LED lamp ultraviolet reflectivity is low.

In this embodiment, referring to fig. 2, the included angle between the inner wall of the adjacent silicon reflector 4 and the bottom thereof is the same, and the included angle between the inner wall of the stacked reflector 3 and the bottom thereof is the same as the included angle between the inner wall of the silicon reflector 4 and the bottom thereof.

Preferably, the included angle between the inner wall of the silicon reflector 4 and the bottom is 0-90 degrees.

Further, the included angle between the inner wall of the silicon reflector 4 and the bottom is 54.7 degrees.

In this embodiment, referring to fig. 1 and fig. 2, in order to effectively improve the light gathering effect of the ultraviolet LED lamp, the reflective cup 3 is formed by stacking at least two or more silicon reflective plates 4; and the silicon reflecting plate 4 of the reflecting cup 3 is stacked into 4 layers.

Further, the via opening shape of the silicon reflector 4 includes any one of polygons, including a square and a rectangle.

Further, the through-hole opening shape of the silicon reflector 4 includes a circular shape.

Further, in order to effectively increase the reflectivity of the reflection cup 3 to ultraviolet rays, the inner wall of the reflection cup 3 is provided with a high ultraviolet reflection layer, the high ultraviolet reflection layer comprises a high ultraviolet reflection material coated on the inner wall of the reflection cup 3, and the high ultraviolet reflection material comprises any one of aluminum, silver, barium sulfate, magnesium chloride and calcium carbonate.

Further, in order to effectively bond and fix the reflection cup 3, the reflection cup 3 is bonded with the substrate 2 through glue, and the glue comprises one or more of ultraviolet-resistant glue and high-temperature-resistant glue.

Further, the substrate 2 includes any one of an alumina ceramic substrate, an aluminum nitride ceramic substrate, a silicon substrate, and a silicon carbide substrate.

In this embodiment, referring to fig. 3, a high ultraviolet transmittance glass 5 is covered above the reflection cup 3, and the high ultraviolet transmittance glass 5 includes any one of quartz glass, ultraviolet glass, and soda lime glass.

Wherein, as shown in fig. 4a to 5b, as shown in fig. 4a, it is the current ultraviolet LED device optical simulation structure chart, as shown in fig. 4b, it is the current ultraviolet LED device effect chart, as shown in fig. 5a, the utility model discloses have the ultraviolet LED device optical simulation structure chart that multilayer silicon reflector 4 piles up, as shown in fig. 5b, the utility model discloses have ultraviolet LED device effect chart that multilayer silicon reflector 4 piles up. Wherein the effect map refers to an angular distribution of light rays. At current anti-light cup 3 with the utility model discloses an inner wall of anti-light cup 3 is 54.7 and under the glossy condition of inner wall with the contained angle of bottom, the utility model discloses the beam angle of the ultraviolet LED device that has multilayer and piles up silicon reflector panel 4 is 60, and the beam angle of the current ultraviolet LED device of utensil is 100.

From a comparison of the effect plots, it can be concluded that the angular distribution of the uv LED device with the multi-layer stacked silicon reflector 4 is narrower than that of the existing uv LED device. Therefore, the utility model discloses can reach better light and gather together the effect.

The foregoing is merely a preferred embodiment of the present invention, and the present invention is not limited to the above embodiment, as long as the technical effects of the present invention are achieved by the same means, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present disclosure should be included within the scope of the present disclosure. All belong to the protection scope of the utility model. The technical solution and/or the embodiments of the invention may be subject to various modifications and variations within the scope of the invention.

Claims

1. A novel ultraviolet LED packaging structure is characterized by comprising an ultraviolet LED chip (1), a substrate (2) and a reflecting cup (3) arranged on the substrate (2), wherein the ultraviolet LED chip (1) is arranged on the substrate (2) and is positioned in the center of the bottom of the reflecting cup (3);

the reflecting cup (3) is formed by stacking a plurality of layers of silicon reflecting plates (4), a through hole is formed in the middle of each silicon reflecting plate (4), the opening of the through hole in the top is larger than that of the through hole in the bottom, and the inner wall of each silicon reflecting plate (4) is in an inverted trapezoid shape;

the inner wall of the reflecting cup (3) stacked by the silicon reflecting plate (4) is smooth and continuous, and the shape and the size of the through hole opening at the bottom of the silicon reflecting plate (4) on the adjacent upper layer are consistent with those of the through hole opening at the top of the silicon reflecting plate (4) on the lower layer.

2. The novel ultraviolet LED package structure of claim 1, wherein the included angle between the inner wall of the adjacent silicon reflector (4) and the bottom thereof is consistent, and the included angle between the inner wall of the stacked reflector (3) and the bottom thereof is consistent with the included angle between the inner wall of the silicon reflector (4) and the bottom thereof.

3. The novel ultraviolet LED packaging structure as claimed in claim 1 or 2, wherein the included angle between the inner wall of the silicon reflector (4) and the bottom is 0-90 degrees.

4. The novel ultraviolet LED package structure of claim 1 or 2, wherein the angle between the inner wall of the silicon reflector (4) and the bottom is 54.7 degrees.

5. The novel UV LED package structure according to claim 1 or 2, wherein said reflector cup (3) is composed of at least two or more stacked silicon reflectors (4).

6. The novel ultraviolet LED package structure of claim 1, wherein the shape of the through hole opening of the silicon reflector (4) comprises any one of polygons.

7. The novel ultraviolet LED packaging structure according to claim 1, wherein the inner wall of the reflection cup (3) is provided with a high ultraviolet reflection layer, the high ultraviolet reflection layer comprises a high ultraviolet reflection material coated on the inner wall of the reflection cup (3), and the high ultraviolet reflection material comprises any one of aluminum, silver, barium sulfate, magnesium chloride and calcium carbonate.

8. The novel ultraviolet LED package structure of claim 1, wherein the reflective cup (3) is bonded to the substrate (2) by glue.

9. The novel ultraviolet LED package structure of claim 1, wherein said substrate (2) comprises any one of an alumina ceramic substrate, an aluminum nitride ceramic substrate, a silicon substrate, and a silicon carbide substrate.

10. The novel ultraviolet LED packaging structure according to claim 1, wherein a high ultraviolet transmittance glass (5) is covered above the reflection cup (3), and the high ultraviolet transmittance glass (5) comprises any one of quartz glass, ultraviolet glass and soda lime glass.