CN218525572U

CN218525572U - CSOP type ceramic package shell

Info

Publication number: CN218525572U
Application number: CN202222766297.5U
Authority: CN
Inventors: 张欣悦; 王鹏程; 阳亚辉
Original assignee: Shenzhen Wonder Electronic Technology Co ltd
Current assignee: Shenzhen Wonder Electronic Technology Co ltd
Priority date: 2022-10-20
Filing date: 2022-10-20
Publication date: 2023-02-24
Anticipated expiration: 2032-10-20

Abstract

The utility model discloses a CSOP type ceramic package shell, including casing and base plate, it has the base plate to peg graft in the casing, the upper portion that is located the base plate in the casing is provided with the recess, be provided with the apron in the recess, the right side fixed mounting of apron has the connecting seat, the connecting seat rotates to be connected in the recess, the left side fixed mounting of apron has the cassette, be provided with two slides in the cassette, fixed mounting has the second spring between two slides, two slides keep away from the equal fixed mounting in one side each other and have the pin pole, it all is provided with the pinhole to correspond two pin pole departments in the recess, two pin poles keep away from one side each other and all extend to in the pinhole that corresponds. This CSOP type ceramic package shell can be fast with base plate and casing installation dismantlement within a definite time to make things convenient for the follow-up maintenance change to the base plate, and can utilize the bracket to lift the base plate out of the recess when dismantling, the staff of being convenient for takes, can absorb the heat that the base plate during operation produced fast simultaneously, thereby further improved the radiating effect.

Description

CSOP type ceramic package shell

Technical Field

The utility model relates to a CSOP type ceramic package shell field specifically is a CSOP type ceramic package shell.

Background

The Ceramic Small Outline Package (CSOP) is one of common surface mount packages, leads pins from two sides, has the advantages of low production cost, excellent performance, high reliability, small volume, light weight, high package density and the like, and is widely applied to integrated circuit packages.

The mode that bolt or injecting glue were pasted is often adopted between current CSOP type ceramic package shell and base plate to install, and this kind of mounting means installation is dismantled trouble and is taken time, is unfavorable for subsequent maintenance, and because CSOP type ceramic package shell inner space is less, leads to the base plate to dismantle very inconvenient when taking, for this reason, we have provided a CSOP type ceramic package shell.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a CSOP type ceramic package shell to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a CSOP type ceramic package shell, includes casing and base plate, it has the base plate to peg graft in the casing, the upper portion that lies in the base plate in the casing is provided with the recess, be provided with the apron in the recess, the right side fixed mounting of apron has the connecting seat, the connecting seat rotates to be connected in the recess, the left side fixed mounting of apron has the cassette, be provided with two slides, two in the cassette fixed mounting has the second spring, two between the slide equal fixed mounting in one side of keeping away from each other has the pin rod, it all is provided with the pinhole, two to correspond two pin rod departments in the recess the pin rod keeps away from one side each other and all extends to in the pinhole that corresponds.

Optionally, the bottom fixed mounting of apron has the heat-conducting plate, fixed mounting has a plurality of radiating fins on the heat-conducting plate, the bottom fixed mounting of heat-conducting plate has graphite alkene fin, the bottom laminating of graphite alkene fin is on the base plate, can absorb the heat that the base plate during operation produced through graphite alkene fin, then transmits on heat-conducting plate and radiating fin, further improves the radiating effect.

Optionally, openings are formed in the cover plate corresponding to the plurality of radiating fins, the top ends of the plurality of radiating fins extend out of the openings, and the radiating fins are convenient to contact with outside air through the design, so that heat is dissipated quickly through air flowing.

Optionally, two the top of slide all fixed mounting have and dial the board, two the top of dialling the board all extends outside the cassette, is convenient for spur the slide through dialling the board, is favorable to the use of this equipment.

Optionally, the bottom is provided with two brackets in the casing, just the both sides that lie in every bracket in the casing all are provided with the mounting groove, every the equal fixed mounting in both sides of bracket has the connecting plate, two the connecting plate is sliding connection respectively in the mounting groove that corresponds, and two the equal fixed mounting in top of connecting plate has first spring, two the equal fixed mounting in mounting groove top in top of first spring drives the connecting plate through first spring shrink and rises in the mounting groove, can make two brackets upwards slide in the casing to lift the base plate out the recess, the staff of being convenient for takes.

Optionally, equal fixed mounting has a plurality of pins on the wall of both sides in the casing, and is a plurality of outside one side that the base plate was kept away from to the pin all extends the casing, is favorable to the use of this equipment through being provided with the pin.

Compared with the prior art, the beneficial effects of the utility model are that:

1. through the mutual cooperation of apron, casing, recess, cassette, connecting seat, group board, slide, second spring, pin pole and pinhole, can install the dismantlement fast between base plate and casing to follow-up maintenance change to the base plate has been made things convenient for.

2. Through graphite alkene fin, heat-conducting plate, radiating fin and trompil, the heat that the during operation of absorption base plate produced fast to the radiating effect has further been improved.

3. Through mutually supporting of mounting groove, connecting plate, first spring and bracket, can utilize the bracket to lift the base plate out of the recess when dismantling, the staff of being convenient for takes.

Drawings

FIG. 1 is a schematic view of the overall structure of a CSOP-type ceramic package casing of the present invention;

FIG. 2 is a cross-sectional view of a CSOP type ceramic package housing of the present invention;

FIG. 3 is a cross-sectional view of a mounting groove in a CSOP type ceramic package housing of the present invention;

fig. 4 is a cross-sectional view of the pin in the CSOP type ceramic package housing according to the present invention.

In the figure: 1. a housing; 2. a cover plate; 3. a substrate; 4. a bracket; 5. mounting grooves; 6. a connecting plate; 7. a first spring; 8. a graphene heat sink; 9. a heat conducting plate; 10. a heat dissipating fin; 11. a connecting seat; 12. opening a hole; 13. a card holder; 14. dialing a plate; 15. a pin; 16. a pin hole; 17. a pin rod; 18. a second spring; 19. a slide plate; 20. and (4) a groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1 to 4, the utility model provides a CSOP type ceramic package shell, including casing 1 and base plate 3, it has base plate 3 to peg graft in the casing 1, the upper portion that lies in base plate 3 in the casing 1 is provided with recess 20, be provided with apron 2 in the recess 20, the right side fixed mounting of apron 2 has connecting seat 11, connecting seat 11 rotates to be connected in recess 20, the left side fixed mounting of apron 2 has cassette 13, be provided with two slides 19 in the cassette 13, fixed mounting has second spring 18 between two slides 19, two slides 19 keep away from the equal fixed mounting in one side each other and have pin 17, it all is provided with pinhole 16 to correspond two pin 17 departments in the recess 20, two pin 17 keep away from one side each other and all extend to in the pinhole 16 that correspond.

Bottom fixed mounting of apron 2 has heat-conducting plate 9, fixed mounting has a plurality of radiating fin 10 on heat-conducting plate 9, the bottom fixed mounting of heat-conducting plate 9 has graphite alkene fin 8, graphite alkene fin 8's bottom laminating is on base plate 3, can absorb the heat that base plate 3 during operation produced through graphite alkene fin 8, then transmit to on heat-conducting plate 9 and the radiating fin 10, further improve the radiating effect, apron 2 is last to correspond a plurality of radiating fin 10 departments and all seted up trompil 12, the top of a plurality of radiating fin 10 all extends outside trompil 12, be convenient for radiating fin 10 and external air contact through this kind of design, thereby utilize the air flow to dispel the heat fast, the equal fixed mounting in top of two slides 19 dials board 14, two are dialled the top of board 14 and all extend outside cassette 13, be convenient for pulling slide 19 through dialling board 14, be favorable to the use of this equipment, casing 1 inner bottom end is provided with two brackets 4, and the both sides that lie in casing 1 every bracket 4 all are provided with mounting groove 5, and the both sides that every bracket 4 all are provided with mounting groove 5 in the casing 1, the both sides that the equal fixed mounting plate 6 has two equal fixed mounting grooves 6 that the pin 7 that take out of spring 7 and all can all drive through the first fixed mounting groove 15 in the first fixed mounting plate 5 that the first fixed mounting plate 7 that the first pin that the first fixed mounting plate 15 is favorable to make the first that the first pin that the first fixed mounting groove 5 that leads that the first that the last pin of the first that the installation of the first fixed mounting groove 5 that leads of the installation of the first that all to lift up.

The working principle is as follows: when the CSOP type ceramic packaging shell is used, the substrate 3 is inserted into the shell 1, the two shifting plates 14 are pulled towards one side close to each other, the two pin rods 17 are contracted into the clamping seat 13, the cover plate 2 is turned leftwards, the clamping seat 13 is clamped into the groove 20, the shifting plates 14 are loosened, the second spring 18 rebounds, the two pin rods 17 extend into the corresponding pin holes 16, the installation can be completed, the substrate 3 can be disassembled by utilizing the principle, when the substrate 3 generates heat during working, the heat generated during working of the substrate 3 can be absorbed by the graphene radiating fins 8 and then is transmitted to the heat conducting plate 9 and the heat radiating fins 10, so that the heat on the heat radiating fins 10 is driven by the flowing of outside air to dissipate the heat, the CSOP type ceramic packaging shell is convenient to use, the substrate 3 and the shell 1 can be rapidly installed and disassembled through the components, the subsequent overhaul and replacement of the substrate 3 are facilitated, and meanwhile, the heat generated during working of the substrate 3 can be rapidly absorbed by the graphene radiating fins 8, the heat conducting plate 9, the heat radiating fins 10 and the open holes 12, so that the heat dissipation effect is further improved;

through mutually supporting of mounting groove 5, connecting plate 6, first spring 7 and bracket 4, can utilize bracket 4 to lift base plate 3 out of recess 20 when dismantling, the staff of being convenient for takes.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a CSOP type ceramic package shell, its characterized in that, includes casing (1) and base plate (3), it has base plate (3) to peg graft in casing (1), the upper portion that lies in base plate (3) in casing (1) is provided with recess (20), be provided with apron (2) in recess (20), the right side fixed mounting of apron (2) has connecting seat (11), connecting seat (11) rotate to be connected in recess (20), the left side fixed mounting of apron (2) has cassette (13), be provided with two slide (19) in cassette (13), two fixed mounting has second spring (18) between slide (19), two slide (19) keep away from the equal fixed mounting in one side each other and have pin pole (17), it all is provided with pinhole (16) to correspond in recess (20) to correspond two pin pole (17) departments, two pin pole (17) keep away from one side each other and all extend to in corresponding pinhole (16).

2. The CSOP type ceramic package shell of claim 1, wherein the bottom end of the cover plate (2) is fixedly provided with a heat conducting plate (9), the heat conducting plate (9) is fixedly provided with a plurality of radiating fins (10), the bottom end of the heat conducting plate (9) is fixedly provided with a graphene radiating fin (8), and the bottom end of the graphene radiating fin (8) is attached to the substrate (3).

3. The CSOP type ceramic package housing of claim 1, wherein the cover plate (2) has openings (12) corresponding to the plurality of heat dissipating fins (10), and the top ends of the plurality of heat dissipating fins (10) extend out of the openings (12).

4. The CSOP type ceramic package casing of claim 1, wherein the top ends of the two sliding plates (19) are fixedly installed with a pulling plate (14), and the top ends of the two pulling plates (14) extend out of the card seat (13).

5. The CSOP type ceramic package shell of claim 1, wherein two brackets (4) are disposed at the bottom of the shell (1), mounting grooves (5) are disposed at both sides of each bracket (4) in the shell (1), connecting plates (6) are fixedly mounted at both sides of each bracket (4), the two connecting plates (6) are slidably connected in the corresponding mounting grooves (5), first springs (7) are fixedly mounted at the top ends of the two connecting plates (6), and the tops of the two first springs (7) are fixedly mounted at the top ends of the mounting grooves (5).

6. The CSOP type ceramic package casing of claim 1, wherein a plurality of pins (15) are fixedly mounted on both side walls of the casing (1), and one side of the plurality of pins (15) away from the substrate (3) extends out of the casing (1).