CN218521355U - Electroplating equipment with V-shaped structure - Google Patents

Abstract

The utility model provides a V type structure electroplating device, including unwinding mechanism, a plurality of plating bath groove and winding mechanism, its characterized in that, every be equipped with the liquid lower roll in the plating bath groove and electroplate positive pole, adjacent two be equipped with one or more between the plating bath groove and be used for providing the electrically conductive roller of cathode electricity for the film, the side of electrically conductive roller is equipped with sprays the mechanism, it is used for spraying the plating bath to the back with the film area of electrically conductive roller contact to spray the mechanism. The utility model discloses a side at the conductor roll sets up one and sprays the mechanism to spray the plating bath to the back with the film zone of conductor roll contact, carry out many places cooling to film and conductor roll, thereby avoid leading to the conductor roll surface to appear crystallization, puncture the film because of intensification, solved the problem that the film that current electroplating device exists damaged in coating film production technology, and have certain inhibiting action to the film heating effect, can restrain and burn the hole on the membrane.

Description

Electroplating equipment with V-shaped structure

Technical Field

The utility model relates to an electroplating device technical field, specific theory relates to a V type structure electroplating device.

Background

The thin film electroplating is a process for plating a metal film layer on the surface of a thin film by utilizing an electrolysis principle, the electroplating equipment comprises an unwinding end, a plating solution area and a winding end, and the thin film is discharged from an unwinding roller of the unwinding end, is electroplated through the plating solution area and is wound on a winding roller of the winding end.

In the process of electroplating the conductive film by the existing electroplating equipment, certain plating solution can adhere to the surface of the conductive film. When the conductive film is contacted with the conductive roller, the plating solution is also contacted with the conductive roller; the conductive roller as the cathode has a certain temperature rise due to electrification, and a part of the plating solution is inevitably evaporated, so that a small amount of crystals are precipitated on the conductive roller by solute in the plating solution and are attached to the conductive roller. In the actual coating operation, the fact that large-area metal simple substance deposition exists on the surface of the conductive roller, sharp pricks which can pierce the conductive film can be easily accumulated, and the production of the conductive film is greatly influenced.

The above problems are worth solving.

Disclosure of Invention

In order to overcome the problems of the prior art, the utility model provides a V-shaped structure electroplating device.

The utility model discloses technical scheme as follows:

the utility model provides a V type structure electroplating device, includes unwinding mechanism, a plurality of plating bath groove and winding mechanism, every be equipped with the liquid lower roll in the plating bath groove and electroplate the positive pole, adjacent two be equipped with one or more between the plating bath groove and be used for providing the electrically conductive roller of negative electricity for the film, the side of electrically conductive roller is equipped with one and sprays the mechanism, it is used for spraying the plating bath to the back with the film region of electrically conductive roller contact to spray the mechanism.

According to the utility model discloses of above-mentioned scheme, the electroplating anode is titanium blue.

According to above-mentioned scheme the utility model discloses, every spray mechanism include a plurality of along the shower head that the axial of conducting roller was arranged.

According to the above technical scheme in the utility model, be equipped with a set of conducting roller set between two adjacent plating solution grooves, every set of conducting roller includes first conducting roller, second conducting roller, third conducting roller and fourth conducting roller, first conducting roller is located the top of second conducting roller, the third conducting roller is located the top of fourth conducting roller, first conducting roller is located the front end of third conducting roller;

the film penetrates out of the former electroplating bath, sequentially bypasses the second conductive roller, the first conductive roller, the third conductive roller and the fourth conductive roller, and then enters the latter electroplating bath, and the four conductive rollers conduct electricity for the film.

According to the above scheme the utility model discloses, first conductive roller with be equipped with between the third conductive roller and wipe the roller, be equipped with down between the fourth conductive roller and the second conductive roller of lower a set of conductive roller group and wipe the roller, wipe the roller down with on wipe the roller all be used for wiping the impurity or the metal simple substance deposit on conductive roller surface.

According to above-mentioned scheme the utility model discloses, it is a plurality of plating solution groove includes the same first plating solution groove of a plurality of size to and the different second plating solution groove of a plurality of size, just first plating solution groove is located the front end of second plating solution groove.

Furthermore, the depth of the second plating solution tanks from the unwinding mechanism to the winding mechanism is gradually increased.

Furthermore, the depths of the second plating solution tanks are sequentially increased in an arithmetic progression.

Further, the top of the first plating anode of the first plating solution tank and the top of the second plating anode of the second plating solution tank are hung on the same horizontal height.

According to above-mentioned scheme the utility model discloses, the bottom in plating bath groove is equipped with the plating bath liquid reserve tank.

According to the scheme, the unwinding mechanism comprises an unwinding roller, an unwinding tension roller, an unwinding flattening roller and an unwinding trimming device, wherein a film is discharged from the unwinding roller and enters a plating solution tank after passing through the unwinding tension roller, the unwinding flattening roller and the unwinding trimming device in sequence;

winding mechanism includes wind-up roll, rolling tension roll, rolling nip roll and rolling side cut device, and the film passes through in proper order the rolling side cut device rolling nip roll with behind the rolling tension roll, the rolling is gone into the wind-up roll.

According to the above scheme the utility model discloses, the plating solution groove with still be equipped with wash bowl, anti oxidation groove and oven between the winding mechanism, the below of wash bowl is equipped with the wash bowl liquid reserve tank, the below of anti oxidation groove is equipped with the anti oxidation liquid reserve tank.

According to the above scheme the utility model discloses, the front end of wash bowl is equipped with the crowded liquid roller of plating bath, the wash bowl with be equipped with the crowded liquid roller of wash bowl between the anti oxidation groove, the rear end of anti oxidation groove is equipped with the crowded liquid roller of anti oxidation liquid.

According to the above scheme the utility model discloses, its beneficial effect lies in:

the utility model discloses a side at the conducting roller sets up one and sprays the mechanism to spray the plating bath to the back with the film zone of conducting roller contact, carry out many places cooling to film and conducting roller, thereby avoid leading to the conducting roller surface to appear crystallization, puncture the film because of heaing up, solved the problem of the film damage that current electroplating device exists in coating film production technology, and have certain inhibiting action to the film heating effect, can restrain and burn the hole on the membrane.

Drawings

FIG. 1 is a schematic view of the present invention;

fig. 2 is a schematic view of the unwinding mechanism of the present invention;

fig. 3 is a schematic view of the winding mechanism of the present invention;

FIG. 4 is a schematic view of a trough portion of the present invention;

FIG. 5 is a schematic view of a first plating liquid zone in a plating liquid tank;

FIG. 6 is a partial schematic view of a second plating liquid region in the plating liquid tank.

In the figure, 1, an unwinding roller; 2. unwinding a tension roller; 3. unwinding a flattening roller; 4. unwinding and trimming devices; 5. a first plating solution tank; 6. a second plating solution tank; 7. a submerged roller; 8. electroplating an anode; 802. a second electroplating anode; 9. a plating solution storage tank; 10. a first conductive roller; 11. a second conductive roller; 12. a third conductive roller; 13. a fourth conductive roller; 14. an upper wiping roller; 15. a lower wiping roller; 16. a spraying mechanism; 17. a rinsing bath; 171. a washing liquid storage tank; 18. an anti-oxidation tank; 181. an antioxidant liquid storage tank; 19. a plating solution squeezing roller; 20. a water washing liquid squeezing roller; 21. an antioxidant liquid squeezing roller; 22. an oven; 23. a winding and trimming device; 24. winding and flattening rollers; 25. winding a tension roller; 26. a wind-up roll; 27. a film.

Detailed Description

For better understanding of the objects, technical solutions and technical effects of the present invention, the present invention will be further explained with reference to the accompanying drawings and embodiments. It is to be noted that the following examples are only for explaining the present invention and are not intended to limit the present invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present, and when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

The meaning of "a number" is two or more unless specifically defined otherwise. The terms "first", "second", "third" and "fourth" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features.

As shown in fig. 1 to 6, a V-shaped electroplating apparatus includes an unwinding mechanism, a plurality of plating solution tanks, and a winding mechanism, wherein each plating solution tank is provided with a lower plating roll 7 and a plating anode 8, one or more conductive rollers are disposed between two adjacent plating solution tanks, a film firstly enters the previous plating solution tank, and then enters the next plating solution tank after going out and bypassing the conductive rollers, and the conductive rollers are used for providing a cathode for the film; a spraying mechanism 16 is arranged beside the conductive roller, and the spraying mechanism 16 is just opposite to the back of the film area contacted with the conductive roller so as to spray the back of the film; the utility model arranges a spraying mechanism beside the conductive roller to spray plating solution on the back of the thin film area contacted with the conductive roller, and simultaneously carries out multi-part cooling on the thin film and the conductive roller, thereby avoiding the crystallization on the surface of the conductive roller and the puncture of the thin film caused by temperature rise, and solving the problem that the existing electroplating equipment damages the thin film in the coating production process; meanwhile, the film has a certain inhibiting effect on 'the film is easy to generate heat', namely, the film has an inhibiting effect on hole burning on the film.

Optionally, the electroplating anode is titanium blue, the submerged roller 7 is located at the bottom of the plating solution tank, titanium blue is arranged on two sides of the upper portion of the submerged roller 7, the bottoms of the titanium blue on two sides are drawn close and hung obliquely, the titanium blue on two sides and the submerged roller 7 on the bottom are of a V-shaped structure, each side of the titanium blue is provided with left titanium blue and right titanium blue, the thin film 27 penetrates through the left titanium blue and the right titanium blue, anode copper in the titanium blue is dissolved to plate the thin film 27 with copper, the thin film 27 is sunk into the bottom of the plating solution tank through the plurality of plating solution tanks in the V-shaped design, the thin film 27 is fully contacted with the plating solution, and the electroplating effect of the thin film 27 is improved.

The utility model discloses in, conducting roller and submerged roller both can be the drive roll and also can be the driven voller, and product quality can be guaranteed to preferred drive roll.

In a preferred embodiment, each spraying mechanism 16 comprises a plurality of spraying heads arranged along the axial direction of the conductive roller, so that the film can be sprayed in a full-width and full-length mode, the film and the conductive roller can be efficiently cooled, and the inhibiting effect on the heating of the conductive roller and the film is improved.

In the electroplating equipment with the traditional structure, the configured conductive rollers are approximately horizontally arranged, and the defects are that the conductive distance (the distance between the conductive roller and the contact conductive point of the film and the plating liquid surface) is longer, so that the problems of larger film resistance and easy heating are caused; if the film is partially defective, heat is concentrated at the defect to cause a hole burning in the film. In order to solve the problems, the scheme is further optimized on the basis of the scheme as follows: each group of the conductive roller sets comprises a first conductive roller 10, a second conductive roller 11, a third conductive roller 12 and a fourth conductive roller 13, wherein the first conductive roller 10 is positioned above the second conductive roller 11, the third conductive roller 12 is positioned above the fourth conductive roller 13, the first conductive roller 10 is positioned at the front end of the third conductive roller 12, and the first conductive roller and the third conductive roller 12 are positioned at the same horizontal height; the film passes through the former electroplating bath, sequentially bypasses the second conductive roller 11, the first conductive roller 10, the third conductive roller 12 and the fourth conductive roller 13, and then enters the latter electroplating bath, and the four conductive rollers conduct electricity for the film.

The film 27 bypasses the conducting roller group by adopting an S-shaped path twice, specifically, the film is firstly taken from the back side surface of the second conducting roller 11 and passes through the front side surface of the first conducting roller 10 to complete a first S-shaped film-taking path; winding from the back side surface of the third conductive roller 12 to the front side surface of the fourth conductive roller 13 to complete a second S-shaped film-running path; and entering the next plating solution tank.

By adopting the up-and-down arrangement structure of the plurality of conductive rollers, the distance between the conductive rollers and the plating solution can be effectively shortened, particularly, the distance can be shortened by half, the shortened conductive distance has a remarkable inhibiting effect on the hole burning problem in the film surface electroplating process, and no hole burning is basically realized; on the other hand, the arrangement of the conductive rollers in the vertical direction can save the installation space in the horizontal direction, and the plating solution tanks can be connected, so that the length of the whole equipment can be effectively shortened, and the floor area of a factory building is saved; the arrangement of the vertical installation is favorable for giving out the installation space of the upper and lower conductive rollers, and is convenient for installing a roller wiping mechanism in the equipment and realizing the cleaning of the roller surface.

In a preferred embodiment, an upper wiping roller 14 is arranged between the first conductive roller 10 and the third conductive roller 12, a lower wiping roller 15 is arranged between the fourth conductive roller 13 and the second conductive roller 11 of the next group of conductive roller sets, and both the lower wiping roller 15 and the upper wiping roller 14 are used for wiping impurities or metal simple substance deposits on the surfaces of the conductive rollers. The two sides of the lower wiping roller 15 respectively contact the side of the fourth conductive roller 13 and the side of the second conductive roller 11 without the film running; both sides of the upper wiping roller 14 contact the sides of the first conductive roller 10 and the third conductive roller 12, respectively, on which the film is not run. It can be seen that the upper wiping roller 14 and the lower wiping roller 15 which are arranged at intervals can wipe two conductive rollers at a time.

In a preferred embodiment, tension sensors are provided on the first conductive roller 10 and the third conductive roller 12 to check the tension.

The utility model also provides a V type structure electroplating device, all the other structures are the same as above-mentioned embodiment, and the difference lies in: the plating solution tank is divided into a first plating solution tank 5 and a second plating solution tank 6; the plating device comprises two first plating solution tanks 5 with the same size and a plurality of second plating solution tanks 6 with different sizes, wherein the first plating solution tank 5 is positioned at the front end of the second plating solution tank 6; from the unwinding mechanism to the winding mechanism, the height of the second electroplating anode 802 in the second plating solution tank 6 is gradually increased from the front end to the rear end, and correspondingly, the depth of the second plating solution tank 802 is gradually increased; the second electroplating anode 802 which is higher and higher gradually increases the effective electroplating distance, is matched with the characteristics of thicker plating layer at the electroplating rear end, stronger conductive capability and capability of increasing current, does not waste the electroplating anode on the premise of ensuring the electroplating efficiency, and reduces the equipment cost.

In an alternative embodiment, the depths of the plurality of second plating solution tanks 6 in the second plating solution zone from the unwinding end to the winding end are sequentially increased in an arithmetic progression, so that the height difference of the second plating anode 802 is a constant value, and the difference between the depth of the film 27 entering the next second plating solution tank 6 and the depth of the film 27 entering the previous second plating solution tank 6 is a constant value.

The bottoms of the first plating solution tanks 5 are horizontal tanks, the bottoms of the two first plating solution tanks 5 are positioned at the same horizontal height, and the depths of the films 27 entering the front and the rear first plating solution tanks 5 are the same; the bottoms of the second plating solution tanks 6 are inclined bottoms, and the bottoms of two adjacent second plating solution tanks 6 are connected front and back.

The top of the electroplating anode 8 of the first plating solution groove 5 and the top of the electroplating anode 8 of the second plating solution groove 6 are hoisted on the same horizontal height, so that the first plating solution groove 5 and the second plating solution groove 6 of the electroplating equipment share one hoisting plate, and the hoisting plate is horizontally arranged, and a film coating mechanism and a conductive roller group of the electroplating equipment are vertically distributed on two sides of the hoisting plate, so that the structural design is more scientific and standardized, and the operation and the maintenance are facilitated.

The plating solution tank of the utility model can be understood as being formed by connecting a plurality of independent plating tanks, also can be understood as a whole tank, and is provided with reinforcing rib reinforcing plates to separate a plurality of plating areas.

The utility model discloses in, the bottom in plating bath groove still is equipped with plating bath liquid reserve tank 9, and plating bath liquid reserve tank 9 is used for the plating bath of splendid attire top plating bath groove drippage, avoids polluting operational environment.

As shown in fig. 2 and fig. 3, in the present invention, the unwinding mechanism includes an unwinding roller 1, an unwinding tension roller 2, an unwinding leveling roller 3 and an unwinding trimming device 4, and the film 27 is discharged from the unwinding roller 1, and enters the plating solution tank after passing through the unwinding tension roller 2, the unwinding leveling roller 3 and the unwinding trimming device 4 in sequence; the winding mechanism comprises a winding roller 26, a winding tension roller 25, a winding flattening roller 24 and a winding edge cutting device 23, and a film 27 is wound into the winding roller 26 after sequentially passing through the winding edge cutting device 23, the winding flattening roller 24 and the winding tension roller 25.

The unwinding tension roller 2 and the winding tension roller 25 are used for tensioning the film 27, so that the front end and the rear end of the film 27 are prevented from being loosened, and the film running efficiency of the film 27 is prevented from being influenced; the unwinding flattening roller 3 and the winding flattening roller 24 are used for flattening the film, so that the front end and the rear end of the film 27 are prevented from being wrinkled, and the film coating quality of the film 27 is prevented from being influenced; the unreeling edge-cutting device 4 and the reeling edge-cutting device 23 are used for cutting out the film scrap.

As shown in fig. 3, in the present invention, a rinsing bath 17, an anti-oxidation bath 18 and an oven 22 are further disposed between the plating bath tank and the winding mechanism, a rinsing bath liquid storage tank 171 is disposed below the rinsing bath 17, and an anti-oxidation liquid storage tank 181 is disposed below the anti-oxidation bath 18; the front end of the rinsing tank 17 is provided with a plating solution squeezing roller 19, a rinsing solution squeezing roller 20 is arranged between the rinsing tank 17 and the oxidation resistant tank 18, and the rear end of the oxidation resistant tank 18 is provided with an oxidation resistant solution squeezing roller 21.

The spraying mechanism sprays the plating solution, so that a liquid layer can be formed to isolate air, and the conductive film is prevented from being exposed in the air and being easily oxidized; on the other hand, the flow of the plating solution into the plating solution tank does not affect the concentration of the plating solution in the tank.

All possible combinations of the technical features in the above embodiments may not be described for the sake of brevity, but should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above embodiments only represent several embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (9)

1. The utility model provides a V type structure electroplating device, includes unwinding mechanism, a plurality of plating bath groove and winding mechanism, its characterized in that, every be equipped with the liquid lower roll in the plating bath groove and electroplate the positive pole, adjacent two be equipped with one or more between the plating bath groove and be used for providing the electrically conductive roller of negative electricity for the film, the side of electrically conductive roller is equipped with sprays the mechanism, it is used for spraying the plating bath to the back with the film area of electrically conductive roller contact to spray the mechanism.

2. The V-shaped structural electroplating equipment according to claim 1, wherein each spraying mechanism comprises a plurality of spraying heads arranged along the axial direction of the conductive roller.

3. The electroplating apparatus according to claim 1, wherein a set of conductive rollers is disposed between two adjacent plating solution tanks, each set of conductive rollers comprises a first conductive roller, a second conductive roller, a third conductive roller and a fourth conductive roller, the first conductive roller is located above the second conductive roller, the third conductive roller is located above the fourth conductive roller, and the first conductive roller is located at the front end of the third conductive roller.

4. The electroplating equipment for the V-shaped structure as claimed in claim 3, wherein an upper wiping roller is arranged between the first conductive roller and the third conductive roller, and a lower wiping roller is arranged between the fourth conductive roller and the second conductive roller of the next group of conductive rollers.

5. The V-shaped structure plating apparatus according to any one of claims 1 to 4, wherein said plurality of plating liquid tanks include a plurality of first plating liquid tanks of the same size, and a plurality of second plating liquid tanks of different sizes, and said first plating liquid tank is located at a front end of said second plating liquid tanks.

6. The V-shaped structural electroplating apparatus according to any one of claims 1 to 4, wherein a plating solution storage tank is arranged at the bottom of the plating solution tank.

7. The electroplating equipment with the V-shaped structure as claimed in any one of claims 1 to 4, wherein the unwinding mechanism comprises an unwinding roller, an unwinding tension roller, an unwinding flattening roller and an unwinding trimming device, a film is unwound from the unwinding roller and enters the plating bath after passing through the unwinding tension roller, the unwinding flattening roller and the unwinding trimming device in sequence;

winding mechanism includes wind-up roll, rolling tension roll, rolling nip roll and rolling side cut device, and the film passes through in proper order rolling side cut device rolling nip roll with behind the rolling tension roll, the rolling is gone into the wind-up roll.

8. The electroplating equipment with the V-shaped structure as claimed in any one of claims 1 to 4, wherein a rinsing bath, an anti-oxidation bath and an oven are further arranged between the plating bath and the winding mechanism, a rinsing bath liquid storage tank is arranged below the rinsing bath, and an anti-oxidation liquid storage tank is arranged below the anti-oxidation bath.

9. The electroplating equipment with the V-shaped structure as claimed in claim 8, wherein a plating solution squeezing roller is arranged at the front end of the rinsing bath, a rinsing solution squeezing roller is arranged between the rinsing bath and the oxidation resistant bath, and an oxidation resistant solution squeezing roller is arranged at the rear end of the oxidation resistant bath.

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