CN218514633U - Controller casing, controller and vehicle - Google Patents
Controller casing, controller and vehicle Download PDFInfo
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- CN218514633U CN218514633U CN202221909804.XU CN202221909804U CN218514633U CN 218514633 U CN218514633 U CN 218514633U CN 202221909804 U CN202221909804 U CN 202221909804U CN 218514633 U CN218514633 U CN 218514633U
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- 239000000110 cooling liquid Substances 0.000 claims abstract description 201
- 239000002826 coolant Substances 0.000 claims abstract description 98
- 238000005192 partition Methods 0.000 claims description 17
- 239000007788 liquid Substances 0.000 abstract description 67
- 230000017525 heat dissipation Effects 0.000 abstract description 29
- 238000013461 design Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000002035 prolonged effect Effects 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000010963 304 stainless steel Substances 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The present disclosure relates to a controller housing, a controller, and a vehicle. The controller housing includes: a housing body and a cover plate; the shell body is provided with a controller accommodating cavity for arranging a controller circuit board; the shell body is further provided with a cooling liquid accommodating groove, and the cover plate encapsulates the cooling liquid accommodating groove to form a cooling liquid accommodating cavity; the controller accommodating cavity is arranged in contact with the cooling liquid accommodating cavity; the shell body is also provided with a cooling liquid inlet and a cooling liquid outlet; the cooling liquid accommodating cavity is communicated with an external cooling liquid circulation loop through the cooling liquid inlet and the cooling liquid outlet. The technical scheme that this disclosed embodiment provided can be directly carry the coolant liquid to the controller casing in, realizes the heat dissipation to the controller through outside coolant liquid circulation circuit, the effectual heat dissipation capacity and the radiating efficiency that has improved, avoided intelligent driving controller fan heat dissipation with high costs, the fault rate is high, the big problem of noise.
Description
Technical Field
The present disclosure relates to the field of vehicle technologies, and in particular, to a controller housing, a controller, and a vehicle.
Background
The existing vehicles increasingly adopt domain controllers, particularly domain controllers related to automatic driving, as a key of the domain controllers, namely domain controller circuit boards, the chip calculation requirement is higher and higher, the temperature control of the domain controllers is the key of safe operation of the system, and reasonable thermal management is needed to ensure the normal operation of the chips. However, the conventional fan for heat dissipation has failed to satisfy the heat dissipation requirement of the chip. And adopt the fan to dispel the heat, still need to add fan, radiator and the control circuit relevant with the fan, whole cooling system structure is comparatively complicated, and the fault rate is higher, and the working noise is big.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the present disclosure provides a controller housing, a controller and a vehicle.
The present disclosure also provides a controller housing comprising:
a housing body and a cover plate;
the shell body is provided with a controller accommodating cavity for arranging a controller circuit board;
the shell body is further provided with a cooling liquid accommodating groove, and the cover plate encapsulates the cooling liquid accommodating groove to form a cooling liquid accommodating cavity;
the controller accommodating cavity is arranged in contact with the cooling liquid accommodating cavity;
the shell body is also provided with a cooling liquid inlet and a cooling liquid outlet; the cooling liquid accommodating cavity is communicated with an external cooling liquid circulation loop through the cooling liquid inlet and the cooling liquid outlet.
In some embodiments, the housing body comprises a first housing and a second housing; the first shell and the second shell are packaged to form the controller accommodating cavity; the cooling liquid containing cavity comprises a first cooling liquid containing cavity and/or a second cooling liquid containing cavity;
the first shell is provided with a first cooling liquid accommodating groove, and the cover plate encapsulates the first cooling liquid accommodating groove to form a first cooling liquid accommodating cavity;
and/or the presence of a gas in the atmosphere,
the second shell is provided with a second cooling liquid containing groove, and the cover plate encapsulates the second cooling liquid containing groove to form the second cooling liquid containing cavity.
In some embodiments, at least one partition is disposed within the coolant containment cavity, the partition dividing the coolant containment cavity into a plurality of communicating chambers.
In some embodiments, the housing body is provided with at least one circuit board connection port; the controller circuit board is electrically connected with an external device through the circuit board connecting port.
In some embodiments, the cooling system further comprises a detachably arranged cooling liquid inlet joint and a detachably arranged cooling liquid outlet joint; the cooling liquid inlet joint is communicated with the external cooling liquid circulation loop through the cooling liquid inlet; the cooling liquid outlet joint is communicated with the external cooling liquid circulation loop through the cooling liquid outlet.
In some embodiments, the housing body located within the coolant receiving groove includes at least one heat dissipating projection.
In some embodiments, the housing body and the heat dissipating protrusion are an integrally formed structure.
In some embodiments, a thermally conductive structure is included; the heat conduction structure is arranged on the inner wall of the controller accommodating cavity.
The present disclosure also provides a controller including a controller circuit board and a controller housing provided by the present disclosure.
The present disclosure also provides a vehicle including the controller provided by the present disclosure.
Compared with the prior art, the technical scheme provided by the embodiment of the disclosure has the following advantages:
according to the technical scheme, the cooling liquid accommodating groove is formed in the controller shell, and the shell body and the cover plate packaging cooling liquid accommodating groove form a cooling liquid accommodating cavity. The shell body is also provided with a cooling liquid inlet and a cooling liquid outlet. The cooling liquid accommodating cavity is communicated with an external cooling liquid circulation loop through a cooling liquid inlet and a cooling liquid outlet. Need not additionally to set up complicated heat transfer structure like this, can directly carry the coolant liquid to the controller casing in, realize the heat dissipation through communicating with outside coolant liquid circulation loop, the effectual heat dissipation capacity and the radiating efficiency that have improved has avoided intelligent driving controller fan heat dissipation with high costs, the fault rate is high, the big problem of noise. Simultaneously with the coolant liquid holding tank setting on the controller casing, can carry out the direct contact heat dissipation between controller circuit board and the coolant liquid holding chamber, further improvement the radiating efficiency.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present disclosure, the drawings used in the embodiments or technical solutions in the prior art description will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic structural diagram of a controller housing according to an embodiment of the present disclosure;
FIG. 2 is a top view of the controller housing provided in FIG. 1;
fig. 3 is a schematic structural assembly diagram of a controller according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a controller according to an embodiment of the present disclosure.
Detailed Description
In order that the above objects, features and advantages of the present disclosure may be more clearly understood, aspects of the present disclosure will be further described below. It should be noted that the embodiments and features of the embodiments of the present disclosure may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure may be practiced in other ways than those described herein; it is to be understood that the embodiments disclosed in the specification are only a few embodiments of the present disclosure, and not all embodiments.
Fig. 1 is a schematic structural diagram of a controller housing according to an embodiment of the present disclosure, and fig. 2 is a top view of the controller housing provided in fig. 1, and as shown in fig. 1 and fig. 2, the controller housing includes a housing body 1 and a cover plate 2. The housing body 1 is formed with a controller accommodating chamber for accommodating a controller circuit board. That is, the controller circuit board may be disposed in the controller accommodating cavity of the housing body 1, and the controller circuit board is packaged by the housing body 1. The shell body 1 is further provided with a cooling liquid accommodating groove 3, and the cover plate 2 encapsulates the cooling liquid accommodating groove 3 to form a cooling liquid accommodating cavity. The controller accommodating cavity is arranged in contact with the cooling liquid accommodating cavity. The coolant receiving chamber is provided in communication with an external coolant circulation circuit. Namely, the cooling liquid accommodating cavity on the shell body 1 is a channel which is formed by the cover plate 2 and the cooling liquid accommodating groove 3 formed on the shell body 1 and can circulate the cooling liquid.
The housing body 1 is further provided with a cooling liquid inlet 7 and a cooling liquid outlet 8. The cooling liquid accommodating cavity is communicated with an external cooling liquid circulation loop through a cooling liquid inlet 7 and a cooling liquid outlet 8. That is, the external cooling liquid circulation loop can be communicated with the cooling liquid accommodating cavity on the shell body 1 through the cooling liquid inlet 7 and the cooling liquid outlet 8, the cooling liquid in the external cooling liquid circulation loop is input into the cooling liquid accommodating groove 3 through the cooling liquid inlet 7, and the cooling liquid is conveyed to the external cooling liquid circulation loop through the cooling liquid outlet 8. And the circuit board of the controller is cooled by low-temperature cooling liquid in the external cooling liquid circulation loop.
According to the technical scheme, the cooling liquid accommodating groove is formed in the controller shell, and the shell body and the cover plate packaging cooling liquid accommodating groove form a cooling liquid accommodating cavity. The shell body is also provided with a cooling liquid inlet and a cooling liquid outlet. The cooling liquid accommodating cavity is communicated with an external cooling liquid circulation loop through a cooling liquid inlet and a cooling liquid outlet. In this way, a complex heat exchange structure is not required to be additionally arranged, and the cooling liquid can be directly conveyed to the cooling liquid accommodating cavity in the controller shell. Then can be through the low-temperature coolant in the outside coolant liquid circulation circuit, carry out cooling heat dissipation to the controller circuit board that the controller holding intracavity set up, effectual heat dissipation capacity and the radiating efficiency of having improved has avoided intelligent driving controller fan heat dissipation with high costs, the fault rate is high, the big problem of noise. Simultaneously with the coolant liquid holding tank setting on the controller casing, can carry out the direct contact heat dissipation between controller circuit board and the coolant liquid holding chamber, further improvement to controller circuit board radiating efficiency, ensure that controller circuit board can normal operating.
In some embodiments, as shown in fig. 1, the housing body 1 of the controller housing is further provided with at least one circuit board connection port 14, for example. The controller circuit board is electrically connected to an external device through the circuit board connection port 14.
According to the technical scheme, the shell body can be provided with at least one circuit board connecting port, so that the controller circuit board can be electrically connected with an external device through the circuit board connecting port, the shell body and the controller circuit board can be conveniently assembled, and the shell is simple in structure and easy to realize.
In some embodiments, as shown in fig. 1, the housing body 1 of the controller housing further comprises a detachably disposed cooling liquid inlet joint 71 and a detachably disposed cooling liquid outlet joint 81. The coolant inlet port joint 71 communicates with the external coolant circulation circuit through the coolant inlet port 7. The coolant outlet port connection 81 is connected to an external coolant circulation circuit via a coolant outlet port 8.
The technical scheme that this disclosed embodiment provided, go into liquid mouth with the coolant liquid and connect, coolant liquid outlet connects and all sets up to detachable and connect, can realize like this with shell body components of a whole that can function independently design, consequently when the interface demand of outside coolant liquid circulation circuit changes, only need change the coolant liquid go into liquid mouth connect, coolant liquid outlet connect can, need not to carry out whole change to the controller casing, and then can reduce manufacturing cost.
In some embodiments, the coolant liquid inlet joint and the coolant liquid outlet joint respectively adopt interference fit with the coolant liquid inlet and the coolant liquid outlet of the shell body, so that the tightness between the coolant liquid inlet joint and the coolant liquid outlet joint and the coolant liquid inlet and the coolant liquid outlet can be ensured.
Optionally, the coolant inlet joint and the coolant outlet joint may be, for example, quick-connect joints, and the use of the quick-connect joints can effectively reduce the production cost.
In some embodiments, the coolant inlet and outlet fittings may be formed, for example, by stamping 304 stainless steel.
In some embodiments, as shown in fig. 1, the case body 1 located inside the coolant accommodating tank 3 includes at least one heat dissipating projection 9.
The technical scheme that this disclosed embodiment provided through set up the heat dissipation arch in the coolant liquid holding tank, has increased the heat dissipation surface area between coolant liquid holding tank and the controller circuit board in other words, has improved the radiating efficiency.
In some embodiments, the shape of the heat dissipating protrusion may be a polyhedron such as a cylinder, a rectangular parallelepiped, or the like.
Illustratively, referring to the structure shown in fig. 1, the heat dissipating protrusion 9 is, for example, a cylinder.
Alternatively, the shape of the heat dissipating protrusions is a shape of a protrusion structure for increasing a surface area, which is known to those skilled in the art, and the present disclosure is not limited thereto.
In some embodiments, as shown in fig. 1, the case body 1 located inside the coolant accommodating tank 3 may include, for example, a plurality of heat dissipating projections 9. The number of the heat dissipation protrusions is set according to the heat dissipation requirement of the actual controller circuit board, and the number is not limited by the disclosure.
In some embodiments, the housing body and the heat dissipating protrusion are integrally formed. Thus, the manufacturing cost can be effectively reduced.
Optionally, the case body and the heat dissipation protrusion are integrally formed by aluminum alloy through die casting.
In some embodiments, a harness securing structure is also provided on the controller housing, for example. The harness fixing structure may be provided on the case body and/or the cover plate, for example. Since the controller circuit board needs to be electrically connected to an external device, there are many wire harnesses around the controller case, and the wire harness fixing structure is provided on the controller case. Can arrange mixed and disorderly pencil around the controller casing in order, both can protect the pencil, avoid the rupture pencil, can also make the pencil of whole control arrange more regularly.
Optionally, as shown in fig. 1, a wire harness fixing structure 21 is provided on the cover plate 2.
The shape of the wire harness fixing structure may be, for example, a structure known to those skilled in the art that can fix the wire harness, and the present disclosure is not limited thereto.
In some embodiments, when the size and height of the chip and other devices on the controller circuit board are different, the housing body is provided with some groove structures to encapsulate the controller circuit board therein. As shown in fig. 1 and 2, these groove structures 15 are used to adaptively avoid a chip or the like disposed on the controller circuit board. Specifically, the number, position and shape of the groove structures arranged on the shell body are arranged according to the structural design requirements of the actual controller, and the disclosure does not limit the number, position and shape.
In some embodiments, such as the configuration shown in fig. 1 and 2, housing body 1 may be provided with threaded connection holes 16. The first shell and the second shell of the shell body can be fixedly connected through a screw and a nut, for example, and the screw is fixedly connected with the nut through a threaded connecting hole, so that the first shell and the second shell are fixedly connected.
In some embodiments, the housing body includes a first housing and a second housing. The first shell and the second shell are packaged to form a controller accommodating cavity. The cooling liquid containing cavity comprises a first cooling liquid containing cavity and/or a second cooling liquid containing cavity. The first shell is provided with a first cooling liquid containing groove, and the cover plate encapsulates the first cooling liquid containing groove to form a first cooling liquid containing cavity. And/or the second shell is provided with a second cooling liquid containing groove, and the cover plate encapsulates the second cooling liquid containing groove to form a second cooling liquid containing cavity.
Exemplarily, fig. 3 is a schematic structural assembly diagram of a controller provided in an embodiment of the present disclosure, and as shown in fig. 3, the housing body 1 includes a first housing 11 and a second housing 12. The first housing 11 and the second housing 12 are packaged to form a controller accommodating chamber. The controller accommodating cavity is used for arranging the controller circuit board 5. The first housing 11 is provided with a first cooling liquid containing groove 31, and the cover plate 2 encloses the first cooling liquid containing groove 31 to form a first cooling liquid containing cavity.
Exemplarily, fig. 4 is a schematic structural diagram of a controller provided in an embodiment of the present disclosure, and as shown in fig. 4, the case body 1 includes a first case 11 and a second case 12. The first housing 11 and the second housing 12 are enclosed to form the controller accommodating chamber 4. The controller accommodating chamber 4 is used for arranging a controller circuit board 5. The cooling liquid accommodating chamber includes a first cooling liquid accommodating chamber 111 and a second cooling liquid accommodating chamber 121. The first housing 11 is provided with a first cooling liquid receiving groove 31, and the cover plate 2 encloses the first cooling liquid receiving groove 31 to form a first cooling liquid receiving cavity 111. And the second housing 12 is provided with a second cooling liquid containing groove 32, and the cover plate 2 encloses the second cooling liquid containing groove 32 to form a second cooling liquid containing cavity 121.
According to the technical scheme provided by the embodiment of the disclosure, the cooling liquid accommodating cavity is communicated with the external cooling liquid circulation loop. Therefore, the first cooling liquid accommodating cavity and the second cooling liquid accommodating cavity can be communicated with the external cooling liquid circulation loop respectively, so that a complex heat exchange structure is not required to be additionally arranged, the cooling liquid can be directly conveyed to the first cooling liquid accommodating cavity and the second cooling liquid accommodating cavity in the controller shell, and then the controller circuit board arranged in the controller accommodating cavity can be cooled through the external cooling liquid circulation loop. Because it holds chamber and second coolant liquid and holds the chamber to be provided with first coolant liquid respectively at first casing and second casing, can cool down the cooling simultaneously to the top and the below of controller circuit board, the area of contact that has increased controller holding chamber and coolant liquid and held the chamber has been equivalent to, the heat radiating area of controller circuit board has been equivalent to having increased promptly, improvement heat dissipation capacity and radiating efficiency that can step forward like this, can realize the rapid cooling to the controller circuit board, ensure that the controller circuit board can normal operating.
In some embodiments, referring to the structure shown in fig. 4, the coolant containment chamber includes, for example, only the first coolant containment chamber 111. Can only hold chamber and outside coolant liquid circulation circuit intercommunication through first coolant liquid like this, directly hold the intracavity with the first coolant liquid that the coolant liquid carried to in the controller casing, hold the controller circuit board that the intracavity set up to the controller through the coolant liquid of intracavity first coolant liquid and dispel the heat. And because first coolant liquid holds the chamber and sets up in the top of controller circuit board, first coolant liquid holds the chamber and can dispel the heat with the chip direct contact that the controller circuit board top set up, can further improvement controller circuit board's chip radiating efficiency.
In some embodiments, referring to the structure shown in fig. 4, the coolant containment chamber includes, for example, only the second coolant containment chamber 121. Can only hold chamber and outside coolant liquid circulation circuit intercommunication through the second coolant liquid like this, directly hold the intracavity with the second coolant liquid that the coolant liquid carried to in the controller casing, hold the controller circuit board that the intracavity set up to the controller through the coolant liquid of intracavity the second coolant liquid and dispel the heat. And the second cooling liquid holds the chamber and sets up in the below of controller circuit board, because the below of controller circuit board is comparatively level and smooth, the second cooling liquid holds the chamber and need not to dodge the chip that sets up on the controller circuit board on structural design, therefore the structure that the second cooling liquid held the chamber is comparatively simple, and can realize the heat dissipation to the controller circuit board that the controller holding intracavity set up.
According to the technical scheme provided by the embodiment of the disclosure, the shell body comprises a first shell and a second shell. The coolant liquid holding tank can set up on first casing and/or second casing, can provide the mode of setting up of multiple coolant liquid holding tank like this, has improved controller casing structural design's variety to satisfy the demand of different controller heat dissipation designs.
In some embodiments, at least one partition is disposed within the coolant containment cavity, the partition dividing the coolant containment cavity into a plurality of communicating chambers.
Illustratively, with reference to the structure shown in fig. 3, one partition plate 6 is provided in the coolant accommodating chamber, and each partition plate 6 divides the coolant accommodating chamber into two chambers that communicate with each other. The cooling liquid flow water channel of the U-shaped structure is formed in the cooling liquid accommodating cavity, so that the flow direction of the cooling liquid can be guided, the retention time of the cooling liquid in the cooling liquid accommodating cavity is prolonged, the heat exchange time between the cooling liquid and the controller circuit board can be prolonged, and the heat dissipation efficiency between the cooling liquid and the controller circuit board can be effectively improved.
According to the technical scheme provided by the embodiment of the disclosure, the cooling liquid accommodating cavity is divided into the communicated multiple cavities by the partition plate through the at least one partition plate arranged in the cooling liquid accommodating cavity. Therefore, the cooling liquid in the cooling liquid accommodating cavity must circularly flow through different cavities, the flowing direction of the cooling liquid can be guided, the staying time of the cooling liquid in the cooling liquid accommodating cavity is prolonged, and the heat exchange time between the cooling liquid and the controller circuit board can be prolonged. Avoid the coolant liquid to flow out fast after getting into the coolant liquid and holding the chamber, and can't carry out effectual heat exchange. Therefore, the heat dissipation efficiency between the cooling liquid and the controller circuit board can be effectively improved.
In some embodiments, at least one baffle is disposed within the coolant-containing chamber, for example on the housing body and/or the cover plate.
In some embodiments, the housing body includes a first housing and a second housing. The first shell and the second shell are packaged to form a controller accommodating cavity. The cooling liquid accommodating cavity comprises a first cooling liquid accommodating cavity and/or a second cooling liquid accommodating cavity. And a partition plate is arranged in the first cooling liquid accommodating cavity and/or the second cooling liquid accommodating cavity.
Illustratively, referring to the structure shown in fig. 4, the cooling liquid receiving cavities include a first cooling liquid receiving cavity 111 and a second cooling liquid receiving cavity 121. The first housing 11 is provided with a first cooling liquid receiving groove 31, and the cover plate 2 encloses the first cooling liquid receiving groove 31 to form a first cooling liquid receiving cavity 111. And the second housing 12 is provided with a second cooling liquid containing groove 32, and the cover plate 2 encapsulates the second cooling liquid containing groove 32 to form a second cooling liquid containing cavity 121. Optionally, a partition plate 6 is disposed on the first housing 11 in the first cooling liquid accommodating cavity 111, and/or a partition plate 6 is disposed on the cover plate 2, and the partition plate 6 divides the first cooling liquid accommodating cavity 111 into a plurality of communicated chambers. And/or a partition plate 6 is arranged on the second shell 12 in the second cooling liquid containing cavity 121, and/or a partition plate 6 is arranged on the cover plate 2.
According to the technical scheme provided by the embodiment of the disclosure, the partition plate can be arranged on the shell body and/or the cover plate. Can provide the design of multiple coolant liquid holding chamber like this, improve the variety of controller shell structure design to satisfy the demand of different controller heat dissipation designs.
In some embodiments, as shown in fig. 3, the cooling liquid inlet 7 and the cooling liquid outlet 8 are respectively communicated with different chambers.
Illustratively, as shown in fig. 3, the first housing 11 is provided with a first cooling liquid receiving groove 31, and the cover plate 2 encloses the first cooling liquid receiving groove 31 to form a first cooling liquid receiving cavity. The first housing 11 is also provided with a coolant inlet 7 and a coolant outlet 8. The first cooling liquid holding tank 31 is communicated with the external cooling liquid circulation circuit through the cooling liquid inlet 7 and the cooling liquid outlet 8. That is, the external cooling liquid circulation loop can be communicated with the first cooling liquid accommodating cavity on the first housing 11 through the cooling liquid inlet 7 and the cooling liquid outlet 8, the cooling liquid in the external cooling liquid circulation loop is input into the first cooling liquid accommodating groove 31 from the cooling liquid inlet 7, and the cooling liquid is conveyed to the external cooling liquid circulation loop through the cooling liquid outlet 8.
The technical scheme that this disclosed embodiment provided through with coolant liquid income liquid mouth and coolant liquid outlet set up respectively to communicate with different cavities. Make coolant liquid go into the liquid mouth through the coolant liquid and flow into the coolant liquid and hold the chamber after like this, the cavity of a plurality of intercommunications that the coolant liquid need be walked around and is separated by a plurality of baffles and form could follow the coolant liquid outlet and flow. The direct outflow after the coolant liquid flows into the coolant liquid holding cavity is avoided, so that the coolant liquid in the coolant liquid holding cavity must circularly flow through different cavities, the flowing direction of the coolant liquid can be guided, the retention time of the coolant liquid in the coolant liquid holding cavity is prolonged, and the heat exchange time between the coolant liquid and the controller circuit board can be prolonged. Avoid the coolant liquid to flow out fast after getting into the coolant liquid and holding the chamber, and can't carry out effectual heat exchange. Therefore, the heat dissipation efficiency between the cooling liquid and the controller circuit board can be effectively improved.
In some embodiments, as shown in fig. 4, the controller housing further comprises a thermally conductive structure 13. The heat conducting structure 13 is disposed on the inner wall of the controller accommodating chamber 4.
In some embodiments, the heat conducting structure is disposed between the controller accommodating cavity and the controller circuit board, and the controller accommodating cavity exchanges heat with the controller circuit board through the heat conducting structure.
As shown in fig. 4, the controller circuit board 5 is provided with at least one chip 51. The heat conducting structure 13 is disposed between the first cooling liquid receiving chamber 111 and the chip 51. The first cooling liquid receiving cavity 111 exchanges heat with the chip 51 through the heat conducting structure 13. The heat conducting structure 13 is disposed between the second cooling liquid accommodating cavity 121 and the bottom plate of the controller circuit board 5, and the second cooling liquid accommodating cavity 121 exchanges heat with the bottom plate of the controller circuit board 5 through the heat conducting structure 13.
In some embodiments, the heat conducting structure is arranged between the controller accommodating cavity and the controller circuit board. The heat conduction structure is used for assisting in heat dissipation, on one hand, the heat dissipation area can be increased, on the other hand, the heat dissipation speed can be increased, and the heat dissipation efficiency is improved.
In some embodiments, the thermally conductive structure may be, for example, thermally conductive silicone grease. Because the heat conduction silicone grease is a colloidal material, the heat conduction efficiency can be enhanced, and the controller circuit board can be protected.
In some embodiments, a sealing structure is also provided between the cover plate and the housing body, for example. The sealing structure may be a sealing ring, for example. Through setting up seal structure, can effectual improvement apron and the sealed effect between the shell body.
In some embodiments, the cover plate and the housing body may be joined together, for example, by friction stir welding. The welding mode of friction stir welding is adopted, so that a good sealing effect can be achieved, and the structure of the sealing ring can be saved.
The embodiment of the present disclosure further provides a controller, which includes a controller circuit board and the controller housing provided by the embodiment of the present disclosure. Have the same or corresponding beneficial effects, and are not described herein again in order to avoid repetition.
In some embodiments, referring to the structure shown in fig. 3, the case body 1 includes a first case 11 and a second case 12. The first housing 11 and the second housing 12 are packaged to form a controller accommodating chamber. The controller accommodating cavity is provided with a controller circuit board 5. The controller circuit board 5 is provided with at least one chip 51. Specifically, the number of chips disposed on the controller circuit board is set according to the requirements of the actual controller circuit board, which is not limited by the present disclosure.
In some embodiments, the controller housing cavity is provided with a plurality of controller circuit boards, for example, which may be connected in series and/or in parallel, for example. Specifically, the number of controller circuit boards is set according to the requirements of the actual controller, and the disclosure does not limit the number.
In some embodiments, the controller may be, for example, a vehicle domain controller. The external coolant circulation circuit may be, for example, a coolant heat exchange circuit inside the vehicle.
The embodiment of the disclosure also provides a vehicle which comprises the controller provided by the embodiment of the disclosure. Have the same or corresponding beneficial effects, and are not described herein again in order to avoid repetition.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising one of 8230; \8230;" 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present disclosure, which enable those skilled in the art to understand or practice the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A controller housing, comprising:
a housing body and a cover plate;
the shell body is provided with a controller accommodating cavity for arranging a controller circuit board;
the shell body is further provided with a cooling liquid accommodating groove, and the cover plate encapsulates the cooling liquid accommodating groove to form a cooling liquid accommodating cavity;
the controller accommodating cavity is arranged in contact with the cooling liquid accommodating cavity; the shell body is also provided with a cooling liquid inlet and a cooling liquid outlet; the cooling liquid accommodating cavity is communicated with an external cooling liquid circulation loop through the cooling liquid inlet and the cooling liquid outlet.
2. The controller housing of claim 1, wherein the housing body comprises a first housing and a second housing; the first shell and the second shell are packaged to form the controller accommodating cavity; the cooling liquid containing cavity comprises a first cooling liquid containing cavity and/or a second cooling liquid containing cavity;
the first shell is provided with a first cooling liquid accommodating groove, and the cover plate encapsulates the first cooling liquid accommodating groove to form a first cooling liquid accommodating cavity;
and/or the presence of a gas in the gas,
the second shell is provided with a second cooling liquid containing groove, and the cover plate encapsulates the second cooling liquid containing groove to form the second cooling liquid containing cavity.
3. The controller housing of claim 1, wherein at least one partition is disposed within the coolant receiving cavity, the partition dividing the coolant receiving cavity into a plurality of communicating chambers.
4. The controller housing of claim 1, wherein the housing body is provided with at least one circuit board connection port; the controller circuit board is electrically connected with an external device through the circuit board connecting port.
5. The controller housing of claim 1, further comprising a removably disposed coolant inlet fitting and a removably disposed coolant outlet fitting; the cooling liquid inlet joint is communicated with the external cooling liquid circulation loop through the cooling liquid inlet; the cooling liquid outlet joint is communicated with the external cooling liquid circulation loop through the cooling liquid outlet.
6. The controller housing of claim 1, wherein the housing body within the coolant receiving groove includes at least one heat dissipating protrusion.
7. The controller housing of claim 6, wherein the housing body and the heat dissipating protrusion are of an integrally formed structure.
8. The controller housing of claim 1, comprising a thermally conductive structure; the heat conduction structure is arranged on the inner wall of the controller accommodating cavity.
9. A controller comprising a controller circuit board and a controller housing according to any one of claims 1 to 8.
10. A vehicle characterized by comprising the controller of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221909804.XU CN218514633U (en) | 2022-07-20 | 2022-07-20 | Controller casing, controller and vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221909804.XU CN218514633U (en) | 2022-07-20 | 2022-07-20 | Controller casing, controller and vehicle |
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| CN218514633U true CN218514633U (en) | 2023-02-21 |
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| CN202221909804.XU Active CN218514633U (en) | 2022-07-20 | 2022-07-20 | Controller casing, controller and vehicle |
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| CN (1) | CN218514633U (en) |
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